JPH01299790A - Alloy for joining of ceramics and metal - Google Patents
Alloy for joining of ceramics and metalInfo
- Publication number
- JPH01299790A JPH01299790A JP12874788A JP12874788A JPH01299790A JP H01299790 A JPH01299790 A JP H01299790A JP 12874788 A JP12874788 A JP 12874788A JP 12874788 A JP12874788 A JP 12874788A JP H01299790 A JPH01299790 A JP H01299790A
- Authority
- JP
- Japan
- Prior art keywords
- alloy
- ceramics
- metal
- joining
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910045601 alloy Inorganic materials 0.000 title claims abstract description 41
- 239000000956 alloy Substances 0.000 title claims abstract description 41
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 36
- 239000002184 metal Substances 0.000 title claims abstract description 36
- 239000000919 ceramic Substances 0.000 title claims abstract description 28
- 238000005304 joining Methods 0.000 title claims abstract description 13
- 229910052802 copper Inorganic materials 0.000 claims abstract description 8
- 229910052709 silver Inorganic materials 0.000 claims abstract description 7
- 229910052719 titanium Inorganic materials 0.000 claims abstract description 7
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 abstract description 13
- 238000005219 brazing Methods 0.000 abstract description 12
- 239000000463 material Substances 0.000 abstract description 11
- 150000002739 metals Chemical class 0.000 abstract description 10
- 239000000945 filler Substances 0.000 abstract description 6
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 abstract description 6
- 229910052721 tungsten Inorganic materials 0.000 abstract description 6
- 239000010937 tungsten Substances 0.000 abstract description 6
- 229910000679 solder Inorganic materials 0.000 abstract description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 15
- 238000000034 method Methods 0.000 description 11
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 6
- 229910052574 oxide ceramic Inorganic materials 0.000 description 6
- 239000011224 oxide ceramic Substances 0.000 description 6
- 239000010949 copper Substances 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- 229910052759 nickel Inorganic materials 0.000 description 5
- 238000012360 testing method Methods 0.000 description 5
- 238000002844 melting Methods 0.000 description 4
- 230000008018 melting Effects 0.000 description 4
- 229910052575 non-oxide ceramic Inorganic materials 0.000 description 4
- 239000011225 non-oxide ceramic Substances 0.000 description 4
- 238000001816 cooling Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- 238000012790 confirmation Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 229910000975 Carbon steel Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 229910001093 Zr alloy Inorganic materials 0.000 description 1
- 239000010962 carbon steel Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 238000007429 general method Methods 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000003870 refractory metal Substances 0.000 description 1
- -1 sialon Chemical compound 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/3006—Ag as the principal constituent
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Ceramic Products (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野］
本発明は、セラミックスと金属とを接合する合金、特に
構造体用ろう材に好適な高接合性合金に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an alloy for joining ceramics and metals, and particularly to a highly bondable alloy suitable for a brazing filler metal for structures.
［従来の技術］
従来より、セラミックスと金属とを接合する方法の一つ
として、いわゆる活性金属法が採用されている。この活
性金属法は、ろう材をセラミックスと金属との間に介在
させ、加熱溶融させることによりセラミックスと金属と
を接合するものである。このろう材としてはＴｉ、Ｚｒ
などの活性金属を含む合金が用いられている。[Prior Art] Conventionally, a so-called active metal method has been employed as one of the methods for joining ceramics and metals. In this active metal method, a brazing material is interposed between a ceramic and a metal, and the ceramic and the metal are bonded by heating and melting the brazing material. As this brazing material, Ti, Zr
Alloys containing active metals such as
［発明が解決しようとする課題］
この様なろう材は一応の接合強度を発揮するのであるが
、特に構造材として用いられる酸化物系セラミ・ンクス
（アルミナ、ジルコニア等）と金属との接合に適用した
場合には、未だ十分な接合強度を持つものとは言えなか
った。この接合強度の不足は特に主成分の酸化物の純度
が高いほど顕著であった。これは酸化物に対してろう材
の濡れ性が不十分であるためであった。[Problem to be solved by the invention] Although such a brazing filler metal exhibits a certain degree of bonding strength, it is particularly difficult to bond oxide-based ceramics (alumina, zirconia, etc.) used as structural materials with metal. When applied, it could not yet be said to have sufficient bonding strength. This lack of bonding strength was particularly noticeable as the purity of the main component oxide was higher. This was due to insufficient wettability of the brazing material to the oxide.
この他の接合方法にＭｏ−Ｍｎ系のペーストを用いる高
融点金属法がある。高融点金属法は、上記ペーストをセ
ラミックスの表面に塗布し、水素雰囲気中で１４００〜
１６００℃で焼成してメタライズ層を設け、更にその表
面にＮｉメ・ンキを行って金属化面を形成し、Ａ ｇ
−Ｃｕ共晶ろうを用いてセラミックスと金属とを接合す
るものである。Another bonding method is a high melting point metal method using a Mo--Mn paste. In the high melting point metal method, the above paste is applied to the surface of ceramics, and the
A metallized layer is formed by firing at 1600°C, and the surface is coated with Ni to form a metallized surface.
-Cu eutectic solder is used to join ceramics and metal.
しかしながら、高融点金属法は、金属化面の形成に工数
が多くかかり、更に水素雰囲気下でかつ高温といった厳
しい条件下で厳格な温度・雰囲気管理を必要とする。こ
のため、設備が大がかりなものとなるとともに、エネル
ギーも大量に消費しコストアップとならざるを得ない。However, the refractory metal method requires a large number of man-hours to form a metallized surface, and also requires strict temperature and atmosphere control under severe conditions such as hydrogen atmosphere and high temperature. Therefore, the equipment becomes large-scale, consumes a large amount of energy, and costs inevitably increase.
しかも、本方法も構造体用に高純度の酸化物系セラミッ
クスを接合するには十分な接合強度とは言えなかった。Furthermore, this method also did not provide sufficient bonding strength for bonding high-purity oxide ceramics for structural bodies.
［目的］
本発明は、作業が容易な活性金属法で用いられる接合用
合金を改良することにより、セラミックス、特に酸化物
系セラミックスである高純度のアルミナセラミックスや
ジルコニアセラミックス等と金属との接合に対して信頼
性の高い接合を実現し、簡単な処理で十分な接合強度を
発揮する合金を提供することを目的とする。[Purpose] The present invention improves the bonding alloy used in the active metal method, which is easy to work with, so that it can be used for bonding ceramics, especially oxide ceramics such as high-purity alumina ceramics and zirconia ceramics, to metals. The purpose of the present invention is to provide an alloy that achieves highly reliable bonding and exhibits sufficient bonding strength through simple processing.
［課題を解決するための手段］
かかる問題点を解決するための本発明の要旨とするとこ
ろは、
Ａｇ、Ｃｕ及びＴ１を含む接合用合金において、更に、
Ｍｎが１〜２０重量％含有されてなることを特徴とする
セラミ・ンクスと金属との接合用合金にある。[Means for Solving the Problems] The gist of the present invention for solving the above problems is as follows: In a joining alloy containing Ag, Cu and T1,
An alloy for bonding ceramic inx and metal, characterized by containing 1 to 20% by weight of Mn.
ここで、Ａｇ、Ｃｕ及びＴｉを含む接合用合金とは通常
用いられているろう材の成分を含んでいることを示して
いる。これらの含有割合は、溶融温度、濡れ性及びろう
付性の観点から、好ましくはＡｇ、Ｃｕ及びＴｉの含有
重量比が、４０〜９０：５０以下：１〜１１のものを用
いる。Here, the joining alloy containing Ag, Cu, and Ti indicates that it contains the components of a commonly used brazing filler metal. From the viewpoint of melting temperature, wettability, and brazing property, the content ratio of these materials is preferably such that the weight ratio of Ag, Cu, and Ti is 40 to 90:50: 1 to 11.
本発明の接合用合金は、上記合金中に更にＭｎが１〜２
０重量％含有させたものである。Ｍｎが１重量％未満で
あると本発明の高接合効果は発揮されず、２０重量％を
越えると本合金が脆化し、衝撃により、本合金部分で破
断し易くなる。The joining alloy of the present invention further contains 1 to 2 Mn in the above alloy.
It contains 0% by weight. If Mn is less than 1% by weight, the high bonding effect of the present invention is not exhibited, and if it exceeds 20% by weight, the alloy becomes brittle and tends to break at the alloy portion due to impact.
このろう材としての合金の製造は、その成分、即ち、Ｍ
ｎ、 Ａｇ、 ＣＩ４及びＴ１に対応する原料、ある
いは必要で有れば他の成分用の原料も加えて、−船釣な
方法で製造される。また所望の形状への加工も一般的な
方法で板状、棒状あるいはブロック状等に成形される。The production of this alloy as a brazing material depends on its composition, namely M
The raw materials corresponding to Ag, CI4 and T1 or, if necessary, the raw materials for other components are also added - produced in a boat-based manner. Further, processing into a desired shape is performed by a general method such as a plate shape, a rod shape, or a block shape.
接合対象のセラミックスとしては、酸化物系セラミック
スだけでなく非酸化物系セラミックスも含む。酸化物系
セラミックスとしては、例えばアルミナ、ジルコニア、
チタニア等が挙げられる。Ceramics to be bonded include not only oxide ceramics but also non-oxide ceramics. Examples of oxide ceramics include alumina, zirconia,
Examples include titania.
また、非酸化物系セラミックスとしては、例えば窒化珪
素、サイアロン、炭化珪素等が挙げられる。Examples of non-oxide ceramics include silicon nitride, sialon, and silicon carbide.
これらの各種セラミックに対して本発明の合金は十分な
接合性を有するのであるが、特に酸化物・系セラミック
スに対しては、従来のＭｎを含有しない接合用合金に比
べて顕著な接合力の向上がみられる。The alloy of the present invention has sufficient bonding properties for these various ceramics, but especially for oxide-based ceramics, it has a remarkable bonding strength compared to conventional bonding alloys that do not contain Mn. There is an improvement.
また、接合対象の金属としては、例えばニッケル、銅、
炭素鋼などの鉄等の過密の金属が挙げられる。In addition, examples of metals to be joined include nickel, copper,
Examples include dense metals such as iron such as carbon steel.
この接合用合金を用いたセラミ・ンクスと金属との接合
は、例えばセラミックスと金属との間に本合金を置いて
加熱し、本合金を溶融させることによりセラミックスの
表面と金属の表面とを濡らし、その後冷却することによ
り完了する。To join ceramics and metal using this bonding alloy, for example, the alloy is placed between the ceramic and the metal, heated, and the alloy is melted to wet the surface of the ceramic and the metal. , and then completed by cooling.
［作用］
本発明の接合用合金を用いて活性金属法でセラミックス
と金属とを接合させると、金属側に対しては相溶性が有
ることから十分に濡れて冷却固化後も十分な接合力を示
す。非酸化物系のセラミックス側に対しては従来のろう
材と同じく十分な濡れ性を示して接合力を発揮する。[Function] When ceramics and metal are bonded by the active metal method using the bonding alloy of the present invention, since it is compatible with the metal side, it is sufficiently wetted and maintains sufficient bonding force even after cooling and solidifying. show. Like conventional brazing filler metals, it exhibits sufficient wettability and exhibits bonding strength on the non-oxide ceramic side.
酸化物系のセラミックスに対しては特にほん合金中のＭ
ｎがセラミックス表面で酸化物に変化し、そのＭｎ酸化
物の性質により、本合金の酸化物系セラミックスへの濡
れ性が高まっていることが想像される。このことにより
、本合金のセラミックスへの接合力の向上に結び付くの
ではないかと思われる。Especially for oxide-based ceramics, M in alloys
It is assumed that n changes to an oxide on the ceramic surface, and the wettability of the present alloy to the oxide-based ceramics is enhanced due to the properties of the Mn oxide. This seems to lead to an improvement in the bonding strength of this alloy to ceramics.
［発明の効果］
本発明の接合用合金はＭｎの存在により、非酸化物系の
セラミックスばかりでなく、酸化物系のセラミックス、
特に高純度の酸化物系セラミックスにもきわめて強固に
接合し、構造体用にも十分に使用可能なセラミックと金
属との接合体を実現できる。[Effects of the Invention] Due to the presence of Mn, the bonding alloy of the present invention can be used not only for non-oxide ceramics but also for oxide ceramics,
In particular, it is possible to realize a ceramic-metal bonded body that can be bonded extremely firmly to high-purity oxide ceramics and can be sufficiently used for structural bodies.
［実施例コ 次に実施例について説明する。[Example code] Next, an example will be described.
まず接合に先立って、第１表に示す供試材Ｎｏ。First, prior to joining, test material No. shown in Table 1 was prepared.
１〜７を図の縦断面図に示すごとく番号順に積み上げた
。各供試材の直径は１１ｍｍである。次に、１Ｏ−５Ｔ
ｏｒｒの真空中で８５０±５０℃で３０分間加熱した。Items 1 to 7 were stacked in numerical order as shown in the longitudinal cross-sectional view of the figure. The diameter of each specimen is 11 mm. Next, 1O-5T
Heated at 850±50° C. for 30 minutes in a vacuum of orr.
この加熱によって、アルミナ１とニッケル板３との間に
存在する本実施例の合金２が溶融し、アルミナ１の表面
及びニッケル板３の表面を濡らす。By this heating, the alloy 2 of the present example existing between the alumina 1 and the nickel plate 3 is melted, and the surface of the alumina 1 and the surface of the nickel plate 3 are wetted.
これを冷却固化させることにより接合を完了した。The bonding was completed by cooling and solidifying this.
同時に第２の合金（ＢＡｇ８）４．６も溶融し、二・ン
ケル板３とタングステン板５とを接合し、更にタングス
テン板５とニッケル棒７とを接合する。At the same time, the second alloy (BAg8) 4.6 is also melted, and the two-layer plate 3 and the tungsten plate 5 are joined together, and further the tungsten plate 5 and the nickel rod 7 are joined together.
このことにより、一体となった接合体８が形成された。As a result, an integrated joined body 8 was formed.
これらニッケル板３及びタングステン板５を介在させる
のは、アルミナ１とニッケル棒７との間の熱膨張率差に
よる残留応力を緩和するためである。The reason why the nickel plate 3 and the tungsten plate 5 are interposed is to relieve residual stress due to the difference in thermal expansion coefficient between the alumina 1 and the nickel rod 7.
第１衷
（％はすべて重量％）
次にアルミナ１とニッケル棒３との接合の強度確認試験
について説明する。First side (all percentages are by weight) Next, a strength confirmation test for bonding the alumina 1 and the nickel rod 3 will be described.
［確認試験コ
まず、この実施例の接合体８を、直径１０ｍｍの円柱状
に切削加工により成形する。そしてこの接合体８につい
て、下方から２点で支え、上方から２点で押圧する周知
の４点まけ試験を行った。[Confirmation Test First, the joined body 8 of this example is formed by cutting into a cylindrical shape with a diameter of 10 mm. A well-known four-point test was conducted on this joined body 8, in which it was supported at two points from below and pressed at two points from above.
その試験条件は、クロスヘツドスピード０．５ｍｍＺ分
、上部スパン１８ｍｍ、下部スパン４０ｍｍとし、大気
中でかつ室温で実験を行った。The test conditions were a crosshead speed of 0.5 mmZ, an upper span of 18 mm, and a lower span of 40 mm, and the experiment was conducted in the atmosphere at room temperature.
この結果、破断位置はアルミナ１内部であり、破断強度
は２３． １ ｋ ｇ／ｍｍ”であった。As a result, the fracture location was inside alumina 1, and the fracture strength was 23. 1 kg/mm”.
比較例として第１表に示した合金２の配合の内、Ｍｎの
みを除いて製造した合金を用いて、同様な測定を行った
ところ、破断位置はアルミナ１と合金２との界面であり
、礁断強度は１８．８ｋｇ／ｍｍ２であった・
尚、セラミックスとしてアルミナ以外のセラミックスと
二・ンケル以外の金属との接合に対して、上記合金２ｔ
ｉ）るいは本発明の組成範囲に含まれる各種配合の接合
用合金を用いた場合にも、同様に高い接合強度を示した
。特に酸化物系のセラミックスについては本発明の組成
範囲に含まれる合金が、従来の活性金属法の合金に比較
して顕著に高い接合強度を示し、構造材にも用い得るこ
とが判明した。As a comparative example, similar measurements were performed using an alloy produced by excluding only Mn from the alloy 2 formulation shown in Table 1, and the fracture position was at the interface between alumina 1 and alloy 2. The reef breaking strength was 18.8 kg/mm2.For the bonding of ceramics other than alumina and metals other than Ni-Nker, the above alloy 2t
i) Similarly, high bonding strength was also exhibited when bonding alloys of various compositions within the composition range of the present invention were used. In particular, for oxide-based ceramics, it has been found that alloys within the composition range of the present invention exhibit significantly higher bonding strength than alloys using conventional active metal methods, and can also be used for structural materials.
図は接合体８の縦断面図である。
１・◆・アルミナ ２・・・接合用合金３・・
・ニッケル板 ４，６・・・ＢＡｇ８５・・・
タングステン板 ７・令・ニッケル棒８・・・接合
体The figure is a longitudinal cross-sectional view of the joined body 8. 1・◆・Alumina 2・・・Jointing alloy 3・・
・Nickel plate 4,6...BAg85...
Tungsten plate 7, age, nickel rod 8...joint body
Claims (1)
とするセラミックスと金属との接合用合金。 ２ Ａｇ、Ｃｕ及びＴｉの含有重量比が、４０〜９０：
５０以下：１〜１１である請求項１記載のセラミックス
と金属との接合用合金。[Scope of Claims] 1. An alloy for joining ceramics and metal, which further contains 1 to 20% by weight of Mn in the joining alloy containing Ag, Cu, and Ti. 2 The content weight ratio of Ag, Cu and Ti is 40 to 90:
50 or less: The alloy for joining ceramics and metal according to claim 1, which has a ratio of 1 to 11.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63128747A JPH0681677B2 (en) | 1988-05-26 | 1988-05-26 | Alloy for joining ceramics and metals |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63128747A JPH0681677B2 (en) | 1988-05-26 | 1988-05-26 | Alloy for joining ceramics and metals |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01299790A true JPH01299790A (en) | 1989-12-04 |
| JPH0681677B2 JPH0681677B2 (en) | 1994-10-19 |
Family
ID=14992461
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63128747A Expired - Fee Related JPH0681677B2 (en) | 1988-05-26 | 1988-05-26 | Alloy for joining ceramics and metals |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0681677B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106475707A (en) * | 2016-12-30 | 2017-03-08 | 江苏科技大学 | Solder for soldering aluminium oxide ceramics and oxygen-free copper and preparation and method for welding |
| CN112372178A (en) * | 2020-04-11 | 2021-02-19 | 湖北中烟工业有限责任公司 | Composite brazing filler metal and preparation method thereof |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5551503A (en) * | 1978-10-07 | 1980-04-15 | Matsushita Electric Works Ltd | Preparation of dressing veneer |
-
1988
- 1988-05-26 JP JP63128747A patent/JPH0681677B2/en not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5551503A (en) * | 1978-10-07 | 1980-04-15 | Matsushita Electric Works Ltd | Preparation of dressing veneer |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106475707A (en) * | 2016-12-30 | 2017-03-08 | 江苏科技大学 | Solder for soldering aluminium oxide ceramics and oxygen-free copper and preparation and method for welding |
| CN112372178A (en) * | 2020-04-11 | 2021-02-19 | 湖北中烟工业有限责任公司 | Composite brazing filler metal and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0681677B2 (en) | 1994-10-19 |
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| LAPS | Cancellation because of no payment of annual fees |