CN105834611A - High-electrical-conductivity and high-reliability Ce-Sn-Ag-Cu solder suitable for electronic packaging - Google Patents
High-electrical-conductivity and high-reliability Ce-Sn-Ag-Cu solder suitable for electronic packaging Download PDFInfo
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- CN105834611A CN105834611A CN201610288123.9A CN201610288123A CN105834611A CN 105834611 A CN105834611 A CN 105834611A CN 201610288123 A CN201610288123 A CN 201610288123A CN 105834611 A CN105834611 A CN 105834611A
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- solder
- electronic packaging
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- reliability
- alloy
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
Abstract
The invention discloses high-electrical-conductivity and high-reliability Ce-Sn-Ag-Cu solder suitable for electronic packaging. Main metal elements of solder alloy include Ce, Sn, Ag, Cu and Be. According to the solder, by adding a trace amount of Be to the Ce-Sn-Ag-Cu solder alloy, the oxidation corrosion resistance, electrical conductivity and thermal conductivity of the solder alloy are improved unexpectedly; and after welding, the dimensional stability of welding spots are high, the anti-dropping capability of the welding spots is high, and strict requirements of existing electronic packaging can be met.
Description
Technical field
The present invention relates to a kind of high performance solder, particularly to a kind of high conductance high reliability being applicable to Electronic Packaging
Ce-Sn-Ag-Cu solder.
Background technology
Develop to thin, light, little and digitized, multifunction direction along with electronic product, the miniaturization of electronic devices and components,
The development trend of precise treatment and high performance will further speed up so that the number of welds for Electronic Packaging increases, size
Diminish, spacing more and more narrow, and the calorifics that it is born, electricity, mechanical loading are more and more higher.Research shows, electronic device
Inefficacy have 70% to be that wherein, solder joint failure is chief reason by caused by the inefficacy encapsulating and assembling.
Solder joint can provide again the same of mechanical connection as electrical path in Electronic Packaging between chip and substrate
Shi Tigao thermal conductivity, is used widely in electronics load, so welding spot reliability problem has very important research meaning
Justice.
The development of High Density Integration ultra fine-pitch Electronic Packaging be necessarily faced with welding spot reliability decline challenge, wherein,
The interconnection short circuit between fillet lifting and the salient point caused is concentrated to be electronic product due to thermal stress between chip bump and pad
In relatively common failure mode.In order to avoid the generation of this situation, need the most effective dimensionally stable controlling solder joint
Property and be on active service during electrical and thermal conductivity performance.
Having studied bright, Ce-Sn-Ag-Cu solder has ratio traditional more preferable electric conductivity of Sn-Pb solder and density,
Although fusion temperature is more slightly higher than Sn-Pb solder, but all within the scope of existing soldering processes are acceptable.The moistening of solder,
Sprawling result of the test to show, Ce-Sn-Ag-Cu solder all ratios on Au/Ni/Cu substrate have more preferable moistening on Cu substrate
Performance.Adding the Ce element of trace, the moistening of Sn-Ag-Cu solder, spreading property can be made to increase significantly, solder is at substrate
On spreading area increase, wetting time shorten, wetting power improve, angle of wetting reduce.The addition of Ce is left 0.03% ~ 0.05%
Time right, the wetting and spreading performance of Ce-Sn-Ag-Cu solder is optimal, and its wetting time shortens than the Sn-Ag-Cu solder being not added with Ce
20%～40%.Ce is surface active element, has enrichment phenomenon on Sn-Ag-Cu solder surface, and the surface enrichment of Ce reduces molten
Melt the surface tension of solder, be effectively improved the moistening of lead-free brazing, spreading property.Solder joint mechanical property test result table
Bright, the interpolation of Ce all will improve tensile force and the shearing force of plate resistor solder joint of its QFP pin solder joint.When Ce content exists
When about 0.03%, the mechanical property of Ce-Sn-Ag-Cu solder joint is optimal.For QFP32, QFP100 and three kinds of electronics of plate resistor
Components and parts, tensile force (shearing force) value of Sn-Ag-Cu-0.03Ce solder joint improves 4.56% than Sn-Ag-Cu solder joint respectively,
4.06% and 3.81%.Theory analysis shows, owing to rare earth element ce has " parent Sn " effect, i.e. Ce element is preferential and Sn element is tied
Close, therefore, the interpolation of Ce can make brazing filler metal alloy and the structure refinement of solder joint, homogenization, can be effectively prevented from Sn element with
Ag element combines and generates thick Ag3Sn intermetallic compound, thus improve the mechanical property of solder joint.Unleaded to QFP pin
Solder joint and plate resistor Lead-Free Solder Joint carry out thermal cycling test (the actual military service situation of simulating solder joint) it was found that experienced by
After Long Time Thermal cyclic test, solder joint mechanical property is gradually lowered along with the increase in thermal cycle cycle, and trace rare-earth element
The addition of Ce can delay the deterioration of solder joint mechanical property, thus is effectively improved the reliability of solder joint.
But, the electrical conductance of Ce-Sn-Ag-Cu solder, reliability still can not meet the harshness of existing Electronic Packaging and want
Ask.Develop the solder that a kind of performance is the most excellent.
Summary of the invention
It is an object of the invention to provide a kind of high conductance high reliability Ce-Sn-Ag-Cu weldering being applicable to Electronic Packaging
Material.
The technical solution used in the present invention is:
A kind of high conductance high reliability Ce-Sn-Ag-Cu solder being applicable to Electronic Packaging, the main metal element of solder alloy
For Ce, Sn, Ag, Cu and Be.
As the further improvement of above-mentioned solder, in solder alloy, the mass percent of main metal element is: Ag: 2.0
～3.8%, Cu: 0.4～0.7%, Ce:0.01～0.7%, Be:0.01～1.0%, surplus is Sn.
As the further improvement of above-mentioned solder, in solder alloy, the mass percent of main metal element is: Ag: 3.0
～3.8%, Cu: 0.5～0.7%, Ce:0.02～0.7%, Be:0.2～0.5%, surplus is Sn.
As the further improvement of above-mentioned solder, in solder alloy, the quality of Ag with Cu adds ratio is (5～6): 1, preferably
, it is (5～5.4) that the quality of Ag with Cu adds ratio: 1.
As the further improvement of above-mentioned solder, in solder alloy, the quality of Ce with Be adds ratio for 1:(1～2), preferably
, the quality of Ce with Be adds ratio for 1:(1～1.5).
A kind of circuit board, circuit board has solder joint, and solder joint is highly reliable by the above-mentioned high conductance being applicable to Electronic Packaging
Property Ce-Sn-Ag-Cu solder welding obtain.
The invention has the beneficial effects as follows:
The solder of the present invention, by adding trace Be in Ce-Sn-Ag-Cu solder alloy solder, improves weldering unexpectedly
The antioxidant anticorrosive performance of material alloy and electrical and thermal conductivity performance, the dimensional stability of postwelding solder joint is high, solder joint anti-dropping capability is strong,
The rigors of existing Electronic Packaging can be met.
Accompanying drawing explanation
Fig. 1 is comparative example 1, the metallograph of comparative example 2 solder alloy；
Fig. 2 is the metallograph of embodiment 1 solder alloy；
Fig. 3 is the solder alloy SEM figure of comparative example 1；
Fig. 4 is the solder alloy SEM figure of comparative example 2 and embodiment 1；
Fig. 5 comparative example 1, comparative example 2 and embodiment 1,2,3 tensile strength of solder joint comparison diagram；
Fig. 6 embodiment 1,2,3,4 solder joint pictorial diagram；
Fig. 7 is the welding point interface figure of comparative example 1, comparative example 2；
Fig. 8 is the welding point interface figure of embodiment 1.
Detailed description of the invention
A kind of high conductance high reliability Ce-Sn-Ag-Cu solder being applicable to Electronic Packaging, the major metal of solder alloy
Element is Ce, Sn, Ag, Cu and Be.Solder can also contain inevitable impurity element.
As the further improvement of above-mentioned solder, in solder alloy, the mass percent of main metal element is: Ag: 2.0
～3.8%, Cu: 0.4～0.7%, Ce:0.01～0.7%, Be:0.01～1.0%, surplus is Sn.
As the further improvement of above-mentioned solder, in solder alloy, the mass percent of main metal element is: Ag: 3.0
～3.8%, Cu: 0.5～0.7%, Ce:0.02～0.7%, Be:0.2～0.5%, surplus is Sn.
As the further improvement of above-mentioned solder, in solder alloy, the quality of Ag with Cu adds ratio is (5～6): 1, preferably
, it is (5～5.4) that the quality of Ag with Cu adds ratio: 1.
As the further improvement of above-mentioned solder, in solder alloy, the quality of Ce with Be adds ratio for 1:(1～2), preferably
, the quality of Ce with Be adds ratio for 1:(1～1.5).
A kind of circuit board, circuit board has solder joint, and solder joint is highly reliable by the above-mentioned high conductance being applicable to Electronic Packaging
Property Ce-Sn-Ag-Cu solder welding obtain.
The solder of the present invention can prepare according to a conventional method, i.e. forms according to the alloy of solder, weighs corresponding metal
Under element or alloy, vacuum state or protection gas shielded, melting is uniform, and secondary melt back is uniform afterwards, uses routine side as required
Method manufactured Board, band, paper tinsel, thread or ultra-fine welding powder.
Below in conjunction with embodiment, further illustrate technical scheme.
For the sake of conveniently comparing, the solder of following example and comparative example is prepared as follows:
1) weigh corresponding raw metal by solder composition, in vacuum intermediate-frequency induction melting furnace, rise in argon atmosphere
Temperature, to 850～1000 DEG C of meltings, is incubated 0.5h；
2) 400～500 DEG C of remeltings 3 times it are cooled to, uniform to ensure the component of organization preparing alloy, air cooling subsequently, prepare solder
Ingot blank；
3) as required, solder ingot blank is used directly as solder, or use the method for the machining such as pressure rolling, extruding to make
Plate, band, paper tinsel, gage solder, or utilize Close-Coupled Gas Atomization equipment be atomized into 15～25 μm, 20～38 the ultra-fine welding powder of μm in case making
With.
The solder composition of embodiment and comparative example is as follows:
Below in conjunction with experiment, further illustrate the performance difference of different solder.
Fig. 1 is comparative example 1, the metallograph of comparative example 2 solder alloy, and Fig. 2 is that the metallographic of embodiment 1 solder alloy shines
Sheet.It can be seen that by adding Be element at Ce-Sn-Ag-Cu solder, β-Sn tissue can significantly be refined, form
By original bar-shaped to granular transformation, and the distribution of crystal grain more disperse is tiny.
Fig. 3 is the solder alloy SEM figure of comparative example 1, and Fig. 4 is the solder alloy SEM figure of comparative example 2 and embodiment 1.From figure
In it can be seen that the solder of the present invention, moreover it is possible to refined eutectic structure, on the basis of Sn-Ag-Cu-Ce solder, add Be element
Can significantly Ag in refined eutectic structure3The size of Sn phase, can be effectively improved the mechanical property of solder alloy.
Fig. 5 comparative example 1, comparative example 2 and embodiment 1,2,3 tensile strength of solder joint comparison diagram.It can be seen that utilize
Solder joint prepared by the solder of the present invention has more preferable mechanical property.
Fig. 6 embodiment 1,2,3,4 solder joint pictorial diagram.It can be seen that the sold joint that the solder of the present invention is formed
Property is excellent, surface zero defect.
Fig. 7 is the welding point interface figure of comparative example 1, comparative example 2, and Fig. 8 is the welding point interface figure of embodiment 1.From figure permissible
Finding out, the welding point interface of the present invention is straight, by adding Be element so that welding point interface is changed to straightened by scallop shape, and
Inhibit the growth of welding point interface brittle compound layer, improve the mechanical property of welding point interface to a certain extent.
Claims (8)
1. it is applicable to a high conductance high reliability Ce-Sn-Ag-Cu solder for Electronic Packaging, the major metal unit of solder alloy
Element is Ce, Sn, Ag, Cu and Be.
The high conductance high reliability Ce-Sn-Ag-Cu solder being applicable to Electronic Packaging the most according to claim 1, its feature
It is: the mass percent of main metal element is: Ag: 2.0～3.8%, Cu: 0.4～0.7%, Ce:0.01～0.7%,
Be:0.01～1.0%, surplus is Sn.
The high conductance high reliability Ce-Sn-Ag-Cu solder being applicable to Electronic Packaging the most according to claim 1, its feature
It is: the mass percent of main metal element is: Ag: 3.0～3.8%, Cu: 0.5～0.7%, Ce:0.02～0.7%,
Be:0.2～0.5%, surplus is Sn.
The high conductance high reliability Ce-Sn-Ag-Cu solder being applicable to Electronic Packaging the most according to claim 2, its feature
It is: it is (5～6) that the quality of Ag with Cu adds ratio: 1.
5. according to the high conductance high reliability Ce-Sn-Ag-Cu solder being applicable to Electronic Packaging described in claim 2 or 4, its
It is characterised by: the quality of Ce with Be adds ratio for 1:(1～2).
The high conductance high reliability Ce-Sn-Ag-Cu solder being applicable to Electronic Packaging the most according to claim 4, its feature
It is: it is (5～5.4) that the quality of Ag with Cu adds ratio: 1.
The high conductance high reliability Ce-Sn-Ag-Cu solder being applicable to Electronic Packaging the most according to claim 5, its feature
It is: the quality of Ce with Be adds ratio for 1:(1～1.5).
8. a circuit board, circuit board has solder joint, it is characterised in that: solder joint is by described in claim 1～7 any one
The high conductance high reliability Ce-Sn-Ag-Cu solder welding being applicable to Electronic Packaging obtains.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610288123.9A CN105834611B (en) | 2016-05-04 | 2016-05-04 | A kind of high conductance high reliability Ce Sn Ag Cu solders suitable for Electronic Packaging |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610288123.9A CN105834611B (en) | 2016-05-04 | 2016-05-04 | A kind of high conductance high reliability Ce Sn Ag Cu solders suitable for Electronic Packaging |
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| CN105834611A true CN105834611A (en) | 2016-08-10 |
| CN105834611B CN105834611B (en) | 2018-02-13 |
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| CN201610288123.9A Expired - Fee Related CN105834611B (en) | 2016-05-04 | 2016-05-04 | A kind of high conductance high reliability Ce Sn Ag Cu solders suitable for Electronic Packaging |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106825983A (en) * | 2017-03-10 | 2017-06-13 | 南京达迈科技实业有限公司 | A kind of SnAgSbNi series lead-free soldering tins alloy and its preparation method and application |
| CN113857713A (en) * | 2021-09-15 | 2021-12-31 | 昆明理工大学 | Low-silver Sn-Ag-Cu lead-free solder and preparation method thereof |
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| CN105149809A (en) * | 2015-10-10 | 2015-12-16 | 南京青锐风新材料科技有限公司 | Antioxidant suitable for SnAgCu or SnCu solder and preparation method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN106825983A (en) * | 2017-03-10 | 2017-06-13 | 南京达迈科技实业有限公司 | A kind of SnAgSbNi series lead-free soldering tins alloy and its preparation method and application |
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| CN113857713A (en) * | 2021-09-15 | 2021-12-31 | 昆明理工大学 | Low-silver Sn-Ag-Cu lead-free solder and preparation method thereof |
| CN113857713B (en) * | 2021-09-15 | 2023-02-28 | 昆明理工大学 | Low-silver Sn-Ag-Cu lead-free solder and preparation method thereof |
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| CN105834611B (en) | 2018-02-13 |
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