CN113881354A - Bonding repair method for carbon fiber reinforced carbon-based composite material, adhesive used by bonding repair method and preparation method of adhesive - Google Patents
Bonding repair method for carbon fiber reinforced carbon-based composite material, adhesive used by bonding repair method and preparation method of adhesive Download PDFInfo
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/71—Ceramic products containing macroscopic reinforcing agents
- C04B35/78—Ceramic products containing macroscopic reinforcing agents containing non-metallic materials
- C04B35/80—Fibres, filaments, whiskers, platelets, or the like
- C04B35/83—Carbon fibres in a carbon matrix
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- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
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- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
- C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
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- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/085—Copper
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- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
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Abstract
The repairing method comprises the following steps of stirring and mixing 10-15 wt.% of diamond powder, 12-15 wt.% of zinc oxide powder, 6-12 wt.% of copper powder, 10-15 wt.% of titanium powder, 32-37 wt.% of low-melting-point glass powder and 20-25 wt.% of organic silicon resin solution to complete preparation of the adhesive; then uniformly coating the adhesive on the surface CfAdhering the surface of the bonding surface of the/C composite material, heating to 250 ℃ in a blast oven at the speed of 5 ℃/hour, and then preserving heat for 2 hoursCuring the adhesive, wherein the thickness of the adhesive layer is controlled to be 0.08-0.3 mu m by applying pressure to the material during curing; finally, the temperature is raised to 1200 ℃ at the speed of 100 ℃/hour under the vacuum environment of-0.1 MPa, and then the temperature is preserved for 2 hours to finish the carbonization of the adhesive. The adhesive provided by the invention has excellent room-temperature and high-temperature adhesive strength and thermal shock resistance, the room-temperature thermal conductivity of the material after adhesive repair is higher than 22.31W/(m.k), and the coefficient of thermal conductivity is higher than CfThe composite material has wide practical value and application prospect in the field of the/C composite material.
Description
Technical Field
The invention belongs to the technical field of carbon/carbon composite materials, and particularly relates to a carbon fiber reinforced carbon-based (C)f/C) a method for repairing the composite material by bonding.
Background
The carbon/carbon composite material has the characteristics of low density, high heat capacity, small thermal deformation, good ablation resistance, excellent room temperature and high temperature mechanical properties and the like, and is widely applied to high temperature parts such as advanced brake systems, thermal protection systems, space shuttles, rocket engines and the like. However, due to CfThe preparation period of the/C composite material is long, the cost is high, and the process is complex, so that the composite material is used for treating C which is damaged or reaches the service lifefthe/C composite material component is necessary to be repaired and reused. The traditional repair technology (riveting, welding or mechanical connection) easily causes damage to the material, so that the strength of the material is reduced, and meanwhile, the weight of the used repair material is large, so that the effective load is reduced. The adhesive bonding is a technology for connecting the surfaces of homogeneous or heterogeneous objects together, has the characteristics of continuous stress distribution, light weight and the like, can effectively avoid the problems of the traditional mechanical connection method, and is very effective CfA method for repairing/C composite material.
CfThe high temperature application field of the/C composite material determines that the adhesive has good heat resistance and toughness to meet the structural adhesive performance requirement, and also has excellent thermal conductivity to meet the heat transfer requirement. C has been developed so farfThe adhesives for the/C composite materials are mainly divided into organic and inorganic adhesives. The organic adhesive forms a carbon bonding layer or a silicon bonding layer after high-temperature heat treatment, has higher bonding strength at room temperature and low temperature, but has certain limitation, low fracture toughness and poor thermal shock resistance due to a single-phase structure. The inorganic adhesive can be reacted with CfThe C/C matrix reacts to form a carbide bonding layer with higher bonding strength, the temperature resistance is excellent, but the ceramic layer and the C arefThe thermal expansion coefficient and the elastic modulus of the/C composite material are greatly mismatched, and residual stress is generated in the cooling process at the preparation temperature, so that the bonding is strongThe degree decreases. In addition, the heat conductivity of the two adhesives is rarely reported. Therefore, the conventional adhesive hardly satisfies CfThe bonding repair requirement of the/C composite material.
Disclosure of Invention
Aiming at the defects of the prior art, the invention aims to provide a bonding repair method of a carbon fiber reinforced carbon-based composite material, a used adhesive and a preparation method thereof.
The above purpose can be realized by the following technical scheme:
in a first aspect, the invention provides a bonding repair method for a carbon fiber reinforced carbon-based composite material, which comprises the following steps:
(1) adhesive preparation:
at the room temperature of 25 ℃, firstly, adding 10-15 wt.% of diamond powder, 12-15 wt.% of zinc oxide powder, 6-12 wt.% of copper powder, 10-15 wt.% of titanium powder and 32-37 wt.% of low-melting-point glass powder into a mortar, mixing and grinding for 30 minutes to prepare mixed powder;
adding the mixed powder and 20-25 wt.% of organic silicon resin solution into a container (beaker) simultaneously, and mechanically stirring for 1 hour to complete the preparation of the adhesive; the organic silicon resin solution is prepared by stirring and mixing organic silicon resin and dimethylbenzene, and the viscosity is 65-100 cps;
(2) curing of the adhesive:
uniformly coating the prepared adhesive on the surfaces of two bonding surfaces of a material to be repaired, then bonding the two surfaces, controlling the pressure applied to the surface of the material in the atmospheric environment, controlling the thickness of the adhesive layer to be 0.08-0.3 mu m, then placing the material into a blast oven, heating to 250 ℃ at the speed of 5 ℃/h, preserving the temperature for 2 hours to complete the curing of the adhesive, and controlling the thickness of the adhesive layer to be 0.08-0.3 mu m by applying pressure to the material during the whole curing period;
(3) carbonization of the adhesive:
and (3) putting the cured material into high-temperature vacuum equipment, heating to 1200 ℃ at the speed of 100 ℃/hour under the vacuum environment of-0.1 MPa, and then preserving heat for 2 hours to finish the carbonization of the adhesive.
The granularity of the diamond powder in the step (1) is 460-650 meshes; the granularity of the zinc oxide powder is 270-325 meshes; the mesh number of the copper powder is 200-325 meshes; the mesh number of the titanium powder is 200-325 meshes; the low-melting point glass powder has a mesh number of 1500-3000 meshes and a melting point of 700-750 ℃.
The organic silicon resin is polymethylphenylsiloxane; the purity of the xylene was analytical grade.
In a second aspect, the present invention provides a high thermal conductivity and high temperature resistant adhesive, which is prepared by the following method:
at the room temperature of 25 ℃, firstly, adding 10-15 wt.% of diamond powder, 12-15 wt.% of zinc oxide powder, 6-12 wt.% of copper powder, 10-15 wt.% of titanium powder and 32-37 wt.% of low-melting-point glass powder into a mortar, mixing and grinding for 30 minutes to prepare mixed powder;
adding the mixed powder and 20-25 wt.% of organic silicon resin solution into a container (beaker) simultaneously, and mechanically stirring for 1 hour to complete the preparation of the adhesive; the organic silicon resin solution is prepared by stirring and mixing organic silicon resin and dimethylbenzene, and the viscosity of the organic silicon resin solution is 65-100 cps.
The particle size of the diamond powder is 460-650 meshes; the granularity of the zinc oxide powder is 270-325 meshes; the mesh number of the copper powder is 200-325 meshes; the mesh number of the titanium powder is 200-325 meshes; the low-melting point glass powder has a mesh number of 1500-3000 meshes and a melting point of 700-750 ℃.
The organic silicon resin is polymethylphenylsiloxane; the purity of the xylene was analytical grade.
The adhesive has excellent room temperature and high temperature adhesive strength and thermal shock resistance, and the heat conductivity coefficient of the material after adhesive repair is higher than 22.31W/(m.k) at room temperature, and the coefficient is CfThe composite material has wide practical value and application prospect in the field of the/C composite material.
In a third aspect, the invention provides a preparation method of a high-thermal-conductivity high-temperature-resistant adhesive, which comprises the following steps:
at the room temperature of 25 ℃, firstly, adding 10-15 wt.% of diamond powder, 12-15 wt.% of zinc oxide powder, 6-12 wt.% of copper powder, 10-15 wt.% of titanium powder and 32-37 wt.% of low-melting-point glass powder into a mortar, mixing and grinding for 30 minutes to prepare mixed powder;
adding the mixed powder and 20-25 wt.% of organic silicon resin solution into a container (beaker) simultaneously, and mechanically stirring for 1 hour to complete the preparation of the adhesive; the organic silicon resin solution is prepared by stirring and mixing organic silicon resin and dimethylbenzene, and the viscosity of the organic silicon resin solution is 65-100 cps.
The particle size of the diamond powder is 460-650 meshes; the granularity of the zinc oxide powder is 270-325 meshes; the mesh number of the copper powder is 200-325 meshes; the mesh number of the titanium powder is 200-325 meshes; the low-melting point glass powder has a mesh number of 1500-3000 meshes and a melting point of 700-750 ℃.
The organic silicon resin is polymethylphenylsiloxane; the purity of the xylene was analytical grade.
In a fourth aspect, the invention provides an application of the high-thermal-conductivity high-temperature-resistant adhesive in repairing a carbon fiber reinforced carbon-based composite material.
The high-heat-conductivity high-temperature-resistant adhesive has the advantages and positive effects that the adhesive not only has good room-temperature and high-temperature adhesive strength, but also has excellent heat-conducting property, and is particularly shown in the following steps:
1) the carbon fiber reinforced carbon base (C) bonded and repaired by the methodfThe room-temperature bonding strength of the/C) composite material is 11.6-13.0 MPa, and the failure mode is that the body is broken;
2) c bonded by the inventionfAfter the/C composite material is subjected to accumulated treatment for 50 hours at 300 ℃, 700 ℃, 1100 ℃ and 1500 ℃ respectively, no defects such as pores, cracks and the like are found at the adhesive layer, the adhesive strength is 11.6-13.0 MPa, the adhesive strength is not attenuated compared with the adhesive strength at room temperature, and the failure mode is still that the body material is broken;
3) c bonded by the inventionfThe adhesive sample of the/C composite material is not cracked after accumulated treatment for 20 hours at 1800 ℃, and the adhesive strength is 6.8-7.5 MPa, which shows that the adhesiveThe heat resistance is excellent;
4) c bonded by the inventionfThe thermal conductivity coefficients of the/C composite material at room temperature (25 ℃), 700 ℃ and 1000 ℃ are respectively 22.31-25.35W/(m.k), 20.86-21.56W/(m.k) and 17.68-19.15W/(m.k), and CfThe thermal conductivity of the/C composite material is equivalent.
Drawings
FIG. 1 is a flow chart of the bond repair method of the present invention.
Detailed Description
The invention is further illustrated with reference to the following figures and examples.
Example 1:
the embodiment provides a bonding repair method for a carbon fiber reinforced carbon-based composite material, which comprises the following steps:
(1) at the room temperature of 25 ℃, 10 wt.% of diamond powder, 12wt.% of zinc oxide powder, 10 wt.% of copper powder, 15wt.% of titanium powder and 33 wt.% of low-melting glass powder are added into a mortar and ground for 30 minutes to prepare mixed powder, then the organic silicon resin is stirred and mixed with a proper amount of xylene to prepare an organic silicon resin solution with the viscosity of 80cps, and finally the 20 wt.% organic silicon resin solution and the mixed powder are added into a beaker at the same time and mechanically stirred for 1 hour. Wherein the particle size of the diamond powder is 460 meshes; the granularity of the zinc oxide powder is 325 meshes; the mesh number of the copper powder is 325 meshes; the mesh number of the titanium powder is 325 meshes; the mesh number of the low-melting-point glass powder is 1500-3000 meshes, and the melting point is 700-750 ℃; the organic silicon resin is polymethylphenylsiloxane; the xylene purity was analytical.
(2) Uniformly coating the adhesive on the surfaces of the two bonding surfaces, then bonding the two surfaces, controlling the pressure applied to the surface of the material under the atmospheric environment to control the thickness of the adhesive layer to be 0.12 mu m, then placing the material into a blast oven, heating to 250 ℃ at the speed of 5 ℃/h, and then preserving heat for 2 hours.
(3) And (3) putting the cured material into high-temperature vacuum equipment, heating to 1200 ℃ at the speed of 100 ℃/hour under the vacuum environment of-0.1 MPa, and then preserving heat for 2 hours.
Using the adhesive of example 1C after grafting repairfthe/C composite material:
the room-temperature bonding strength is 12.5MPa, and the failure mode is Cfthe/C composite material body is broken;
after accumulated treatment is carried out for 50 hours at 300 ℃, 700 ℃, 1100 ℃ and 1500 ℃, no defects such as pores, cracks and the like are found at the glue layer, the bonding strength is 12.6MPa, the bonding strength is not attenuated compared with the bonding strength at room temperature, and the failure mode is that the body material is still broken;
the bonded sample does not crack after accumulated treatment for 20 hours at 1800 ℃, the bonding strength is 7.2MPa, and the bonded sample has excellent heat resistance;
thermal conductivities at room temperature (25 ℃), 700 ℃ and 1000 ℃ of 23.54W/(m.k), 21.23W/(m.k) and 18.56W/(m.k), respectively, and CfThe thermal conductivity of the/C composite material is equivalent.
The test method of the bonding performance is as follows:
room temperature adhesive strength: the shear performance of a sample is tested by adopting a short beam method on a universal electronic testing machine to measure;
heat resistance: placing the bonded sample into a tube furnace, preserving heat for a corresponding time at a test temperature point under the protection of argon, and then cooling the sample to room temperature for bonding performance test;
coefficient of thermal conductivity: the bonded sample was placed in an LFA427HT laser thermal conductivity meter manufactured by KASS Germany, and the thermal conductivity was measured under vacuum.
Example 2:
the embodiment provides a bonding repair method for a carbon fiber reinforced carbon-based composite material, which comprises the following steps:
(1) at the room temperature of 25 ℃, 10 wt.% of diamond powder, 10 wt.% of zinc oxide powder, 10 wt.% of copper powder, 10 wt.% of titanium powder and 35 wt.% of low-melting glass powder are added into a mortar and ground for 30 minutes to prepare mixed powder, then the organic silicon resin and a proper amount of dimethylbenzene are stirred and mixed to prepare an organic silicon resin solution with the viscosity of 100cps, and finally the 25wt.% of organic silicon resin solution and the mixed powder are simultaneously added into a beaker and mechanically stirred for 1 hour to complete the preparation of the adhesive. Wherein the particle size of the diamond powder is 460 meshes; the granularity of the zinc oxide powder is 325 meshes; the mesh number of the copper powder is 325 meshes; the mesh number of the titanium powder is 325 meshes; the mesh number of the low-melting-point glass powder is 1500 meshes; the organic silicon resin is polymethylphenylsiloxane; the xylene purity was analytical.
(2) Uniformly coating the adhesive on the surfaces of the two bonding surfaces, then bonding the two surfaces, controlling the pressure applied to the surface of the material under the atmospheric environment to control the thickness of the adhesive layer to be 0.15 mu m, then placing the material into a blast oven, heating to 250 ℃ at the speed of 5 ℃/h, and then preserving heat for 2 hours.
(3) And (3) putting the cured material into high-temperature vacuum equipment, heating to 1200 ℃ at the speed of 100 ℃/hour under the vacuum environment of-0.1 MPa, and then preserving heat for 2 hours to finish the carbonization of the adhesive.
C after adhesive repair in example 2fthe/C composite material:
the room-temperature bonding strength is 13.0MPa, and the failure mode is Cfthe/C composite material body is broken;
after accumulated treatment is carried out for 50 hours at 300 ℃, 700 ℃, 1100 ℃ and 1500 ℃, no defects such as pores, cracks and the like are found at the glue layer, the bonding strength is 13.0MPa, the bonding strength is not attenuated compared with the bonding strength at room temperature, and the failure mode is that the body material is still broken;
the bonded sample does not crack after accumulated treatment for 20 hours at 1800 ℃, the bonding strength is 7.1MPa, and the bonded sample has excellent heat resistance;
thermal conductivities at room temperature (25 ℃), 700 ℃ and 1000 ℃ of 22.31W/(m.k), 20.97W/(m.k) and 17.90W/(m.k), respectively, and CfThe thermal conductivity of the/C composite material is equivalent.
The above test method for the adhesion property was the same as in example 1.
Example 3:
the embodiment provides a bonding repair method for a carbon fiber reinforced carbon-based composite material, which comprises the following steps:
(1) at the room temperature of 25 ℃, 13 wt.% of diamond powder, 12wt.% of zinc oxide powder, 8 wt.% of copper powder, 10 wt.% of titanium powder and 32 wt.% of low-melting glass powder are added into a mortar and ground for 30 minutes to prepare mixed powder, then the organic silicon resin and a proper amount of dimethylbenzene are stirred and mixed to prepare an organic silicon resin solution with the viscosity of 85cps, and finally the 25wt.% of organic silicon resin solution and the mixed powder are simultaneously added into a beaker and mechanically stirred for 1 hour to complete the preparation of the adhesive. Wherein the particle size of the diamond powder is 650 meshes; the granularity of the zinc oxide powder is 270 meshes; the mesh number of the copper powder is 200 meshes; the mesh number of the titanium powder is 325 meshes; the mesh number of the low-melting-point glass powder is 1500 meshes; the organic silicon resin is polymethylphenylsiloxane; the xylene purity was analytical.
(2) Uniformly coating the adhesive on the surfaces of the two bonding surfaces, then bonding the two surfaces, controlling the thickness of an adhesive layer to be 0.08 mu m by controlling the pressure applied to the surface of the material in an atmospheric environment, then placing the material into a blast oven, heating to 250 ℃ at the speed of 5 ℃/h, and then preserving heat for 2 hours.
(3) And (3) putting the cured material into high-temperature vacuum equipment, heating to 1200 ℃ at the speed of 100 ℃/hour under the vacuum environment of-0.1 MPa, and then preserving heat for 2 hours.
C after adhesive repair in example 3fthe/C composite material:
the room-temperature bonding strength is 12.9MPa, and the failure mode is Cfthe/C composite material body is broken;
after accumulated treatment is carried out for 50 hours at 300 ℃, 700 ℃, 1100 ℃ and 1500 ℃, no defects such as pores, cracks and the like are found at the glue layer, the bonding strength is 12.9MPa, the bonding strength is not attenuated compared with the bonding strength at room temperature, and the failure mode is that the body material is still broken;
the bonded sample does not crack after accumulated treatment for 20 hours at 1800 ℃, the bonding strength is 7.1MPa, and the bonded sample has excellent heat resistance;
thermal conductivities at room temperature (25 ℃), 700 ℃ and 1000 ℃ of 24.68W/(m.k), 21.12W/(m.k) and 19.03W/(m.k), respectively, and CfThe thermal conductivity of the/C composite material is equivalent.
The above test method for the adhesion property was the same as in example 1.
Claims (10)
1. A bonding repair method for a carbon fiber reinforced carbon-based composite material is characterized by comprising the following steps: the method comprises the following steps:
(1) adhesive preparation:
at the room temperature of 25 ℃, firstly, adding 10-15 wt.% of diamond powder, 12-15 wt.% of zinc oxide powder, 6-12 wt.% of copper powder, 10-15 wt.% of titanium powder and 32-37 wt.% of low-melting-point glass powder into a mortar, mixing and grinding for 30 minutes to prepare mixed powder;
simultaneously adding the mixed powder and 20-25 wt.% of organic silicon resin solution into a container, and mechanically stirring for 1 hour to complete the preparation of the adhesive; the organic silicon resin solution is prepared by stirring and mixing organic silicon resin and dimethylbenzene, and the viscosity is 65-100 cps;
(2) curing of the adhesive:
uniformly coating the prepared adhesive on the surfaces of two bonding surfaces of a material to be repaired, then bonding the two surfaces, controlling the pressure applied to the surface of the material in the atmospheric environment, controlling the thickness of the adhesive layer to be 0.08-0.3 mu m, then placing the material into a blast oven, heating to 250 ℃ at the speed of 5 ℃/h, preserving the temperature for 2 hours to complete the curing of the adhesive, and controlling the thickness of the adhesive layer to be 0.08-0.3 mu m by applying pressure to the material during the whole curing period;
(3) carbonization of the adhesive:
and (3) putting the cured material into high-temperature vacuum equipment, heating to 1200 ℃ at the speed of 100 ℃/hour under the vacuum environment of-0.1 MPa, and then preserving heat for 2 hours to finish the carbonization of the adhesive.
2. The method for repairing the adhesion of the carbon fiber reinforced carbon-based composite material according to claim 1, wherein: the granularity of the diamond powder in the step (1) is 460-650 meshes; the granularity of the zinc oxide powder is 270-325 meshes; the mesh number of the copper powder is 200-325 meshes; the mesh number of the titanium powder is 200-325 meshes; the low-melting point glass powder has a mesh number of 1500-3000 meshes and a melting point of 700-750 ℃.
3. The method for repairing the adhesion of the carbon fiber reinforced carbon-based composite material according to claim 1, wherein: the organic silicon resin is polymethylphenylsiloxane; the purity of the xylene was analytical grade.
4. The high-heat-conductivity high-temperature-resistant adhesive is characterized in that: the adhesive is prepared by the following method:
at the room temperature of 25 ℃, firstly, adding 10-15 wt.% of diamond powder, 12-15 wt.% of zinc oxide powder, 6-12 wt.% of copper powder, 10-15 wt.% of titanium powder and 32-37 wt.% of low-melting-point glass powder into a mortar, mixing and grinding for 30 minutes to prepare mixed powder;
simultaneously adding the mixed powder and 20-25 wt.% of organic silicon resin solution into a container, and mechanically stirring for 1 hour to complete the preparation of the adhesive; the organic silicon resin solution is prepared by stirring and mixing organic silicon resin and dimethylbenzene, and the viscosity of the organic silicon resin solution is 65-100 cps.
5. The high thermal conductivity and high temperature resistance adhesive according to claim 4, wherein: the particle size of the diamond powder is 460-650 meshes; the granularity of the zinc oxide powder is 270-325 meshes; the mesh number of the copper powder is 200-325 meshes; the mesh number of the titanium powder is 200-325 meshes; the low-melting point glass powder has a mesh number of 1500-3000 meshes and a melting point of 700-750 ℃.
6. The high thermal conductivity and high temperature resistance adhesive according to claim 4, wherein: the organic silicon resin is polymethylphenylsiloxane; the purity of the xylene was analytical grade.
7. A preparation method of a high-heat-conductivity high-temperature-resistant adhesive is characterized by comprising the following steps: the method comprises the following steps:
at the room temperature of 25 ℃, firstly, adding 10-15 wt.% of diamond powder, 12-15 wt.% of zinc oxide powder, 6-12 wt.% of copper powder, 10-15 wt.% of titanium powder and 32-37 wt.% of low-melting-point glass powder into a mortar, mixing and grinding for 30 minutes to prepare mixed powder;
simultaneously adding the mixed powder and 20-25 wt.% of organic silicon resin solution into a container, and mechanically stirring for 1 hour to complete the preparation of the adhesive; the organic silicon resin solution is prepared by stirring and mixing organic silicon resin and dimethylbenzene, and the viscosity of the organic silicon resin solution is 65-100 cps.
8. The preparation method of the high-thermal-conductivity high-temperature-resistant adhesive according to claim 7, characterized in that: the particle size of the diamond powder is 460-650 meshes; the granularity of the zinc oxide powder is 270-325 meshes; the mesh number of the copper powder is 200-325 meshes; the mesh number of the titanium powder is 200-325 meshes; the low-melting point glass powder has a mesh number of 1500-3000 meshes and a melting point of 700-750 ℃.
9. The preparation method of the high-thermal-conductivity high-temperature-resistant adhesive according to claim 7, characterized in that: the organic silicon resin is polymethylphenylsiloxane; the purity of the xylene was analytical grade.
10. The application of the high-thermal-conductivity high-temperature-resistant adhesive as defined in any one of claims 4 to 6 in repairing carbon fiber reinforced carbon-based composite materials.
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| CN115403400A (en) * | 2022-08-19 | 2022-11-29 | 宏德新材料科技(葫芦岛)股份有限公司 | Aircraft carbon/carbon composite material brake disc repairing method and adhesive used in method |
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| CN115403400B (en) * | 2022-08-19 | 2023-03-21 | 宏德新材料科技(葫芦岛)股份有限公司 | Aircraft carbon/carbon composite material brake disc repairing method and adhesive used in method |
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