CN114561152B - Room-temperature-curing inorganic-organic composite adhesive with temperature resistance of 400 ℃ and preparation method thereof - Google Patents
Room-temperature-curing inorganic-organic composite adhesive with temperature resistance of 400 ℃ and preparation method thereof Download PDFInfo
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- CN114561152B CN114561152B CN202210202907.0A CN202210202907A CN114561152B CN 114561152 B CN114561152 B CN 114561152B CN 202210202907 A CN202210202907 A CN 202210202907A CN 114561152 B CN114561152 B CN 114561152B
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- 239000000853 adhesive Substances 0.000 title claims abstract description 67
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 67
- 239000002131 composite material Substances 0.000 title claims abstract description 43
- 238000002360 preparation method Methods 0.000 title claims abstract description 15
- 229920005989 resin Polymers 0.000 claims abstract description 53
- 239000011347 resin Substances 0.000 claims abstract description 53
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 39
- 238000000498 ball milling Methods 0.000 claims abstract description 32
- 239000011812 mixed powder Substances 0.000 claims abstract description 29
- 239000004570 mortar (masonry) Substances 0.000 claims abstract description 26
- 239000000463 material Substances 0.000 claims abstract description 18
- 238000000227 grinding Methods 0.000 claims abstract description 17
- 239000012745 toughening agent Substances 0.000 claims abstract description 15
- 238000000034 method Methods 0.000 claims abstract description 12
- 238000002156 mixing Methods 0.000 claims abstract description 10
- 238000011068 loading method Methods 0.000 claims abstract description 8
- 239000000203 mixture Substances 0.000 claims description 40
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 claims description 34
- 239000003822 epoxy resin Substances 0.000 claims description 21
- 229920000647 polyepoxide Polymers 0.000 claims description 21
- 238000006243 chemical reaction Methods 0.000 claims description 17
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 16
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 claims description 12
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 12
- 239000011734 sodium Substances 0.000 claims description 12
- 229910052708 sodium Inorganic materials 0.000 claims description 12
- 238000005303 weighing Methods 0.000 claims description 11
- 239000004952 Polyamide Substances 0.000 claims description 9
- 239000004111 Potassium silicate Substances 0.000 claims description 9
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims description 9
- 239000000395 magnesium oxide Substances 0.000 claims description 9
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 claims description 9
- 229920002647 polyamide Polymers 0.000 claims description 9
- 229910052913 potassium silicate Inorganic materials 0.000 claims description 9
- 235000019353 potassium silicate Nutrition 0.000 claims description 9
- 239000004115 Sodium Silicate Substances 0.000 claims description 8
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 8
- NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 claims description 8
- 229910052911 sodium silicate Inorganic materials 0.000 claims description 8
- 230000007306 turnover Effects 0.000 claims description 8
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 7
- -1 phenolic amine Chemical class 0.000 claims description 7
- 229910052710 silicon Inorganic materials 0.000 claims description 7
- 239000010703 silicon Substances 0.000 claims description 7
- 229910000861 Mg alloy Inorganic materials 0.000 claims description 6
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 claims description 6
- SNAAJJQQZSMGQD-UHFFFAOYSA-N aluminum magnesium Chemical compound [Mg].[Al] SNAAJJQQZSMGQD-UHFFFAOYSA-N 0.000 claims description 6
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 claims description 6
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 claims description 6
- 239000000292 calcium oxide Substances 0.000 claims description 6
- BITYAPCSNKJESK-UHFFFAOYSA-N potassiosodium Chemical compound [Na].[K] BITYAPCSNKJESK-UHFFFAOYSA-N 0.000 claims description 6
- 239000011591 potassium Substances 0.000 claims description 6
- 229910052700 potassium Inorganic materials 0.000 claims description 6
- 239000000843 powder Substances 0.000 claims description 6
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 claims description 6
- 238000003756 stirring Methods 0.000 claims description 6
- FDLQZKYLHJJBHD-UHFFFAOYSA-N [3-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=CC(CN)=C1 FDLQZKYLHJJBHD-UHFFFAOYSA-N 0.000 claims description 5
- UGACIEPFGXRWCH-UHFFFAOYSA-N [Si].[Ti] Chemical compound [Si].[Ti] UGACIEPFGXRWCH-UHFFFAOYSA-N 0.000 claims description 5
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N iron oxide Inorganic materials [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 claims description 5
- NNHHDJVEYQHLHG-UHFFFAOYSA-N potassium silicate Chemical compound [K+].[K+].[O-][Si]([O-])=O NNHHDJVEYQHLHG-UHFFFAOYSA-N 0.000 claims description 5
- VILCJCGEZXAXTO-UHFFFAOYSA-N 2,2,2-tetramine Chemical compound NCCNCCNCCN VILCJCGEZXAXTO-UHFFFAOYSA-N 0.000 claims description 4
- RNLHGQLZWXBQNY-UHFFFAOYSA-N 3-(aminomethyl)-3,5,5-trimethylcyclohexan-1-amine Chemical compound CC1(C)CC(N)CC(C)(CN)C1 RNLHGQLZWXBQNY-UHFFFAOYSA-N 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- RPNUMPOLZDHAAY-UHFFFAOYSA-N Diethylenetriamine Chemical compound NCCNCCN RPNUMPOLZDHAAY-UHFFFAOYSA-N 0.000 claims description 4
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 claims description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 4
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims description 4
- CFOAUMXQOCBWNJ-UHFFFAOYSA-N [B].[Si] Chemical compound [B].[Si] CFOAUMXQOCBWNJ-UHFFFAOYSA-N 0.000 claims description 4
- YKTSYUJCYHOUJP-UHFFFAOYSA-N [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] Chemical compound [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] YKTSYUJCYHOUJP-UHFFFAOYSA-N 0.000 claims description 4
- YDYPVWDJZRYAMO-UHFFFAOYSA-N [Ti].[Si].[B] Chemical compound [Ti].[Si].[B] YDYPVWDJZRYAMO-UHFFFAOYSA-N 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- 125000003700 epoxy group Chemical group 0.000 claims description 4
- 239000011777 magnesium Substances 0.000 claims description 4
- 229910052749 magnesium Inorganic materials 0.000 claims description 4
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 4
- 239000000377 silicon dioxide Substances 0.000 claims description 4
- 235000012239 silicon dioxide Nutrition 0.000 claims description 4
- 239000011787 zinc oxide Substances 0.000 claims description 4
- NDLPOXTZKUMGOV-UHFFFAOYSA-N oxo(oxoferriooxy)iron hydrate Chemical compound O.O=[Fe]O[Fe]=O NDLPOXTZKUMGOV-UHFFFAOYSA-N 0.000 claims description 3
- 125000003277 amino group Chemical group 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 abstract description 5
- 238000004026 adhesive bonding Methods 0.000 abstract description 2
- 238000012360 testing method Methods 0.000 description 20
- 230000032683 aging Effects 0.000 description 13
- 229910001069 Ti alloy Inorganic materials 0.000 description 12
- 239000002585 base Substances 0.000 description 10
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 9
- 229940104869 fluorosilicate Drugs 0.000 description 9
- 238000009833 condensation Methods 0.000 description 6
- 230000005494 condensation Effects 0.000 description 6
- 238000004132 cross linking Methods 0.000 description 6
- 239000000499 gel Substances 0.000 description 6
- 230000007062 hydrolysis Effects 0.000 description 6
- 238000006460 hydrolysis reaction Methods 0.000 description 6
- 239000000805 composite resin Substances 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- 239000003513 alkali Substances 0.000 description 3
- 239000003054 catalyst Substances 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 238000001556 precipitation Methods 0.000 description 3
- 229910052814 silicon oxide Inorganic materials 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 229910010272 inorganic material Inorganic materials 0.000 description 2
- 239000011147 inorganic material Substances 0.000 description 2
- 229920000768 polyamine Polymers 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 229920000742 Cotton Polymers 0.000 description 1
- 235000015842 Hesperis Nutrition 0.000 description 1
- 235000012633 Iberis amara Nutrition 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 229920006332 epoxy adhesive Polymers 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000012774 insulation material Substances 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J1/00—Adhesives based on inorganic constituents
- C09J1/02—Adhesives based on inorganic constituents containing water-soluble alkali silicates
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
A room temperature curing high temperature resistant 400 ℃ inorganic-organic composite adhesive and a preparation method thereof relate to the field of adhesives, in particular to a room temperature curing high temperature resistant inorganic-organic composite adhesive and a preparation method thereof. The method aims to solve the problems that the existing inorganic-organic composite adhesive can be cured only by heating, and the adhesive bonding strength is low and the temperature resistance is poor in room temperature curing. The inorganic-organic composite adhesive consists of inorganic resin base material, inorganic toughening agent, inorganic curing agent, curing accelerator and organic components in parts by mass. The method comprises the following steps: loading an inorganic toughening agent, an inorganic curing agent and a curing accelerator into a ball mill, performing ball milling and dispersing, taking out mixed powder and putting into a mortar; adding inorganic resin base material into the mixed powder, grinding and mixing in a mortar to obtain a uniform and viscous paste; adding the organic components into a mortar, and grinding to uniform paste, thus obtaining the inorganic-organic composite adhesive. The invention is used for preparing inorganic-organic composite adhesive.
Description
Technical Field
The invention relates to the field of adhesives, in particular to a room-temperature-curing high-temperature-resistant inorganic-organic composite adhesive and a preparation method thereof.
Background
Regarding room temperature curing high temperature resistant organic adhesive, the adhesive products developed at present are room temperature vulcanizing silicone rubber adhesive, room temperature curing epoxy structural adhesive and other heat resistant adhesives, which are mainly used for bonding metal, rubber and other heat resistant nonmetallic materials. The EA9309 bi-component epoxy adhesive produced by Dexter company has room temperature shear strength of 33-35 Mpa, but basically has no bonding strength above 300 ℃; after BK series organic silica gel adhesive is modified by butyl acrylate and asbestos, the toughness and the bonding strength are greatly improved, wherein the BK-15M type adhesive is cured for 12-24 hours at 24 ℃ and the maximum use temperature is 350 ℃. However, the organic adhesive has the defects of poor temperature resistance, particularly poor high-temperature durability and the like after being cured, and the application of the organic adhesive in high-temperature occasions is limited.
The product of the room temperature curable inorganic adhesive mainly comprises inorganic adhesives such as silicate, phosphate and the like, and has the main advantage of good high temperature resistance. Resbond TM907GF, manufactured by Cotronics, is a ceramic-based adhesive that is room temperature curable for bonding titanium alloys at a temperature of-185-1290 ℃ and a room temperature shear strength of 4.4Mpa, and is particularly useful for bonding spacecraft components. The inorganic adhesive can be used for bonding materials such as titanium alloy, graphite and the like, the service temperature is 1000-1600 ℃, and the adhesive can also be used for bonding and repairing parts on missiles, rockets, satellites and spacecraft flying at high speed. However, the room temperature cured product has the main defects of high brittleness and low bonding strength to metal materials and high-temperature resistant heat insulation materials.
The inorganic-organic composite adhesive has the characteristics of inorganic and organic adhesives, meets the bonding performance and high temperature resistance of the adhesive, and generally needs to be heated and cured to obtain higher bonding performance and heat resistance. Patent CN101440268 discloses a high-temperature-resistant inorganic-organic hybrid epoxy resin adhesive, which needs heating to cure, the room-temperature shear strength after heating and curing is 11MPa, the room-temperature shear strength after aging at 400 ℃ for 5 hours is 4.6MPa, and the room-temperature curing has the problems of low adhesive bonding strength and poor temperature resistance, so that the use requirement is difficult to meet.
Disclosure of Invention
The invention aims to solve the problems that the existing inorganic-organic composite adhesive can be cured only by heating, and the room-temperature curing has low bonding strength and poor temperature resistance, and provides a room-temperature curing inorganic-organic composite adhesive with 400 ℃ temperature resistance and a preparation method thereof.
The invention relates to a room temperature curing temperature-resistant 400 ℃ inorganic-organic composite adhesive, which consists of 100 parts of inorganic resin base materials, 100-110 parts of inorganic toughening agents, 5-20 parts of inorganic curing agents, 3-15 parts of curing accelerators and 2-30 parts of organic components according to parts by weight; the organic component comprises a hybrid organic resin and a room temperature curing agent, wherein the molar ratio of epoxy groups in the hybrid organic resin to amino groups in the room temperature curing agent is 1:1.
Further, the inorganic resin base material is silicate resin with the modulus of 2.3-2.4; the silicate resin is one or a mixture of more of potassium silicate, sodium silicate, aluminum silicate and sodium potassium silicate.
Further, the inorganic toughening agent is one or a mixture of more of aluminum powder, iron powder, copper powder and aluminum magnesium alloy powder.
Further, the inorganic curing agent is one or a mixture of more of aluminum oxide, silicon dioxide, magnesium oxide, calcium oxide, zinc oxide and ferric oxide.
Further, the curing accelerator is one or a mixture of several of sodium fluosilicate, potassium fluosilicate, magnesium fluosilicate and aluminum fluosilicate.
Further, the hybrid organic resin is one or a mixture of more of silicon hybrid epoxy resin, silicon-titanium hybrid epoxy resin, silicon-boron hybrid epoxy resin and silicon-titanium-boron hybrid epoxy resin.
Further, the room temperature curing agent is one or a mixture of more of polyamide 200#, polyamide 300#, ethylenediamine, hexamethylenediamine, diethylenetriamine, triethylenetetramine, polyethylenepolyamine, m-xylylenediamine, isophoronediamine and phenolic amine.
The preparation method of the room-temperature-curing inorganic-organic composite adhesive with the temperature resistance of 400 ℃ comprises the following steps:
1. weighing 100 parts of inorganic resin base material, 100-110 parts of inorganic toughening agent, 5-20 parts of inorganic curing agent, 3-15 parts of curing accelerator and 2-30 parts of organic component according to parts by mass;
the preparation method of the organic component comprises the following steps: weighing the hybrid organic resin and the room temperature curing agent according to the mol ratio of the hybrid organic resin to the room temperature curing agent reaction active groups of 1:1, mechanically stirring, and uniformly mixing to obtain an organic component;
2. loading an inorganic toughening agent, an inorganic curing agent and a curing accelerator into a ball mill, setting the rotation frequency to be 15.00Hz-20.00Hz, setting the turnover speed to be 8-10 rpm, ball milling and dispersing for 4-6 minutes, and then taking out mixed powder and putting the mixed powder into a mortar;
3. adding an inorganic resin base material into the mixed powder obtained in the second step, and grinding and mixing the mixed powder in a mortar until the mixed powder is uniformly sticky paste for later use;
4. and (3) adding the organic component into the mortar in the third step, and continuously grinding the mixture to form uniform paste, thus obtaining the room-temperature-curing inorganic-organic composite adhesive with the temperature resistance of 400 ℃.
The invention has the beneficial effects that:
the invention combines the characteristics of heat resistance of inorganic materials, good curing process performance of organic resins and bonding performance. In the curing process of the composite resin, an organic network crosslinking reaction between epoxy and an amine curing agent and an inorganic network crosslinking reaction of silicate resin can occur, and interpenetrating between the two networks can also occur, and the crosslinking reactions endow the composite resin with good cementing performance. Because the silicate resin base material is alkaline, the epoxy group can be promoted to open loop to generate curing reaction at room temperature under alkaline environment. After fluorosilicate is added into silicate system, acid produced by fluorosilicate hydrolysis and alkali produced by silicate hydrolysis are neutralized, along with the continuous progress of reaction, the alkalinity in the system is reduced, the precipitation and condensation of silicate sol are ensured, the reaction is promoted to continuously progress in the forward direction at room temperature, silicate is continuously dehydrated and condensed, silicate sol is changed into high-temperature resistant polymer substance with a body type network-Si-O-Si-structure from low molecular of a linear structure in the condensation process, silicate gel is continuously precipitated and condensed, so that the silicate gel is solidified, and the adhered surface is glued to obtain strength, and the inorganic system can be solidified at room temperature under the action of fluorosilicate solidifying catalyst.
The room-temperature-curing inorganic-organic composite adhesive with the temperature resistance of 400 ℃ prepared by the invention can be cured at room temperature. The adhesive has high normal-temperature bonding strength, high bonding strength retention rate after high temperature and aging, and the bonding strength of the titanium alloy test piece is 7.3-8.6MPa after room-temperature curing, 3.2-7.1MPa at 400 ℃ and 2.6-5.8MPa after aging for 5 hours at 400 ℃.
Detailed Description
The technical scheme of the invention is not limited to the specific embodiments listed below, and also includes any combination of the specific embodiments.
The first embodiment is as follows: the room-temperature-curing temperature-resistant 400 ℃ inorganic-organic composite adhesive consists of, by mass, 100 parts of an inorganic resin base material, 100-110 parts of an inorganic toughening agent, 5-20 parts of an inorganic curing agent, 3-15 parts of a curing accelerator and 2-30 parts of an organic component; the organic component comprises a hybrid organic resin and a room temperature curing agent, wherein the mol ratio of the hybrid organic resin to the reactive groups of the room temperature curing agent is 1:1.
The second embodiment is as follows: the inorganic resin binder in this embodiment is a silicate resin having a modulus of 2.3 to 2.4. Other compositions and parameters are the same as in the first embodiment.
And a third specific embodiment: in this embodiment, the silicate resin is one or a mixture of several of potassium silicate, sodium silicate, aluminum silicate and sodium potassium silicate. Other compositions and parameters are the same as in one or both of the embodiments.
The specific embodiment IV is as follows: in the embodiment, the inorganic toughening agent is one or a mixture of more of aluminum powder, iron powder, copper powder and aluminum magnesium alloy powder. Other compositions and parameters are the same as in the first, second or third embodiments.
Fifth embodiment: in this embodiment, the inorganic curing agent is one or a mixture of several of aluminum oxide, silicon dioxide, magnesium oxide, calcium oxide, zinc oxide and iron oxide. Other compositions and parameters are the same as in one to one fourth of the embodiments.
Specific embodiment six: in the embodiment, the curing accelerator is one or a mixture of several of sodium fluosilicate, potassium fluosilicate, magnesium fluosilicate and aluminum fluosilicate. Other compositions and parameters are the same as in one of the first to fifth embodiments.
The inorganic curing agent and the curing accelerator are used together, so that the inorganic resin in the composite adhesive can be cured at room temperature. After fluorosilicate is added into silicate system, acid produced by fluorosilicate hydrolysis and alkali produced by silicate hydrolysis are neutralized, along with the continuous progress of reaction, the alkalinity in the system is reduced, the precipitation and condensation of silicate sol are ensured, the reaction is promoted to continuously progress in the forward direction at room temperature, silicate is continuously dehydrated and condensed, silicate sol is changed into high-temperature resistant polymer substance with a body type network-Si-O-Si-structure from low molecular of a linear structure in the condensation process, silicate gel is continuously precipitated and condensed, so that the silicate gel is solidified, and the adhered surface is glued to obtain strength, and the inorganic system can be solidified at room temperature under the action of fluorosilicate solidifying catalyst.
Seventh embodiment: the hybrid organic resin in the embodiment is one or a mixture of more of silicon hybrid epoxy resin, silicon-titanium hybrid epoxy resin, silicon-boron hybrid epoxy resin and silicon-titanium-boron hybrid epoxy resin. Other compositions and parameters are the same as in one of the first to sixth embodiments.
The inorganic element hybridized organic resin can have better compatibility with an inorganic system, so that the manufacturability of the inorganic-organic composite adhesive is good. Under the high temperature condition, the hybridized organic resin carbon residue can be hybridized with an inorganic system for the second time, and better heat resistance is shown.
Eighth embodiment: in the embodiment, the room temperature curing agent is one or a mixture of more than one of polyamide 200#, polyamide 300#, ethylenediamine, hexamethylenediamine, diethylenetriamine, triethylenetetramine, polyethylenepolyamine, m-xylylenediamine, isophoronediamine and phenolic amine. Other compositions and parameters are the same as in one of the first to seventh embodiments.
The room temperature curing agent can cure the hybrid organic resin under room temperature condition, so that the inorganic-organic composite adhesive has better room temperature bonding strength.
Detailed description nine: the preparation method of the room-temperature-curing inorganic-organic composite adhesive with the temperature resistance of 400 ℃ comprises the following steps:
1. weighing 100 parts of inorganic resin base material, 100-110 parts of inorganic toughening agent, 5-20 parts of inorganic curing agent, 3-15 parts of curing accelerator and 2-30 parts of organic component according to parts by mass;
the preparation method of the organic component comprises the following steps: weighing the hybrid organic resin and the room temperature curing agent according to the mol ratio of the hybrid organic resin to the room temperature curing agent reaction active groups of 1:1, mechanically stirring, and uniformly mixing to obtain an organic component;
2. loading an inorganic toughening agent, an inorganic curing agent and a curing accelerator into a ball mill, setting the rotation frequency to be 15.00Hz-20.00Hz, setting the turnover speed to be 8-10 rpm, ball milling and dispersing for 4-6 minutes, and then taking out mixed powder and putting the mixed powder into a mortar;
3. adding an inorganic resin base material into the mixed powder obtained in the second step, and grinding and mixing the mixed powder in a mortar until the mixed powder is uniformly sticky paste for later use;
4. and (3) adding the organic component into the mortar in the third step, and continuously grinding the mixture to form uniform paste, thus obtaining the room-temperature-curing inorganic-organic composite adhesive with the temperature resistance of 400 ℃.
The inorganic resin base material is silicate resin with the modulus of 2.3-2.4; the silicate resin is one or a mixture of more of potassium silicate, sodium silicate, aluminum silicate and sodium potassium silicate.
The inorganic toughening agent is one or a mixture of more of aluminum powder, iron powder, copper powder and aluminum magnesium alloy powder.
The inorganic curing agent is one or a mixture of more of aluminum oxide, silicon dioxide, magnesium oxide, calcium oxide, zinc oxide and ferric oxide.
The curing accelerator is one or a mixture of several of sodium fluosilicate, potassium fluosilicate, magnesium fluosilicate and aluminum fluosilicate.
The hybridized organic resin is one or a mixture of more of silicon hybridized epoxy resin, silicon-titanium hybridized epoxy resin, silicon-boron hybridized epoxy resin and silicon-titanium-boron hybridized epoxy resin.
The room temperature curing agent is one or a mixture of more of polyamide 200#, polyamide 300#, ethylenediamine, hexamethylenediamine, diethylenetriamine, triethylenetetramine, polyethylene polyamine, m-xylylenediamine, isophoronediamine and phenolic amine.
Combines the characteristics of heat resistance of inorganic materials, good curing process performance of organic resins and bonding performance. In the curing process of the composite resin, an organic network crosslinking reaction between epoxy and an amine curing agent and an inorganic network crosslinking reaction of silicate resin can occur, and interpenetrating between the two networks can also occur, and the crosslinking reactions endow the composite resin with good cementing performance. Because the silicate resin base material is alkaline, the epoxy group can be promoted to open loop to generate curing reaction at room temperature under alkaline environment. After fluorosilicate is added into silicate system, acid produced by fluorosilicate hydrolysis and alkali produced by silicate hydrolysis are neutralized, along with the continuous progress of reaction, the alkalinity in the system is reduced, the precipitation and condensation of silicate sol are ensured, the reaction is promoted to continuously progress in the forward direction at room temperature, silicate is continuously dehydrated and condensed, silicate sol is changed into high-temperature resistant polymer substance with a body type network-Si-O-Si-structure from low molecular of a linear structure in the condensation process, silicate gel is continuously precipitated and condensed, so that the silicate gel is solidified, and the adhered surface is glued to obtain strength, and the inorganic system can be solidified at room temperature under the action of fluorosilicate solidifying catalyst.
The following examples of the present invention are described in detail, and are provided by taking the technical scheme of the present invention as a premise, and the detailed embodiments and specific operation procedures are given, but the scope of the present invention is not limited to the following examples.
The following examples and comparative examples were subjected to shear strength testing as follows:
the adhered test piece is a TC4 titanium alloy test piece, the size is length multiplied by width multiplied by thickness multiplied by 60mm multiplied by 20mm multiplied by 3mm, the titanium alloy test piece is wiped by ethyl acetate to remove oil, then 60-mesh diamond abrasive paper is used for polishing the surface of the titanium alloy to be flat, the surface is uniform and consistent, the titanium alloy test piece is wiped by cotton cloth stained with ethyl acetate to be clean, and the cleaned test piece is dried until the ethyl acetate is completely volatilized. Uniformly coating glue solution on the surface of a polished test piece, folding the test piece, placing the bonded test piece in a clamp, pressurizing to (0.08+/-0.01) MPa, and curing for 7-14 days in an environment with the temperature of (23+/-2) ℃ and the relative humidity of not more than 60%. After curing, the test for shear strength at room temperature was conducted according to HB 5164-81. The high temperature shear strength test was performed according to GJB 444-1988 standard. And (3) placing the cured test piece into an aging box, heating the aging box to 400 ℃, preserving heat for a specified time, closing the aging box, naturally cooling the aging box to room temperature, taking out the test piece, and performing high-temperature aging according to HB 5164-81 standard and then performing normal-temperature shear strength test.
Example 1:
the preparation method of the room-temperature-curing inorganic-organic composite adhesive with the temperature resistance of 400 ℃ comprises the following steps:
1. 105 parts of aluminum powder, 15 parts of magnesium oxide and 10 parts of sodium fluosilicate are weighed according to the parts by weight, the aluminum powder, the magnesium oxide and the sodium fluosilicate are put into a ball milling tank of an omnibearing planetary ball mill, grinding balls are put into the ball milling tank, the ball milling tank is arranged and fixed on a planetary position, the rotation frequency of the ball milling tank is set to 20.00Hz, the turnover speed is set to 8 r/min, the ball milling is carried out for 5 minutes, and mixed powder is taken out after the ball milling and put into a mortar.
2. According to the parts by weight, 100 parts of sodium silicate with the modulus of 2.35 is added into the mixed powder in the first step, and the mixture is ground and mixed in a mortar to form a uniform sticky paste for standby.
3. And (3) weighing the silicon hybrid epoxy resin AFG-90 and m-xylylenediamine according to the mol ratio of the hybrid organic resin to the reactive groups of the room temperature curing agent of 1:1, and mechanically stirring and uniformly mixing to obtain an organic component.
4. And adding 25 parts of organic components into a mortar according to the parts by weight, and continuously grinding until the paste is uniform and consistent, thus obtaining the inorganic-organic composite adhesive with room temperature curing and temperature resistance of 400 ℃.
The composite adhesive prepared in the embodiment is used for bonding a titanium alloy test piece, and after the composite adhesive is cured at room temperature for 14 days, the room temperature shear strength is 8.6MPa, the shear strength at 400 ℃ is 7.1MPa, and the room temperature shear strength after aging at 400 ℃ for 5 hours is 5.8MPa.
Example 2:
the preparation method of the room-temperature-curing inorganic-organic composite adhesive with the temperature resistance of 400 ℃ comprises the following steps:
1. 108 parts of aluminum powder, 14 parts of magnesium oxide and 12 parts of sodium fluosilicate are weighed according to the parts by weight, the aluminum powder, the magnesium oxide and the sodium fluosilicate are put into a ball milling tank of an omnibearing planetary ball mill, grinding balls are put into the ball milling tank, the ball milling tank is arranged and fixed on a planetary position, the rotation frequency of the ball milling tank is set to 18.00Hz, the turnover speed is set to 8 r/min, the ball milling is carried out for 5 minutes, and mixed powder is taken out after the ball milling and put into a mortar.
2. According to the mass parts, 100 parts of potassium sodium silicate with the modulus of 2.31 is added into the mixed powder in the first step, and the mixture is ground and mixed in a mortar to form a uniform sticky paste for standby.
3. And (3) weighing the silicon hybrid epoxy resin AFG-90 and polyethylene polyamine according to the mol ratio of the hybrid organic resin to the reactive groups of the room temperature curing agent of 1:1, and mechanically stirring and uniformly mixing to obtain an organic component.
4. Adding 22 parts of organic components into a mortar according to the parts by weight, and continuously grinding until the paste is uniform and consistent, thus obtaining the inorganic-organic composite adhesive with room temperature curing and temperature resistance of 400 ℃.
The composite adhesive prepared in the embodiment is used for bonding a titanium alloy test piece, and after the composite adhesive is cured at room temperature for 7 days, the room temperature shear strength is 8.4MPa, the shear strength at 400 ℃ is 3.2MPa, and the room temperature shear strength after aging at 400 ℃ for 5 hours is 3.7MPa.
Example 3:
the preparation method of the room-temperature-curing inorganic-organic composite adhesive with the temperature resistance of 400 ℃ comprises the following steps:
1. 105 parts of aluminum powder, 15 parts of calcium oxide and 10 parts of potassium fluosilicate are weighed according to the parts by weight, the aluminum powder, the calcium oxide and the potassium fluosilicate are put into a ball milling tank of an omnibearing planetary ball mill, grinding balls are put into the ball milling tank, the ball milling tank is arranged and fixed on a planetary position, the rotation frequency of the ball milling tank is set to 15.00Hz, the turnover speed is set to 8 r/min, the ball milling is carried out for 6 minutes, and mixed powder is taken out after the ball milling and put into a mortar.
2. According to the parts by weight, 100 parts of sodium silicate with the modulus of 2.35 is added into the mixed powder in the first step, and the mixture is ground and mixed in a mortar to form a uniform sticky paste for standby.
3. And (3) weighing the silicon hybrid epoxy resin AFG-90 and the phenolic amine T-31 according to the mol ratio of the hybrid organic resin to the reactive groups of the room temperature curing agent of 1:1, and mechanically stirring and uniformly mixing to obtain an organic component.
4. Adding 27 parts of organic components into a mortar according to the parts by weight, and continuously grinding until the paste is uniform and consistent, thus obtaining the inorganic-organic composite adhesive with room temperature curing and temperature resistance of 400 ℃.
The composite adhesive prepared in the embodiment is used for bonding a titanium alloy test piece, and after the composite adhesive is cured at room temperature for 14 days, the room temperature shear strength is 7.8MPa, the shear strength at 400 ℃ is 4.6MPa, and the room temperature shear strength after aging at 400 ℃ for 5 hours is 2.6MPa.
Example 4:
the preparation method of the room-temperature-curing inorganic-organic composite adhesive with the temperature resistance of 400 ℃ comprises the following steps:
1. weighing 110 parts of aluminum magnesium alloy powder, 20 parts of silicon oxide and 5 parts of sodium fluosilicate according to the parts by weight, loading the aluminum magnesium alloy powder, the silicon oxide and the sodium fluosilicate into a ball milling tank of an omnibearing planetary ball mill, loading grinding balls, installing and fixing the ball milling tank on a planetary position, setting the rotation frequency of the ball milling tank to 20.00Hz, setting the turnover speed to 8 rpm, ball milling and dispersing for 5 minutes, and taking out mixed powder after ball milling and putting the mixed powder into a mortar.
2. According to the mass parts, 100 parts of potassium silicate with the modulus of 2.31 is added into the mixed powder in the first step, and the mixture is ground and mixed in a mortar to form a uniform sticky paste for standby.
3. And (3) according to the mol ratio of the hybrid organic resin to the reactive groups of the room temperature curing agent of 1:1, the silicon-titanium hybrid epoxy resin E-51 and the polyamide No. 300 are mechanically stirred and uniformly mixed to obtain the organic component.
4. Adding 2 parts of organic components into a mortar according to parts by weight, and continuously grinding until the paste is uniform and consistent, thus obtaining the inorganic-organic composite adhesive with room temperature curing and temperature resistance of 400 ℃.
The composite adhesive prepared in the embodiment is used for bonding a titanium alloy test piece, and after the composite adhesive is cured at room temperature for 14 days, the room temperature shear strength is 7.3MPa, the shear strength at 400 ℃ is 6.2MPa, and the room temperature shear strength after aging at 400 ℃ for 5 hours is 5.2MPa.
Comparative example: the comparative example is a method for preparing a room temperature curing adhesive without an organic component, comprising the following steps:
1. weighing 110 parts of aluminum powder, 20 parts of magnesium oxide and 5 parts of sodium fluosilicate according to the parts by weight, loading the aluminum powder, the silicon oxide and the sodium fluosilicate into a ball milling tank of an omnibearing planetary ball mill, loading grinding balls, installing and fixing the ball milling tank on a planetary position, setting the rotation frequency of the ball milling tank to 20.00Hz, setting the turnover speed to 8 r/min, ball milling and dispersing for 6 minutes, and taking out mixed powder after ball milling and putting the mixed powder into a mortar.
2. According to the parts by weight, 100 parts of potassium sodium silicate with the modulus of 2.4 is added into the mixed powder in the first step, and the mixture is ground and mixed in a mortar until the mixture is a uniform and sticky paste, so that the adhesive is prepared.
The adhesive prepared in the example was used to bond titanium alloy test pieces, and after 14 days of room temperature curing, the room temperature shear strength was 2.2MPa, the shear strength at 400℃was 1.6MPa, and after 5 hours of aging at 400℃the room temperature shear strength was 2.9MPa.
As can be seen from the above examples, the unhybridized inorganic adhesive has a lower bond strength.
Claims (4)
1. The room-temperature-curing inorganic-organic composite adhesive with the temperature resistance of 400 ℃ is characterized by comprising, by mass, 100 parts of an inorganic resin base material, 100-110 parts of an inorganic toughening agent, 5-20 parts of an inorganic curing agent, 3-15 parts of a curing accelerator and 2-30 parts of an organic component; the organic component comprises a hybrid organic resin and a room temperature curing agent, wherein the molar ratio of epoxy groups in the hybrid organic resin to amino groups in the room temperature curing agent is 1:1; the inorganic resin base material is silicate resin with the modulus of 2.3-2.4, the silicate resin is one or a mixture of several of potassium silicate, sodium silicate, aluminum silicate and sodium potassium silicate, and the curing accelerator is one or a mixture of several of sodium fluosilicate, potassium fluosilicate, magnesium fluosilicate and aluminum fluosilicate; the hybridized organic resin is one or a mixture of more of silicon hybridized epoxy resin, silicon-titanium hybridized epoxy resin, silicon-boron hybridized epoxy resin and silicon-titanium-boron hybridized epoxy resin;
the inorganic curing agent is one or a mixture of more of aluminum oxide, silicon dioxide, magnesium oxide, calcium oxide, zinc oxide and ferric oxide.
2. The room temperature curing temperature resistant 400 ℃ inorganic-organic composite adhesive according to claim 1, wherein the inorganic toughening agent is one or a mixture of a plurality of aluminum powder, iron powder, copper powder and aluminum magnesium alloy powder.
3. The room temperature curing inorganic-organic composite adhesive with the temperature resistance of 400 ℃ according to claim 1, wherein the room temperature curing agent is one or a mixture of more of polyamide 200, polyamide 300, ethylenediamine, hexamethylenediamine, diethylenetriamine, triethylenetetramine, m-xylylenediamine, isophorone diamine and phenolic amine.
4. The method for preparing the room-temperature-curing inorganic-organic composite adhesive with the temperature resistance of 400 ℃ as claimed in claim 1, which is characterized by comprising the following steps:
1. weighing 100 parts of inorganic resin base material, 100-110 parts of inorganic toughening agent, 5-20 parts of inorganic curing agent, 3-15 parts of curing accelerator and 2-30 parts of organic component according to parts by mass;
the preparation method of the organic component comprises the following steps: weighing the hybrid organic resin and the room temperature curing agent according to the mol ratio of the hybrid organic resin to the room temperature curing agent reaction active groups of 1:1, mechanically stirring, and uniformly mixing to obtain an organic component;
2. loading an inorganic toughening agent, an inorganic curing agent and a curing accelerator into a ball mill, setting the rotation frequency to be 15.00Hz-20.00Hz, setting the turnover speed to be 8-10 rpm, ball milling and dispersing for 4-6 minutes, and then taking out mixed powder and putting the mixed powder into a mortar;
3. adding an inorganic resin base material into the mixed powder obtained in the second step, and grinding and mixing the mixed powder in a mortar until the mixed powder is uniformly sticky paste for later use;
4. and (3) adding the organic component into the mortar in the third step, and continuously grinding the mixture to form uniform paste, thus obtaining the room-temperature-curing inorganic-organic composite adhesive with the temperature resistance of 400 ℃.
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