CN105436741A - Silver-copper-indium-titanium middle-temperature brazing filler metal - Google Patents
Silver-copper-indium-titanium middle-temperature brazing filler metal Download PDFInfo
- Publication number
- CN105436741A CN105436741A CN201510920495.4A CN201510920495A CN105436741A CN 105436741 A CN105436741 A CN 105436741A CN 201510920495 A CN201510920495 A CN 201510920495A CN 105436741 A CN105436741 A CN 105436741A
- Authority
- CN
- China
- Prior art keywords
- copper
- silver
- indium
- filler metal
- brazing filler
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/3006—Ag as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/008—Soldering within a furnace
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/18—Dissimilar materials
Abstract
The invention belongs to the technical field of welding, and relates to a silver-copper-indium-titanium brazing filler metal used for connecting SiO2f/SiO2 composite ceramics and metals (such as tungsten, molybdenum, tungsten-molybdenum alloy, niobium, niobium-molybdenum alloy, invar alloy and kovar alloy). The silver-copper-indium-titanium brazing filler metal is characterized by comprising, by weight percentage, 19.2-28.2% of Cu, 8.2-19.4% of In, 3.5-7.2% of Ti, and the balance Ag. The brazing filler metal is good in machinability, and can be machined into strips, and required brazing temperature is lower than that of a traditional Ag-Cu-Ti brazing filler metal by about 100 DEG C, so that the silver-copper-indium-titanium brazing filler metal has a great significance in the field of ceramic and metal brazing connection in the aspect of reducing post-welding residual thermal stress of joints. The brazing filler metal not only is suitable for connecting the SiO2f/SiO2 composite ceramics and metals, and is also suitable for connecting ceramics, or connecting ceramics and metals, or connecting metals owing to excellent activity of the brazing filler metal.
Description
Technical field
The present invention relates to a kind of silver-copper-indium-titanium cored solder, be applicable to SiO
2f/ SiO
2the connection of composite ceramics and metal material, belongs to middle temperature brazing material field.
Background technology
0.33 × 10 is only for thermal coefficient of expansion
-6k
-1siO
2f/ SiO
2composite ceramics, because the coefficient of thermal expansion differences between itself and metal is very big, cause there is very large thermal stress in the joint be connected with metal, under individual cases, the joint of postwelding even directly ftractures.In order to alleviate this pottery with in metal heterogenous material joint because bi-material thermal coefficient of expansion does not mate the thermal stress caused, common solution is: (1) doses the slow release layer material of thermal coefficient of expansion between both or the fabulous slow release layer material of plasticity between metal and pottery; (2) reduce brazing temperature, reduce the materials to be welded coefficient of thermal expansion differences under high temperature; (3) solder self plasticity is improved.Often need such scheme connected applications in engineer applied to obtain best relieve stresses effect.
About SiO
2f/ SiO
2the connection of composite ceramics and metal, the units such as Beijing Research Inst. of Aeronautic Material adopt silver-copper-titanium active solder respectively to SiO
2f/ SiO
2with metallic copper, stainless steel, Invar alloy, niobium, molybdenum alloy, titanium alloy, Ti
3al base alloy, TiAl intermetallic compound connect, and result shows that the thermal coefficient of expansion of welded metal is less, and the residual thermal stress in joint is less, and strength of joint is higher.In order to alleviate the residual thermal stress in this heterogenous material joint, should select to there is the low metal of thermal coefficient of expansion if tungsten, molybdenum, tungsten-molybdenum alloy, niobium, niobium-molybdenum alloy, invar alloy or kovar alloy etc. are as slow release layer; Reducing brazing temperature in addition is also the effective means alleviating joint stress.
At present, middle temperature active solder silver-copper-titanium obtains a wide range of applications on the industrial circles such as Aeronautics and Astronautics, chemical industry, machinery, electronics, metallurgy, nuclear energy, be suitable for the brazing of following combination of materials: ceramic to ceramic, ceramic-metal, metal-metal etc., corresponding brazing temperature is generally at 860 DEG C ~ 900 DEG C.Although the application of this solder is ripe, its too high brazing temperature brings larger thermal stress in ceramic-metal joint, and the strength of joint of correspondence is also relatively low.
Silver-copper-indium-titanium system solder is near silver-copper eutectic on component base, add the indium of 8% ~ 20% and a small amount of active element titanium wherein, the object wherein adding indium reduces solder fusing point and corresponding brazing temperature, and can improve strength of joint by a relatively large margin.There is a kind of ripe trade mark silver-copper-indium-titanium solder abroad at present, the corresponding trade mark is IncusilABA, nominal composition is Ag59-Cu27.25-In12.5-Ti1.25 (mass fraction %), this solder has lower liquidus temperature, brazing temperature can control at 750 DEG C ~ 800 DEG C, the brazing temperature of more conventional silver-copper-titanium active solder is low about 100 DEG C, and this is with the obvious advantage in alleviation joint stress.But the content of the active element titanium in this solder is relatively low, at soldering SiO
2f/ SiO
2show active not enough during composite ceramics, wetting mother metal and seam-filling ability relatively poor.
In order to solve SiO
2f/ SiO
2a connection difficult problem for composite ceramics and metal, needs development to have the intermediate temperature solder of low melting point, high activity, high-ductility, to meet current engineer applied demand.
Summary of the invention
Object of the present invention provides a kind of silver-copper-indium-titanium cored solder for above-mentioned the deficiencies in the prior art just, its objective is for SiO
2f/ SiO
2the connection of composite ceramics and metal material.
The object of the invention is to be achieved through the following technical solutions:
Technical solution of the present invention provides a kind of silver-copper-indium-titanium middle temperature brazing material, and it is characterized in that: the chemical composition of this solder and percentage by weight are: Cu:19.2 ~ 28.2, In:8.2 ~ 19.4, Ti:3.5 ~ 7.2, surplus is Ag.
Technical solution of the present invention also provides a kind of and adopts described silver-copper-indium-titanium middle temperature brazing material by SiO
2f/ SiO
2composite ceramics and metal material carry out the method be connected, and the method adopts vacuum brazing technique, and the temperature of soldering is 750 DEG C ~ 800 DEG C, and described metal material refers to tungsten, molybdenum, tungsten-molybdenum alloy, niobium, niobium-molybdenum alloy, invar alloy or kovar alloy.
The advantage of technical solution of the present invention
In solder described in technical solution of the present invention, the content of titanium is 3.5% ~ 7.2%, and higher Ti content serves positive role for raising solder activity.After tested, this solder is at SiO
2f/ SiO
2angle of wetting on composite ceramics is lower than 30 °, and IncusilABA is at SiO
2f/ SiO
2angle of wetting on composite ceramics has exceeded 70 °, and this illustrates that Ti content high in solder of the present invention can promote the wetting and spreading of solder on welded mother metal.In addition, solder brazing temperature of the present invention can control at 750 DEG C ~ 800 DEG C, compare brazing temperature with routine silver-copper-titanium active solder and reduce about 100 DEG C, on the basis ensureing joint performance level, brazing temperature is more low is more beneficial to the residual thermal stress reduced in joint, more can effectively avoid occurring cracking in joint cooling procedure after brazing.With regard to strength of joint, adopt the SiO that silver-copper-titanium solder obtains
2f/ SiO
2composite ceramics-niobium shearing strength of joint is 26MPa, and this combination of materials shearing strength of joint adopting silver-copper-indium of the present invention-titanium solder to obtain reaches 30MPa, improves 15%.Moreover silver-copper-indium-titanium solder of the present invention can be prepared into band by rolling or quick cooling method and use, and also can be mixed with soldering paste and use.In addition, the connection of other ceramic to ceramic, ceramic-metal, metal-metal is also suitable for.
Detailed description of the invention
Below with reference to embodiment, technical solution of the present invention is further described:
Table 1 gives chemical analysis in the embodiment of solder described in technical solution of the present invention and each embodiment thereof and percentage by weight composition.
The type of service of above-mentioned solder can be alloy block, can be alloy rolling band, can make alloy powder, can be element mixed-powder, the chilling state foil solder that also can flash set technology be adopted as required to make.Concrete preparation method is as follows: for alloy block, the main block adopting machine-tooled method to cut required form and size on the solder ingot of melting; Band adds cold rolling rolling mainly through hot rolling cogging and is with and gets rid of band two kinds of methods preparations by chilling state foil Preparation equipment; Powder brazing alloy mainly adopts simple metal powder to carry out in proportion mixing and being prepared by powder by atomization two kinds of modes.
The method using above-mentioned high-temp solder to carry out soldering is:
(1) assemble, according to the requirement of jointing, add solder of the present invention at welded linkage interface;
(2) heat, put into vacuum furnace together with fixture after weldment assembling, cool to room temperature with the furnace again after insulation, the brazing temperature of recommendation is 750 DEG C ~ 800 DEG C.
Adopt the composition solder of the embodiment 1-35 shown in table 1, their processability is good, be prepared into band, under the brazing temperature of 750 DEG C ~ 800 DEG C, carried out SiO2f/SiO2 composite ceramics be connected with the vacuum brazing of niobium, obtain strength of joint more silver-colored-strength of joint that copper-titanium solder is corresponding exceeds more than 15%.
Adopt the composition solder of the embodiment 1-35 shown in table 1, their processability is good, be prepared into band, under the brazing temperature of 750 DEG C ~ 800 DEG C, carried out SiO2f/SiO2 composite ceramics be connected with the vacuum brazing of molybdenum, obtain strength of joint more silver-colored-strength of joint that copper-titanium solder is corresponding exceeds more than 20%.
Adopt the composition solder of the embodiment 1-35 shown in table 1, their processability is good, be prepared into band, under the brazing temperature of 750 DEG C ~ 800 DEG C, carried out SiO2f/SiO2 composite ceramics be connected with the vacuum brazing of kovar alloy, obtain strength of joint more silver-colored-strength of joint that copper-titanium solder is corresponding exceeds more than 18%.
Claims (2)
1. silver-copper-indium-titanium middle temperature brazing material, it is characterized in that: the chemical composition of this solder and percentage by weight are: Cu:19.2 ~ 28.2, In:8.2 ~ 19.4, Ti:3.5 ~ 7.2, surplus is Ag.
2. the application of silver-copper-indium-titanium middle temperature brazing material as claimed in claim 1, is characterized in that: this kind of silver-copper-indium-titanium middle temperature brazing material is used for SiO
2f/ SiO
2the connection of composite ceramics and metal material, the method for described connection adopts vacuum brazing technique, and the temperature of soldering is 750 DEG C ~ 800 DEG C, and described metal material refers to tungsten, molybdenum, tungsten-molybdenum alloy, niobium, niobium-molybdenum alloy, invar alloy or kovar alloy.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510920495.4A CN105436741A (en) | 2015-12-11 | 2015-12-11 | Silver-copper-indium-titanium middle-temperature brazing filler metal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510920495.4A CN105436741A (en) | 2015-12-11 | 2015-12-11 | Silver-copper-indium-titanium middle-temperature brazing filler metal |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105436741A true CN105436741A (en) | 2016-03-30 |
Family
ID=55547618
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510920495.4A Pending CN105436741A (en) | 2015-12-11 | 2015-12-11 | Silver-copper-indium-titanium middle-temperature brazing filler metal |
Country Status (1)
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|---|---|
| CN (1) | CN105436741A (en) |
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106475707A (en) * | 2016-12-30 | 2017-03-08 | 江苏科技大学 | Solder for soldering aluminium oxide ceramics and oxygen-free copper and preparation and method for welding |
| CN106736034A (en) * | 2016-12-30 | 2017-05-31 | 江苏科技大学 | The solder and preparation and method for welding of soldering 3D printing stainless steel and aluminium oxide ceramics |
| CN106736035A (en) * | 2016-12-30 | 2017-05-31 | 江苏科技大学 | The solder and method for welding of soldering 3D printing stainless steel and silicon nitride ceramics |
| CN108480876A (en) * | 2018-03-30 | 2018-09-04 | 西安瑞鑫科金属材料有限责任公司 | A kind of silver-base solder for zirconia ceramics and solder bonding metal |
| CN108637447A (en) * | 2018-05-15 | 2018-10-12 | 西南交通大学 | A kind of dissimilar metal electron beam soldering method of titanium alloy and kovar alloy |
| CN109384474A (en) * | 2018-11-28 | 2019-02-26 | 北京有色金属与稀土应用研究所 | Ceramic low-temp active metallization lotion, ceramic metallization method and the vacuum electron device according to this method preparation |
| CN110695567A (en) * | 2019-10-21 | 2020-01-17 | 北京航空航天大学 | Silver-based brazing filler metal with low melting point and high plasticity |
| CN112372179A (en) * | 2020-10-29 | 2021-02-19 | 西北工业大学 | Alloy solder for connecting stainless steel and carbon/carbon composite material and preparation and use method thereof |
| CN113020840A (en) * | 2021-03-02 | 2021-06-25 | 中国工程物理研究院材料研究所 | Brazing method between beryllium material and metal piece |
| CN113020735A (en) * | 2021-03-22 | 2021-06-25 | 哈尔滨工业大学 | Preparation method of silicon nitride ceramic/stainless steel braze welding joint with corrosion resistance and stress relief |
| CN113478040A (en) * | 2021-09-08 | 2021-10-08 | 北京机电研究所有限公司 | Active brazing method for improving performance of graphite/copper dissimilar material joint |
| CN113843547A (en) * | 2021-09-23 | 2021-12-28 | 浙江亚通焊材有限公司 | Low-temperature active brazing filler metal and method for brazing silicon carbide ceramic |
| CN114669816A (en) * | 2022-04-22 | 2022-06-28 | 湖南省新化县鑫星电子陶瓷有限责任公司 | Alumina ceramic-metal brazing method |
| CN114952080A (en) * | 2022-06-01 | 2022-08-30 | 中国航空制造技术研究院 | Ti-Zr-Cu-Ni-In amorphous solder for SP700 titanium alloy and preparation method and application thereof |
| CN115519849A (en) * | 2022-09-28 | 2022-12-27 | 徐州鑫华耐磨材料有限公司 | Composite wear-resisting plate and manufacturing method thereof |
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| US4883745A (en) * | 1988-11-07 | 1989-11-28 | Gte Products Corporation | Silver-copper-titanium brazing alloy containing crust inhibiting element |
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Cited By (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106475707A (en) * | 2016-12-30 | 2017-03-08 | 江苏科技大学 | Solder for soldering aluminium oxide ceramics and oxygen-free copper and preparation and method for welding |
| CN106736034A (en) * | 2016-12-30 | 2017-05-31 | 江苏科技大学 | The solder and preparation and method for welding of soldering 3D printing stainless steel and aluminium oxide ceramics |
| CN106736035A (en) * | 2016-12-30 | 2017-05-31 | 江苏科技大学 | The solder and method for welding of soldering 3D printing stainless steel and silicon nitride ceramics |
| CN108480876A (en) * | 2018-03-30 | 2018-09-04 | 西安瑞鑫科金属材料有限责任公司 | A kind of silver-base solder for zirconia ceramics and solder bonding metal |
| CN108637447A (en) * | 2018-05-15 | 2018-10-12 | 西南交通大学 | A kind of dissimilar metal electron beam soldering method of titanium alloy and kovar alloy |
| CN108637447B (en) * | 2018-05-15 | 2020-03-31 | 西南交通大学 | Electron beam welding method for dissimilar metals of titanium alloy and kovar alloy |
| CN109384474A (en) * | 2018-11-28 | 2019-02-26 | 北京有色金属与稀土应用研究所 | Ceramic low-temp active metallization lotion, ceramic metallization method and the vacuum electron device according to this method preparation |
| CN110695567A (en) * | 2019-10-21 | 2020-01-17 | 北京航空航天大学 | Silver-based brazing filler metal with low melting point and high plasticity |
| CN112372179A (en) * | 2020-10-29 | 2021-02-19 | 西北工业大学 | Alloy solder for connecting stainless steel and carbon/carbon composite material and preparation and use method thereof |
| CN113020840A (en) * | 2021-03-02 | 2021-06-25 | 中国工程物理研究院材料研究所 | Brazing method between beryllium material and metal piece |
| CN113020840B (en) * | 2021-03-02 | 2022-11-25 | 中国工程物理研究院材料研究所 | Brazing method between beryllium material and metal piece |
| CN113020735A (en) * | 2021-03-22 | 2021-06-25 | 哈尔滨工业大学 | Preparation method of silicon nitride ceramic/stainless steel braze welding joint with corrosion resistance and stress relief |
| CN113020735B (en) * | 2021-03-22 | 2022-06-21 | 哈尔滨工业大学 | Preparation method of silicon nitride ceramic/stainless steel braze welding joint with corrosion resistance and stress relief |
| CN113478040A (en) * | 2021-09-08 | 2021-10-08 | 北京机电研究所有限公司 | Active brazing method for improving performance of graphite/copper dissimilar material joint |
| CN113843547A (en) * | 2021-09-23 | 2021-12-28 | 浙江亚通焊材有限公司 | Low-temperature active brazing filler metal and method for brazing silicon carbide ceramic |
| CN114669816A (en) * | 2022-04-22 | 2022-06-28 | 湖南省新化县鑫星电子陶瓷有限责任公司 | Alumina ceramic-metal brazing method |
| CN114669816B (en) * | 2022-04-22 | 2023-08-22 | 湖南省新化县鑫星电子陶瓷有限责任公司 | Alumina ceramic-metal brazing method |
| CN114952080A (en) * | 2022-06-01 | 2022-08-30 | 中国航空制造技术研究院 | Ti-Zr-Cu-Ni-In amorphous solder for SP700 titanium alloy and preparation method and application thereof |
| CN115519849A (en) * | 2022-09-28 | 2022-12-27 | 徐州鑫华耐磨材料有限公司 | Composite wear-resisting plate and manufacturing method thereof |
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Application publication date: 20160330 |