CN103894694B - A kind of compound green low-melting-point glass solder connects the method for Aluminum Matrix Composites Strengthened by SiC - Google Patents

A kind of compound green low-melting-point glass solder connects the method for Aluminum Matrix Composites Strengthened by SiC Download PDF

Info

Publication number
CN103894694B
CN103894694B CN201410155293.0A CN201410155293A CN103894694B CN 103894694 B CN103894694 B CN 103894694B CN 201410155293 A CN201410155293 A CN 201410155293A CN 103894694 B CN103894694 B CN 103894694B
Authority
CN
China
Prior art keywords
sic
parts
matrix composites
aluminum matrix
glass powder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201410155293.0A
Other languages
Chinese (zh)
Other versions
CN103894694A (en
Inventor
何鹏
林铁松
林盼盼
马楠
陈诚
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Harbin Institute of Technology
Original Assignee
Harbin Institute of Technology
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Harbin Institute of Technology filed Critical Harbin Institute of Technology
Priority to CN201410155293.0A priority Critical patent/CN103894694B/en
Publication of CN103894694A publication Critical patent/CN103894694A/en
Application granted granted Critical
Publication of CN103894694B publication Critical patent/CN103894694B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/008—Soldering within a furnace
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/19—Soldering, e.g. brazing, or unsoldering taking account of the properties of the materials to be soldered
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • B23K1/206—Cleaning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams, slurries
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3601—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with inorganic compounds as principal constituents
    • B23K35/3602—Carbonates, basic oxides or hydroxides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/16—Composite materials, e.g. fibre reinforced

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Glass Compositions (AREA)

Abstract

Compound green low-melting-point glass solder connects a method for Aluminum Matrix Composites Strengthened by SiC, and it relates to a kind of method connecting Aluminum Matrix Composites Strengthened by SiC.When the object of the invention is to solve SiC reinforcement body burden height in existing Aluminum Matrix Composites Strengthened by SiC, the Aluminum Matrix Composites Strengthened by SiC intensity that existing method of attachment is deposited upon connection is not high, and the low and existing solder of strength of joint and Aluminum Matrix Composites Strengthened by SiC surface exist inconsistent problem.Step: one, parent glass particle classifying; Two, take; Three, the pre-treatment of β-SiC whisker; Four, the preparation of compound lead-free low-temperature seal glass powder; Five, mix and blend; Six, impurity is removed; Seven, apply; Eight, test specimen assembling and welding.The present invention can obtain a kind of method that Aluminum Matrix Composites Strengthened by SiC low temperature brazing connects.

Description

A kind of compound green low-melting-point glass solder connects the method for Aluminum Matrix Composites Strengthened by SiC
Technical field
The present invention relates to a kind of method connecting Aluminum Matrix Composites Strengthened by SiC.
Background technology
At present, the method connecting Aluminum Matrix Composites Strengthened by SiC mainly contains melting welding, friction welding (FW), diffusion welding, soldering etc., wherein method for brazing is the most widely used method of attachment of most study, and it plays an important role in the connectivity problem solving Aluminum Matrix Composites Strengthened by SiC in engineering field.The solder being usually used in brazed aluminum based composites mainly contains aluminium silicon system and two kinds, zinc-aluminium system, no matter is which kind of solder is all undesirable to the Wet Out of matrix material.This is mainly because there is oxide film and the SiC reinforcement body of one deck densification in matrix material aluminum substrate surface, the formation key of oxide film and reinforcement is ionic linkage and covalent linkage, the metallic bond of itself and metal is completely incompatible, interfacial energy is very big, causes metal solder to be difficult to soak at these two kinds of material surfaces.
When in matrix material, carborundum content is lower, common way be abolished by brazing flux, mechanical breaking, vacuum abolish and ultrasonicly the oxide film that method removes composite material surface such as to abolish, do not consider the impact of SiC reinforcement phase simultaneously, the welding of matrix material is converted into the welding of aluminium alloy mother metal, improves the wettability of metal solder at composite material surface to a certain extent on year-on-year basis.But increasing gradually when SiC reinforcement body burden in matrix material, even if aluminum substrate surface does not exist oxide film, solder is all by not rewetting matrix material.There is researcher to pass through to adopt the modes such as plating, electroless plating at the preset W metal of composite material surface, Cu etc., indirectly achieve the welding of aluminum matrix composite.But on the one hand preset metal level and the mechanical snap between matrix material to be connected intensity own not high, affect strength of joint, the more important thing is that the method does not equally solve solder and the inconsistent root problem of composite material surface yet.
Summary of the invention
When the object of the invention is to solve SiC reinforcement body burden height in existing Aluminum Matrix Composites Strengthened by SiC, the Aluminum Matrix Composites Strengthened by SiC intensity that existing method of attachment is deposited upon connection is not high, there is inconsistent problem in the low and existing solder of strength of joint and Aluminum Matrix Composites Strengthened by SiC surface, and provides a kind of compound green low-melting-point glass solder to connect the method for Aluminum Matrix Composites Strengthened by SiC.
Compound green low-melting-point glass solder connects a method for Aluminum Matrix Composites Strengthened by SiC, specifically completes according to the following steps:
One, parent glass particle classifying: parent glass powder is placed in ball grinder, under rotating speed is 100r/min ~ 200r/min, be (35 ~ 45) in the mass ratio of abrading-ball and parent glass powder: the ratio of 1 adds abrading-ball, ball milling 1h ~ 5h, obtain powder, powder is put on 200 order metallic screens and vibrate, put on 500 order metallic screens by the powder in 200 mesh sieve holes and vibrate, be not by the powder in 500 mesh sieve holes the parent glass powder that particle diameter is 25 μm ~ 75 μm;
Parent glass powder described in step one is one or both mixture of bismuthate system lead-free low-temperature seal glass powder or phosphate-based lead-free low-temperature seal glass powder;
Bismuthate system lead-free low-temperature seal glass powder described in step one, concrete proportioning by weight mark by 40 parts ~ 50 parts Bi 2o 3, 20 parts ~ 40 parts of B 2o 3, 5 parts ~ 20 parts of BaO, 2 parts ~ 10 parts ZnO, 0.1 part ~ 2 parts Al 2o 3, 0.1 part ~ 2 parts of SiO 2with 0.1 part ~ 2 parts Li 2o forms;
Phosphate-based lead-free low-temperature seal glass powder described in step one, concrete proportioning by weight mark by 30 parts ~ 60 parts P 2o 5, 20 parts ~ 40 parts of SnO, 10 parts ~ 20 parts ZnO, 10 parts ~ 20 parts B 2o 3, 0.1 part ~ 5 parts of Al 2o 3, 0.1 part ~ 5 parts of SiO 2with 0.1 part ~ 2 parts Li 2o forms;
Two, take: take parent glass powder and β-SiC whisker that particle diameter is 25 μm ~ 75 μm;
Particle diameter described in step 2 is that to account for particle diameter be the parent glass powder of 25 μm ~ 75 μm and 75% ~ 95% of β-SiC whisker total mass to the parent glass powder of 25 μm ~ 75 μm;
It is the parent glass powder of 25 μm ~ 75 μm and 5% ~ 25% of β-SiC whisker total mass that β-SiC whisker described in step 2 accounts for particle diameter;
The particle diameter of the β-SiC whisker described in step 2 is 0.05 μm ~ 1.0 μm, length-to-diameter ratio >=10, and purity is more than 99%;
Three, the pre-treatment of β-SiC whisker: 1., under power is 50W ~ 100W, is placed in dehydrated alcohol magnetic agitation 1h ~ 3h by the β-SiC whisker after taking, and then filters and drying, obtains the β-SiC whisker after cleaning; 2., under oxygen atmosphere, the β-SiC whisker after cleaning is placed in process furnace, with the heating rate of 15 DEG C/min, process furnace is heated to 1000 DEG C ~ 1300 DEG C, and is incubated 3h ~ 5h at 1000 DEG C ~ 1300 DEG C, obtain the β-SiC whisker after being oxidized; 3., repeating step three 1. once, obtain pretreated β-SiC whisker;
Four, the preparation of compound lead-free low-temperature seal glass powder: by pretreated β-SiC whisker, take after particle diameter be that the parent glass powder of 25 μm ~ 75 μm and dehydrated alcohol are placed in ball grinder, add abrading-ball, then under nitrogen atmosphere protection and rotating speed are 200r/min ~ 400r/min, ball milling 0.5h ~ 3h, obtains compound lead-free low-temperature seal glass powder;
Particle diameter after taking described in step 4 is the parent glass powder of 25 μm ~ 75 μm and the pretreated total mass of β-SiC whisker and the volume ratio of dehydrated alcohol is 100g:(300 ~ 400) mL;
Particle diameter after taking described in step 4 is the parent glass powder of 25 μm ~ 75 μm and the pretreated total mass of β-SiC whisker and the mass ratio of abrading-ball is 1:(35 ~ 45);
Five, mix and blend: under rotating speed is 100r/min ~ 150r/min, is placed in soldering paste stirrer by compound lead-free low-temperature seal glass powder and caking agent and stirs 0.5h ~ 2h, obtains compound green low-melting-point glass solder soldering paste;
Compound lead-free low-temperature seal glass powder described in step 5 and the mass ratio of caking agent are 5:(0.5 ~ 2.5);
Caking agent described in step 5 is the mixture of Terpineol 350 and dehydrated alcohol, and described Terpineol 350 and the volume ratio of dehydrated alcohol are 5:(1 ~ 5);
Six, remove impurity: 1., adopt ultrasonic method, utilize acetone to Aluminum Matrix Composites Strengthened by SiC ultrasonic cleaning, obtain the Aluminum Matrix Composites Strengthened by SiC after cleaning; 2. use the waterproof abrasive paper of 600#, 800#, 1000# and 1200# to carry out carrying out mechanical grinding to the Aluminum Matrix Composites Strengthened by SiC after ultrasonic cleaning, successively, obtain ganoid Aluminum Matrix Composites Strengthened by SiC; 3., adopt ultrasonic method, utilize distilled water and the smooth Aluminum Matrix Composites Strengthened by SiC of acetone effects on surface to clean respectively; 4., by Aluminum Matrix Composites Strengthened by SiC dry 20min ~ 40min at the temperature of 40 DEG C ~ 60 DEG C, the Aluminum Matrix Composites Strengthened by SiC after removing impurity is obtained;
In Aluminum Matrix Composites Strengthened by SiC described in step 6, the volume fraction of silicon carbide is 10% ~ 80%;
Seven, apply: adopt the method for silk screen printing compound green low-melting-point glass solder soldering paste to be evenly coated in the surface of the Aluminum Matrix Composites Strengthened by SiC after removing impurity, coating thickness is 15 μm ~ 100 μm, obtains the Aluminum Matrix Composites Strengthened by SiC after applying;
Eight, test specimen assembling and welding: 1., by the Aluminum Matrix Composites Strengthened by SiC surface after two pieces of coatings contact and align, obtaining the test specimen to be welded assembled; 2., the test specimen to be welded assembled is positioned in resistance furnace, 0.5MPa ~ 1MPa welding pressure is applied to the test specimen to be welded assembled, by resistance furnace with the temperature rise rate of 10 DEG C/min ~ 20 DEG C/min from room temperature to 300 DEG C, and be incubated 10min ~ 30min at 300 DEG C; 3., 380 DEG C ~ 580 DEG C are warming up to the temperature rise rate of 5 DEG C/min ~ 10 DEG C/min from 300 DEG C, and 30min ~ 60min is incubated at 380 DEG C ~ 580 DEG C, naturally cool to room temperature with stove, obtain the Aluminum Matrix Composites Strengthened by SiC that compound green low-melting-point glass solder connects.
Advantage of the present invention: one, the present invention considers from the physical properties on Aluminum Matrix Composites Strengthened by SiC surface, utilize the ceramic attribute of SiC reinforcement body and aluminum substrate surface film oxide itself, the parent glass powder solder good with stupalith consistency is selected to carry out modification, parent glass powder solder is formed primarily of ionic linkage and covalent linkage compound, fundamentally solve solder in Aluminum Matrix Composites Strengthened by SiC wettability of the surface problem, achieve Aluminum Matrix Composites Strengthened by SiC in atmosphere with the reliable connection under low temperature; Two, the present invention is without the need to the operation of complexity and equipment, by the welding joint regulating the coating thickness of the compound green low-melting-point glass solder soldering paste of coating can obtain different in width weld seam, the Aluminum Matrix Composites Strengthened by SiC welding joint room temperature shearing resistance that the compound green low-melting-point glass solder that the present invention obtains connects reaches 50MPa ~ 104MPa; Three, the Aluminum Matrix Composites Strengthened by SiC pore-free that the compound green low-melting-point glass solder that the present invention obtains connects, dense structure, strength of welded joint are high, solve that ordinary method welding temperature is high, the non-wetted problem of metal solder; Four, the present invention can also be used for the connection of other ceramic/metal based composites.
The present invention can obtain a kind of method that compound green low-melting-point glass solder connects Aluminum Matrix Composites Strengthened by SiC.
Accompanying drawing explanation
Fig. 1 is the SEM figure that the Aluminum Matrix Composites Strengthened by SiC of compound green low-melting-point glass solder connection prepared by test five amplifies 3000 times.
Embodiment
Embodiment one: present embodiment is a kind of method that compound green low-melting-point glass solder connects Aluminum Matrix Composites Strengthened by SiC, specifically completes according to the following steps:
One, parent glass particle classifying: parent glass powder is placed in ball grinder, under rotating speed is 100r/min ~ 200r/min, be (35 ~ 45) in the mass ratio of abrading-ball and parent glass powder: the ratio of 1 adds abrading-ball, ball milling 1h ~ 5h, obtain powder, powder is put on 200 order metallic screens and vibrate, put on 500 order metallic screens by the powder in 200 mesh sieve holes and vibrate, be not by the powder in 500 mesh sieve holes the parent glass powder that particle diameter is 25 μm ~ 75 μm;
Parent glass powder described in step one is one or both mixture of bismuthate system lead-free low-temperature seal glass powder or phosphate-based lead-free low-temperature seal glass powder;
Bismuthate system lead-free low-temperature seal glass powder described in step one, concrete proportioning by weight mark by 40 parts ~ 50 parts Bi 2o 3, 20 parts ~ 40 parts of B 2o 3, 5 parts ~ 20 parts of BaO, 2 parts ~ 10 parts ZnO, 0.1 part ~ 2 parts Al 2o 3, 0.1 part ~ 2 parts of SiO 2with 0.1 part ~ 2 parts Li 2o forms;
Phosphate-based lead-free low-temperature seal glass powder described in step one, concrete proportioning by weight mark by 30 parts ~ 60 parts P 2o 5, 20 parts ~ 40 parts of SnO, 10 parts ~ 20 parts ZnO, 10 parts ~ 20 parts B 2o 3, 0.1 part ~ 5 parts of Al 2o 3, 0.1 part ~ 5 parts of SiO 2with 0.1 part ~ 2 parts Li 2o forms;
Two, take: take parent glass powder and β-SiC whisker that particle diameter is 25 μm ~ 75 μm;
Particle diameter described in step 2 is that to account for particle diameter be the parent glass powder of 25 μm ~ 75 μm and 75% ~ 95% of β-SiC whisker total mass to the parent glass powder of 25 μm ~ 75 μm;
It is the parent glass powder of 25 μm ~ 75 μm and 5% ~ 25% of β-SiC whisker total mass that β-SiC whisker described in step 2 accounts for particle diameter;
The particle diameter of the β-SiC whisker described in step 2 is 0.05 μm ~ 1.0 μm, length-to-diameter ratio >=10, and purity is more than 99%;
Three, the pre-treatment of β-SiC whisker: 1., under power is 50W ~ 100W, is placed in dehydrated alcohol magnetic agitation 1h ~ 3h by the β-SiC whisker after taking, and then filters and drying, obtains the β-SiC whisker after cleaning; 2., under oxygen atmosphere, the β-SiC whisker after cleaning is placed in process furnace, with the heating rate of 15 DEG C/min, process furnace is heated to 1000 DEG C ~ 1300 DEG C, and is incubated 3h ~ 5h at 1000 DEG C ~ 1300 DEG C, obtain the β-SiC whisker after being oxidized; 3., repeating step three 1. once, obtain pretreated β-SiC whisker;
Four, the preparation of compound lead-free low-temperature seal glass powder: by pretreated β-SiC whisker, take after particle diameter be that the parent glass powder of 25 μm ~ 75 μm and dehydrated alcohol are placed in ball grinder, add abrading-ball, then under nitrogen atmosphere protection and rotating speed are 200r/min ~ 400r/min, ball milling 0.5h ~ 3h, obtains compound lead-free low-temperature seal glass powder;
Particle diameter after taking described in step 4 is the parent glass powder of 25 μm ~ 75 μm and the pretreated total mass of β-SiC whisker and the volume ratio of dehydrated alcohol is 100g:(300 ~ 400) mL;
Particle diameter after taking described in step 4 is the parent glass powder of 25 μm ~ 75 μm and the pretreated total mass of β-SiC whisker and the mass ratio of abrading-ball is 1:(35 ~ 45);
Five, mix and blend: under rotating speed is 100r/min ~ 150r/min, is placed in soldering paste stirrer by compound lead-free low-temperature seal glass powder and caking agent and stirs 0.5h ~ 2h, obtains compound green low-melting-point glass solder soldering paste;
Compound lead-free low-temperature seal glass powder described in step 5 and the mass ratio of caking agent are 5:(0.5 ~ 2.5);
Caking agent described in step 5 is the mixture of Terpineol 350 and dehydrated alcohol, and described Terpineol 350 and the volume ratio of dehydrated alcohol are 5:(1 ~ 5);
Six, remove impurity: 1., adopt ultrasonic method, utilize acetone to Aluminum Matrix Composites Strengthened by SiC ultrasonic cleaning, obtain the Aluminum Matrix Composites Strengthened by SiC after cleaning; 2. use the waterproof abrasive paper of 600#, 800#, 1000# and 1200# to carry out carrying out mechanical grinding to the Aluminum Matrix Composites Strengthened by SiC after ultrasonic cleaning, successively, obtain ganoid Aluminum Matrix Composites Strengthened by SiC; 3., adopt ultrasonic method, utilize distilled water and the smooth Aluminum Matrix Composites Strengthened by SiC of acetone effects on surface to clean respectively; 4., by Aluminum Matrix Composites Strengthened by SiC dry 20min ~ 40min at the temperature of 40 DEG C ~ 60 DEG C, the Aluminum Matrix Composites Strengthened by SiC after removing impurity is obtained;
In Aluminum Matrix Composites Strengthened by SiC described in step 6, the volume fraction of silicon carbide is 10% ~ 80%;
Seven, apply: adopt the method for silk screen printing compound green low-melting-point glass solder soldering paste to be evenly coated in the surface of the Aluminum Matrix Composites Strengthened by SiC after removing impurity, coating thickness is 15 μm ~ 100 μm, obtains the Aluminum Matrix Composites Strengthened by SiC after applying;
Eight, test specimen assembling and welding: 1., by the Aluminum Matrix Composites Strengthened by SiC surface after two pieces of coatings contact and align, obtaining the test specimen to be welded assembled; 2., the test specimen to be welded assembled is positioned in resistance furnace, 0.5MPa ~ 1MPa welding pressure is applied to the test specimen to be welded assembled, by resistance furnace with the temperature rise rate of 10 DEG C/min ~ 20 DEG C/min from room temperature to 300 DEG C, and be incubated 10min ~ 30min at 300 DEG C; 3., 380 DEG C ~ 580 DEG C are warming up to the temperature rise rate of 5 DEG C/min ~ 10 DEG C/min from 300 DEG C, and 30min ~ 60min is incubated at 380 DEG C ~ 580 DEG C, naturally cool to room temperature with stove, obtain the Aluminum Matrix Composites Strengthened by SiC that compound green low-melting-point glass solder connects.
Binding agent described in present embodiment step 5 is Terpineol 350, and boiling point is 220 DEG C ~ 230 DEG C, and decomposition temperature is 290 DEG C ~ 300 DEG C;
The fusing point of the compound lead-free low-temperature seal glass powder described in present embodiment step 5 is 350 DEG C ~ 550 DEG C.
The advantage of present embodiment: one, present embodiment is considered from the physical properties on Aluminum Matrix Composites Strengthened by SiC surface, utilize the ceramic attribute of SiC reinforcement body and aluminum substrate surface film oxide itself, the parent glass powder solder good with stupalith consistency is selected to carry out modification, parent glass powder solder is formed primarily of ionic linkage and covalent linkage compound, fundamentally solve solder in Aluminum Matrix Composites Strengthened by SiC wettability of the surface problem, achieve Aluminum Matrix Composites Strengthened by SiC in atmosphere with the reliable connection under low temperature; Two, present embodiment is without the need to the operation of complexity and equipment, by the welding joint regulating the coating thickness of the compound green low-melting-point glass solder soldering paste of coating can obtain different in width weld seam, the Aluminum Matrix Composites Strengthened by SiC welding joint room temperature shearing resistance that the compound green low-melting-point glass solder that present embodiment obtains connects reaches 50MPa ~ 104MPa; Three, the Aluminum Matrix Composites Strengthened by SiC pore-free that the compound green low-melting-point glass solder that present embodiment obtains connects, dense structure, strength of welded joint are high, solve that ordinary method welding temperature is high, the non-wetted problem of metal solder; Four, present embodiment can also be used for the connection of other ceramic/metal based composites.
Present embodiment can obtain a kind of method that compound green low-melting-point glass solder connects Aluminum Matrix Composites Strengthened by SiC.
Embodiment two: present embodiment and embodiment one difference are: the bismuthate system lead-free low-temperature seal glass powder described in step one, concrete proportioning by weight mark by 45 parts ~ 50 parts Bi 2o 3, 25 parts ~ 35 parts of B 2o 3, 10 parts ~ 20 parts of BaO, 5 parts ~ 10 parts ZnO, 0.1 part ~ 1 part Al 2o 3, 0.1 part ~ 1 part of SiO 2with 0.1 part ~ 1 part Li 2o forms.Other steps are identical with embodiment one.
Embodiment three: one of present embodiment and embodiment one or two difference is: the phosphate-based lead-free low-temperature seal glass powder described in step one, concrete proportioning by weight mark by 40 parts ~ 60 parts P 2o 5, 30 parts ~ 40 parts of SnO, 15 parts ~ 20 parts ZnO, 15 parts ~ 20 parts B 2o 3, 1 part ~ 5 parts of Al 2o 3, 1 part ~ 5 parts of SiO 2with 1 part ~ 2 parts Li 2o forms.Other steps are identical with embodiment one or two.
Embodiment four: one of present embodiment and embodiment one to three difference is: the particle diameter of the β-SiC whisker described in step 2 is 0.05 μm ~ 0.8 μm, and length-to-diameter ratio >=10, purity is more than 99%.Other steps are identical with embodiment one to three.
Embodiment five: one of present embodiment and embodiment one to four difference is: step 3 2. under oxygen atmosphere, β-SiC whisker after cleaning is placed in process furnace, with the heating rate of 15 DEG C/min, process furnace is heated to 1100 DEG C ~ 1300 DEG C, and 4h ~ 5h is incubated at 1100 DEG C ~ 1300 DEG C, obtain the β-SiC whisker after being oxidized.Other steps are identical with embodiment one to four.
Embodiment six: one of present embodiment and embodiment one to five difference is: the particle diameter after taking described in step 4 is the parent glass powder of 25 μm ~ 75 μm and the pretreated total mass of β-SiC whisker and the volume ratio of dehydrated alcohol is 100g:(350 ~ 400) mL.Other steps are identical with embodiment one to five.
Embodiment seven: one of present embodiment and embodiment one to six difference is: the compound lead-free low-temperature seal glass powder described in step 5 and the mass ratio of caking agent are 5:(1 ~ 2.5).Other steps are identical with embodiment one to six.
Embodiment eight: one of present embodiment and embodiment one to seven difference is: the caking agent described in step 5 is the mixture of Terpineol 350 and dehydrated alcohol, described Terpineol 350 and the volume ratio of dehydrated alcohol are 5:(3 ~ 5).Other steps are identical with embodiment one to seven.
Embodiment nine: one of present embodiment and embodiment one to eight difference is: adopt the method for silk screen printing compound green low-melting-point glass solder soldering paste to be evenly coated in the surface of the Aluminum Matrix Composites Strengthened by SiC after removing impurity in step 7, coating thickness is 15 μm ~ 50 μm, obtains the Aluminum Matrix Composites Strengthened by SiC after applying.Other steps are identical with embodiment one to eight.
Embodiment ten: one of present embodiment and embodiment one to nine difference is: step 8 3. in be warming up to 420 DEG C ~ 580 DEG C with the temperature rise rate of 8 DEG C/min ~ 10 DEG C/min from 300 DEG C, and 40min ~ 60min is incubated at 420 DEG C ~ 580 DEG C, naturally cool to room temperature with stove, obtain the Aluminum Matrix Composites Strengthened by SiC that compound green low-melting-point glass solder connects.Other steps are identical with embodiment one to nine.
Adopt following verification experimental verification beneficial effect of the present invention:
Test one: a kind of method that compound green low-melting-point glass solder connects Aluminum Matrix Composites Strengthened by SiC specifically completes according to the following steps:
One, parent glass particle classifying: parent glass powder is placed in ball grinder, under rotating speed is 150r/min, the ratio being 40:1 in the mass ratio of abrading-ball and parent glass powder adds abrading-ball, ball milling 3h, obtain powder, powder is put on 200 order metallic screens and vibrate, put on 500 order metallic screens by the powder in 200 mesh sieve holes and vibrate, be not by the powder in 500 mesh sieve holes the parent glass powder that particle diameter is 25 μm ~ 75 μm;
Parent glass powder described in step one is bismuthate system lead-free low-temperature seal glass powder;
Bismuthate system lead-free low-temperature seal glass powder described in step one, concrete proportioning by weight mark by 40 parts of Bi 2o 3, 20 parts of B 2o 3, 5 parts of BaO, 2 parts of ZnO, 0.1 part of Al 2o 3, 0.1 part of SiO 2with 0.1 part of Li 2o forms;
Two, take: take parent glass powder and β-SiC whisker that particle diameter is 25 μm ~ 75 μm;
Particle diameter described in step 2 is that to account for particle diameter be the parent glass powder of 25 μm ~ 75 μm and 95% of β-SiC whisker total mass to the parent glass powder of 25 μm ~ 75 μm;
It is the parent glass powder of 25 μm ~ 75 μm and 5% of β-SiC whisker total mass that β-SiC whisker described in step 2 accounts for particle diameter;
The particle diameter of the β-SiC whisker described in step 2 is 0.05 μm ~ 1.0 μm, length-to-diameter ratio >=10, and purity is more than 99%;
Three, the pre-treatment of β-SiC whisker: 1., under power is 60W, is placed in dehydrated alcohol magnetic agitation 2h by the β-SiC whisker after taking, and then filters and drying, obtains the β-SiC whisker after cleaning; 2., under oxygen atmosphere, the β-SiC whisker after cleaning is placed in process furnace, with the heating rate of 15 DEG C/min, process furnace is heated to 1200 DEG C, and is incubated 4h at 1200 DEG C, obtain the β-SiC whisker after being oxidized; 3., repeating step three 1. once, obtain pretreated β-SiC whisker;
Four, the preparation of compound lead-free low-temperature seal glass powder: by pretreated β-SiC whisker, take after particle diameter be that the parent glass powder of 25 μm ~ 75 μm and dehydrated alcohol are placed in ball grinder, add abrading-ball, then under nitrogen atmosphere protection and rotating speed are 300r/min, ball milling 2h, obtains compound lead-free low-temperature seal glass powder;
Particle diameter after taking described in step 4 is the parent glass powder of 25 μm ~ 75 μm and the pretreated total mass of β-SiC whisker and the volume ratio of dehydrated alcohol is 100g:300mL;
Particle diameter after taking described in step 4 is the parent glass powder of 25 μm ~ 75 μm and the pretreated total mass of β-SiC whisker and the mass ratio of abrading-ball is 1:40;
Five, mix and blend: under rotating speed is 100r/min, is placed in soldering paste stirrer by compound lead-free low-temperature seal glass powder and caking agent and stirs 1h, obtains compound green low-melting-point glass solder soldering paste;
Compound lead-free low-temperature seal glass powder described in step 5 and the mass ratio of caking agent are 5:1;
Caking agent described in step 5 is the mixture of Terpineol 350 and dehydrated alcohol, and described Terpineol 350 and the volume ratio of dehydrated alcohol are 5:1;
Six, remove impurity: 1., adopt ultrasonic method, utilize acetone to Aluminum Matrix Composites Strengthened by SiC ultrasonic cleaning, obtain the Aluminum Matrix Composites Strengthened by SiC after cleaning; 2. use the waterproof abrasive paper of 600#, 800#, 1000# and 1200# to carry out carrying out mechanical grinding to the Aluminum Matrix Composites Strengthened by SiC after ultrasonic cleaning, successively, obtain ganoid Aluminum Matrix Composites Strengthened by SiC; 3., adopt ultrasonic method, utilize distilled water and the smooth Aluminum Matrix Composites Strengthened by SiC of acetone effects on surface to clean respectively; 4., by Aluminum Matrix Composites Strengthened by SiC dry 30min at the temperature of 56 DEG C, the Aluminum Matrix Composites Strengthened by SiC after removing impurity is obtained;
In Aluminum Matrix Composites Strengthened by SiC described in step 6, the volume fraction of silicon carbide is 10%;
Seven, apply: adopt the method for silk screen printing compound green low-melting-point glass solder soldering paste to be evenly coated in the surface of the Aluminum Matrix Composites Strengthened by SiC after removing impurity, coating thickness is 30 μm, obtains the Aluminum Matrix Composites Strengthened by SiC after applying;
Eight, test specimen assembling and welding: 1., by the Aluminum Matrix Composites Strengthened by SiC surface after two pieces of coatings contact and align, obtaining the test specimen to be welded assembled; 2., the test specimen to be welded assembled is positioned in resistance furnace, 1MPa welding pressure is applied to the test specimen to be welded assembled, by resistance furnace with the temperature rise rate of 15 DEG C/min from room temperature to 300 DEG C, and be incubated 30min at 300 DEG C; 3., with the temperature rise rate of 5 DEG C/min be warming up to 400 DEG C from 300 DEG C, and be incubated 60min at 400 DEG C, naturally cool to room temperature with stove, obtain the Aluminum Matrix Composites Strengthened by SiC that compound green low-melting-point glass solder connects.
This test is considered from the physical properties on Aluminum Matrix Composites Strengthened by SiC surface, utilize the ceramic attribute of SiC reinforcement body and aluminum substrate surface film oxide itself, the parent glass powder solder good with stupalith consistency is selected to carry out modification, parent glass powder solder is formed primarily of ionic linkage and covalent linkage compound, fundamentally solve solder in Aluminum Matrix Composites Strengthened by SiC wettability of the surface problem, achieve Aluminum Matrix Composites Strengthened by SiC in atmosphere with the reliable connection under low temperature; This test is without the need to the operation of complexity and equipment, by the welding joint regulating the coating thickness of the compound green low-melting-point glass solder soldering paste of coating can obtain different in width weld seam, the Aluminum Matrix Composites Strengthened by SiC welding joint room temperature shearing resistance that the compound green low-melting-point glass solder that this test obtains connects reaches 58MPa; Three, the Aluminum Matrix Composites Strengthened by SiC pore-free that the compound green low-melting-point glass solder that this test obtains connects, dense structure, strength of welded joint are high, solve that ordinary method welding temperature is high, the non-wetted problem of metal solder.
Test two: a kind of method that compound green low-melting-point glass solder connects Aluminum Matrix Composites Strengthened by SiC specifically completes according to the following steps:
One, parent glass particle classifying: parent glass powder is placed in ball grinder, under rotating speed is 150r/min, the ratio being 40:1 in the mass ratio of abrading-ball and parent glass powder adds abrading-ball, ball milling 3h, obtain powder, powder is put on 200 order metallic screens and vibrate, put on 500 order metallic screens by the powder in 200 mesh sieve holes and vibrate, be not by the powder in 500 mesh sieve holes the parent glass powder that particle diameter is 25 μm ~ 75 μm;
Parent glass powder described in step one is bismuthate system lead-free low-temperature seal glass powder;
Bismuthate system lead-free low-temperature seal glass powder described in step one, concrete proportioning by weight mark by 40 parts of Bi 2o 3, 20 parts of B 2o 3, 5 parts of BaO, 2 parts of ZnO, 0.1 part of Al 2o 3, 0.1 part of SiO 2with 0.1 part of Li 2o forms;
Two, take: take parent glass powder and β-SiC whisker that particle diameter is 25 μm ~ 75 μm;
Particle diameter described in step 2 is that to account for particle diameter be the parent glass powder of 25 μm ~ 75 μm and 91% of β-SiC whisker total mass to the parent glass powder of 25 μm ~ 75 μm;
It is the parent glass powder of 25 μm ~ 75 μm and 9% of β-SiC whisker total mass that β-SiC whisker described in step 2 accounts for particle diameter;
The particle diameter of the β-SiC whisker described in step 2 is 0.05 μm ~ 1.0 μm, length-to-diameter ratio >=10, and purity is more than 99%;
Three, the pre-treatment of β-SiC whisker: 1., under power is 60W, is placed in dehydrated alcohol magnetic agitation 2h by the β-SiC whisker after taking, and then filters and drying, obtains the β-SiC whisker after cleaning; 2., under oxygen atmosphere, the β-SiC whisker after cleaning is placed in process furnace, with the heating rate of 15 DEG C/min, process furnace is heated to 1300 DEG C, and is incubated 3h at 1300 DEG C, obtain the β-SiC whisker after being oxidized; 3., repeating step three 1. once, obtain pretreated β-SiC whisker;
Four, the preparation of compound lead-free low-temperature seal glass powder: by pretreated β-SiC whisker, take after particle diameter be that the parent glass powder of 25 μm ~ 75 μm and dehydrated alcohol are placed in ball grinder, add abrading-ball, then under nitrogen atmosphere protection and rotating speed are 300r/min, ball milling 3h, obtains compound lead-free low-temperature seal glass powder;
Particle diameter after taking described in step 4 is the parent glass powder of 25 μm ~ 75 μm and the pretreated total mass of β-SiC whisker and the volume ratio of dehydrated alcohol is 100g:300mL;
Particle diameter after taking described in step 4 is the parent glass powder of 25 μm ~ 75 μm and the pretreated total mass of β-SiC whisker and the mass ratio of abrading-ball is 1:40;
Five, mix and blend: under rotating speed is 100r/min, is placed in soldering paste stirrer by compound lead-free low-temperature seal glass powder and caking agent and stirs 0.5h, obtains compound green low-melting-point glass solder soldering paste;
Compound lead-free low-temperature seal glass powder described in step 5 and the mass ratio of caking agent are 5:1;
Caking agent described in step 5 is the mixture of Terpineol 350 and dehydrated alcohol, and described Terpineol 350 and the volume ratio of dehydrated alcohol are 5:1;
Six, remove impurity: 1., adopt ultrasonic method, utilize acetone to Aluminum Matrix Composites Strengthened by SiC ultrasonic cleaning, obtain the Aluminum Matrix Composites Strengthened by SiC after cleaning; 2. use the waterproof abrasive paper of 600#, 800#, 1000# and 1200# to carry out carrying out mechanical grinding to the Aluminum Matrix Composites Strengthened by SiC after ultrasonic cleaning, successively, obtain ganoid Aluminum Matrix Composites Strengthened by SiC; 3., adopt ultrasonic method, utilize distilled water and the smooth Aluminum Matrix Composites Strengthened by SiC of acetone effects on surface to clean respectively; 4., by Aluminum Matrix Composites Strengthened by SiC dry 30min at the temperature of 56 DEG C, the Aluminum Matrix Composites Strengthened by SiC after removing impurity is obtained;
In Aluminum Matrix Composites Strengthened by SiC described in step 6, the volume fraction of silicon carbide is 25%;
Seven, apply: adopt the method for silk screen printing compound green low-melting-point glass solder soldering paste to be evenly coated in the surface of the Aluminum Matrix Composites Strengthened by SiC after removing impurity, coating thickness is 50 μm, obtains the Aluminum Matrix Composites Strengthened by SiC after applying;
Eight, test specimen assembling and welding: 1., by the Aluminum Matrix Composites Strengthened by SiC surface after two pieces of coatings contact and align, obtaining the test specimen to be welded assembled; 2., the test specimen to be welded assembled is positioned in resistance furnace, 1MPa welding pressure is applied to the test specimen to be welded assembled, by resistance furnace with the temperature rise rate of 15 DEG C/min from room temperature to 300 DEG C, and be incubated 30min at 300 DEG C; 3., with the temperature rise rate of 5 DEG C/min be warming up to 460 DEG C from 300 DEG C, and be incubated 60min at 460 DEG C, naturally cool to room temperature with stove, obtain the Aluminum Matrix Composites Strengthened by SiC that compound green low-melting-point glass solder connects.
This test is considered from the physical properties on Aluminum Matrix Composites Strengthened by SiC surface, utilize the ceramic attribute of SiC reinforcement body and aluminum substrate surface film oxide itself, the parent glass powder solder good with stupalith consistency is selected to carry out modification, parent glass powder solder is formed primarily of ionic linkage and covalent linkage compound, fundamentally solve solder in Aluminum Matrix Composites Strengthened by SiC wettability of the surface problem, achieve Aluminum Matrix Composites Strengthened by SiC in atmosphere with the reliable connection under low temperature; This test is without the need to the operation of complexity and equipment, by the welding joint regulating the coating thickness of the compound green low-melting-point glass solder soldering paste of coating can obtain different in width weld seam, the Aluminum Matrix Composites Strengthened by SiC welding joint room temperature shearing resistance that the compound green low-melting-point glass solder that this test obtains connects reaches 69MPa; Three, the Aluminum Matrix Composites Strengthened by SiC pore-free that the compound green low-melting-point glass solder that this test obtains connects, dense structure, strength of welded joint are high, solve that ordinary method welding temperature is high, the non-wetted problem of metal solder.
Test three: a kind of method that compound green low-melting-point glass solder connects Aluminum Matrix Composites Strengthened by SiC specifically completes according to the following steps:
One, parent glass particle classifying: parent glass powder is placed in ball grinder, under rotating speed is 150r/min, the ratio being 40:1 in the mass ratio of abrading-ball and parent glass powder adds abrading-ball, ball milling 3h, obtain powder, powder is put on 200 order metallic screens and vibrate, put on 500 order metallic screens by the powder in 200 mesh sieve holes and vibrate, be not by the powder in 500 mesh sieve holes the parent glass powder that particle diameter is 25 μm ~ 75 μm;
Parent glass powder described in step one is bismuthate system lead-free low-temperature seal glass powder;
Bismuthate system lead-free low-temperature seal glass powder described in step one, concrete proportioning by weight mark by 40 parts of Bi 2o 3, 20 parts of B 2o 3, 5 parts of BaO, 2 parts of ZnO, 0.1 part of Al 2o 3, 0.1 part of SiO 2with 0.1 part of Li 2o forms;
Two, take: take parent glass powder and β-SiC whisker that particle diameter is 25 μm ~ 75 μm;
Particle diameter described in step 2 is that to account for particle diameter be the parent glass powder of 25 μm ~ 75 μm and 86% of β-SiC whisker total mass to the parent glass powder of 25 μm ~ 75 μm;
It is the parent glass powder of 25 μm ~ 75 μm and 14% of β-SiC whisker total mass that β-SiC whisker described in step 2 accounts for particle diameter;
The particle diameter of the β-SiC whisker described in step 2 is 0.05 μm ~ 1.0 μm, length-to-diameter ratio >=10, and purity is more than 99%;
Three, the pre-treatment of β-SiC whisker: 1., under power is 60W, is placed in dehydrated alcohol magnetic agitation 2h by the β-SiC whisker after taking, and then filters and drying, obtains the β-SiC whisker after cleaning; 2., under oxygen atmosphere, the β-SiC whisker after cleaning is placed in process furnace, with the heating rate of 15 DEG C/min, process furnace is heated to 1300 DEG C, and is incubated 3h at 1300 DEG C, obtain the β-SiC whisker after being oxidized; 3., repeating step three 1. once, obtain pretreated β-SiC whisker;
Four, the preparation of compound lead-free low-temperature seal glass powder: by pretreated β-SiC whisker, take after particle diameter be that the parent glass powder of 25 μm ~ 75 μm and dehydrated alcohol are placed in ball grinder, add abrading-ball, then under nitrogen atmosphere protection and rotating speed are 350r/min, ball milling 2h, obtains compound lead-free low-temperature seal glass powder;
Particle diameter after taking described in step 4 is the parent glass powder of 25 μm ~ 75 μm and the pretreated total mass of β-SiC whisker and the volume ratio of dehydrated alcohol is 100g:350mL;
Particle diameter after taking described in step 4 is the parent glass powder of 25 μm ~ 75 μm and the pretreated total mass of β-SiC whisker and the mass ratio of abrading-ball is 1:40;
Five, mix and blend: under rotating speed is 100r/min, is placed in soldering paste stirrer by compound lead-free low-temperature seal glass powder and caking agent and stirs 0.5h, obtains compound green low-melting-point glass solder soldering paste;
Compound lead-free low-temperature seal glass powder described in step 5 and the mass ratio of caking agent are 5:1.5;
Caking agent described in step 5 is the mixture of Terpineol 350 and dehydrated alcohol, and described Terpineol 350 and the volume ratio of dehydrated alcohol are 5:2;
Six, remove impurity: 1., adopt ultrasonic method, utilize acetone to Aluminum Matrix Composites Strengthened by SiC ultrasonic cleaning, obtain the Aluminum Matrix Composites Strengthened by SiC after cleaning; 2. use the waterproof abrasive paper of 600#, 800#, 1000# and 1200# to carry out carrying out mechanical grinding to the Aluminum Matrix Composites Strengthened by SiC after ultrasonic cleaning, successively, obtain ganoid Aluminum Matrix Composites Strengthened by SiC; 3., adopt ultrasonic method, utilize distilled water and the smooth Aluminum Matrix Composites Strengthened by SiC of acetone effects on surface to clean respectively; 4., by Aluminum Matrix Composites Strengthened by SiC dry 30min at the temperature of 56 DEG C, the Aluminum Matrix Composites Strengthened by SiC after removing impurity is obtained;
In Aluminum Matrix Composites Strengthened by SiC described in step 6, the volume fraction of silicon carbide is 40%;
Seven, apply: adopt the method for silk screen printing compound green low-melting-point glass solder soldering paste to be evenly coated in the surface of the Aluminum Matrix Composites Strengthened by SiC after removing impurity, coating thickness is 60 μm, obtains the Aluminum Matrix Composites Strengthened by SiC after applying;
Eight, test specimen assembling and welding: 1., by the Aluminum Matrix Composites Strengthened by SiC surface after two pieces of coatings contact and align, obtaining the test specimen to be welded assembled; 2., the test specimen to be welded assembled is positioned in resistance furnace, 1MPa welding pressure is applied to the test specimen to be welded assembled, by resistance furnace with the temperature rise rate of 15 DEG C/min from room temperature to 300 DEG C, and be incubated 30min at 300 DEG C; 3., with the temperature rise rate of 5 DEG C/min be warming up to 480 DEG C from 300 DEG C, and be incubated 60min at 480 DEG C, naturally cool to room temperature with stove, obtain the Aluminum Matrix Composites Strengthened by SiC that compound green low-melting-point glass solder connects.
This test is considered from the physical properties on Aluminum Matrix Composites Strengthened by SiC surface, utilize the ceramic attribute of SiC reinforcement body and aluminum substrate surface film oxide itself, the parent glass powder solder good with stupalith consistency is selected to carry out modification, parent glass powder solder is formed primarily of ionic linkage and covalent linkage compound, fundamentally solve solder in Aluminum Matrix Composites Strengthened by SiC wettability of the surface problem, achieve Aluminum Matrix Composites Strengthened by SiC in atmosphere with the reliable connection under low temperature; This test is without the need to the operation of complexity and equipment, by the welding joint regulating the coating thickness of the compound green low-melting-point glass solder soldering paste of coating can obtain different in width weld seam, the Aluminum Matrix Composites Strengthened by SiC welding joint room temperature shearing resistance that the compound green low-melting-point glass solder that this test obtains connects reaches 77MPa; Three, the Aluminum Matrix Composites Strengthened by SiC pore-free that the compound green low-melting-point glass solder that this test obtains connects, dense structure, strength of welded joint are high, solve that ordinary method welding temperature is high, the non-wetted problem of metal solder.
Test four: a kind of method that compound green low-melting-point glass solder connects Aluminum Matrix Composites Strengthened by SiC specifically completes according to the following steps:
One, parent glass particle classifying: parent glass powder is placed in ball grinder, under rotating speed is 150r/min, the ratio being 40:1 in the mass ratio of abrading-ball and parent glass powder adds abrading-ball, ball milling 3h, obtain powder, powder is put on 200 order metallic screens and vibrate, put on 500 order metallic screens by the powder in 200 mesh sieve holes and vibrate, be not by the powder in 500 mesh sieve holes the parent glass powder that particle diameter is 25 μm ~ 75 μm;
Parent glass powder described in step one is bismuthate system lead-free low-temperature seal glass powder;
Bismuthate system lead-free low-temperature seal glass powder described in step one, concrete proportioning by weight mark by 40 parts of Bi 2o 3, 20 parts of B 2o 3, 5 parts of BaO, 2 parts of ZnO, 0.1 part of Al 2o 3, 0.1 part of SiO 2with 0.1 part of Li 2o forms;
Two, take: take parent glass powder and β-SiC whisker that particle diameter is 25 μm ~ 75 μm;
Particle diameter described in step 2 is that to account for particle diameter be the parent glass powder of 25 μm ~ 75 μm and 83% of β-SiC whisker total mass to the parent glass powder of 25 μm ~ 75 μm;
It is the parent glass powder of 25 μm ~ 75 μm and 17% of β-SiC whisker total mass that β-SiC whisker described in step 2 accounts for particle diameter;
The particle diameter of the β-SiC whisker described in step 2 is 0.05 μm ~ 1.0 μm, length-to-diameter ratio >=10, and purity is more than 99%;
Three, the pre-treatment of β-SiC whisker: 1., under power is 60W, is placed in dehydrated alcohol magnetic agitation 2h by the β-SiC whisker after taking, and then filters and drying, obtains the β-SiC whisker after cleaning; 2., under oxygen atmosphere, the β-SiC whisker after cleaning is placed in process furnace, with the heating rate of 15 DEG C/min, process furnace is heated to 1300 DEG C, and is incubated 4h at 1300 DEG C, obtain the β-SiC whisker after being oxidized; 3., repeating step three 1. once, obtain pretreated β-SiC whisker;
Four, the preparation of compound lead-free low-temperature seal glass powder: by pretreated β-SiC whisker, take after particle diameter be that the parent glass powder of 25 μm ~ 75 μm and dehydrated alcohol are placed in ball grinder, add abrading-ball, then under nitrogen atmosphere protection and rotating speed are 350r/min, ball milling 3h, obtains compound lead-free low-temperature seal glass powder;
Particle diameter after taking described in step 4 is the parent glass powder of 25 μm ~ 75 μm and the pretreated total mass of β-SiC whisker and the volume ratio of dehydrated alcohol is 100g:350mL;
Particle diameter after taking described in step 4 is the parent glass powder of 25 μm ~ 75 μm and the pretreated total mass of β-SiC whisker and the mass ratio of abrading-ball is 1:40;
Five, mix and blend: under rotating speed is 100r/min, is placed in soldering paste stirrer by compound lead-free low-temperature seal glass powder and caking agent and stirs 0.5h, obtains compound green low-melting-point glass solder soldering paste;
Compound lead-free low-temperature seal glass powder described in step 5 and the mass ratio of caking agent are 5:1.5;
Caking agent described in step 5 is the mixture of Terpineol 350 and dehydrated alcohol, and described Terpineol 350 and the volume ratio of dehydrated alcohol are 5:3;
Six, remove impurity: 1., adopt ultrasonic method, utilize acetone to Aluminum Matrix Composites Strengthened by SiC ultrasonic cleaning, obtain the Aluminum Matrix Composites Strengthened by SiC after cleaning; 2. use the waterproof abrasive paper of 600#, 800#, 1000# and 1200# to carry out carrying out mechanical grinding to the Aluminum Matrix Composites Strengthened by SiC after ultrasonic cleaning, successively, obtain ganoid Aluminum Matrix Composites Strengthened by SiC; 3., adopt ultrasonic method, utilize distilled water and the smooth Aluminum Matrix Composites Strengthened by SiC of acetone effects on surface to clean respectively; 4., by Aluminum Matrix Composites Strengthened by SiC dry 30min at the temperature of 56 DEG C, the Aluminum Matrix Composites Strengthened by SiC after removing impurity is obtained;
In Aluminum Matrix Composites Strengthened by SiC described in step 6, the volume fraction of silicon carbide is 50%;
Seven, apply: adopt the method for silk screen printing compound green low-melting-point glass solder soldering paste to be evenly coated in the surface of the Aluminum Matrix Composites Strengthened by SiC after removing impurity, coating thickness is 70 μm, obtains the Aluminum Matrix Composites Strengthened by SiC after applying;
Eight, test specimen assembling and welding: 1., by the Aluminum Matrix Composites Strengthened by SiC surface after two pieces of coatings contact and align, obtaining the test specimen to be welded assembled; 2., the test specimen to be welded assembled is positioned in resistance furnace, 1MPa welding pressure is applied to the test specimen to be welded assembled, by resistance furnace with the temperature rise rate of 15 DEG C/min from room temperature to 300 DEG C, and be incubated 30min at 300 DEG C; 3., with the temperature rise rate of 5 DEG C/min be warming up to 490 DEG C from 300 DEG C, and be incubated 60min at 490 DEG C, naturally cool to room temperature with stove, obtain the Aluminum Matrix Composites Strengthened by SiC that compound green low-melting-point glass solder connects.
This test is considered from the physical properties on Aluminum Matrix Composites Strengthened by SiC surface, utilize the ceramic attribute of SiC reinforcement body and aluminum substrate surface film oxide itself, the parent glass powder solder good with stupalith consistency is selected to carry out modification, parent glass powder solder is formed primarily of ionic linkage and covalent linkage compound, fundamentally solve solder in Aluminum Matrix Composites Strengthened by SiC wettability of the surface problem, achieve Aluminum Matrix Composites Strengthened by SiC in atmosphere with the reliable connection under low temperature; This test is without the need to the operation of complexity and equipment, by the welding joint regulating the coating thickness of the compound green low-melting-point glass solder soldering paste of coating can obtain different in width weld seam, the Aluminum Matrix Composites Strengthened by SiC welding joint room temperature shearing resistance that the compound green low-melting-point glass solder that this test obtains connects reaches 85MPa; Three, the Aluminum Matrix Composites Strengthened by SiC pore-free that the compound green low-melting-point glass solder that this test obtains connects, dense structure, strength of welded joint are high, solve that ordinary method welding temperature is high, the non-wetted problem of metal solder.
Test five: a kind of method that compound green low-melting-point glass solder connects Aluminum Matrix Composites Strengthened by SiC specifically completes according to the following steps:
One, parent glass particle classifying: parent glass powder is placed in ball grinder, under rotating speed is 150r/min, the ratio being 40:1 in the mass ratio of abrading-ball and parent glass powder adds abrading-ball, ball milling 3h, obtain powder, powder is put on 200 order metallic screens and vibrate, put on 500 order metallic screens by the powder in 200 mesh sieve holes and vibrate, be not by the powder in 500 mesh sieve holes the parent glass powder that particle diameter is 25 μm ~ 75 μm;
Parent glass powder described in step one is bismuthate system lead-free low-temperature seal glass powder;
Bismuthate system lead-free low-temperature seal glass powder described in step one, concrete proportioning by weight mark by 40 parts of Bi 2o 3, 20 parts of B 2o 3, 5 parts of BaO, 2 parts of ZnO, 0.1 part of Al 2o 3, 0.1 part of SiO 2with 0.1 part of Li 2o forms;
Two, take: take parent glass powder and β-SiC whisker that particle diameter is 25 μm ~ 75 μm;
Particle diameter described in step 2 is that to account for particle diameter be the parent glass powder of 25 μm ~ 75 μm and 80% of β-SiC whisker total mass to the parent glass powder of 25 μm ~ 75 μm;
It is the parent glass powder of 25 μm ~ 75 μm and 20% of β-SiC whisker total mass that β-SiC whisker described in step 2 accounts for particle diameter;
The particle diameter of the β-SiC whisker described in step 2 is 0.05 μm ~ 1.0 μm, length-to-diameter ratio >=10, and purity is more than 99%;
Three, the pre-treatment of β-SiC whisker: 1., under power is 60W, is placed in dehydrated alcohol magnetic agitation 2h by the β-SiC whisker after taking, and then filters and drying, obtains the β-SiC whisker after cleaning; 2., under oxygen atmosphere, the β-SiC whisker after cleaning is placed in process furnace, with the heating rate of 15 DEG C/min, process furnace is heated to 1300 DEG C, and is incubated 4h at 1300 DEG C, obtain the β-SiC whisker after being oxidized; 3., repeating step three 1. once, obtain pretreated β-SiC whisker;
Four, the preparation of compound lead-free low-temperature seal glass powder: by pretreated β-SiC whisker, take after particle diameter be that the parent glass powder of 25 μm ~ 75 μm and dehydrated alcohol are placed in ball grinder, add abrading-ball, then under nitrogen atmosphere protection and rotating speed are 400r/min, ball milling 2h, obtains compound lead-free low-temperature seal glass powder;
Particle diameter after taking described in step 4 is the parent glass powder of 25 μm ~ 75 μm and the pretreated total mass of β-SiC whisker and the volume ratio of dehydrated alcohol is 100g:400mL;
Particle diameter after taking described in step 4 is the parent glass powder of 25 μm ~ 75 μm and the pretreated total mass of β-SiC whisker and the mass ratio of abrading-ball is 1:40;
Five, mix and blend: under rotating speed is 100r/min, is placed in soldering paste stirrer by compound lead-free low-temperature seal glass powder and caking agent and stirs 0.5h, obtains compound green low-melting-point glass solder soldering paste;
Compound lead-free low-temperature seal glass powder described in step 5 and the mass ratio of caking agent are 5:2.0;
Caking agent described in step 5 is the mixture of Terpineol 350 and dehydrated alcohol, and described Terpineol 350 and the volume ratio of dehydrated alcohol are 5:3;
Six, remove impurity: 1., adopt ultrasonic method, utilize acetone to Aluminum Matrix Composites Strengthened by SiC ultrasonic cleaning, obtain the Aluminum Matrix Composites Strengthened by SiC after cleaning; 2. use the waterproof abrasive paper of 600#, 800#, 1000# and 1200# to carry out carrying out mechanical grinding to the Aluminum Matrix Composites Strengthened by SiC after ultrasonic cleaning, successively, obtain ganoid Aluminum Matrix Composites Strengthened by SiC; 3., adopt ultrasonic method, utilize distilled water and the smooth Aluminum Matrix Composites Strengthened by SiC of acetone effects on surface to clean respectively; 4., by Aluminum Matrix Composites Strengthened by SiC dry 30min at the temperature of 56 DEG C, the Aluminum Matrix Composites Strengthened by SiC after removing impurity is obtained;
In Aluminum Matrix Composites Strengthened by SiC described in step 6, the volume fraction of silicon carbide is 60%;
Seven, apply: adopt the method for silk screen printing compound green low-melting-point glass solder soldering paste to be evenly coated in the surface of the Aluminum Matrix Composites Strengthened by SiC after removing impurity, coating thickness is 80 μm, obtains the Aluminum Matrix Composites Strengthened by SiC after applying;
Eight, test specimen assembling and welding: 1., by the Aluminum Matrix Composites Strengthened by SiC surface after two pieces of coatings contact and align, obtaining the test specimen to be welded assembled; 2., the test specimen to be welded assembled is positioned in resistance furnace, 1MPa welding pressure is applied to the test specimen to be welded assembled, by resistance furnace with the temperature rise rate of 15 DEG C/min from room temperature to 300 DEG C, and be incubated 30min at 300 DEG C; 3., with the temperature rise rate of 5 DEG C/min be warming up to 500 DEG C from 300 DEG C, and be incubated 60min at 500 DEG C, naturally cool to room temperature with stove, obtain the Aluminum Matrix Composites Strengthened by SiC that compound green low-melting-point glass solder connects.
Fig. 1 is the SEM figure that the Aluminum Matrix Composites Strengthened by SiC of compound green low-melting-point glass solder connection prepared by test five amplifies 3000 times; As can be seen from Figure 1, low temperature glass solder and matrix material can soak very well, and interface cohesion is tight, pore-free.
This test is considered from the physical properties on Aluminum Matrix Composites Strengthened by SiC surface, utilize the ceramic attribute of SiC reinforcement body and aluminum substrate surface film oxide itself, the parent glass powder solder good with stupalith consistency is selected to carry out modification, parent glass powder solder is formed primarily of ionic linkage and covalent linkage compound, fundamentally solve solder in Aluminum Matrix Composites Strengthened by SiC wettability of the surface problem, achieve Aluminum Matrix Composites Strengthened by SiC in atmosphere with the reliable connection under low temperature; This test is without the need to the operation of complexity and equipment, by the welding joint regulating the coating thickness of the compound green low-melting-point glass solder soldering paste of coating can obtain different in width weld seam, the Aluminum Matrix Composites Strengthened by SiC welding joint room temperature shearing resistance that the compound green low-melting-point glass solder that this test obtains connects reaches 96MPa; Three, the Aluminum Matrix Composites Strengthened by SiC strength of welded joint that the compound green low-melting-point glass solder that this test obtains connects is high, and solution ordinary method welding temperature is high, the non-wetted problem of metal solder.
Test six: a kind of method that compound green low-melting-point glass solder connects Aluminum Matrix Composites Strengthened by SiC specifically completes according to the following steps:
One, parent glass particle classifying: parent glass powder is placed in ball grinder, under rotating speed is 150r/min, the ratio being 40:1 in the mass ratio of abrading-ball and parent glass powder adds abrading-ball, ball milling 3h, obtain powder, powder is put on 200 order metallic screens and vibrate, put on 500 order metallic screens by the powder in 200 mesh sieve holes and vibrate, be not by the powder in 500 mesh sieve holes the parent glass powder that particle diameter is 25 μm ~ 75 μm;
Parent glass powder described in step one is bismuthate system lead-free low-temperature seal glass powder;
Bismuthate system lead-free low-temperature seal glass powder described in step one, concrete proportioning by weight mark by 40 parts of Bi 2o 3, 20 parts of B 2o 3, 5 parts of BaO, 2 parts of ZnO, 0.1 part of Al 2o 3, 0.1 part of SiO 2with 0.1 part of Li 2o forms;
Two, take: take parent glass powder and β-SiC whisker that particle diameter is 25 μm ~ 75 μm;
Particle diameter described in step 2 is that to account for particle diameter be the parent glass powder of 25 μm ~ 75 μm and 75% of β-SiC whisker total mass to the parent glass powder of 25 μm ~ 75 μm;
It is the parent glass powder of 25 μm ~ 75 μm and 25% of β-SiC whisker total mass that β-SiC whisker described in step 2 accounts for particle diameter;
The particle diameter of the β-SiC whisker described in step 2 is 0.05 μm ~ 1.0 μm, length-to-diameter ratio >=10, and purity is more than 99%;
Three, the pre-treatment of β-SiC whisker: 1., under power is 60W, is placed in dehydrated alcohol magnetic agitation 2h by the β-SiC whisker after taking, and then filters and drying, obtains the β-SiC whisker after cleaning; 2., under oxygen atmosphere, the β-SiC whisker after cleaning is placed in process furnace, with the heating rate of 15 DEG C/min, process furnace is heated to 1300 DEG C, and is incubated 4h at 1300 DEG C, obtain the β-SiC whisker after being oxidized; 3., repeating step three 1. once, obtain pretreated β-SiC whisker;
Four, the preparation of compound lead-free low-temperature seal glass powder: by pretreated β-SiC whisker, take after particle diameter be that the parent glass powder of 25 μm ~ 75 μm and dehydrated alcohol are placed in ball grinder, add abrading-ball, then under nitrogen atmosphere protection and rotating speed are 400r/min, ball milling 3h, obtains compound lead-free low-temperature seal glass powder;
Particle diameter after taking described in step 4 is the parent glass powder of 25 μm ~ 75 μm and the pretreated total mass of β-SiC whisker and the volume ratio of dehydrated alcohol is 100g:400mL;
Particle diameter after taking described in step 4 is the parent glass powder of 25 μm ~ 75 μm and the pretreated total mass of β-SiC whisker and the mass ratio of abrading-ball is 1:40;
Five, mix and blend: under rotating speed is 100r/min, is placed in soldering paste stirrer by compound lead-free low-temperature seal glass powder and caking agent and stirs 0.5h, obtains compound green low-melting-point glass solder soldering paste;
Compound lead-free low-temperature seal glass powder described in step 5 and the mass ratio of caking agent are 5:2.0;
Caking agent described in step 5 is the mixture of Terpineol 350 and dehydrated alcohol, and described Terpineol 350 and the volume ratio of dehydrated alcohol are 5:4;
Six, remove impurity: 1., adopt ultrasonic method, utilize acetone to Aluminum Matrix Composites Strengthened by SiC ultrasonic cleaning, obtain the Aluminum Matrix Composites Strengthened by SiC after cleaning; 2. use the waterproof abrasive paper of 600#, 800#, 1000# and 1200# to carry out carrying out mechanical grinding to the Aluminum Matrix Composites Strengthened by SiC after ultrasonic cleaning, successively, obtain ganoid Aluminum Matrix Composites Strengthened by SiC; 3., adopt ultrasonic method, utilize distilled water and the smooth Aluminum Matrix Composites Strengthened by SiC of acetone effects on surface to clean respectively; 4., by Aluminum Matrix Composites Strengthened by SiC dry 30min at the temperature of 56 DEG C, the Aluminum Matrix Composites Strengthened by SiC after removing impurity is obtained;
In Aluminum Matrix Composites Strengthened by SiC described in step 6, the volume fraction of silicon carbide is 80%;
Seven, apply: adopt the method for silk screen printing compound green low-melting-point glass solder soldering paste to be evenly coated in the surface of the Aluminum Matrix Composites Strengthened by SiC after removing impurity, coating thickness is 90 μm, obtains the Aluminum Matrix Composites Strengthened by SiC after applying;
Eight, test specimen assembling and welding: 1., by the Aluminum Matrix Composites Strengthened by SiC surface after two pieces of coatings contact and align, obtaining the test specimen to be welded assembled; 2., the test specimen to be welded assembled is positioned in resistance furnace, 1MPa welding pressure is applied to the test specimen to be welded assembled, by resistance furnace with the temperature rise rate of 15 DEG C/min from room temperature to 300 DEG C, and be incubated 30min at 300 DEG C; 3., with the temperature rise rate of 5 DEG C/min be warming up to 515 DEG C from 300 DEG C, and be incubated 60min at 515 DEG C, naturally cool to room temperature with stove, obtain the Aluminum Matrix Composites Strengthened by SiC that compound green low-melting-point glass solder connects.
This test is considered from the physical properties on Aluminum Matrix Composites Strengthened by SiC surface, utilize the ceramic attribute of SiC reinforcement body and aluminum substrate surface film oxide itself, the parent glass powder solder good with stupalith consistency is selected to carry out modification, parent glass powder solder is formed primarily of ionic linkage and covalent linkage compound, fundamentally solve solder in Aluminum Matrix Composites Strengthened by SiC wettability of the surface problem, achieve Aluminum Matrix Composites Strengthened by SiC in atmosphere with the reliable connection under low temperature; This test is without the need to the operation of complexity and equipment, by the welding joint regulating the coating thickness of the compound green low-melting-point glass solder soldering paste of coating can obtain different in width weld seam, the Aluminum Matrix Composites Strengthened by SiC welding joint room temperature shearing resistance that the compound green low-melting-point glass solder that this test obtains connects reaches 102MPa; Three, the Aluminum Matrix Composites Strengthened by SiC pore-free that the compound green low-melting-point glass solder that this test obtains connects, dense structure, strength of welded joint are high, solve that ordinary method welding temperature is high, the non-wetted problem of metal solder.

Claims (10)

1. compound green low-melting-point glass solder connects a method for Aluminum Matrix Composites Strengthened by SiC, it is characterized in that what a kind of method of compound green low-melting-point glass solder connection Aluminum Matrix Composites Strengthened by SiC specifically completed according to the following steps:
One, parent glass particle classifying: parent glass powder is placed in ball grinder, under rotating speed is 100r/min ~ 200r/min, be (35 ~ 45) in the mass ratio of abrading-ball and parent glass powder: the ratio of 1 adds abrading-ball, ball milling 1h ~ 5h, obtain powder, powder is put on 200 order metallic screens and vibrate, put on 500 order metallic screens by the powder in 200 mesh sieve holes and vibrate, be not by the powder in 500 mesh sieve holes the parent glass powder that particle diameter is 25 μm ~ 75 μm;
Parent glass powder described in step one is one or both mixture of bismuthate system lead-free low-temperature seal glass powder or phosphate-based lead-free low-temperature seal glass powder;
Bismuthate system lead-free low-temperature seal glass powder described in step one, concrete proportioning by weight mark by 40 parts ~ 50 parts Bi 2o 3, 20 parts ~ 40 parts of B 2o 3, 5 parts ~ 20 parts of BaO, 2 parts ~ 10 parts ZnO, 0.1 part ~ 2 parts Al 2o 3, 0.1 part ~ 2 parts of SiO 2with 0.1 part ~ 2 parts Li 2o forms;
Phosphate-based lead-free low-temperature seal glass powder described in step one, concrete proportioning by weight mark by 30 parts ~ 60 parts P 2o 5, 20 parts ~ 40 parts of SnO, 10 parts ~ 20 parts ZnO, 10 parts ~ 20 parts B 2o 3, 0.1 part ~ 5 parts of Al 2o 3, 0.1 part ~ 5 parts of SiO 2with 0.1 part ~ 2 parts Li 2o forms;
Two, take: take parent glass powder and β-SiC whisker that particle diameter is 25 μm ~ 75 μm;
Particle diameter described in step 2 is that to account for particle diameter be the parent glass powder of 25 μm ~ 75 μm and 75% ~ 95% of β-SiC whisker total mass to the parent glass powder of 25 μm ~ 75 μm;
It is the parent glass powder of 25 μm ~ 75 μm and 5% ~ 25% of β-SiC whisker total mass that β-SiC whisker described in step 2 accounts for particle diameter;
The particle diameter of the β-SiC whisker described in step 2 is 0.05 μm ~ 1.0 μm, length-to-diameter ratio >=10, and purity is more than 99%;
Three, the pre-treatment of β-SiC whisker: 1., under power is 50W ~ 100W, is placed in dehydrated alcohol magnetic agitation 1h ~ 3h by the β-SiC whisker after taking, and then filters and drying, obtains the β-SiC whisker after cleaning; 2., under oxygen atmosphere, the β-SiC whisker after cleaning is placed in process furnace, with the heating rate of 15 DEG C/min, process furnace is heated to 1000 DEG C ~ 1300 DEG C, and is incubated 3h ~ 5h at 1000 DEG C ~ 1300 DEG C, obtain the β-SiC whisker after being oxidized; 3., under power is 50W ~ 100W, the β-SiC whisker after oxidation is placed in dehydrated alcohol magnetic agitation 1h ~ 3h, then filters and drying, obtain pretreated β-SiC whisker;
Four, the preparation of compound lead-free low-temperature seal glass powder: by pretreated β-SiC whisker, take after particle diameter be that the parent glass powder of 25 μm ~ 75 μm and dehydrated alcohol are placed in ball grinder, add abrading-ball, then under nitrogen atmosphere protection and rotating speed are 200r/min ~ 400r/min, ball milling 0.5h ~ 3h, obtains compound lead-free low-temperature seal glass powder;
Particle diameter after taking described in step 4 is the parent glass powder of 25 μm ~ 75 μm and the pretreated total mass of β-SiC whisker and the volume ratio of dehydrated alcohol is 100g:(300 ~ 400) mL;
Particle diameter after taking described in step 4 is the parent glass powder of 25 μm ~ 75 μm and the pretreated total mass of β-SiC whisker and the mass ratio of abrading-ball is 1:(35 ~ 40);
Five, mix and blend: under rotating speed is 100r/min ~ 150r/min, is placed in soldering paste stirrer by compound lead-free low-temperature seal glass powder and caking agent and stirs 0.5h ~ 2h, obtains compound green low-melting-point glass solder soldering paste;
Compound lead-free low-temperature seal glass powder described in step 5 and the mass ratio of caking agent are 5:(0.5 ~ 2.5);
Caking agent described in step 5 is the mixture of Terpineol 350 and dehydrated alcohol, and described Terpineol 350 and the volume ratio of dehydrated alcohol are 5:(1 ~ 5);
Six, remove impurity: 1., adopt ultrasonic method, utilize acetone to Aluminum Matrix Composites Strengthened by SiC ultrasonic cleaning, obtain the Aluminum Matrix Composites Strengthened by SiC after cleaning; 2. use the waterproof abrasive paper of 600#, 800#, 1000# and 1200# to carry out carrying out mechanical grinding to the Aluminum Matrix Composites Strengthened by SiC after ultrasonic cleaning, successively, obtain ganoid Aluminum Matrix Composites Strengthened by SiC; 3., adopt ultrasonic method, utilize distilled water and the smooth Aluminum Matrix Composites Strengthened by SiC of acetone effects on surface to clean respectively; 4., by Aluminum Matrix Composites Strengthened by SiC dry 20min ~ 40min at the temperature of 40 DEG C ~ 60 DEG C, the Aluminum Matrix Composites Strengthened by SiC after removing impurity is obtained;
In Aluminum Matrix Composites Strengthened by SiC described in step 6, the volume fraction of silicon carbide is 10% ~ 80%;
Seven, apply: adopt the method for silk screen printing compound green low-melting-point glass solder soldering paste to be evenly coated in the surface of the Aluminum Matrix Composites Strengthened by SiC after removing impurity, coating thickness is 15 μm ~ 100 μm, obtains the Aluminum Matrix Composites Strengthened by SiC after applying;
Eight, test specimen assembling and welding: 1., by the Aluminum Matrix Composites Strengthened by SiC surface after two pieces of coatings contact and align, obtaining the test specimen to be welded assembled; 2., the test specimen to be welded assembled is positioned in resistance furnace, 0.5MPa ~ 1MPa welding pressure is applied to the test specimen to be welded assembled, by resistance furnace with the temperature rise rate of 10 DEG C/min ~ 20 DEG C/min from room temperature to 300 DEG C, and be incubated 10min ~ 30min at 300 DEG C; 3., 380 DEG C ~ 580 DEG C are warming up to the temperature rise rate of 5 DEG C/min ~ 10 DEG C/min from 300 DEG C, and 30min ~ 60min is incubated at 380 DEG C ~ 580 DEG C, naturally cool to room temperature with stove, obtain the Aluminum Matrix Composites Strengthened by SiC that compound green low-melting-point glass solder connects.
2. a kind of compound green low-melting-point glass solder according to claim 1 connects the method for Aluminum Matrix Composites Strengthened by SiC, it is characterized in that the bismuthate system lead-free low-temperature seal glass powder described in step one, concrete proportioning by weight mark by 45 parts ~ 50 parts Bi 2o 3, 25 parts ~ 35 parts of B 2o 3, 10 parts ~ 20 parts of BaO, 5 parts ~ 10 parts ZnO, 0.1 part ~ 1 part Al 2o 3, 0.1 part ~ 1 part of SiO 2with 0.1 part ~ 1 part Li 2o forms.
3. a kind of compound green low-melting-point glass solder according to claim 1 connects the method for Aluminum Matrix Composites Strengthened by SiC, it is characterized in that the phosphate-based lead-free low-temperature seal glass powder described in step one, concrete proportioning by weight mark by 40 parts ~ 60 parts P 2o 5, 30 parts ~ 40 parts of SnO, 15 parts ~ 20 parts ZnO, 15 parts ~ 20 parts B 2o 3, 1 part ~ 5 parts of Al 2o 3, 1 part ~ 5 parts of SiO 2with 1 part ~ 2 parts Li 2o forms.
4. a kind of compound green low-melting-point glass solder according to claim 1 connects the method for Aluminum Matrix Composites Strengthened by SiC, it is characterized in that the particle diameter of the β-SiC whisker described in step 2 is 0.05 μm ~ 0.8 μm, length-to-diameter ratio >=10, purity is more than 99%.
5. a kind of compound green low-melting-point glass solder according to claim 1 connects the method for Aluminum Matrix Composites Strengthened by SiC, to it is characterized in that during step 3 2. under oxygen atmosphere, β-SiC whisker after cleaning is placed in process furnace, with the heating rate of 15 DEG C/min, process furnace is heated to 1100 DEG C ~ 1300 DEG C, and 4h ~ 5h is incubated at 1100 DEG C ~ 1300 DEG C, obtain the β-SiC whisker after being oxidized.
6. a kind of compound green low-melting-point glass solder according to claim 1 connects the method for Aluminum Matrix Composites Strengthened by SiC, it is characterized in that the particle diameter after taking described in step 4 be the parent glass powder of 25 μm ~ 75 μm and the pretreated total mass of β-SiC whisker and the volume ratio of dehydrated alcohol is 100g:(350 ~ 400) mL.
7. a kind of compound green low-melting-point glass solder according to claim 1 connects the method for Aluminum Matrix Composites Strengthened by SiC, it is characterized in that the mass ratio of compound lead-free low-temperature seal glass powder described in step 5 and caking agent is 5:(1 ~ 2.5).
8. a kind of compound green low-melting-point glass solder according to claim 1 connects the method for Aluminum Matrix Composites Strengthened by SiC, the caking agent that it is characterized in that described in step 5 is the mixture of Terpineol 350 and dehydrated alcohol, and described Terpineol 350 and the volume ratio of dehydrated alcohol are 5:(3 ~ 5).
9. a kind of compound green low-melting-point glass solder according to claim 1 connects the method for Aluminum Matrix Composites Strengthened by SiC, it is characterized in that in step 7, adopting the method for silk screen printing compound green low-melting-point glass solder soldering paste to be evenly coated in the surface of the Aluminum Matrix Composites Strengthened by SiC after removing impurity, coating thickness is 15 μm ~ 50 μm, obtains the Aluminum Matrix Composites Strengthened by SiC after applying.
10. a kind of compound green low-melting-point glass solder according to claim 1 connects the method for Aluminum Matrix Composites Strengthened by SiC, it is characterized in that being warming up to 420 DEG C ~ 580 DEG C with the temperature rise rate of 8 DEG C/min ~ 10 DEG C/min from 300 DEG C during step 8 3., and 40min ~ 60min is incubated at 420 DEG C ~ 580 DEG C, naturally cool to room temperature with stove, obtain the Aluminum Matrix Composites Strengthened by SiC that compound green low-melting-point glass solder connects.
CN201410155293.0A 2014-04-17 2014-04-17 A kind of compound green low-melting-point glass solder connects the method for Aluminum Matrix Composites Strengthened by SiC Active CN103894694B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201410155293.0A CN103894694B (en) 2014-04-17 2014-04-17 A kind of compound green low-melting-point glass solder connects the method for Aluminum Matrix Composites Strengthened by SiC

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201410155293.0A CN103894694B (en) 2014-04-17 2014-04-17 A kind of compound green low-melting-point glass solder connects the method for Aluminum Matrix Composites Strengthened by SiC

Publications (2)

Publication Number Publication Date
CN103894694A CN103894694A (en) 2014-07-02
CN103894694B true CN103894694B (en) 2016-01-20

Family

ID=50986441

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201410155293.0A Active CN103894694B (en) 2014-04-17 2014-04-17 A kind of compound green low-melting-point glass solder connects the method for Aluminum Matrix Composites Strengthened by SiC

Country Status (1)

Country Link
CN (1) CN103894694B (en)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104402227B (en) * 2014-10-22 2017-04-05 广东风华高新科技股份有限公司 High-temperature agglomerant and preparation method thereof
CN104909795A (en) * 2015-05-12 2015-09-16 哈尔滨工业大学 High-temperature ceramic/metal riveting-glass sealing combination connection method
CN105149890A (en) * 2015-10-19 2015-12-16 哈尔滨工业大学 Method for Li-series ferrite connection through compound glass solder
CN105481253B (en) * 2015-12-09 2019-01-08 哈尔滨工业大学 A kind of preparation method of compound low temperature sealing glass solder soldering paste
CN105364245B (en) * 2015-12-17 2017-11-03 哈尔滨工业大学 A kind of sapphire low-temperature welding method
CN105499733B (en) * 2015-12-29 2018-03-16 哈尔滨工业大学 A kind of low temperature glass method for welding of differential arc oxidation auxiliary
CN105522244B (en) * 2015-12-29 2018-01-30 哈尔滨工业大学 A kind of low temperature glass method for welding of ultrasonic assistant
CN105458437B (en) * 2015-12-29 2018-10-09 哈尔滨工业大学 A kind of low temperature glass method for welding of anodic oxidation auxiliary
CN105418131B (en) * 2015-12-30 2018-03-30 哈尔滨工业大学 A kind of aluminium oxide ceramics low temperature brazing connection method
CN105418132A (en) * 2016-01-07 2016-03-23 上海电机学院 Method for adopting aluminum or aluminum alloy to directly braze aluminum nitride ceramics
CN106116627B (en) * 2016-06-16 2019-07-02 哈尔滨工业大学 A kind of method of phosphate glass solder law temperature joining aluminium oxide ceramics
CN106825978B (en) * 2017-02-24 2019-08-27 哈尔滨工业大学深圳研究生院 A kind of solder and welding method for welding for china with metal
CN107116318A (en) * 2017-03-28 2017-09-01 常州大学 A kind of preparation method of the low silver-colored hypoeutectic solder of high wettability
CN110405379B (en) * 2018-04-27 2020-11-13 哈尔滨工业大学 Ag-CuO-B2O3Brazing filler metal, preparation method thereof and method for connecting sapphire by using brazing filler metal
CN109693056B (en) * 2019-02-25 2021-05-25 西安明科微电子材料有限公司 Insulator solder for aluminum silicon carbide tube shell and preparation method thereof
CN112608164B (en) * 2020-11-12 2021-08-27 中广核研究院有限公司 Connection brazing filler metal, preparation method thereof and silicon carbide cladding connection method
CN113881354B (en) * 2021-09-29 2022-07-22 湖北瑞宇空天高新技术有限公司 Bonding repair method for carbon fiber reinforced carbon-based composite material, used bonding agent and preparation method thereof
CN115815726B (en) * 2022-12-02 2023-09-22 哈尔滨工业大学 Method for connecting YSZ ceramic and Crofer22H stainless steel under air by using Ag-based brazing filler metal
CN116765673A (en) * 2023-08-25 2023-09-19 长春理工大学 V, te-containing solder and preparation method and application thereof

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7407902B2 (en) * 2002-03-29 2008-08-05 Matsushita Electric Industrial Co., Ltd. Bismuth glass composition, and magnetic head and plasma display panel including the same as sealing member
KR101011420B1 (en) * 2006-07-11 2011-01-28 니폰 덴키 가라스 가부시키가이샤 Glass composition for sealing and sealed material
DE102007025465B3 (en) * 2007-05-30 2008-09-25 Schott Ag Solder glass contains specified percentage ranges of silica, boron oxide, zinc oxide, bismuth oxide and aluminum oxide, ratio of silica to aluminum oxide being below specified value
CN101544470A (en) * 2009-04-20 2009-09-30 贵阳晶华电子材料有限公司 High-bismuth-oxide dielectric material for electrode coating
CN101786899B (en) * 2010-01-26 2012-07-04 哈尔滨工业大学 Solder for welding carbon/silicon carbide ceramic matrix composite material and titanium-aluminum-based alloy and soldering method
CN102658411B (en) * 2012-05-24 2013-12-25 哈尔滨工业大学 Ultrasonic brazing method for high-volume-fraction silicon carbide particle enhanced aluminum-base composite and low-expansion alloy

Also Published As

Publication number Publication date
CN103894694A (en) 2014-07-02

Similar Documents

Publication Publication Date Title
CN103894694B (en) A kind of compound green low-melting-point glass solder connects the method for Aluminum Matrix Composites Strengthened by SiC
CN104759725B (en) A kind of method using micro/nano level metallic particles filling Sn parent metal to realize electronic building brick High-temperature Packaging
CN105237026B (en) A kind of ceramics/ceramic joining method of multiple physical field coupling regulation and control intermediate solder layer
CN105522244B (en) A kind of low temperature glass method for welding of ultrasonic assistant
CN105272369B (en) A kind of porous ceramics connection method
CN106312220A (en) Ceramic substrate copper cladding low-temperature connection method for power module
CN110330356B (en) Silicon carbide ceramic brazing connection method
EP1513782A1 (en) Method for producing gas-tight and high-temperature resistant unions of shaped parts, which are made of a non-oxidic ceramic material, by using a laser
WO2009135387A1 (en) Ceramic grain reinforced composite braziing filler metal
CN105585326B (en) A kind of technique of nanometer of foil diffusion connection carbon/silicon carbide ceramic matrix composite
CN107151147A (en) It is a kind of to be used for the solder and soldering processes of silicon carbide ceramics soldering in atmosphere
Fujimoto et al. Joining of pure copper using Cu nanoparticles derived from CuO paste
CN106944698A (en) The SiC ceramic and the direct method for welding of SiC ceramic reinforced aluminum matrix composites ultrasonic cryogenic being modified based on thermal oxide surface
CN105149717A (en) Silicon-based ceramic surface metallization method
CN106588064B (en) The solder and connection method of carbon/carbon compound material and nickel base superalloy
CN104909795A (en) High-temperature ceramic/metal riveting-glass sealing combination connection method
CN104496511B (en) A kind of online reaction forming method of ceramic form
CN108406029B (en) Titanium-based composite brazing filler metal and preparation and brazing methods thereof
CN105541367B (en) A kind of ceramic discharge tube low temperature nickel metallization method for sealing
CN105499733B (en) A kind of low temperature glass method for welding of differential arc oxidation auxiliary
CN108658627A (en) A kind of method for metallising of aluminium nitride ceramics
CN105585325B (en) A kind of silicon-carbon element original position reaction forming technique of carbon/silicon carbide ceramic matrix composite
CN114178738A (en) Active solder for brazing ceramic and stainless steel and solder paste
CN102699571A (en) Moderate-temperature brazing filler metal for graphite-base composite material connection and preparation method thereof
CN103193499B (en) A kind of method of attachment of carbon-carbon composites

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant