CN103894694A - Method for connection between composite type green low-melting solder glass and silicon carbide reinforced aluminum matrix composites - Google Patents

Method for connection between composite type green low-melting solder glass and silicon carbide reinforced aluminum matrix composites Download PDF

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Publication number
CN103894694A
CN103894694A CN201410155293.0A CN201410155293A CN103894694A CN 103894694 A CN103894694 A CN 103894694A CN 201410155293 A CN201410155293 A CN 201410155293A CN 103894694 A CN103894694 A CN 103894694A
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sic
parts
matrix composites
aluminum matrix
glass powder
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CN103894694B (en
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何鹏
林铁松
林盼盼
马楠
陈诚
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Harbin Institute of Technology
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Harbin Institute of Technology
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/008—Soldering within a furnace
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/19—Soldering, e.g. brazing, or unsoldering taking account of the properties of the materials to be soldered
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • B23K1/206—Cleaning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams, slurries
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3601—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with inorganic compounds as principal constituents
    • B23K35/3602—Carbonates, basic oxides or hydroxides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/16—Composite materials, e.g. fibre reinforced

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Glass Compositions (AREA)

Abstract

The invention provides a method for connection between composite type green low-melting solder glass and silicon carbide reinforced aluminum matrix composites and relates to a method for connecting the silicon carbide reinforced aluminum matrix composites. The method aims at solving the problems that the silicon carbide reinforced aluminum matrix composites connected through an existing connection method are low in strength and the joint strength, and the surface of existing solder and the surface of the silicon carbide reinforced aluminum matrix composites are incompatible when the content of silicon carbide reinforced bodies in existing silicon carbide reinforced aluminum matrix composites is increased. The method includes the steps of classifying basis glass power, weighing, pretreating beta-SiC whiskers, preparing composite type lead-free low-temperature sealing glass powder, mixing, stirring, removing impurities, coating and assembling and welding test pieces. Through the method, the silicon carbide reinforced aluminum matrix composites can be connected in a low-temperature soldering mode.

Description

A kind of compound green low-melting-point glass solder connects the method for Aluminum Matrix Composites Strengthened by SiC
Technical field
The present invention relates to a kind of method that connects Aluminum Matrix Composites Strengthened by SiC.
Background technology
At present, the method that connects Aluminum Matrix Composites Strengthened by SiC mainly contains melting welding, friction welding (FW), diffusion welding (DW), soldering etc., wherein method for brazing is the most widely used method of attachment of most study, and it plays an important role aspect solving the connectivity problem of Aluminum Matrix Composites Strengthened by SiC in engineering field.The solder that is usually used in brazed aluminum based composites mainly contains aluminium silicon system and zinc-aluminium is two kinds, no matter is which kind of solder is all undesirable to the wetting situation of composite.This is mainly because composite aluminum substrate surface exists oxide-film and the SiC reinforcement body of one deck densification, the formation key of oxide-film and reinforcement is ionic bond and covalent bond, the metallic bond of itself and metal is completely incompatible, interface energy is very big, causes metal solder to be difficult at these two kinds of material surfaces wetting.
In the time that in composite, carborundum content is lower, common way be by brazing flux abolish, mechanical breaking, vacuum abolish and the ultrasonic oxide-film of the method such as abolishing and remove composite material surface, do not consider the impact of SiC reinforcement phase simultaneously, the welding of composite is converted into the welding of aluminium alloy mother metal, has improved on year-on-year basis to a certain extent the wettability of metal solder at composite material surface.But when the increasing gradually of SiC reinforcement body burden in composite, even if aluminum substrate surface does not exist oxide-film, solder all will no longer soak composite.Have researcher by employing electroplate, the mode such as chemical plating is at the preset metal Ni of composite material surface, Cu etc., indirectly realized the welding of aluminum matrix composite.But on the one hand the mechanical snap between preset metal level and composite to be connected intensity own not high, affect strength of joint, the more important thing is that the method does not equally solve the inconsistent root problem of solder and composite material surface yet.
Summary of the invention
The object of the invention is to solve in existing Aluminum Matrix Composites Strengthened by SiC when SiC reinforcement body burden is high, existing method of attachment exists the Aluminum Matrix Composites Strengthened by SiC intensity after connecting not high, there is inconsistent problem in the low and existing solder of strength of joint and Aluminum Matrix Composites Strengthened by SiC surface, and provides a kind of compound green low-melting-point glass solder to connect the method for Aluminum Matrix Composites Strengthened by SiC.
Compound green low-melting-point glass solder connects a method for Aluminum Matrix Composites Strengthened by SiC, specifically completes according to the following steps:
One, parent glass particle classifying: parent glass powder is placed in to ball grinder, be under 100r/min～200r/min at rotating speed, be (35～45) in the mass ratio of abrading-ball and parent glass powder: 1 ratio adds abrading-ball, ball milling 1h～5h, obtain powder, powder is put on 200 order metallic screens and vibrated, put on 500 order metallic screens and vibrate by the powder in 200 mesh sieve holes, be not by the powder in 500 mesh sieve holes the parent glass powder that particle diameter is 25 μ m～75 μ m;
Parent glass powder described in step 1 is that bismuthates is one or both mixture of lead-free low-temperature seal glass powder or phosphate-based lead-free low-temperature seal glass powder;
Bismuthates described in step 1 is lead-free low-temperature seal glass powder, concrete proportioning by weight mark by 40 parts～50 parts Bi 2o 3, 20 parts～40 parts of B 2o 3, 5 parts～20 parts of BaO, 2 parts～10 parts ZnO, 0.1 part～2 parts Al 2o 3, 0.1 part～2 parts of SiO 2with 0.1 part～2 parts Li 2o composition;
Phosphate-based lead-free low-temperature seal glass powder described in step 1, concrete proportioning by weight mark by 30 parts～60 parts P 2o 5, 20 parts～40 parts of SnO, 10 parts～20 parts ZnO, 10 parts～20 parts B 2o 3, 0.1 part～5 parts of Al 2o 3, 0.1 part～5 parts of SiO 2with 0.1 part～2 parts Li 2o composition;
Two, take: taking particle diameter is parent glass powder and the β-SiC whisker of 25 μ m～75 μ m;
Particle diameter described in step 2 be the parent glass powder of 25 μ m～75 μ m account for parent glass powder that particle diameter is 25 μ m～75 μ m and β-SiC whisker gross mass 75%～95%;
β-SiC whisker described in step 2 accounts for 5%～25% of parent glass powder that particle diameter is 25 μ m～75 μ m and β-SiC whisker gross mass;
The particle diameter of the β-SiC whisker described in step 2 is 0.05 μ m～1.0 μ m, draw ratio >=10, and purity is more than 99%;
Three, the pretreatment of β-SiC whisker: 1., be under 50W～100W at power, the β-SiC whisker after taking is placed in to absolute ethyl alcohol magnetic agitation 1h～3h, then filters and be dried, the β-SiC whisker after being cleaned; 2., under oxygen atmosphere, by clean after β-SiC whisker be placed in heating furnace, with the rate of heat addition of 15 ℃/min, heating furnace is heated to 1000 ℃～1300 ℃, and is incubated 3h～5h at 1000 ℃～1300 ℃, the β-SiC whisker after being oxidized; 3., repeating step three 1. once, obtain pretreated β-SiC whisker;
Four, the preparation of compound lead-free low-temperature seal glass powder: the particle diameter by pretreated β-SiC whisker, after taking is that parent glass powder and the absolute ethyl alcohol of 25 μ m～75 μ m is placed in ball grinder, add abrading-ball, then be under 200r/min～400r/min in nitrogen atmosphere protection and rotating speed, ball milling 0.5h～3h, obtains compound lead-free low-temperature seal glass powder;
Particle diameter after taking described in step 4 is that the parent glass powder of 25 μ m～75 μ m and the gross mass of pretreated β-SiC whisker and the volume ratio of absolute ethyl alcohol are 100g:(300～400) mL;
Particle diameter after taking described in step 4 is that the parent glass powder of 25 μ m～75 μ m and the gross mass of pretreated β-SiC whisker and the mass ratio of abrading-ball are 1:(35～45);
Five, mix and blend: be under 100r/min～150r/min at rotating speed, compound lead-free low-temperature seal glass powder and bonding agent be placed in to soldering paste mixer and stir 0.5h～2h, obtain compound green low-melting-point glass solder soldering paste;
Compound lead-free low-temperature seal glass powder described in step 5 and the mass ratio of bonding agent are 5:(0.5～2.5);
Bonding agent described in step 5 is the mixture of terpinol and absolute ethyl alcohol, and described terpinol and the volume ratio of absolute ethyl alcohol are 5:(1～5);
Six, remove impurity: 1., adopt ultrasonic method, utilize acetone to Aluminum Matrix Composites Strengthened by SiC ultrasonic cleaning, the Aluminum Matrix Composites Strengthened by SiC after being cleaned; 2. use, successively the waterproof abrasive paper of 600#, 800#, 1000# and 1200# to carry out the Aluminum Matrix Composites Strengthened by SiC after ultrasonic cleaning to carry out mechanical grinding, obtain ganoid Aluminum Matrix Composites Strengthened by SiC; 3., adopt ultrasonic method, utilize respectively distilled water and the smooth Aluminum Matrix Composites Strengthened by SiC of acetone effects on surface to clean; 4., by Aluminum Matrix Composites Strengthened by SiC dry 20min～40min at the temperature of 40 ℃～60 ℃, obtain removing the Aluminum Matrix Composites Strengthened by SiC after impurity;
In Aluminum Matrix Composites Strengthened by SiC described in step 6, the volume fraction of carborundum is 10%～80%;
Seven, apply: adopt the method for serigraphy compound green low-melting-point glass solder soldering paste to be evenly coated in to the Aluminum Matrix Composites Strengthened by SiC surface of removing after impurity, coating thickness is 15 μ m～100 μ m, the Aluminum Matrix Composites Strengthened by SiC after being applied;
Eight, test specimen assembling and welding: 1., the Aluminum Matrix Composites Strengthened by SiC surface after two coatings is contacted and alignd, the test specimen to be welded that obtains assembling; 2., the test specimen to be welded assembling is positioned in resistance furnace, the test specimen to be welded assembling is applied to 0.5MPa～1MPa welding pressure, resistance furnace is warming up to 300 ℃ with the heating rate of 10 ℃/min～20 ℃/min from room temperature, and is incubated 10min～30min at 300 ℃; 3., be warming up to 380 ℃～580 ℃ with the heating rate of 5 ℃/min～10 ℃/min from 300 ℃, and be incubated 30min～60min at 380 ℃～580 ℃, naturally cool to room temperature with stove, obtain the Aluminum Matrix Composites Strengthened by SiC that compound green low-melting-point glass solder connects.
Advantage of the present invention: one, the present invention considers from the physical property on Aluminum Matrix Composites Strengthened by SiC surface, utilize the ceramic attribute of SiC reinforcement body and aluminum substrate surface film oxide itself, select the parent glass powder solder good with ceramic material compatibility to carry out modification, parent glass powder solder is mainly by ionic bond with covalent bond is compound forms, fundamentally solve solder in Aluminum Matrix Composites Strengthened by SiC wettability of the surface problem, realized the reliable connection of Aluminum Matrix Composites Strengthened by SiC in air and under low temperature; Two, the present invention is without complicated operation and equipment, the coating thickness that applies compound green low-melting-point glass solder soldering paste by adjusting can obtain the welding point of different in width weld seam, and the Aluminum Matrix Composites Strengthened by SiC welding point room temperature shear strength that the compound green low-melting-point glass solder that the present invention obtains connects reaches 50MPa～104MPa; Three, Aluminum Matrix Composites Strengthened by SiC pore-free, dense structure, strength of welded joint that the compound green low-melting-point glass solder that the present invention obtains connects are high, and solution conventional method welding temperature is high, the non-wetted problem of metal solder; Four, the present invention can also be used for the connection of other ceramic/metal based composites.
The present invention can obtain a kind of method that compound green low-melting-point glass solder connects Aluminum Matrix Composites Strengthened by SiC.
Accompanying drawing explanation
Fig. 1 is that the Aluminum Matrix Composites Strengthened by SiC that the compound green low-melting-point glass solder of test five preparations connects amplifies the SEM figure of 3000 times.
The specific embodiment
The specific embodiment one: present embodiment is a kind of method that compound green low-melting-point glass solder connects Aluminum Matrix Composites Strengthened by SiC, specifically completes according to the following steps:
One, parent glass particle classifying: parent glass powder is placed in to ball grinder, be under 100r/min～200r/min at rotating speed, be (35～45) in the mass ratio of abrading-ball and parent glass powder: 1 ratio adds abrading-ball, ball milling 1h～5h, obtain powder, powder is put on 200 order metallic screens and vibrated, put on 500 order metallic screens and vibrate by the powder in 200 mesh sieve holes, be not by the powder in 500 mesh sieve holes the parent glass powder that particle diameter is 25 μ m～75 μ m;
Parent glass powder described in step 1 is that bismuthates is one or both mixture of lead-free low-temperature seal glass powder or phosphate-based lead-free low-temperature seal glass powder;
Bismuthates described in step 1 is lead-free low-temperature seal glass powder, concrete proportioning by weight mark by 40 parts～50 parts Bi 2o 3, 20 parts～40 parts of B 2o 3, 5 parts～20 parts of BaO, 2 parts～10 parts ZnO, 0.1 part～2 parts Al 2o 3, 0.1 part～2 parts of SiO 2with 0.1 part～2 parts Li 2o composition;
Phosphate-based lead-free low-temperature seal glass powder described in step 1, concrete proportioning by weight mark by 30 parts～60 parts P 2o 5, 20 parts～40 parts of SnO, 10 parts～20 parts ZnO, 10 parts～20 parts B 2o 3, 0.1 part～5 parts of Al 2o 3, 0.1 part～5 parts of SiO 2with 0.1 part～2 parts Li 2o composition;
Two, take: taking particle diameter is parent glass powder and the β-SiC whisker of 25 μ m～75 μ m;
Particle diameter described in step 2 be the parent glass powder of 25 μ m～75 μ m account for parent glass powder that particle diameter is 25 μ m～75 μ m and β-SiC whisker gross mass 75%～95%;
β-SiC whisker described in step 2 accounts for 5%～25% of parent glass powder that particle diameter is 25 μ m～75 μ m and β-SiC whisker gross mass;
The particle diameter of the β-SiC whisker described in step 2 is 0.05 μ m～1.0 μ m, draw ratio >=10, and purity is more than 99%;
Three, the pretreatment of β-SiC whisker: 1., be under 50W～100W at power, the β-SiC whisker after taking is placed in to absolute ethyl alcohol magnetic agitation 1h～3h, then filters and be dried, the β-SiC whisker after being cleaned; 2., under oxygen atmosphere, by clean after β-SiC whisker be placed in heating furnace, with the rate of heat addition of 15 ℃/min, heating furnace is heated to 1000 ℃～1300 ℃, and is incubated 3h～5h at 1000 ℃～1300 ℃, the β-SiC whisker after being oxidized; 3., repeating step three 1. once, obtain pretreated β-SiC whisker;
Four, the preparation of compound lead-free low-temperature seal glass powder: the particle diameter by pretreated β-SiC whisker, after taking is that parent glass powder and the absolute ethyl alcohol of 25 μ m～75 μ m is placed in ball grinder, add abrading-ball, then be under 200r/min～400r/min in nitrogen atmosphere protection and rotating speed, ball milling 0.5h～3h, obtains compound lead-free low-temperature seal glass powder;
Particle diameter after taking described in step 4 is that the parent glass powder of 25 μ m～75 μ m and the gross mass of pretreated β-SiC whisker and the volume ratio of absolute ethyl alcohol are 100g:(300～400) mL;
Particle diameter after taking described in step 4 is that the parent glass powder of 25 μ m～75 μ m and the gross mass of pretreated β-SiC whisker and the mass ratio of abrading-ball are 1:(35～45);
Five, mix and blend: be under 100r/min～150r/min at rotating speed, compound lead-free low-temperature seal glass powder and bonding agent be placed in to soldering paste mixer and stir 0.5h～2h, obtain compound green low-melting-point glass solder soldering paste;
Compound lead-free low-temperature seal glass powder described in step 5 and the mass ratio of bonding agent are 5:(0.5～2.5);
Bonding agent described in step 5 is the mixture of terpinol and absolute ethyl alcohol, and described terpinol and the volume ratio of absolute ethyl alcohol are 5:(1～5);
Six, remove impurity: 1., adopt ultrasonic method, utilize acetone to Aluminum Matrix Composites Strengthened by SiC ultrasonic cleaning, the Aluminum Matrix Composites Strengthened by SiC after being cleaned; 2. use, successively the waterproof abrasive paper of 600#, 800#, 1000# and 1200# to carry out the Aluminum Matrix Composites Strengthened by SiC after ultrasonic cleaning to carry out mechanical grinding, obtain ganoid Aluminum Matrix Composites Strengthened by SiC; 3., adopt ultrasonic method, utilize respectively distilled water and the smooth Aluminum Matrix Composites Strengthened by SiC of acetone effects on surface to clean; 4., by Aluminum Matrix Composites Strengthened by SiC dry 20min～40min at the temperature of 40 ℃～60 ℃, obtain removing the Aluminum Matrix Composites Strengthened by SiC after impurity;
In Aluminum Matrix Composites Strengthened by SiC described in step 6, the volume fraction of carborundum is 10%～80%;
Seven, apply: adopt the method for serigraphy compound green low-melting-point glass solder soldering paste to be evenly coated in to the Aluminum Matrix Composites Strengthened by SiC surface of removing after impurity, coating thickness is 15 μ m～100 μ m, the Aluminum Matrix Composites Strengthened by SiC after being applied;
Eight, test specimen assembling and welding: 1., the Aluminum Matrix Composites Strengthened by SiC surface after two coatings is contacted and alignd, the test specimen to be welded that obtains assembling; 2., the test specimen to be welded assembling is positioned in resistance furnace, the test specimen to be welded assembling is applied to 0.5MPa～1MPa welding pressure, resistance furnace is warming up to 300 ℃ with the heating rate of 10 ℃/min～20 ℃/min from room temperature, and is incubated 10min～30min at 300 ℃; 3., be warming up to 380 ℃～580 ℃ with the heating rate of 5 ℃/min～10 ℃/min from 300 ℃, and be incubated 30min～60min at 380 ℃～580 ℃, naturally cool to room temperature with stove, obtain the Aluminum Matrix Composites Strengthened by SiC that compound green low-melting-point glass solder connects.
Binding agent described in present embodiment step 5 is terpinol, and boiling point is 220 ℃～230 ℃, and decomposition temperature is 290 ℃～300 ℃;
The fusing point of the compound lead-free low-temperature seal glass powder described in present embodiment step 5 is 350 ℃～550 ℃.
The advantage of present embodiment: one, present embodiment is considered from the physical property on Aluminum Matrix Composites Strengthened by SiC surface, utilize the ceramic attribute of SiC reinforcement body and aluminum substrate surface film oxide itself, select the parent glass powder solder good with ceramic material compatibility to carry out modification, parent glass powder solder is mainly by ionic bond with covalent bond is compound forms, fundamentally solve solder in Aluminum Matrix Composites Strengthened by SiC wettability of the surface problem, realized the reliable connection of Aluminum Matrix Composites Strengthened by SiC in air and under low temperature; Two, present embodiment is without complicated operation and equipment, the coating thickness that applies compound green low-melting-point glass solder soldering paste by adjusting can obtain the welding point of different in width weld seam, and the Aluminum Matrix Composites Strengthened by SiC welding point room temperature shear strength that the compound green low-melting-point glass solder that present embodiment obtains connects reaches 50MPa～104MPa; Three, Aluminum Matrix Composites Strengthened by SiC pore-free, dense structure, strength of welded joint that the compound green low-melting-point glass solder that present embodiment obtains connects are high, and solution conventional method welding temperature is high, the non-wetted problem of metal solder; Four, present embodiment can also be used for the connection of other ceramic/metal based composites.
Present embodiment can obtain a kind of method that compound green low-melting-point glass solder connects Aluminum Matrix Composites Strengthened by SiC.
The specific embodiment two: present embodiment and the specific embodiment one difference are: the bismuthates described in step 1 is lead-free low-temperature seal glass powder, concrete proportioning by weight mark by 45 parts～50 parts Bi 2o 3, 25 parts～35 parts of B 2o 3, 10 parts～20 parts of BaO, 5 parts～10 parts ZnO, 0.1 part～1 part Al 2o 3, 0.1 part～1 part of SiO 2with 0.1 part～1 part Li 2o composition.Other steps are identical with the specific embodiment one.
The specific embodiment three: one of present embodiment and specific embodiment one or two difference is: the phosphate-based lead-free low-temperature seal glass powder described in step 1, concrete proportioning by weight mark by 40 parts～60 parts P 2o 5, 30 parts～40 parts of SnO, 15 parts～20 parts ZnO, 15 parts～20 parts B 2o 3, 1 part～5 parts of Al 2o 3, 1 part～5 parts of SiO 2with 1 part～2 parts Li 2o composition.Other steps are identical with the specific embodiment one or two.
The specific embodiment four: one of present embodiment and specific embodiment one to three difference is: the particle diameter of the β-SiC whisker described in step 2 is 0.05 μ m～0.8 μ m, draw ratio >=10, purity is more than 99%.Other steps are identical with the specific embodiment one to three.
The specific embodiment five: one of present embodiment and specific embodiment one to four difference is: step 3 2. under oxygen atmosphere, β-SiC whisker after cleaning is placed in to heating furnace, heating furnace is heated to 1100 ℃～1300 ℃ by the rate of heat addition with 15 ℃/min, and at 1100 ℃～1300 ℃, be incubated 4h～5h, the β-SiC whisker after being oxidized.Other steps are identical with the specific embodiment one to four.
The specific embodiment six: one of present embodiment and specific embodiment one to five difference is: the particle diameter after taking described in step 4 is that the parent glass powder of 25 μ m～75 μ m and the gross mass of pretreated β-SiC whisker and the volume ratio of absolute ethyl alcohol are 100g:(350～400) mL.Other steps are identical with the specific embodiment one to five.
The specific embodiment seven: one of present embodiment and specific embodiment one to six difference is: the compound lead-free low-temperature seal glass powder described in step 5 and the mass ratio of bonding agent are 5:(1～2.5).Other steps are identical with the specific embodiment one to six.
The specific embodiment eight: one of present embodiment and specific embodiment one to seven difference is: the bonding agent described in step 5 is the mixture of terpinol and absolute ethyl alcohol, and described terpinol and the volume ratio of absolute ethyl alcohol are 5:(3～5).Other steps are identical with the specific embodiment one to seven.
The specific embodiment nine: one of present embodiment and specific embodiment one to eight difference is: adopt the method for serigraphy compound green low-melting-point glass solder soldering paste to be evenly coated in to the Aluminum Matrix Composites Strengthened by SiC surface of removing after impurity in step 7, coating thickness is 15 μ m～50 μ m, the Aluminum Matrix Composites Strengthened by SiC after being applied.Other steps are identical with the specific embodiment one to eight.
The specific embodiment ten: one of present embodiment and specific embodiment one to nine difference is: step 8 is warming up to 420 ℃～580 ℃ with the heating rate of 8 ℃/min～10 ℃/min from 300 ℃ in 3., and be incubated 40min～60min at 420 ℃～580 ℃, naturally cool to room temperature with stove, obtain the Aluminum Matrix Composites Strengthened by SiC that compound green low-melting-point glass solder connects.Other steps are identical with the specific embodiment one to nine.
Adopt following verification experimental verification beneficial effect of the present invention:
Test one: a kind of method that compound green low-melting-point glass solder connects Aluminum Matrix Composites Strengthened by SiC specifically completes according to the following steps:
One, parent glass particle classifying: parent glass powder is placed in to ball grinder, be under 150r/min at rotating speed, the ratio that is 40:1 in the mass ratio of abrading-ball and parent glass powder adds abrading-ball, ball milling 3h, obtain powder, powder is put on 200 order metallic screens and vibrated, put on 500 order metallic screens and vibrate by the powder in 200 mesh sieve holes, be not by the powder in 500 mesh sieve holes the parent glass powder that particle diameter is 25 μ m～75 μ m;
Parent glass powder described in step 1 is that bismuthates is lead-free low-temperature seal glass powder;
Bismuthates described in step 1 is lead-free low-temperature seal glass powder, concrete proportioning by weight mark by 40 parts of Bi 2o 3, 20 parts of B 2o 3, 5 parts of BaO, 2 parts of ZnO, 0.1 part of Al 2o 3, 0.1 part of SiO 2with 0.1 part of Li 2o composition;
Two, take: taking particle diameter is parent glass powder and the β-SiC whisker of 25 μ m～75 μ m;
Particle diameter described in step 2 be the parent glass powder of 25 μ m～75 μ m account for parent glass powder that particle diameter is 25 μ m～75 μ m and β-SiC whisker gross mass 95%;
β-SiC whisker described in step 2 accounts for 5% of parent glass powder that particle diameter is 25 μ m～75 μ m and β-SiC whisker gross mass;
The particle diameter of the β-SiC whisker described in step 2 is 0.05 μ m～1.0 μ m, draw ratio >=10, and purity is more than 99%;
Three, the pretreatment of β-SiC whisker: 1., be under 60W at power, the β-SiC whisker after taking is placed in to absolute ethyl alcohol magnetic agitation 2h, then filters and be dried, the β-SiC whisker after being cleaned; 2., under oxygen atmosphere, by clean after β-SiC whisker be placed in heating furnace, with the rate of heat addition of 15 ℃/min, heating furnace is heated to 1200 ℃, and is incubated 4h at 1200 ℃, the β-SiC whisker after being oxidized; 3., repeating step three 1. once, obtain pretreated β-SiC whisker;
Four, the preparation of compound lead-free low-temperature seal glass powder: the particle diameter by pretreated β-SiC whisker, after taking is that parent glass powder and the absolute ethyl alcohol of 25 μ m～75 μ m is placed in ball grinder, add abrading-ball, then be under 300r/min in nitrogen atmosphere protection and rotating speed, ball milling 2h, obtains compound lead-free low-temperature seal glass powder;
Particle diameter after taking described in step 4 is that the parent glass powder of 25 μ m～75 μ m and the gross mass of pretreated β-SiC whisker and the volume ratio of absolute ethyl alcohol are 100g:300mL;
Particle diameter after taking described in step 4 is that the parent glass powder of 25 μ m～75 μ m and the gross mass of pretreated β-SiC whisker and the mass ratio of abrading-ball are 1:40;
Five, mix and blend: be under 100r/min at rotating speed, compound lead-free low-temperature seal glass powder and bonding agent be placed in to soldering paste mixer and stir 1h, obtain compound green low-melting-point glass solder soldering paste;
Compound lead-free low-temperature seal glass powder described in step 5 and the mass ratio of bonding agent are 5:1;
Bonding agent described in step 5 is the mixture of terpinol and absolute ethyl alcohol, and described terpinol and the volume ratio of absolute ethyl alcohol are 5:1;
Six, remove impurity: 1., adopt ultrasonic method, utilize acetone to Aluminum Matrix Composites Strengthened by SiC ultrasonic cleaning, the Aluminum Matrix Composites Strengthened by SiC after being cleaned; 2. use, successively the waterproof abrasive paper of 600#, 800#, 1000# and 1200# to carry out the Aluminum Matrix Composites Strengthened by SiC after ultrasonic cleaning to carry out mechanical grinding, obtain ganoid Aluminum Matrix Composites Strengthened by SiC; 3., adopt ultrasonic method, utilize respectively distilled water and the smooth Aluminum Matrix Composites Strengthened by SiC of acetone effects on surface to clean; 4., by Aluminum Matrix Composites Strengthened by SiC dry 30min at the temperature of 56 ℃, obtain removing the Aluminum Matrix Composites Strengthened by SiC after impurity;
In Aluminum Matrix Composites Strengthened by SiC described in step 6, the volume fraction of carborundum is 10%;
Seven, apply: adopt the method for serigraphy compound green low-melting-point glass solder soldering paste to be evenly coated in to the Aluminum Matrix Composites Strengthened by SiC surface of removing after impurity, coating thickness is 30 μ m, the Aluminum Matrix Composites Strengthened by SiC after being applied;
Eight, test specimen assembling and welding: 1., the Aluminum Matrix Composites Strengthened by SiC surface after two coatings is contacted and alignd, the test specimen to be welded that obtains assembling; 2., the test specimen to be welded assembling is positioned in resistance furnace, the test specimen to be welded assembling is applied to 1MPa welding pressure, resistance furnace is warming up to 300 ℃ with the heating rate of 15 ℃/min from room temperature, and is incubated 30min at 300 ℃; 3., be warming up to 400 ℃ with the heating rate of 5 ℃/min from 300 ℃, and be incubated 60min at 400 ℃, naturally cool to room temperature with stove, obtain the Aluminum Matrix Composites Strengthened by SiC that compound green low-melting-point glass solder connects.
This test is considered from the physical property on Aluminum Matrix Composites Strengthened by SiC surface, utilize the ceramic attribute of SiC reinforcement body and aluminum substrate surface film oxide itself, select the parent glass powder solder good with ceramic material compatibility to carry out modification, parent glass powder solder is mainly by ionic bond with covalent bond is compound forms, fundamentally solve solder in Aluminum Matrix Composites Strengthened by SiC wettability of the surface problem, realized the reliable connection of Aluminum Matrix Composites Strengthened by SiC in air and under low temperature; This test is without complicated operation and equipment, the coating thickness that applies compound green low-melting-point glass solder soldering paste by adjusting can obtain the welding point of different in width weld seam, and the Aluminum Matrix Composites Strengthened by SiC welding point room temperature shear strength that the compound green low-melting-point glass solder that this test obtains connects reaches 58MPa; Three, Aluminum Matrix Composites Strengthened by SiC pore-free, dense structure, strength of welded joint that the compound green low-melting-point glass solder that this test obtains connects are high, and solution conventional method welding temperature is high, the non-wetted problem of metal solder.
Test two: a kind of method that compound green low-melting-point glass solder connects Aluminum Matrix Composites Strengthened by SiC specifically completes according to the following steps:
One, parent glass particle classifying: parent glass powder is placed in to ball grinder, be under 150r/min at rotating speed, the ratio that is 40:1 in the mass ratio of abrading-ball and parent glass powder adds abrading-ball, ball milling 3h, obtain powder, powder is put on 200 order metallic screens and vibrated, put on 500 order metallic screens and vibrate by the powder in 200 mesh sieve holes, be not by the powder in 500 mesh sieve holes the parent glass powder that particle diameter is 25 μ m～75 μ m;
Parent glass powder described in step 1 is that bismuthates is lead-free low-temperature seal glass powder;
Bismuthates described in step 1 is lead-free low-temperature seal glass powder, concrete proportioning by weight mark by 40 parts of Bi 2o 3, 20 parts of B 2o 3, 5 parts of BaO, 2 parts of ZnO, 0.1 part of Al 2o 3, 0.1 part of SiO 2with 0.1 part of Li 2o composition;
Two, take: taking particle diameter is parent glass powder and the β-SiC whisker of 25 μ m～75 μ m;
Particle diameter described in step 2 be the parent glass powder of 25 μ m～75 μ m account for parent glass powder that particle diameter is 25 μ m～75 μ m and β-SiC whisker gross mass 91%;
β-SiC whisker described in step 2 accounts for 9% of parent glass powder that particle diameter is 25 μ m～75 μ m and β-SiC whisker gross mass;
The particle diameter of the β-SiC whisker described in step 2 is 0.05 μ m～1.0 μ m, draw ratio >=10, and purity is more than 99%;
Three, the pretreatment of β-SiC whisker: 1., be under 60W at power, the β-SiC whisker after taking is placed in to absolute ethyl alcohol magnetic agitation 2h, then filters and be dried, the β-SiC whisker after being cleaned; 2., under oxygen atmosphere, by clean after β-SiC whisker be placed in heating furnace, with the rate of heat addition of 15 ℃/min, heating furnace is heated to 1300 ℃, and is incubated 3h at 1300 ℃, the β-SiC whisker after being oxidized; 3., repeating step three 1. once, obtain pretreated β-SiC whisker;
Four, the preparation of compound lead-free low-temperature seal glass powder: the particle diameter by pretreated β-SiC whisker, after taking is that parent glass powder and the absolute ethyl alcohol of 25 μ m～75 μ m is placed in ball grinder, add abrading-ball, then be under 300r/min in nitrogen atmosphere protection and rotating speed, ball milling 3h, obtains compound lead-free low-temperature seal glass powder;
Particle diameter after taking described in step 4 is that the parent glass powder of 25 μ m～75 μ m and the gross mass of pretreated β-SiC whisker and the volume ratio of absolute ethyl alcohol are 100g:300mL;
Particle diameter after taking described in step 4 is that the parent glass powder of 25 μ m～75 μ m and the gross mass of pretreated β-SiC whisker and the mass ratio of abrading-ball are 1:40;
Five, mix and blend: be under 100r/min at rotating speed, compound lead-free low-temperature seal glass powder and bonding agent be placed in to soldering paste mixer and stir 0.5h, obtain compound green low-melting-point glass solder soldering paste;
Compound lead-free low-temperature seal glass powder described in step 5 and the mass ratio of bonding agent are 5:1;
Bonding agent described in step 5 is the mixture of terpinol and absolute ethyl alcohol, and described terpinol and the volume ratio of absolute ethyl alcohol are 5:1;
Six, remove impurity: 1., adopt ultrasonic method, utilize acetone to Aluminum Matrix Composites Strengthened by SiC ultrasonic cleaning, the Aluminum Matrix Composites Strengthened by SiC after being cleaned; 2. use, successively the waterproof abrasive paper of 600#, 800#, 1000# and 1200# to carry out the Aluminum Matrix Composites Strengthened by SiC after ultrasonic cleaning to carry out mechanical grinding, obtain ganoid Aluminum Matrix Composites Strengthened by SiC; 3., adopt ultrasonic method, utilize respectively distilled water and the smooth Aluminum Matrix Composites Strengthened by SiC of acetone effects on surface to clean; 4., by Aluminum Matrix Composites Strengthened by SiC dry 30min at the temperature of 56 ℃, obtain removing the Aluminum Matrix Composites Strengthened by SiC after impurity;
In Aluminum Matrix Composites Strengthened by SiC described in step 6, the volume fraction of carborundum is 25%;
Seven, apply: adopt the method for serigraphy compound green low-melting-point glass solder soldering paste to be evenly coated in to the Aluminum Matrix Composites Strengthened by SiC surface of removing after impurity, coating thickness is 50 μ m, the Aluminum Matrix Composites Strengthened by SiC after being applied;
Eight, test specimen assembling and welding: 1., the Aluminum Matrix Composites Strengthened by SiC surface after two coatings is contacted and alignd, the test specimen to be welded that obtains assembling; 2., the test specimen to be welded assembling is positioned in resistance furnace, the test specimen to be welded assembling is applied to 1MPa welding pressure, resistance furnace is warming up to 300 ℃ with the heating rate of 15 ℃/min from room temperature, and is incubated 30min at 300 ℃; 3., be warming up to 460 ℃ with the heating rate of 5 ℃/min from 300 ℃, and be incubated 60min at 460 ℃, naturally cool to room temperature with stove, obtain the Aluminum Matrix Composites Strengthened by SiC that compound green low-melting-point glass solder connects.
This test is considered from the physical property on Aluminum Matrix Composites Strengthened by SiC surface, utilize the ceramic attribute of SiC reinforcement body and aluminum substrate surface film oxide itself, select the parent glass powder solder good with ceramic material compatibility to carry out modification, parent glass powder solder is mainly by ionic bond with covalent bond is compound forms, fundamentally solve solder in Aluminum Matrix Composites Strengthened by SiC wettability of the surface problem, realized the reliable connection of Aluminum Matrix Composites Strengthened by SiC in air and under low temperature; This test is without complicated operation and equipment, the coating thickness that applies compound green low-melting-point glass solder soldering paste by adjusting can obtain the welding point of different in width weld seam, and the Aluminum Matrix Composites Strengthened by SiC welding point room temperature shear strength that the compound green low-melting-point glass solder that this test obtains connects reaches 69MPa; Three, Aluminum Matrix Composites Strengthened by SiC pore-free, dense structure, strength of welded joint that the compound green low-melting-point glass solder that this test obtains connects are high, and solution conventional method welding temperature is high, the non-wetted problem of metal solder.
Test three: a kind of method that compound green low-melting-point glass solder connects Aluminum Matrix Composites Strengthened by SiC specifically completes according to the following steps:
One, parent glass particle classifying: parent glass powder is placed in to ball grinder, be under 150r/min at rotating speed, the ratio that is 40:1 in the mass ratio of abrading-ball and parent glass powder adds abrading-ball, ball milling 3h, obtain powder, powder is put on 200 order metallic screens and vibrated, put on 500 order metallic screens and vibrate by the powder in 200 mesh sieve holes, be not by the powder in 500 mesh sieve holes the parent glass powder that particle diameter is 25 μ m～75 μ m;
Parent glass powder described in step 1 is that bismuthates is lead-free low-temperature seal glass powder;
Bismuthates described in step 1 is lead-free low-temperature seal glass powder, concrete proportioning by weight mark by 40 parts of Bi 2o 3, 20 parts of B 2o 3, 5 parts of BaO, 2 parts of ZnO, 0.1 part of Al 2o 3, 0.1 part of SiO 2with 0.1 part of Li 2o composition;
Two, take: taking particle diameter is parent glass powder and the β-SiC whisker of 25 μ m～75 μ m;
Particle diameter described in step 2 be the parent glass powder of 25 μ m～75 μ m account for parent glass powder that particle diameter is 25 μ m～75 μ m and β-SiC whisker gross mass 86%;
β-SiC whisker described in step 2 accounts for 14% of parent glass powder that particle diameter is 25 μ m～75 μ m and β-SiC whisker gross mass;
The particle diameter of the β-SiC whisker described in step 2 is 0.05 μ m～1.0 μ m, draw ratio >=10, and purity is more than 99%;
Three, the pretreatment of β-SiC whisker: 1., be under 60W at power, the β-SiC whisker after taking is placed in to absolute ethyl alcohol magnetic agitation 2h, then filters and be dried, the β-SiC whisker after being cleaned; 2., under oxygen atmosphere, by clean after β-SiC whisker be placed in heating furnace, with the rate of heat addition of 15 ℃/min, heating furnace is heated to 1300 ℃, and is incubated 3h at 1300 ℃, the β-SiC whisker after being oxidized; 3., repeating step three 1. once, obtain pretreated β-SiC whisker;
Four, the preparation of compound lead-free low-temperature seal glass powder: the particle diameter by pretreated β-SiC whisker, after taking is that parent glass powder and the absolute ethyl alcohol of 25 μ m～75 μ m is placed in ball grinder, add abrading-ball, then be under 350r/min in nitrogen atmosphere protection and rotating speed, ball milling 2h, obtains compound lead-free low-temperature seal glass powder;
Particle diameter after taking described in step 4 is that the parent glass powder of 25 μ m～75 μ m and the gross mass of pretreated β-SiC whisker and the volume ratio of absolute ethyl alcohol are 100g:350mL;
Particle diameter after taking described in step 4 is that the parent glass powder of 25 μ m～75 μ m and the gross mass of pretreated β-SiC whisker and the mass ratio of abrading-ball are 1:40;
Five, mix and blend: be under 100r/min at rotating speed, compound lead-free low-temperature seal glass powder and bonding agent be placed in to soldering paste mixer and stir 0.5h, obtain compound green low-melting-point glass solder soldering paste;
Compound lead-free low-temperature seal glass powder described in step 5 and the mass ratio of bonding agent are 5:1.5;
Bonding agent described in step 5 is the mixture of terpinol and absolute ethyl alcohol, and described terpinol and the volume ratio of absolute ethyl alcohol are 5:2;
Six, remove impurity: 1., adopt ultrasonic method, utilize acetone to Aluminum Matrix Composites Strengthened by SiC ultrasonic cleaning, the Aluminum Matrix Composites Strengthened by SiC after being cleaned; 2. use, successively the waterproof abrasive paper of 600#, 800#, 1000# and 1200# to carry out the Aluminum Matrix Composites Strengthened by SiC after ultrasonic cleaning to carry out mechanical grinding, obtain ganoid Aluminum Matrix Composites Strengthened by SiC; 3., adopt ultrasonic method, utilize respectively distilled water and the smooth Aluminum Matrix Composites Strengthened by SiC of acetone effects on surface to clean; 4., by Aluminum Matrix Composites Strengthened by SiC dry 30min at the temperature of 56 ℃, obtain removing the Aluminum Matrix Composites Strengthened by SiC after impurity;
In Aluminum Matrix Composites Strengthened by SiC described in step 6, the volume fraction of carborundum is 40%;
Seven, apply: adopt the method for serigraphy compound green low-melting-point glass solder soldering paste to be evenly coated in to the Aluminum Matrix Composites Strengthened by SiC surface of removing after impurity, coating thickness is 60 μ m, the Aluminum Matrix Composites Strengthened by SiC after being applied;
Eight, test specimen assembling and welding: 1., the Aluminum Matrix Composites Strengthened by SiC surface after two coatings is contacted and alignd, the test specimen to be welded that obtains assembling; 2., the test specimen to be welded assembling is positioned in resistance furnace, the test specimen to be welded assembling is applied to 1MPa welding pressure, resistance furnace is warming up to 300 ℃ with the heating rate of 15 ℃/min from room temperature, and is incubated 30min at 300 ℃; 3., be warming up to 480 ℃ with the heating rate of 5 ℃/min from 300 ℃, and be incubated 60min at 480 ℃, naturally cool to room temperature with stove, obtain the Aluminum Matrix Composites Strengthened by SiC that compound green low-melting-point glass solder connects.
This test is considered from the physical property on Aluminum Matrix Composites Strengthened by SiC surface, utilize the ceramic attribute of SiC reinforcement body and aluminum substrate surface film oxide itself, select the parent glass powder solder good with ceramic material compatibility to carry out modification, parent glass powder solder is mainly by ionic bond with covalent bond is compound forms, fundamentally solve solder in Aluminum Matrix Composites Strengthened by SiC wettability of the surface problem, realized the reliable connection of Aluminum Matrix Composites Strengthened by SiC in air and under low temperature; This test is without complicated operation and equipment, the coating thickness that applies compound green low-melting-point glass solder soldering paste by adjusting can obtain the welding point of different in width weld seam, and the Aluminum Matrix Composites Strengthened by SiC welding point room temperature shear strength that the compound green low-melting-point glass solder that this test obtains connects reaches 77MPa; Three, Aluminum Matrix Composites Strengthened by SiC pore-free, dense structure, strength of welded joint that the compound green low-melting-point glass solder that this test obtains connects are high, and solution conventional method welding temperature is high, the non-wetted problem of metal solder.
Test four: a kind of method that compound green low-melting-point glass solder connects Aluminum Matrix Composites Strengthened by SiC specifically completes according to the following steps:
One, parent glass particle classifying: parent glass powder is placed in to ball grinder, be under 150r/min at rotating speed, the ratio that is 40:1 in the mass ratio of abrading-ball and parent glass powder adds abrading-ball, ball milling 3h, obtain powder, powder is put on 200 order metallic screens and vibrated, put on 500 order metallic screens and vibrate by the powder in 200 mesh sieve holes, be not by the powder in 500 mesh sieve holes the parent glass powder that particle diameter is 25 μ m～75 μ m;
Parent glass powder described in step 1 is that bismuthates is lead-free low-temperature seal glass powder;
Bismuthates described in step 1 is lead-free low-temperature seal glass powder, concrete proportioning by weight mark by 40 parts of Bi 2o 3, 20 parts of B 2o 3, 5 parts of BaO, 2 parts of ZnO, 0.1 part of Al 2o 3, 0.1 part of SiO 2with 0.1 part of Li 2o composition;
Two, take: taking particle diameter is parent glass powder and the β-SiC whisker of 25 μ m～75 μ m;
Particle diameter described in step 2 be the parent glass powder of 25 μ m～75 μ m account for parent glass powder that particle diameter is 25 μ m～75 μ m and β-SiC whisker gross mass 83%;
β-SiC whisker described in step 2 accounts for 17% of parent glass powder that particle diameter is 25 μ m～75 μ m and β-SiC whisker gross mass;
The particle diameter of the β-SiC whisker described in step 2 is 0.05 μ m～1.0 μ m, draw ratio >=10, and purity is more than 99%;
Three, the pretreatment of β-SiC whisker: 1., be under 60W at power, the β-SiC whisker after taking is placed in to absolute ethyl alcohol magnetic agitation 2h, then filters and be dried, the β-SiC whisker after being cleaned; 2., under oxygen atmosphere, by clean after β-SiC whisker be placed in heating furnace, with the rate of heat addition of 15 ℃/min, heating furnace is heated to 1300 ℃, and is incubated 4h at 1300 ℃, the β-SiC whisker after being oxidized; 3., repeating step three 1. once, obtain pretreated β-SiC whisker;
Four, the preparation of compound lead-free low-temperature seal glass powder: the particle diameter by pretreated β-SiC whisker, after taking is that parent glass powder and the absolute ethyl alcohol of 25 μ m～75 μ m is placed in ball grinder, add abrading-ball, then be under 350r/min in nitrogen atmosphere protection and rotating speed, ball milling 3h, obtains compound lead-free low-temperature seal glass powder;
Particle diameter after taking described in step 4 is that the parent glass powder of 25 μ m～75 μ m and the gross mass of pretreated β-SiC whisker and the volume ratio of absolute ethyl alcohol are 100g:350mL;
Particle diameter after taking described in step 4 is that the parent glass powder of 25 μ m～75 μ m and the gross mass of pretreated β-SiC whisker and the mass ratio of abrading-ball are 1:40;
Five, mix and blend: be under 100r/min at rotating speed, compound lead-free low-temperature seal glass powder and bonding agent be placed in to soldering paste mixer and stir 0.5h, obtain compound green low-melting-point glass solder soldering paste;
Compound lead-free low-temperature seal glass powder described in step 5 and the mass ratio of bonding agent are 5:1.5;
Bonding agent described in step 5 is the mixture of terpinol and absolute ethyl alcohol, and described terpinol and the volume ratio of absolute ethyl alcohol are 5:3;
Six, remove impurity: 1., adopt ultrasonic method, utilize acetone to Aluminum Matrix Composites Strengthened by SiC ultrasonic cleaning, the Aluminum Matrix Composites Strengthened by SiC after being cleaned; 2. use, successively the waterproof abrasive paper of 600#, 800#, 1000# and 1200# to carry out the Aluminum Matrix Composites Strengthened by SiC after ultrasonic cleaning to carry out mechanical grinding, obtain ganoid Aluminum Matrix Composites Strengthened by SiC; 3., adopt ultrasonic method, utilize respectively distilled water and the smooth Aluminum Matrix Composites Strengthened by SiC of acetone effects on surface to clean; 4., by Aluminum Matrix Composites Strengthened by SiC dry 30min at the temperature of 56 ℃, obtain removing the Aluminum Matrix Composites Strengthened by SiC after impurity;
In Aluminum Matrix Composites Strengthened by SiC described in step 6, the volume fraction of carborundum is 50%;
Seven, apply: adopt the method for serigraphy compound green low-melting-point glass solder soldering paste to be evenly coated in to the Aluminum Matrix Composites Strengthened by SiC surface of removing after impurity, coating thickness is 70 μ m, the Aluminum Matrix Composites Strengthened by SiC after being applied;
Eight, test specimen assembling and welding: 1., the Aluminum Matrix Composites Strengthened by SiC surface after two coatings is contacted and alignd, the test specimen to be welded that obtains assembling; 2., the test specimen to be welded assembling is positioned in resistance furnace, the test specimen to be welded assembling is applied to 1MPa welding pressure, resistance furnace is warming up to 300 ℃ with the heating rate of 15 ℃/min from room temperature, and is incubated 30min at 300 ℃; 3., be warming up to 490 ℃ with the heating rate of 5 ℃/min from 300 ℃, and be incubated 60min at 490 ℃, naturally cool to room temperature with stove, obtain the Aluminum Matrix Composites Strengthened by SiC that compound green low-melting-point glass solder connects.
This test is considered from the physical property on Aluminum Matrix Composites Strengthened by SiC surface, utilize the ceramic attribute of SiC reinforcement body and aluminum substrate surface film oxide itself, select the parent glass powder solder good with ceramic material compatibility to carry out modification, parent glass powder solder is mainly by ionic bond with covalent bond is compound forms, fundamentally solve solder in Aluminum Matrix Composites Strengthened by SiC wettability of the surface problem, realized the reliable connection of Aluminum Matrix Composites Strengthened by SiC in air and under low temperature; This test is without complicated operation and equipment, the coating thickness that applies compound green low-melting-point glass solder soldering paste by adjusting can obtain the welding point of different in width weld seam, and the Aluminum Matrix Composites Strengthened by SiC welding point room temperature shear strength that the compound green low-melting-point glass solder that this test obtains connects reaches 85MPa; Three, Aluminum Matrix Composites Strengthened by SiC pore-free, dense structure, strength of welded joint that the compound green low-melting-point glass solder that this test obtains connects are high, and solution conventional method welding temperature is high, the non-wetted problem of metal solder.
Test five: a kind of method that compound green low-melting-point glass solder connects Aluminum Matrix Composites Strengthened by SiC specifically completes according to the following steps:
One, parent glass particle classifying: parent glass powder is placed in to ball grinder, be under 150r/min at rotating speed, the ratio that is 40:1 in the mass ratio of abrading-ball and parent glass powder adds abrading-ball, ball milling 3h, obtain powder, powder is put on 200 order metallic screens and vibrated, put on 500 order metallic screens and vibrate by the powder in 200 mesh sieve holes, be not by the powder in 500 mesh sieve holes the parent glass powder that particle diameter is 25 μ m～75 μ m;
Parent glass powder described in step 1 is that bismuthates is lead-free low-temperature seal glass powder;
Bismuthates described in step 1 is lead-free low-temperature seal glass powder, concrete proportioning by weight mark by 40 parts of Bi 2o 3, 20 parts of B 2o 3, 5 parts of BaO, 2 parts of ZnO, 0.1 part of Al 2o 3, 0.1 part of SiO 2with 0.1 part of Li 2o composition;
Two, take: taking particle diameter is parent glass powder and the β-SiC whisker of 25 μ m～75 μ m;
Particle diameter described in step 2 be the parent glass powder of 25 μ m～75 μ m account for parent glass powder that particle diameter is 25 μ m～75 μ m and β-SiC whisker gross mass 80%;
β-SiC whisker described in step 2 accounts for 20% of parent glass powder that particle diameter is 25 μ m～75 μ m and β-SiC whisker gross mass;
The particle diameter of the β-SiC whisker described in step 2 is 0.05 μ m～1.0 μ m, draw ratio >=10, and purity is more than 99%;
Three, the pretreatment of β-SiC whisker: 1., be under 60W at power, the β-SiC whisker after taking is placed in to absolute ethyl alcohol magnetic agitation 2h, then filters and be dried, the β-SiC whisker after being cleaned; 2., under oxygen atmosphere, by clean after β-SiC whisker be placed in heating furnace, with the rate of heat addition of 15 ℃/min, heating furnace is heated to 1300 ℃, and is incubated 4h at 1300 ℃, the β-SiC whisker after being oxidized; 3., repeating step three 1. once, obtain pretreated β-SiC whisker;
Four, the preparation of compound lead-free low-temperature seal glass powder: the particle diameter by pretreated β-SiC whisker, after taking is that parent glass powder and the absolute ethyl alcohol of 25 μ m～75 μ m is placed in ball grinder, add abrading-ball, then be under 400r/min in nitrogen atmosphere protection and rotating speed, ball milling 2h, obtains compound lead-free low-temperature seal glass powder;
Particle diameter after taking described in step 4 is that the parent glass powder of 25 μ m～75 μ m and the gross mass of pretreated β-SiC whisker and the volume ratio of absolute ethyl alcohol are 100g:400mL;
Particle diameter after taking described in step 4 is that the parent glass powder of 25 μ m～75 μ m and the gross mass of pretreated β-SiC whisker and the mass ratio of abrading-ball are 1:40;
Five, mix and blend: be under 100r/min at rotating speed, compound lead-free low-temperature seal glass powder and bonding agent be placed in to soldering paste mixer and stir 0.5h, obtain compound green low-melting-point glass solder soldering paste;
Compound lead-free low-temperature seal glass powder described in step 5 and the mass ratio of bonding agent are 5:2.0;
Bonding agent described in step 5 is the mixture of terpinol and absolute ethyl alcohol, and described terpinol and the volume ratio of absolute ethyl alcohol are 5:3;
Six, remove impurity: 1., adopt ultrasonic method, utilize acetone to Aluminum Matrix Composites Strengthened by SiC ultrasonic cleaning, the Aluminum Matrix Composites Strengthened by SiC after being cleaned; 2. use, successively the waterproof abrasive paper of 600#, 800#, 1000# and 1200# to carry out the Aluminum Matrix Composites Strengthened by SiC after ultrasonic cleaning to carry out mechanical grinding, obtain ganoid Aluminum Matrix Composites Strengthened by SiC; 3., adopt ultrasonic method, utilize respectively distilled water and the smooth Aluminum Matrix Composites Strengthened by SiC of acetone effects on surface to clean; 4., by Aluminum Matrix Composites Strengthened by SiC dry 30min at the temperature of 56 ℃, obtain removing the Aluminum Matrix Composites Strengthened by SiC after impurity;
In Aluminum Matrix Composites Strengthened by SiC described in step 6, the volume fraction of carborundum is 60%;
Seven, apply: adopt the method for serigraphy compound green low-melting-point glass solder soldering paste to be evenly coated in to the Aluminum Matrix Composites Strengthened by SiC surface of removing after impurity, coating thickness is 80 μ m, the Aluminum Matrix Composites Strengthened by SiC after being applied;
Eight, test specimen assembling and welding: 1., the Aluminum Matrix Composites Strengthened by SiC surface after two coatings is contacted and alignd, the test specimen to be welded that obtains assembling; 2., the test specimen to be welded assembling is positioned in resistance furnace, the test specimen to be welded assembling is applied to 1MPa welding pressure, resistance furnace is warming up to 300 ℃ with the heating rate of 15 ℃/min from room temperature, and is incubated 30min at 300 ℃; 3., be warming up to 500 ℃ with the heating rate of 5 ℃/min from 300 ℃, and be incubated 60min at 500 ℃, naturally cool to room temperature with stove, obtain the Aluminum Matrix Composites Strengthened by SiC that compound green low-melting-point glass solder connects.
Fig. 1 is that the Aluminum Matrix Composites Strengthened by SiC that the compound green low-melting-point glass solder of test five preparations connects amplifies the SEM figure of 3000 times; As can be seen from Figure 1, low temperature glass solder and composite can be fine wetting, and interface combination is tight, pore-free.
This test is considered from the physical property on Aluminum Matrix Composites Strengthened by SiC surface, utilize the ceramic attribute of SiC reinforcement body and aluminum substrate surface film oxide itself, select the parent glass powder solder good with ceramic material compatibility to carry out modification, parent glass powder solder is mainly by ionic bond with covalent bond is compound forms, fundamentally solve solder in Aluminum Matrix Composites Strengthened by SiC wettability of the surface problem, realized the reliable connection of Aluminum Matrix Composites Strengthened by SiC in air and under low temperature; This test is without complicated operation and equipment, the coating thickness that applies compound green low-melting-point glass solder soldering paste by adjusting can obtain the welding point of different in width weld seam, and the Aluminum Matrix Composites Strengthened by SiC welding point room temperature shear strength that the compound green low-melting-point glass solder that this test obtains connects reaches 96MPa; Three, the Aluminum Matrix Composites Strengthened by SiC strength of welded joint that the compound green low-melting-point glass solder that this test obtains connects is high, and solution conventional method welding temperature is high, the non-wetted problem of metal solder.
Test six: a kind of method that compound green low-melting-point glass solder connects Aluminum Matrix Composites Strengthened by SiC specifically completes according to the following steps:
One, parent glass particle classifying: parent glass powder is placed in to ball grinder, be under 150r/min at rotating speed, the ratio that is 40:1 in the mass ratio of abrading-ball and parent glass powder adds abrading-ball, ball milling 3h, obtain powder, powder is put on 200 order metallic screens and vibrated, put on 500 order metallic screens and vibrate by the powder in 200 mesh sieve holes, be not by the powder in 500 mesh sieve holes the parent glass powder that particle diameter is 25 μ m～75 μ m;
Parent glass powder described in step 1 is that bismuthates is lead-free low-temperature seal glass powder;
Bismuthates described in step 1 is lead-free low-temperature seal glass powder, concrete proportioning by weight mark by 40 parts of Bi 2o 3, 20 parts of B 2o 3, 5 parts of BaO, 2 parts of ZnO, 0.1 part of Al 2o 3, 0.1 part of SiO 2with 0.1 part of Li 2o composition;
Two, take: taking particle diameter is parent glass powder and the β-SiC whisker of 25 μ m～75 μ m;
Particle diameter described in step 2 be the parent glass powder of 25 μ m～75 μ m account for parent glass powder that particle diameter is 25 μ m～75 μ m and β-SiC whisker gross mass 75%;
β-SiC whisker described in step 2 accounts for 25% of parent glass powder that particle diameter is 25 μ m～75 μ m and β-SiC whisker gross mass;
The particle diameter of the β-SiC whisker described in step 2 is 0.05 μ m～1.0 μ m, draw ratio >=10, and purity is more than 99%;
Three, the pretreatment of β-SiC whisker: 1., be under 60W at power, the β-SiC whisker after taking is placed in to absolute ethyl alcohol magnetic agitation 2h, then filters and be dried, the β-SiC whisker after being cleaned; 2., under oxygen atmosphere, by clean after β-SiC whisker be placed in heating furnace, with the rate of heat addition of 15 ℃/min, heating furnace is heated to 1300 ℃, and is incubated 4h at 1300 ℃, the β-SiC whisker after being oxidized; 3., repeating step three 1. once, obtain pretreated β-SiC whisker;
Four, the preparation of compound lead-free low-temperature seal glass powder: the particle diameter by pretreated β-SiC whisker, after taking is that parent glass powder and the absolute ethyl alcohol of 25 μ m～75 μ m is placed in ball grinder, add abrading-ball, then be under 400r/min in nitrogen atmosphere protection and rotating speed, ball milling 3h, obtains compound lead-free low-temperature seal glass powder;
Particle diameter after taking described in step 4 is that the parent glass powder of 25 μ m～75 μ m and the gross mass of pretreated β-SiC whisker and the volume ratio of absolute ethyl alcohol are 100g:400mL;
Particle diameter after taking described in step 4 is that the parent glass powder of 25 μ m～75 μ m and the gross mass of pretreated β-SiC whisker and the mass ratio of abrading-ball are 1:40;
Five, mix and blend: be under 100r/min at rotating speed, compound lead-free low-temperature seal glass powder and bonding agent be placed in to soldering paste mixer and stir 0.5h, obtain compound green low-melting-point glass solder soldering paste;
Compound lead-free low-temperature seal glass powder described in step 5 and the mass ratio of bonding agent are 5:2.0;
Bonding agent described in step 5 is the mixture of terpinol and absolute ethyl alcohol, and described terpinol and the volume ratio of absolute ethyl alcohol are 5:4;
Six, remove impurity: 1., adopt ultrasonic method, utilize acetone to Aluminum Matrix Composites Strengthened by SiC ultrasonic cleaning, the Aluminum Matrix Composites Strengthened by SiC after being cleaned; 2. use, successively the waterproof abrasive paper of 600#, 800#, 1000# and 1200# to carry out the Aluminum Matrix Composites Strengthened by SiC after ultrasonic cleaning to carry out mechanical grinding, obtain ganoid Aluminum Matrix Composites Strengthened by SiC; 3., adopt ultrasonic method, utilize respectively distilled water and the smooth Aluminum Matrix Composites Strengthened by SiC of acetone effects on surface to clean; 4., by Aluminum Matrix Composites Strengthened by SiC dry 30min at the temperature of 56 ℃, obtain removing the Aluminum Matrix Composites Strengthened by SiC after impurity;
In Aluminum Matrix Composites Strengthened by SiC described in step 6, the volume fraction of carborundum is 80%;
Seven, apply: adopt the method for serigraphy compound green low-melting-point glass solder soldering paste to be evenly coated in to the Aluminum Matrix Composites Strengthened by SiC surface of removing after impurity, coating thickness is 90 μ m, the Aluminum Matrix Composites Strengthened by SiC after being applied;
Eight, test specimen assembling and welding: 1., the Aluminum Matrix Composites Strengthened by SiC surface after two coatings is contacted and alignd, the test specimen to be welded that obtains assembling; 2., the test specimen to be welded assembling is positioned in resistance furnace, the test specimen to be welded assembling is applied to 1MPa welding pressure, resistance furnace is warming up to 300 ℃ with the heating rate of 15 ℃/min from room temperature, and is incubated 30min at 300 ℃; 3., be warming up to 515 ℃ with the heating rate of 5 ℃/min from 300 ℃, and be incubated 60min at 515 ℃, naturally cool to room temperature with stove, obtain the Aluminum Matrix Composites Strengthened by SiC that compound green low-melting-point glass solder connects.
This test is considered from the physical property on Aluminum Matrix Composites Strengthened by SiC surface, utilize the ceramic attribute of SiC reinforcement body and aluminum substrate surface film oxide itself, select the parent glass powder solder good with ceramic material compatibility to carry out modification, parent glass powder solder is mainly by ionic bond with covalent bond is compound forms, fundamentally solve solder in Aluminum Matrix Composites Strengthened by SiC wettability of the surface problem, realized the reliable connection of Aluminum Matrix Composites Strengthened by SiC in air and under low temperature; This test is without complicated operation and equipment, the coating thickness that applies compound green low-melting-point glass solder soldering paste by adjusting can obtain the welding point of different in width weld seam, and the Aluminum Matrix Composites Strengthened by SiC welding point room temperature shear strength that the compound green low-melting-point glass solder that this test obtains connects reaches 102MPa; Three, Aluminum Matrix Composites Strengthened by SiC pore-free, dense structure, strength of welded joint that the compound green low-melting-point glass solder that this test obtains connects are high, and solution conventional method welding temperature is high, the non-wetted problem of metal solder.

Claims (10)

1. compound green low-melting-point glass solder connects a method for Aluminum Matrix Composites Strengthened by SiC, it is characterized in that a kind of method that compound green low-melting-point glass solder connects Aluminum Matrix Composites Strengthened by SiC specifically completes according to the following steps:
One, parent glass particle classifying: parent glass powder is placed in to ball grinder, be under 100r/min～200r/min at rotating speed, be (35～45) in the mass ratio of abrading-ball and parent glass powder: 1 ratio adds abrading-ball, ball milling 1h～5h, obtain powder, powder is put on 200 order metallic screens and vibrated, put on 500 order metallic screens and vibrate by the powder in 200 mesh sieve holes, be not by the powder in 500 mesh sieve holes the parent glass powder that particle diameter is 25 μ m～75 μ m;
Parent glass powder described in step 1 is that bismuthates is one or both mixture of lead-free low-temperature seal glass powder or phosphate-based lead-free low-temperature seal glass powder;
Bismuthates described in step 1 is lead-free low-temperature seal glass powder, concrete proportioning by weight mark by 40 parts～50 parts Bi 2o 3, 20 parts～40 parts of B 2o 3, 5 parts～20 parts of BaO, 2 parts～10 parts ZnO, 0.1 part～2 parts Al 2o 3, 0.1 part～2 parts of SiO 2with 0.1 part～2 parts Li 2o composition;
Phosphate-based lead-free low-temperature seal glass powder described in step 1, concrete proportioning by weight mark by 30 parts～60 parts P 2o 5, 20 parts～40 parts of SnO, 10 parts～20 parts ZnO, 10 parts～20 parts B 2o 3, 0.1 part～5 parts of Al 2o 3, 0.1 part～5 parts of SiO 2with 0.1 part～2 parts Li 2o composition;
Two, take: taking particle diameter is parent glass powder and the β-SiC whisker of 25 μ m～75 μ m;
Particle diameter described in step 2 be the parent glass powder of 25 μ m～75 μ m account for parent glass powder that particle diameter is 25 μ m～75 μ m and β-SiC whisker gross mass 75%～95%;
β-SiC whisker described in step 2 accounts for 5%～25% of parent glass powder that particle diameter is 25 μ m～75 μ m and β-SiC whisker gross mass;
The particle diameter of the β-SiC whisker described in step 2 is 0.05 μ m～1.0 μ m, draw ratio >=10, and purity is more than 99%;
Three, the pretreatment of β-SiC whisker: 1., be under 50W～100W at power, the β-SiC whisker after taking is placed in to absolute ethyl alcohol magnetic agitation 1h～3h, then filters and be dried, the β-SiC whisker after being cleaned; 2., under oxygen atmosphere, by clean after β-SiC whisker be placed in heating furnace, with the rate of heat addition of 15 ℃/min, heating furnace is heated to 1000 ℃～1300 ℃, and is incubated 3h～5h at 1000 ℃～1300 ℃, the β-SiC whisker after being oxidized; 3., repeating step three 1. once, obtain pretreated β-SiC whisker;
Four, the preparation of compound lead-free low-temperature seal glass powder: the particle diameter by pretreated β-SiC whisker, after taking is that parent glass powder and the absolute ethyl alcohol of 25 μ m～75 μ m is placed in ball grinder, add abrading-ball, then be under 200r/min～400r/min in nitrogen atmosphere protection and rotating speed, ball milling 0.5h～3h, obtains compound lead-free low-temperature seal glass powder;
Particle diameter after taking described in step 4 is that the parent glass powder of 25 μ m～75 μ m and the gross mass of pretreated β-SiC whisker and the volume ratio of absolute ethyl alcohol are 100g:(300～400) mL;
Particle diameter after taking described in step 4 is that the parent glass powder of 25 μ m～75 μ m and the gross mass of pretreated β-SiC whisker and the mass ratio of abrading-ball are 1:(35～40);
Five, mix and blend: be under 100r/min～150r/min at rotating speed, compound lead-free low-temperature seal glass powder and bonding agent be placed in to soldering paste mixer and stir 0.5h～2h, obtain compound green low-melting-point glass solder soldering paste;
Compound lead-free low-temperature seal glass powder described in step 5 and the mass ratio of bonding agent are 5:(0.5～2.5);
Bonding agent described in step 5 is the mixture of terpinol and absolute ethyl alcohol, and described terpinol and the volume ratio of absolute ethyl alcohol are 5:(1～5);
Six, remove impurity: 1., adopt ultrasonic method, utilize acetone to Aluminum Matrix Composites Strengthened by SiC ultrasonic cleaning, the Aluminum Matrix Composites Strengthened by SiC after being cleaned; 2. use, successively the waterproof abrasive paper of 600#, 800#, 1000# and 1200# to carry out the Aluminum Matrix Composites Strengthened by SiC after ultrasonic cleaning to carry out mechanical grinding, obtain ganoid Aluminum Matrix Composites Strengthened by SiC; 3., adopt ultrasonic method, utilize respectively distilled water and the smooth Aluminum Matrix Composites Strengthened by SiC of acetone effects on surface to clean; 4., by Aluminum Matrix Composites Strengthened by SiC dry 20min～40min at the temperature of 40 ℃～60 ℃, obtain removing the Aluminum Matrix Composites Strengthened by SiC after impurity;
In Aluminum Matrix Composites Strengthened by SiC described in step 6, the volume fraction of carborundum is 10%～80%;
Seven, apply: adopt the method for serigraphy compound green low-melting-point glass solder soldering paste to be evenly coated in to the Aluminum Matrix Composites Strengthened by SiC surface of removing after impurity, coating thickness is 15 μ m～100 μ m, the Aluminum Matrix Composites Strengthened by SiC after being applied;
Eight, test specimen assembling and welding: 1., the Aluminum Matrix Composites Strengthened by SiC surface after two coatings is contacted and alignd, the test specimen to be welded that obtains assembling; 2., the test specimen to be welded assembling is positioned in resistance furnace, the test specimen to be welded assembling is applied to 0.5MPa～1MPa welding pressure, resistance furnace is warming up to 300 ℃ with the heating rate of 10 ℃/min～20 ℃/min from room temperature, and is incubated 10min～30min at 300 ℃; 3., be warming up to 380 ℃～580 ℃ with the heating rate of 5 ℃/min～10 ℃/min from 300 ℃, and be incubated 30min～60min at 380 ℃～580 ℃, naturally cool to room temperature with stove, obtain the Aluminum Matrix Composites Strengthened by SiC that compound green low-melting-point glass solder connects.
2. a kind of compound green low-melting-point glass solder according to claim 1 connects the method for Aluminum Matrix Composites Strengthened by SiC, it is characterized in that the bismuthates described in step 1 is lead-free low-temperature seal glass powder, concrete proportioning by weight mark by 45 parts～50 parts Bi 2o 3, 25 parts～35 parts of B 2o 3, 10 parts～20 parts of BaO, 5 parts～10 parts ZnO, 0.1 part～1 part Al 2o 3, 0.1 part～1 part of SiO 2with 0.1 part～1 part Li 2o composition.
3. a kind of compound green low-melting-point glass solder according to claim 1 connects the method for Aluminum Matrix Composites Strengthened by SiC, it is characterized in that the phosphate-based lead-free low-temperature seal glass powder described in step 1, concrete proportioning by weight mark by 40 parts～60 parts P 2o 5, 30 parts～40 parts of SnO, 15 parts～20 parts ZnO, 15 parts～20 parts B 2o 3, 1 part～5 parts of Al 2o 3, 1 part～5 parts of SiO 2with 1 part～2 parts Li 2o composition.
4. a kind of compound green low-melting-point glass solder according to claim 1 connects the method for Aluminum Matrix Composites Strengthened by SiC, the particle diameter that it is characterized in that the β-SiC whisker described in step 2 is 0.05 μ m～0.8 μ m, draw ratio >=10, purity is more than 99%.
5. a kind of compound green low-melting-point glass solder according to claim 1 connects the method for Aluminum Matrix Composites Strengthened by SiC, it is characterized in that during step 3 2. under oxygen atmosphere, β-SiC whisker after cleaning is placed in to heating furnace, heating furnace is heated to 1100 ℃～1300 ℃ by the rate of heat addition with 15 ℃/min, and at 1100 ℃～1300 ℃, be incubated 4h～5h, the β-SiC whisker after being oxidized.
6. a kind of compound green low-melting-point glass solder according to claim 1 connects the method for Aluminum Matrix Composites Strengthened by SiC, it is characterized in that particle diameter after taking described in step 4 is that the parent glass powder of 25 μ m～75 μ m and the gross mass of pretreated β-SiC whisker and the volume ratio of absolute ethyl alcohol are 100g:(350～400) mL.
7. a kind of compound green low-melting-point glass solder according to claim 1 connects the method for Aluminum Matrix Composites Strengthened by SiC, it is characterized in that compound lead-free low-temperature seal glass powder described in step 5 and the mass ratio of bonding agent are 5:(1～2.5).
8. a kind of compound green low-melting-point glass solder according to claim 1 connects the method for Aluminum Matrix Composites Strengthened by SiC, it is characterized in that the bonding agent described in step 5 is the mixture of terpinol and absolute ethyl alcohol, described terpinol and the volume ratio of absolute ethyl alcohol are 5:(3～5).
9. a kind of compound green low-melting-point glass solder according to claim 1 connects the method for Aluminum Matrix Composites Strengthened by SiC, it is characterized in that adopting in step 7 the method for serigraphy compound green low-melting-point glass solder soldering paste to be evenly coated in to the Aluminum Matrix Composites Strengthened by SiC surface of removing after impurity, coating thickness is 15 μ m～50 μ m, the Aluminum Matrix Composites Strengthened by SiC after being applied.
10. a kind of compound green low-melting-point glass solder according to claim 1 connects the method for Aluminum Matrix Composites Strengthened by SiC, it is characterized in that during step 8 being 3. warming up to 420 ℃～580 ℃ with the heating rate of 8 ℃/min～10 ℃/min from 300 ℃, and be incubated 40min～60min at 420 ℃～580 ℃, naturally cool to room temperature with stove, obtain the Aluminum Matrix Composites Strengthened by SiC that compound green low-melting-point glass solder connects.
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104402227A (en) * 2014-10-22 2015-03-11 广东风华高新科技股份有限公司 High-temperature binder and preparation method thereof
CN104909795A (en) * 2015-05-12 2015-09-16 哈尔滨工业大学 High-temperature ceramic/metal riveting-glass sealing combination connection method
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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1656033A (en) * 2002-03-29 2005-08-17 松下电器产业株式会社 Bismuth glass composition, and magnetic head and plasma display panel including the same as sealing member
DE102007025465B3 (en) * 2007-05-30 2008-09-25 Schott Ag Solder glass contains specified percentage ranges of silica, boron oxide, zinc oxide, bismuth oxide and aluminum oxide, ratio of silica to aluminum oxide being below specified value
CN101484396A (en) * 2006-07-11 2009-07-15 日本电气硝子株式会社 Glass composition for sealing and sealed material
CN101544470A (en) * 2009-04-20 2009-09-30 贵阳晶华电子材料有限公司 High-bismuth-oxide dielectric material for electrode coating
CN101786899A (en) * 2010-01-26 2010-07-28 哈尔滨工业大学 Solder for welding carbon/silicon carbide ceramic matrix composite material and titanium-aluminum-based alloy and soldering method
CN102658411A (en) * 2012-05-24 2012-09-12 哈尔滨工业大学 Ultrasonic brazing method for high-volume-fraction silicon carbide particle enhanced aluminum-base composite and low-expansion alloy

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1656033A (en) * 2002-03-29 2005-08-17 松下电器产业株式会社 Bismuth glass composition, and magnetic head and plasma display panel including the same as sealing member
CN101484396A (en) * 2006-07-11 2009-07-15 日本电气硝子株式会社 Glass composition for sealing and sealed material
DE102007025465B3 (en) * 2007-05-30 2008-09-25 Schott Ag Solder glass contains specified percentage ranges of silica, boron oxide, zinc oxide, bismuth oxide and aluminum oxide, ratio of silica to aluminum oxide being below specified value
CN101544470A (en) * 2009-04-20 2009-09-30 贵阳晶华电子材料有限公司 High-bismuth-oxide dielectric material for electrode coating
CN101786899A (en) * 2010-01-26 2010-07-28 哈尔滨工业大学 Solder for welding carbon/silicon carbide ceramic matrix composite material and titanium-aluminum-based alloy and soldering method
CN102658411A (en) * 2012-05-24 2012-09-12 哈尔滨工业大学 Ultrasonic brazing method for high-volume-fraction silicon carbide particle enhanced aluminum-base composite and low-expansion alloy

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
李辉等: "陶瓷基复合材料焊接技术研究进展", 《焊接技术》 *

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Publication number Priority date Publication date Assignee Title
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CN109693056A (en) * 2019-02-25 2019-04-30 西安明科微电子材料有限公司 A kind of aluminium silicon carbide shell insulator solder and preparation method thereof
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CN112608164A (en) * 2020-11-12 2021-04-06 中广核研究院有限公司 Connection brazing filler metal, preparation method thereof and silicon carbide cladding connection method
CN112608164B (en) * 2020-11-12 2021-08-27 中广核研究院有限公司 Connection brazing filler metal, preparation method thereof and silicon carbide cladding connection method
CN113881354A (en) * 2021-09-29 2022-01-04 湖北瑞宇空天高新技术有限公司 Bonding repair method for carbon fiber reinforced carbon-based composite material, adhesive used by bonding repair method and preparation method of adhesive
CN113881354B (en) * 2021-09-29 2022-07-22 湖北瑞宇空天高新技术有限公司 Bonding repair method for carbon fiber reinforced carbon-based composite material, used bonding agent and preparation method thereof
CN115815726A (en) * 2022-12-02 2023-03-21 哈尔滨工业大学 Method for connecting YSZ ceramic and Crofer22H stainless steel by Ag-based brazing filler metal in air
CN115815726B (en) * 2022-12-02 2023-09-22 哈尔滨工业大学 Method for connecting YSZ ceramic and Crofer22H stainless steel under air by using Ag-based brazing filler metal
CN116765673A (en) * 2023-08-25 2023-09-19 长春理工大学 V, te-containing solder and preparation method and application thereof

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