CN1443626A - Leadless welding flux with optimum informance and price ratio - Google Patents
Leadless welding flux with optimum informance and price ratio Download PDFInfo
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- CN1443626A CN1443626A CN 03116488 CN03116488A CN1443626A CN 1443626 A CN1443626 A CN 1443626A CN 03116488 CN03116488 CN 03116488 CN 03116488 A CN03116488 A CN 03116488A CN 1443626 A CN1443626 A CN 1443626A
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- Prior art keywords
- alloy
- lead
- solder
- price ratio
- free solder
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- 230000004907 flux Effects 0.000 title abstract description 4
- 238000003466 welding Methods 0.000 title description 14
- 239000012535 impurity Substances 0.000 claims abstract description 9
- 229910000679 solder Inorganic materials 0.000 claims description 30
- 229910045601 alloy Inorganic materials 0.000 abstract description 17
- 239000000956 alloy Substances 0.000 abstract description 17
- 229910020816 Sn Pb Inorganic materials 0.000 abstract description 14
- 229910020922 Sn-Pb Inorganic materials 0.000 abstract description 14
- 229910008783 Sn—Pb Inorganic materials 0.000 abstract description 14
- 230000003647 oxidation Effects 0.000 abstract description 6
- 238000007254 oxidation reaction Methods 0.000 abstract description 6
- 238000005476 soldering Methods 0.000 abstract description 6
- 230000008018 melting Effects 0.000 abstract description 3
- 238000002844 melting Methods 0.000 abstract description 3
- 239000000126 substance Substances 0.000 abstract description 2
- 239000000203 mixture Substances 0.000 abstract 1
- 229910007570 Zn-Al Inorganic materials 0.000 description 10
- 230000005496 eutectics Effects 0.000 description 9
- 239000006023 eutectic alloy Substances 0.000 description 6
- 229910020994 Sn-Zn Inorganic materials 0.000 description 5
- 229910009069 Sn—Zn Inorganic materials 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 229910020888 Sn-Cu Inorganic materials 0.000 description 4
- 229910019204 Sn—Cu Inorganic materials 0.000 description 4
- 230000003064 anti-oxidating effect Effects 0.000 description 4
- 230000003078 antioxidant effect Effects 0.000 description 4
- 238000005266 casting Methods 0.000 description 4
- 230000004927 fusion Effects 0.000 description 4
- 238000005303 weighing Methods 0.000 description 4
- 229910018521 Al—Sb Inorganic materials 0.000 description 3
- 229910020836 Sn-Ag Inorganic materials 0.000 description 3
- 229910020988 Sn—Ag Inorganic materials 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000012467 final product Substances 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 241001062472 Stokellia anisodon Species 0.000 description 2
- 239000003963 antioxidant agent Substances 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 239000002893 slag Substances 0.000 description 2
- 239000002689 soil Substances 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 229910002058 ternary alloy Inorganic materials 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229910018182 Al—Cu Inorganic materials 0.000 description 1
- 241000500881 Lepisma Species 0.000 description 1
- 241001465754 Metazoa Species 0.000 description 1
- 241001417490 Sillaginidae Species 0.000 description 1
- 229910020830 Sn-Bi Inorganic materials 0.000 description 1
- 229910018728 Sn—Bi Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- -1 certain Cu Chemical class 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000010793 electronic waste Substances 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 230000035558 fertility Effects 0.000 description 1
- 230000008014 freezing Effects 0.000 description 1
- 238000007710 freezing Methods 0.000 description 1
- 210000001035 gastrointestinal tract Anatomy 0.000 description 1
- 238000007429 general method Methods 0.000 description 1
- 239000000383 hazardous chemical Substances 0.000 description 1
- 230000036541 health Effects 0.000 description 1
- 230000002607 hemopoietic effect Effects 0.000 description 1
- 210000000987 immune system Anatomy 0.000 description 1
- 238000001727 in vivo Methods 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 230000005764 inhibitory process Effects 0.000 description 1
- 229910000765 intermetallic Inorganic materials 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000001537 neural effect Effects 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 231100000614 poison Toxicity 0.000 description 1
- 230000007096 poisonous effect Effects 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 238000005382 thermal cycling Methods 0.000 description 1
- 231100000331 toxic Toxicity 0.000 description 1
- 230000002588 toxic effect Effects 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
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Abstract
The present invention provides a leadless soldering flux, and is characterized by that its composition contains (wt%) 5-20% of Zn, 0.2-5% or Al, 0-2.5% of Sb, 0-1.5% of Cu and the rest is Sn and inevitable impurity. Said soldering flux contains no harmful substance Pb, and its melting point and melting interval are approximated to that of existent Sn-Pb alloy, it also has the excellent oxidation resistance, and shows the excellent performance-price ratio.
Description
Technical field
The present invention relates to lead-free solder, relate more specifically to a kind of lead-free solder that is suitable for brazing solders such as electronics assembling and encapsulation and electrical equipment, Communication Equipment, automobile.
Background technology
The use of scolder is with a long history, and with slicker solder water receiving pipe being extensive use of to the hyundai electronics industry, the annual according to statistics world has 20000 tons of lead to be used in the electron trade approximately from ancient Roman.Our employed scolder is the Sn-Pb eutectic alloy at present, and is leaded 37%, and fusing point is 183 ℃, and the resistance toheat of it and base material is approaching, and has good weldability, electroconductibility and lower advantages such as price, thereby is widely used.But lead is a kind of polyaffinity poisonous substance that has, have the property of accumulating in vivo, be difficult for excreting, plumbous to all toxic effect of each histoorgan in the body, main infringement neural system, hemopoietic system, Digestive tract and human immune system, and the Fertility that jeopardizes the mankind and animal.The waste and old electric product is buried in the soil, and the lead in its scolder pollutes soil through the infiltration meeting, and the water that permeates the ground will seriously jeopardize human health.The problem of Lead contamination has caused the very big concern of countries in the world, and many countries are administering " electronic waste " as the task of top priority.
The tin-base lead-free solder of studying at present is:
(1) Sn-Cu serial alloy welding material
The Sn-Cu eutectic alloy consists of 99.3Sn-0.7Cu, and fusing point is approximately 227 ℃, have many good qualities, but obviously weak point is that fusing point is too high.
(2) Sn-Bi serial alloy welding material
Consist of 42Sn-58Bi, eutectic temperature is 138 ℃, and fusing point is low, and performance is similar to Sn-Pb, but shortcoming is the Bi resource-constrained, the price height, and thermostability is not as good as the Sn-Pb alloy.
(3) Sn-Ag serial alloy welding material
The Sn-Ag series lead-free solder is based on its brilliant scolder of 96.5Sn-3.5Ag, adds metals such as certain Cu, Bi, In and forms.Sn-Ag is that the advantage of scolder is: resistance to fatigue obviously is better than the Sn-Pb eutectic solder, and tensile strength, early strength and longterm strength are all superior than Sn-Pb.But the problem that exists is to cost an arm and a leg, and fusing point is higher.
(4) Sn-Zn serial alloy welding material
Classical group becomes 91Sn-9Zn, and eutectic temperature is 198 ℃, is characterized in: fusing point is close with the Sn-Pb eutectic solder; Ductility is identical substantially with the Sn-Pb eutectic solder; Tensile strength and creep resistance are more superior than Sn-Pb eutectic solder; Cost is low.Shortcoming is easy oxidation, and welding slag is many, and the storage stability of soldering paste is poor.
Summary of the invention
The purpose of this invention is to provide a kind of novel lead-free scolder with superiority price ratio.
Lead-free solder of the present invention contains (% by weight): 5～20 Zn, 0.2～5 Al, 0～2.5 Sb, 0～1.5 Cu, surplus is Sn and unavoidable impurities.
Usually, the lead-free solder that the present invention relates to contains (% by weight): 8～10 Zn, 0.4～0.6 Al, and surplus is Sn and unavoidable impurities, its temperature of fusion is 188～198 ℃, alternative existing Sn-Pb eutectic alloy;
The lead-free solder that the present invention relates to contains (% by weight): 8～12 Zn, 0.4～1.0 Al, 0.5～1.5 Cu, surplus is Sn and unavoidable impurities, its temperature of fusion is 188～220 ℃, can be used for welding strength and fusing point are had the occasion of particular requirement;
The lead-free solder that the present invention relates to contains (% by weight): 8～14 Zn, 0.4～0.7 Al, 0.2～0.7 Sb, and surplus is Sn and unavoidable impurities, its temperature of fusion is 188～230 ℃, alternative existing Sn-Pb solder.
Lead-free solder of the present invention can be made by the general method casting, it is the weighing raw metal, fusion prepares Zn-Al, Zn-Al-Sb, Sn-Cu master alloy, again Sn is melted, add Zn-Al, Zn-Al-Sb, Sn-Cu master alloy, note stirring, fusing back cooling fast fully, the mutual solid solubility of each element is improved, and precipitate refinement and disperse.Aforesaid operations can carry out in air, also can carry out in a vacuum or under protection of inert gas.
In existing tin-base lead-free solder research system, consider that from cost and abundance the Sn-Zn solder is have practical value most a kind of.We discover, the oxidation essence of Sn-Zn alloy is the oxidation of Zn, because the zone of oxidation of Zn is loosened, it can not stop the Sn-Zn alloy further oxidized effectively, thereby its oxidising process is without stop, must cause that the easy oxidation of Sn-Zn solder, welding slag are many, the phenomenons such as storage stability difference of soldering paste.The present invention as antioxidant, configures the accurate eutectic alloy of Sn-Zn-Al ternary with excellent antioxidant performance with the Al element, and accurate eutectic temperature is 188 ℃, and the temperature range of liquid-solid two-phase coexistence is 2-4 ℃.
Microscopic mechanism is resolved: because Al is a face-centred cubic structure; has isotropic feature; so the Sn-Zn-Al alloy is when solidifying; Al separates out and is distributed in the alloy substrate with the form of highly dispersed small particle; each small particle all produces the anti-oxidation protection effect to the alloy substrate in the certain limit on every side; like this, with more a spot of Al, just can play the ideal antioxidant effect.
In the Sn-Zn-Al alloy, add a certain amount of Cu, Sb, can form intermetallic compound, can play effective inhibition to FATIGUE CRACK GROWTH, and can regulate wettability, electroconductibility and the thermal conductivity of welding flux alloy with Sn.The lead-free solder of the present invention Pb that do not contain hazardous substance, its fusing point and melting region and existing Sn-Pb eutectic alloy are very approaching, and have good antioxidant property.This scolder demonstrates superior cost performance, with existing welding set and technology good consistency is arranged.
Description of drawings
Fig. 1 is the intensification and the temperature lowering curve of the accurate eutectic alloy of Sn-Zn-Al, and its fusing point and freezing point temperature are about 188 ℃, 2～4 ℃ of the temperature ranges of liquid-solid two-phase coexistence.
Embodiment
Embodiment 1
By (weight %) proportioning weighing raw metal, Zn is 8.8, Al is 0.5, surplus is Sn, putting into stove smelts, fusing back casting get final product the Sn-Zn-Al solder, its temperature lift-down curve as shown in Figure 1, the accurate eutectic temperature of Sn-Zn-Al ternary alloy is about 188 ℃ as can be known, and is very approaching with 183 ℃ of the eutectic temperatures of Sn-Pb alloy.Electric iron with routine carries out welding test to the Sn-Zn-Al lead-free solder, can go up tin and welding smoothly.Thermal cycling test shows that the Sn-Zn-Al ternary alloy has very excellent antioxidation performance.
Embodiment 2
By (weight %) proportioning weighing raw metal, Zn is 10, Al is 0.5, Cu is 0.8, surplus is Sn, put into stove and smelt, the casting of fusing back get final product the Sn-Zn-Al-Cu solder, very excellent antioxidation performance is arranged.
Embodiment 3
By (weight %) proportioning weighing raw metal, Zn is 10, Al is 0.5, Sb is 0.3, surplus is Sn, put into stove and smelt, the casting of fusing back get final product the Sn-Zn-Al-Sb solder, alternative existing Sn-Pb solder (non-cocrystallizing type) has very excellent antioxidation performance.
Leadless welding alloy of the present invention can obtain various physical form by general making method well known in the prior art, as paste, powder, piece, rod and silk etc., and then be adapted to multiple weldprocedure, as Reflow Soldering, wave soldering and manual welding etc., also can in spraying plating and coating technology, use.
Claims (4)
1. lead-free solder with superiority price ratio, it is characterized in that containing (% by weight): 5～20 Zn, 0.2～5 Al, 0～2.5 Sb, 0～1.5 Cu, surplus is Sn and unavoidable impurities.
2. by the described lead-free solder of claim 1, it is characterized in that containing (% by weight): 8～10 Zn, 0.4～0.6 Al, surplus is Sn and unavoidable impurities.
3. by the described lead-free solder of claim 1, it is characterized in that containing (% by weight): 8～12 Zn, 0.4～1.0 Al, 0.5～1.5 Cu, surplus is Sn and unavoidable impurities.
4. by the described lead-free solder of claim 1, it is characterized in that containing (% by weight): 8～14 Zn, 0.4～1.2 Al, 0.2～0.8 Sb, surplus is Sn and unavoidable impurities.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 03116488 CN1239291C (en) | 2003-04-16 | 2003-04-16 | Leadless welding flux with optimum informance and price ratio |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 03116488 CN1239291C (en) | 2003-04-16 | 2003-04-16 | Leadless welding flux with optimum informance and price ratio |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1443626A true CN1443626A (en) | 2003-09-24 |
| CN1239291C CN1239291C (en) | 2006-02-01 |
Family
ID=27814887
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 03116488 Expired - Fee Related CN1239291C (en) | 2003-04-16 | 2003-04-16 | Leadless welding flux with optimum informance and price ratio |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1239291C (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2007014530A1 (en) * | 2005-08-02 | 2007-02-08 | Jusheng Ma | Lead-free sn-ag-cu-ni-al system solder alloy |
| CN100396426C (en) * | 2005-12-12 | 2008-06-25 | 黄德欢 | Al-Cu-Sn series lead-free soldering tin |
| CN100457367C (en) * | 2006-12-12 | 2009-02-04 | 朱晓明 | A leadless solder |
| CN101880792A (en) * | 2010-06-07 | 2010-11-10 | 深圳市亿铖达工业有限公司 | Anti-corrosive anti-oxidation Pb-free solder alloy for aluminum soldering |
| CN102029478A (en) * | 2010-12-10 | 2011-04-27 | 株洲冶炼集团股份有限公司 | Lead-free solder |
| CN104353840A (en) * | 2014-11-25 | 2015-02-18 | 北京康普锡威科技有限公司 | Low-cost lead-free soldering flux alloy powder for LED (light emitting diode) and preparation method of alloy powder |
| CN105436738A (en) * | 2015-07-13 | 2016-03-30 | 深圳市国睿通用物理科技开发有限公司 | Low-temperature solder alloy and preparation method and application thereof |
| CN106676321A (en) * | 2016-12-07 | 2017-05-17 | 北京态金科技有限公司 | Low-melting-point metal and preparation method and application thereof |
-
2003
- 2003-04-16 CN CN 03116488 patent/CN1239291C/en not_active Expired - Fee Related
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2007014530A1 (en) * | 2005-08-02 | 2007-02-08 | Jusheng Ma | Lead-free sn-ag-cu-ni-al system solder alloy |
| CN1313631C (en) * | 2005-08-02 | 2007-05-02 | 马莒生 | Tin silver copper nickel aluminium series leadless welding flux alloy |
| CN100396426C (en) * | 2005-12-12 | 2008-06-25 | 黄德欢 | Al-Cu-Sn series lead-free soldering tin |
| CN100457367C (en) * | 2006-12-12 | 2009-02-04 | 朱晓明 | A leadless solder |
| CN101880792A (en) * | 2010-06-07 | 2010-11-10 | 深圳市亿铖达工业有限公司 | Anti-corrosive anti-oxidation Pb-free solder alloy for aluminum soldering |
| CN101880792B (en) * | 2010-06-07 | 2012-08-22 | 深圳市亿铖达工业有限公司 | Anti-corrosive anti-oxidation Pb-free solder alloy for aluminum soldering |
| CN102029478A (en) * | 2010-12-10 | 2011-04-27 | 株洲冶炼集团股份有限公司 | Lead-free solder |
| CN104353840A (en) * | 2014-11-25 | 2015-02-18 | 北京康普锡威科技有限公司 | Low-cost lead-free soldering flux alloy powder for LED (light emitting diode) and preparation method of alloy powder |
| CN105436738A (en) * | 2015-07-13 | 2016-03-30 | 深圳市国睿通用物理科技开发有限公司 | Low-temperature solder alloy and preparation method and application thereof |
| CN106676321A (en) * | 2016-12-07 | 2017-05-17 | 北京态金科技有限公司 | Low-melting-point metal and preparation method and application thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1239291C (en) | 2006-02-01 |
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Granted publication date: 20060201 Termination date: 20100416 |