CN106475707A - Solder for soldering aluminium oxide ceramics and oxygen-free copper and preparation and method for welding - Google Patents
Solder for soldering aluminium oxide ceramics and oxygen-free copper and preparation and method for welding Download PDFInfo
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- CN106475707A CN106475707A CN201611257505.1A CN201611257505A CN106475707A CN 106475707 A CN106475707 A CN 106475707A CN 201611257505 A CN201611257505 A CN 201611257505A CN 106475707 A CN106475707 A CN 106475707A
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- solder
- oxygen
- aluminium oxide
- oxide ceramics
- free copper
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/3006—Ag as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/40—Making wire or rods for soldering or welding
Abstract
The invention discloses a kind of solder for soldering aluminium oxide ceramics and oxygen-free copper, selected solder elemental composition by weight percentage includes：Cu22.0%～28.0%, In10.0%～14.0%, Ti3.0%～5.0%, Pr0.01%～0.3%, Ce0.01%～0.2%, balance of Ag.The solder for soldering aluminium oxide ceramics and oxygen-free copper of the present invention, the good fluidity of this solder, good to mother metal wettability and good with the binding ability of oxygen-free copper and aluminium oxide ceramics, shear strength is high, can effectively reduce the residual stress producing during soldering；At 770 DEG C, brazing filler metal melts temperature declines to a great extent the brazing temperature of solder of the present invention, and under brazing temperature, brazing filler metal melts are uniform；Particularly with the addition of mixed rare-earth elements Ce, Pr, significantly improve the wettability of solder, reduce brazing temperature, the thickness of controlling interface compound, significantly improve joint mechanical property.
Description
Technical field
The present invention relates to the solder for soldering aluminium oxide ceramics and oxygen-free copper and preparation and method for welding, belong to welding neck
Domain.
Background technology
Highly purified aluminium oxide ceramics have high temperature resistant, corrosion-resistant, wear-resistant and dielectric strength is high, dielectric loss is low, electric
The excellent feature such as stable performance, oxygen-free copper has excellent conduction, heat conductivility and good machining property, and it contains
Oxygen amount is low, chemical activity is less, and processing characteristics is better than fine copper.The two is welded, respective feature can be given full play to, obtain
Obtain excellent properties.But due to aluminium oxide ceramics with oxygen-free copper as coefficient-of-linear-expansion difference is larger, soldering processes are proposed
High requirement.Came soldering silica/alumina pottery and oxygen-free copper using the method for indirect soldering in the past, but indirect soldering pollution
Greatly, in actual application, there is inconvenience in complex operation.Li Feibin et al. proposes direct using Ag-Cu-Ti active solder
Soldering high-purity alumina ceramic and oxygen-free copper, the method can be with soldering aluminium oxide ceramics and oxygen-free copper, but brazing temperature is higher,
Reach 850 DEG C, leading to easily to produce brittle phase makes the shearing strength of welding point relatively low；Wang Xianfeng, Liu Libin et al. use Cu-
Ti solder brazing aluminium oxide ceramics and oxygen-free copper, brazing temperature reaches 1000 DEG C, and brazing temperature is too high, easily produces Cu3Ti3O
Phase, producing unsound compound makes intensity decline.
Content of the invention
Goal of the invention：In order to overcome the deficiencies in the prior art, the present invention provides a kind of soldering aluminium oxide that is used for make pottery
The solder of porcelain and oxygen-free copper and preparation and method for welding, the brazing temperature of this solder at 770 DEG C, brazing filler metal melts temperature significantly under
Fall, under brazing temperature, brazing filler metal melts are uniform；Particularly with the addition of mixed rare-earth elements Ce, Pr, significantly improve the moistening of solder
Property, reduce brazing temperature, the thickness of controlling interface compound, significantly improve joint mechanical property.
Technical scheme：For solving above-mentioned technical problem, the present invention a kind of for soldering aluminium oxide ceramics and oxygen-free copper
Solder, described solder elemental composition by weight percentage includes：Cu22.0%～28.0%, In10.0%～14.0%,
Ti3.0%～5.0%, Pr0.01%～0.3%, Ce0.01%～0.2%, balance of Ag.
Preferably, described solder elemental composition by weight percentage includes：Cu24.0%～26.0%,
In11.0%～13.0%, Ti3.5%～4.5%, Pr0.01%～0.1%, Ce0.01%～0.1%, balance of Ag.
Preferably, described solder elemental composition by weight percentage includes：Cu：25.5%, In12.0%,
Ti4.0%, Pr0.05%, Ce0.05%, balance of Ag.
Preferably, described solder is paillon foil banding, thickness is 50～100 μm.
A kind of above-mentioned preparation method for soldering aluminium oxide ceramics and the solder of oxygen-free copper, comprises the following steps：
1) highly purified Ti granule, In granule, Pr granule, Ce granule, the prepared mixture of Cu piece are weighed by mass percentage,
Put in the container added with acetone, carry out being cleaned by ultrasonic 15～20min at a temperature of 15～25 DEG C about；
2) mixture after being cleaned by ultrasonic step 1 is dried at a temperature of 30～50 DEG C, obtains the mixture of drying；
3) mixture and Ag are adopted the method prepared composition uniform solder foundry alloy of vacuum induction melting, will prepare
Foundry alloy pulverize after, load high vacuum single roller strip machine quartz glass tube in；
4) quartz glass tube is installed in and gets rid of in the electrical induction circle with machine, and its nozzle to copper roller surface spacing is adjusted
Whole is 150～200 μm；
5) close fire door, be evacuated to 1.5 × 10 using mechanical pump-3Pa, then adopts molecular pump pumping high vacuum, fine vacuum
Degree is not less than 9 × 10-5Pa, then cavity is full of high-purity Ar gas to 200～230mbar；
6) open motor, make, in the range of copper roller rotating speed 28～33m/s, to be then turned on high frequency electric source, by quartz glass tube
Foundry alloy high-frequency induction heating to complete molten homogeneous, be incubated superheated melt 60s～80s；
7) Ar gas air pressure is modulated P=50KPa, with high pressure argon gas, the superheated melt in quartz glass is continuously ejected into height
The cooling copper roller surface of speed rotation, liquid metal is formed foil shape by chilling, thus obtaining solder foil strip, thickness for 50～
100μm.
Preferably, described step 4) in nozzle be rectangle, its length is 8～10mm, and width is 0.8～1.2mm.
Preferably, described step 6) in copper roller diameter be 250mm, copper roller width is 50mm.
A kind of above-mentioned method for welding for soldering aluminium oxide ceramics and the solder of oxygen-free copper, comprises the following steps：
1) preparatory stage：Aluminium oxide ceramics to be brazed and oxygen-free copper sample end face are cleared up, removes the miscellaneous of surface
Matter, greasy dirt and oxide-film, are ground smooth with abrasive paper for metallograph, and aluminium oxide ceramics are put together with oxygen-free copper and solder paillon foil
In acetone, 15～20min is cleaned using ultrasound wave, and carries out drying and processing, period is paid special attention to prevent the oxygen of solder element
Change；
2) assembling stage：Solder paillon foil after cleaning is placed between aluminium oxide ceramics and oxygen-free copper welding surface, and tightly
Attachment is assigned in special brazing jig the precision it is ensured that connecting, and places the pressure head of nominal-mass on fixture, produce 0.04～
The constant perpendicular pressure of 0.06MPa；
3) the soldering connection stage：The fixture assembling is integrally placed at vacuum and is not less than 1.5 × 10-5The soldering oven of Pa
In, with the ramp of 15 DEG C/min to 500 DEG C, it is incubated 30min, then with the ramp of 10 DEG C/min to 770 DEG C, insulation
20min, then it is cooled to 300 DEG C with the speed of 5 DEG C/min, cool to room temperature afterwards again with the furnace, blow-on is taken out and by weldering connector is
Can.
Beneficial effect：Compared with prior art, the present invention has advantages below：
(1) remarkable advantage of the present invention is the good fluidity of this solder, good to mother metal wettability, and with oxygen-free copper and oxidation
The binding ability of aluminum pottery is good, and shear strength is high, can effectively reduce the residual stress producing during soldering；The pricker of solder of the present invention
At 770 DEG C, brazing filler metal melts temperature declines to a great extent weldering temperature, and under brazing temperature, brazing filler metal melts are uniform；Dilute particularly with the addition of mixing
Earth elements Ce, Pr, significantly improve the wettability of solder, reduce brazing temperature, the thickness of controlling interface compound, significantly improve
Joint mechanical property.
(2) adopt the solder Joining Technology of the present invention reliable and stable, connected using vacuum brazing, component is in heating process
It is in vacuum state, whole component no deforms, no microfissure, pore and the defect such as be mingled with, its moistened surface is sprawled preferably, pricker
Material and matrix mother metal are sufficiently formed solid solution metallurgical reaction, tissue particle, are sufficient filling with brazed seam, improve the bulk strength of joint,
And have good plastic deformation ability, thus more stable reliable jointing can be obtained；
(3) the solder preparation method that the present invention obtains and soldering processes are simple, easy to implement quick, the preparation of solder and
Soldering processes repeat and reproduce, and Process of Vacuum Brazing need not add brazing flux and protective measure, be easy to widely promote and apply.
Specific embodiment
Embodiment 1
The composition of solder and mass percent proportioning are：Cu：23.0%, In11.0%, Ti3.0%, Pr0.02%,
Ce0.02%, balance of Ag.
A kind of above-mentioned preparation method for soldering aluminium oxide ceramics and the middle temperature Ag base solder of oxygen-free copper includes following step
Suddenly：
1) highly purified Ti granule, In granule, Pr granule, Ce granule, the prepared mixture of Cu piece are weighed by mass percentage,
Put in the container added with acetone, carry out being cleaned by ultrasonic 15～20min at a temperature of 20 DEG C about；
2) mixture after being cleaned by ultrasonic step 1 is dried at a temperature of 30～50 DEG C, obtains the mixture of drying；
3) mixture and Ag are adopted the method prepared composition uniform solder foundry alloy of vacuum induction melting, will prepare
Foundry alloy pulverize after, load high vacuum single roller strip machine quartz glass tube in；
4) quartz glass tube is installed in and gets rid of in the electrical induction circle with machine, and its nozzle to copper roller surface spacing is adjusted
Whole is 150～200 μm；
5) close fire door, be evacuated to 1.5 × 10 using mechanical pump-3Pa, then adopts molecular pump pumping high vacuum, fine vacuum
Degree is not less than 9 × 10-5Pa, then cavity is full of high-purity Ar gas to 200～230mbar；
6) open motor, make, in the range of copper roller rotating speed 28～33m/s, to be then turned on high frequency electric source, by quartz glass tube
Foundry alloy high-frequency induction heating to complete molten homogeneous, be incubated superheated melt 60s～80s；
7) Ar gas air pressure is modulated P=50KPa, with high pressure argon gas, the superheated melt in quartz glass is continuously ejected into height
The cooling copper roller surface of speed rotation, liquid metal is formed foil shape by chilling, thus obtaining solder foil strip, thickness for 50～
100μm.
A kind of soldering processes for soldering aluminium oxide ceramics and the middle temperature Ag base solder of oxygen-free copper are it is characterised in that include
Following steps：
1) preparatory stage：Aluminium oxide ceramics to be brazed and oxygen-free copper sample end face are cleared up, removes the miscellaneous of surface
Matter, greasy dirt and oxide-film, are ground smooth with abrasive paper for metallograph, and aluminium oxide ceramics are put together with oxygen-free copper and solder paillon foil
In acetone, 15～20min is cleaned using ultrasound wave, and carries out drying and processing, period is paid special attention to prevent the oxygen of solder element
Change；
2) assembling stage：Solder paillon foil after cleaning is placed between aluminium oxide ceramics and oxygen-free copper welding surface, and tightly
Attachment is assigned in special brazing jig the precision it is ensured that connecting, and places the pressure head of nominal-mass on fixture, produce 0.04～
The constant perpendicular pressure of 0.06MPa；
3) the soldering connection stage：The fixture assembling is integrally placed at vacuum and is not less than 1.5 × 10-5The soldering oven of Pa
In, with the ramp of 15 DEG C/min to 500 DEG C, it is incubated 30min, then with the ramp of 10 DEG C/min to 770 DEG C, insulation
20min, then it is cooled to 300 DEG C with the speed of 5 DEG C/min, cool to room temperature afterwards again with the furnace, blow-on is taken out and by weldering connector is
Can.
Result：The jointing that soldering obtains forms well, and metallographic observation finds that brazing area forms the interface cohesion of densification,
Alloying component is evenly distributed, and room temperature shear strength is 117MPa.
Embodiment 2
The composition of solder and mass percent proportioning are：Cu：27.0%, In13.0%, Ti5.0%, Pr0.08%,
Ce0.1%, balance of Ag.
A kind of above-mentioned preparation method for soldering aluminium oxide ceramics and the middle temperature Ag base solder of oxygen-free copper includes following step
Suddenly：
1) highly purified Ti granule, In granule, Pr granule, Ce granule, the prepared mixture of Cu piece are weighed by mass percentage,
Put in the container added with acetone, carry out being cleaned by ultrasonic 15～20min at a temperature of 20 DEG C about；
2) mixture after being cleaned by ultrasonic step 1 is dried at a temperature of 30～50 DEG C, obtains the mixture of drying；
3) mixture and Ag are adopted the method prepared composition uniform solder foundry alloy of vacuum induction melting, will prepare
Foundry alloy pulverize after, load high vacuum single roller strip machine quartz glass tube in；
4) quartz glass tube is installed in and gets rid of in the electrical induction circle with machine, and its nozzle to copper roller surface spacing is adjusted
Whole is 150～200 μm；
5) close fire door, be evacuated to 1.5 × 10 using mechanical pump-3Pa, then adopts molecular pump pumping high vacuum, fine vacuum
Degree is not less than 9 × 10-5Pa, then cavity is full of high-purity Ar gas to 200～230mbar；
6) open motor, make, in the range of copper roller rotating speed 28～33m/s, to be then turned on high frequency electric source, by quartz glass tube
Foundry alloy high-frequency induction heating to complete molten homogeneous, be incubated superheated melt 60s～80s；
7) by Ar gas air pressure modulation P=50KPa, with high pressure argon gas, the superheated melt in quartz glass is continuously sprayed
To the cooling copper roller surface of high-speed rotation, liquid metal is formed foil shape by chilling, thus obtaining solder foil strip, thickness is
50～100 μm.
A kind of soldering processes for soldering aluminium oxide ceramics and the middle temperature Ag base solder of oxygen-free copper are it is characterised in that include
Following steps：
1) preparatory stage：Aluminium oxide ceramics to be brazed and oxygen-free copper sample end face are cleared up, removes the miscellaneous of surface
Matter, greasy dirt and oxide-film, are ground smooth with abrasive paper for metallograph, and aluminium oxide ceramics are put together with oxygen-free copper and solder paillon foil
In acetone, 15～20min is cleaned using ultrasound wave, and carries out drying and processing, period is paid special attention to prevent the oxygen of solder element
Change；
2) assembling stage：Solder paillon foil after cleaning is placed between aluminium oxide ceramics and oxygen-free copper welding surface, and tightly
Attachment is assigned in special brazing jig the precision it is ensured that connecting, and places the pressure head of nominal-mass on fixture, produce 0.04～
The constant perpendicular pressure of 0.06MPa；
3) the soldering connection stage：The fixture assembling is integrally placed at vacuum and is not less than 1.5 × 10-5The soldering oven of Pa
In, with the ramp of 15 DEG C/min to 500 DEG C, it is incubated 30min, then with the ramp of 10 DEG C/min to 770 DEG C, insulation
20min, then it is cooled to 300 DEG C with the speed of 5 DEG C/min, cool to room temperature afterwards again with the furnace, blow-on is taken out and by weldering connector is
Can.
Result：The jointing that soldering obtains forms well, and metallographic observation finds that brazing area forms the interface cohesion of densification,
Alloying component is evenly distributed, and room temperature shear strength is 122MPa.
Embodiment 3
The composition of solder and mass percent proportioning are：Cu：25.5%, In12.0%, Ti4.0%, Pr0.05%,
Ce0.05%, balance of Ag.
A kind of above-mentioned preparation method for soldering aluminium oxide ceramics and the middle temperature Ag base solder of oxygen-free copper includes following step
Suddenly：
1) highly purified Ti granule, In granule, Pr granule, Ce granule, the prepared mixture of Cu piece are weighed by mass percentage,
Put in the container added with acetone, carry out being cleaned by ultrasonic 15～20min at a temperature of 20 DEG C about；
2) mixture after being cleaned by ultrasonic step 1 is dried at a temperature of 30～50 DEG C, obtains the mixture of drying；
3) mixture and Ag are adopted the method prepared composition uniform solder foundry alloy of vacuum induction melting, will prepare
Foundry alloy pulverize after, load high vacuum single roller strip machine quartz glass tube in；
4) quartz glass tube is installed in and gets rid of in the electrical induction circle with machine, and its nozzle to copper roller surface spacing is adjusted
Whole is 150～200 μm；
5) close fire door, be evacuated to 1.5 × 10 using mechanical pump-3Pa, then adopts molecular pump pumping high vacuum, fine vacuum
Degree is not less than 9 × 10-5Pa, then cavity is full of high-purity Ar gas to 200～230mbar；
6) open motor, make, in the range of copper roller rotating speed 28～33m/s, to be then turned on high frequency electric source, by quartz glass tube
Foundry alloy high-frequency induction heating to complete molten homogeneous, be incubated superheated melt 60s～80s；
7) by Ar gas air pressure modulation P=50KPa, with high pressure argon gas, the superheated melt in quartz glass is continuously sprayed
To the cooling copper roller surface of high-speed rotation, liquid metal is formed foil shape by chilling, thus obtaining solder foil strip, thickness is
50～100 μm.
A kind of soldering processes for soldering aluminium oxide ceramics and the middle temperature Ag base solder of oxygen-free copper are it is characterised in that include
Following steps：
1) preparatory stage：Aluminium oxide ceramics to be brazed and oxygen-free copper sample end face are cleared up, removes the miscellaneous of surface
Matter, greasy dirt and oxide-film, are ground smooth with abrasive paper for metallograph, and aluminium oxide ceramics are put together with oxygen-free copper and solder paillon foil
In acetone, 15～20min is cleaned using ultrasound wave, and carries out drying and processing, period is paid special attention to prevent the oxygen of solder element
Change；
2) assembling stage：Solder paillon foil after cleaning is placed between aluminium oxide ceramics and oxygen-free copper welding surface, and tightly
Attachment is assigned in special brazing jig the precision it is ensured that connecting, and places the pressure head of nominal-mass on fixture, produce 0.04～
The constant perpendicular pressure of 0.06MPa；
3) the soldering connection stage：The fixture assembling is integrally placed at vacuum and is not less than 1.5 × 10-5The soldering oven of Pa
In, with the ramp of 15 DEG C/min to 500 DEG C, it is incubated 30min, then with the ramp of 10 DEG C/min to 770 DEG C, insulation
20min, then it is cooled to 300 DEG C with the speed of 5 DEG C/min, cool to room temperature afterwards again with the furnace, blow-on is taken out and by weldering connector is
Can.
Result：The jointing that soldering obtains forms well, and metallographic observation finds that brazing area forms the interface cohesion of densification,
Alloying component is evenly distributed, and room temperature shear strength is 134MPa.
Embodiment 4
The composition of solder and mass percent proportioning are：Cu：22.0%, In10.0%, Ti3.0%, Pr0.01%,
Ce0.01%, balance of Ag.
The preparation method of solder and welding method are same as Example 1.
Result：The jointing that soldering obtains forms well, and metallographic observation finds that brazing area forms the interface cohesion of densification,
Alloying component is evenly distributed, and room temperature shear strength is 131MPa.
Embodiment 5
The composition of solder and mass percent proportioning are：Cu：28.0%, In14.0%, Ti5.0%, Pr0.3%,
Ce0.2%, balance of Ag.
The preparation method of solder and welding method are same as Example 1.
Result：The jointing that soldering obtains forms well, and metallographic observation finds that brazing area forms the interface cohesion of densification,
Alloying component is evenly distributed, and room temperature shear strength is 125MPa.
Embodiment 6
The composition of solder and mass percent proportioning are：Cu：24.0%, In11.0%, Ti3.5.0%, Pr0.01%,
Ce0.01%, balance of Ag.
The preparation method of solder and welding method are same as Example 1.
Result：The jointing that soldering obtains forms well, and metallographic observation finds that brazing area forms the interface cohesion of densification,
Alloying component is evenly distributed, and room temperature shear strength is 127MPa.
Embodiment 7
Design 3 groups of comparative examples, basic step is same as Example 3, difference is that material content is different, specially：
The constituent content of comparative example 1：Cu25.0%, In13.0%, Ti4.0%, Pr0.0%, Ce0.0%, balance of Ag.
The constituent content of comparative example 2：Cu29.5%, In12.0%, Ti4.0%, Pr0.05%, Ce0.05%, balance of
Ag.
The constituent content of comparative example 3：Cu25.0%, In12.0%, Ti4.0%, Pr0.2%, Ce0.2%, balance of Ag.
Embodiment 1-3 and 7 welding points being obtained are carried out performance detection, the result of the test of acquisition is as shown in table 1.
Table 1
As shown in Table 1, the soldered fitting dense micro-structure that embodiment 1-3 is obtained, is uniformly distributed, and linkage interface is obvious,
Shear strength is between 117～134MPa, it can thus be appreciated that the present invention is used for the middle temperature Ag base of soldering aluminium oxide ceramics and oxygen-free copper
Solder possesses good adhesive force and wettability, and soldered fitting bond strength is high.
Contrast test 1 shows, without the addition of rare earth element, the content of suitable raising In also can be entered at 770 DEG C
Row soldering, but lacked the wetting action of rare earth it is impossible to suppress the generation of intermetallic compound, joint performance, the shearing of joint
Intensity is remarkably decreased.Contrast test 2 shows although Cu element is mother metal matrix element, can reduce Cu matrix in soldering
Consume, but Cu element is excessive, the activity of Ti can be suppressed, deteriorate wettability, so, Cu constituent content can not be too high, according to reality
Test and show, content is the most suitable 25% about.Contrast test 3 shows, rare earth element is excessive, can lead under the wettability of solder
Fall, excessive rare earth can aoxidize slagging, increases the viscosity of solder, wettability degradation, joint performance is also remarkably decreased.
The above be only the preferred embodiment of the present invention it should be pointed out that：Ordinary skill people for the art
For member, under the premise without departing from the principles of the invention, some improvements and modifications can also be made, these improvements and modifications also should
It is considered as protection scope of the present invention.
Claims (8)
1. a kind of solder for soldering aluminium oxide ceramics and oxygen-free copper it is characterised in that：Described solder is by weight percentage
Elemental composition include：Cu22.0%～28.0%, In10.0%～14.0%, Ti3.0%～5.0%, Pr0.01%～
0.3%, Ce0.01%～0.2%, balance of Ag.
2. the solder for soldering aluminium oxide ceramics and oxygen-free copper according to claim 1 it is characterised in that：Described solder
Elemental composition by weight percentage includes：Cu24.0%～26.0%, In11.0%～13.0%, Ti3.5%～
4.5%, Pr0.01%～0.1%, Ce0.01%～0.1%, balance of Ag.
3. the solder for soldering aluminium oxide ceramics and oxygen-free copper according to claim 2 it is characterised in that：Described solder
Elemental composition by weight percentage includes：Cu：25.5%, In12.0%, Ti4.0%, Pr0.05%, Ce0.05%, remaining
Measure as Ag.
4. the solder for soldering aluminium oxide ceramics and oxygen-free copper according to claim 1 it is characterised in that：Described solder
For paillon foil banding, thickness is 50～100 μm.
5. the preparation side for soldering aluminium oxide ceramics and the solder of oxygen-free copper as described in a kind of any one as Claims 1-4
Method is it is characterised in that comprise the following steps：
1) weigh highly purified Ti granule, In granule, Pr granule, Ce granule, the prepared mixture of Cu piece by mass percentage, put into
In container added with acetone, carry out being cleaned by ultrasonic 15～20min at a temperature of 15～25 DEG C about；
2) mixture after being cleaned by ultrasonic step 1 is dried at a temperature of 30～50 DEG C, obtains the mixture of drying；
3) mixture and Ag are adopted the method prepared composition uniform solder foundry alloy of vacuum induction melting, by the mother preparing
After alloy pulverizes, load in the quartz glass tube of high vacuum single roller strip machine；
4) quartz glass tube is installed in and gets rid of in the electrical induction circle with machine, and its nozzle is adjusted to copper roller surface spacing
150～200 μm；
5) close fire door, be evacuated to 1.5 × 10 using mechanical pump-3Pa, then adopts molecular pump pumping high vacuum, condition of high vacuum degree is not
Less than 9 × 10-5Pa, then cavity is full of high-purity Ar gas to 200～230mbar；
6) open motor, make, in the range of copper roller rotating speed 28～33m/s, to be then turned on high frequency electric source, by the mother in quartz glass tube
Alloy high-frequency induction heating, to complete molten homogeneous, is incubated superheated melt 60s～80s；
7) Ar gas air pressure is modulated P=50KPa, with high pressure argon gas, the superheated melt in quartz glass is continuously ejected into rotation at a high speed
The cooling copper roller surface turning, liquid metal is formed foil shape by chilling, thus obtaining solder foil strip, thickness is 50～100 μ
m.
6. the preparation method for soldering aluminium oxide ceramics and the solder of oxygen-free copper according to claim 5, its feature exists
In：Described step 4) in nozzle be rectangle, its length be 8～10mm, width be 0.8～1.2mm.
7. the preparation method for soldering aluminium oxide ceramics and the solder of oxygen-free copper according to claim 5, its feature exists
In：Described step 6) in copper roller diameter be 250mm, copper roller width be 50mm.
8. the soldering side for soldering aluminium oxide ceramics and the solder of oxygen-free copper as described in a kind of any one as claim 1-4
Method is it is characterised in that comprise the following steps：
1) preparatory stage：Aluminium oxide ceramics to be brazed and oxygen-free copper sample end face are cleared up, removes impurity, the oil on surface
Dirt and oxide-film, are ground with abrasive paper for metallograph smooth, aluminium oxide ceramics are placed in third together with oxygen-free copper and solder paillon foil
In ketone, 15～20min is cleaned using ultrasound wave, and carries out drying and processing；
2) assembling stage：Solder paillon foil after cleaning is placed between aluminium oxide ceramics and oxygen-free copper welding surface, and is close to fill
It is assigned in special brazing jig the precision it is ensured that connecting, the pressure head of nominal-mass is placed on fixture, produce 0.04～
The constant perpendicular pressure of 0.06MPa；
3) the soldering connection stage：The fixture assembling is integrally placed at vacuum and is not less than 1.5 × 10-5In the soldering oven of Pa, with
The ramp of 15 DEG C/min, to 500 DEG C, is incubated 30min, then with the ramp of 10 DEG C/min to 770 DEG C, is incubated 20min,
It is cooled to 300 DEG C with the speed of 5 DEG C/min again, cools to room temperature afterwards again with the furnace, blow-on is taken out by weldering connector.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611257505.1A CN106475707A (en) | 2016-12-30 | 2016-12-30 | Solder for soldering aluminium oxide ceramics and oxygen-free copper and preparation and method for welding |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611257505.1A CN106475707A (en) | 2016-12-30 | 2016-12-30 | Solder for soldering aluminium oxide ceramics and oxygen-free copper and preparation and method for welding |
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| Publication Number | Publication Date |
|---|---|
| CN106475707A true CN106475707A (en) | 2017-03-08 |
Family
ID=58285203
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| CN201611257505.1A Pending CN106475707A (en) | 2016-12-30 | 2016-12-30 | Solder for soldering aluminium oxide ceramics and oxygen-free copper and preparation and method for welding |
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| CN (1) | CN106475707A (en) |
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| CN109175785A (en) * | 2018-10-31 | 2019-01-11 | 无锡日月合金材料有限公司 | A kind of vacuum seal solder alloy |
| CN114160899A (en) * | 2021-12-19 | 2022-03-11 | 南京理工大学 | Manufacturing method of cast aluminum engine piston component |
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