CN115124956B - Epoxy resin adhesive with normal temperature solidification, high bonding strength and high glass transition temperature - Google Patents
Epoxy resin adhesive with normal temperature solidification, high bonding strength and high glass transition temperature Download PDFInfo
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- CN115124956B CN115124956B CN202210779206.3A CN202210779206A CN115124956B CN 115124956 B CN115124956 B CN 115124956B CN 202210779206 A CN202210779206 A CN 202210779206A CN 115124956 B CN115124956 B CN 115124956B
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- epoxy resin
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- 239000000853 adhesive Substances 0.000 title claims abstract description 34
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 34
- 239000003822 epoxy resin Substances 0.000 title claims abstract description 27
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 27
- 230000009477 glass transition Effects 0.000 title claims abstract description 14
- 238000007711 solidification Methods 0.000 title claims description 3
- 230000008023 solidification Effects 0.000 title claims description 3
- 239000004952 Polyamide Substances 0.000 claims description 14
- 239000006087 Silane Coupling Agent Substances 0.000 claims description 14
- 239000003795 chemical substances by application Substances 0.000 claims description 14
- 229920002647 polyamide Polymers 0.000 claims description 14
- 239000000126 substance Substances 0.000 claims description 13
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 8
- GEQHKFFSPGPGLN-UHFFFAOYSA-N cyclohexane-1,3-diamine Chemical compound NC1CCCC(N)C1 GEQHKFFSPGPGLN-UHFFFAOYSA-N 0.000 claims description 7
- 238000002156 mixing Methods 0.000 claims description 5
- GDCXCDOQEWMQSO-UHFFFAOYSA-N 2,2,2-trifluoroacetyl isocyanate Chemical compound FC(F)(F)C(=O)N=C=O GDCXCDOQEWMQSO-UHFFFAOYSA-N 0.000 claims description 4
- ZZTCPWRAHWXWCH-UHFFFAOYSA-N diphenylmethanediamine Chemical compound C=1C=CC=CC=1C(N)(N)C1=CC=CC=C1 ZZTCPWRAHWXWCH-UHFFFAOYSA-N 0.000 claims description 4
- 229920006332 epoxy adhesive Polymers 0.000 claims 3
- 238000002360 preparation method Methods 0.000 abstract description 12
- 238000000034 method Methods 0.000 abstract description 7
- 230000000694 effects Effects 0.000 abstract description 5
- 238000010008 shearing Methods 0.000 abstract description 4
- 230000006872 improvement Effects 0.000 abstract description 2
- 238000003756 stirring Methods 0.000 description 17
- 238000006243 chemical reaction Methods 0.000 description 8
- 238000001514 detection method Methods 0.000 description 6
- 238000007599 discharging Methods 0.000 description 6
- 238000004090 dissolution Methods 0.000 description 6
- 238000004806 packaging method and process Methods 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 5
- 229910000831 Steel Inorganic materials 0.000 description 4
- 239000004841 bisphenol A epoxy resin Substances 0.000 description 4
- 239000010959 steel Substances 0.000 description 4
- 238000005259 measurement Methods 0.000 description 3
- 238000005086 pumping Methods 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 229910021485 fumed silica Inorganic materials 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 230000009974 thixotropic effect Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000011417 postcuring Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Epoxy Resins (AREA)
Abstract
The invention discloses an epoxy resin adhesive with normal temperature curing, high bonding strength and high glass transition temperature, a preparation method and a use method thereof, and relates to the technical field of epoxy resin adhesives, wherein the adhesive has excellent bonding effect under the high temperature condition, the glass transition temperature reaches 143 ℃ after preheating for 1h at the working temperature (80 ℃) of parts, and the shearing strength reaches 12.3Mpa at 120 ℃; the glass transition temperature of the part reaches 150 ℃ after being preheated for 1h at 110 ℃, the shearing strength reaches 13.5Mpa at 120 ℃, the high temperature resistance of the part is improved along with the improvement of the use temperature and the increase of the use time, and the good performance of the part can be highlighted when the use time is longer at the high temperature, so that the problems of poor use of the high temperature resistance and low high and low temperature cycle times of the existing adhesive are solved.
Description
Technical field:
the invention relates to the technical field of epoxy resin adhesives, in particular to an epoxy resin adhesive with normal temperature curing, high bonding strength and high glass transition temperature, and a preparation method and a use method thereof.
The background technology is as follows:
the double-component epoxy resin adhesive has wide application in the aspect of adhesive, is mainly used for bonding materials such as metal products, ceramics, copper products, glass and the like, and mainly has the functions of bonding, sealing, temperature resistance and the like after being cured. With the updating of products, the high-temperature-resistant and high-bonding strength of the adhesive are required.
There are a number of problems from the current methods of using common adhesives. Firstly, the construction time is short, the post-curing speed is general, and the curing process is poor; secondly, the temperature resistance is poor, the bonding strength is low under the environment of 120 ℃, and meanwhile, the common adhesive can only circulate at high and low temperatures for 2000-5000 times, so that the requirement of the production process is difficult to meet.
The invention comprises the following steps:
the invention aims to solve the technical problems of providing a two-component epoxy resin adhesive and a preparation method thereof, wherein parts which are solidified and bonded at normal temperature by the adhesive are preheated for 1h at a working temperature (more than 80 ℃), the parts can work at a high temperature of 120 ℃, the bonding strength is high, the glass transition temperature is 143 ℃, and the problems of poor temperature resistance, low bonding strength at high temperature and the like of the adhesive in the market can be solved.
The technical problems to be solved by the invention are realized by adopting the following technical scheme:
the invention aims to provide a normal-temperature-cured, high-adhesive-strength and high-glass-transition-temperature double-component epoxy resin adhesive, which is formed by mixing a component A and a component B, wherein the weight ratio of the component A to the component B is 100:40.
The component A comprises the following substances in parts by mass: 97-99 parts of bisphenol A type epoxy resin and 1-3 parts of silane coupling agent.
The component B comprises the following substances in parts by mass: 60-70 parts of polyamide curing agent, 25-30 parts of diaminodiphenyl methane (DDM) and 5-10 parts of 1, 3-cyclohexanediamine.
Preferably, the epoxy resin is bisphenol a epoxy resin 128.
Preferably, the silane coupling agent is KH560 silane coupling agent.
Preferably, the polyamide curing agent is a Dow chemical polyamide 125.
The second purpose of the invention is to provide a preparation method of the double-component epoxy resin adhesive, which comprises the following steps:
(1) Pouring epoxy resin and a silane coupling agent into a reaction kettle, stirring, and vacuumizing to obtain a component A;
(2) And adding a polyamide curing agent and 1, 3-cyclohexanediamine into the reaction kettle, stirring and heating, adding diaminodiphenyl methane, stirring, and vacuumizing to obtain the component B.
The invention further provides a use method of the double-component epoxy resin adhesive, wherein the component A and the component B are mixed according to the proportion and then coated on the parts to be bonded, and the parts are fixed and then are cured at normal temperature.
If thixotropic property is required, the thixotropic effect can be achieved by adding 3-5 parts of fumed silica into the component A and the component B. Accordingly, 3 to 5 parts of fumed silica are added to each of the A and B components in the preparation method of the adhesive.
In the invention, the curing agent adopts the ceramic chemical polyamide curing agent 125 which has high curing speed, high bonding strength and high temperature resistance, the DDM curing agent is added to further enhance the high temperature resistance of the adhesive, and the KH560 silane coupling agent is added to further enhance the bonding effect of the adhesive.
The beneficial effects of the invention are as follows: the invention provides a normal-temperature curing, high-bonding-strength and high-glass-transition-temperature double-component epoxy resin adhesive, a preparation method and a use method thereof, wherein the adhesive has excellent bonding effect under the high-temperature condition, the glass transition temperature reaches 143 ℃ after being preheated for 1h at the working temperature (80 ℃) of parts, and the shearing strength reaches 12.3Mpa at 120 ℃; the glass transition temperature of the part reaches 150 ℃ after being preheated for 1h at 110 ℃, the shearing strength reaches 13.5Mpa at 120 ℃, the high temperature resistance of the part is improved along with the improvement of the use temperature and the increase of the use time, and the good performance of the part can be highlighted when the use time is longer at the high temperature, so that the problems of poor use of the high temperature resistance and low high and low temperature cycle times of the existing adhesive are solved.
The specific embodiment is as follows:
the invention is further described in connection with the following embodiments in order to make the technical means, the creation features, the achievement of the purpose and the effect of the invention easy to understand.
The "parts" in the following examples are weight ratio units, and represent arbitrary unit weights, such as each part=100 g, 1kg, 100kg, or the like.
Example 1
And (3) preparation of the component A: 98.5 parts of bisphenol A epoxy resin 128 and 1.5 parts of KH560 silane coupling agent are added into a reaction kettle, stirring is started, the temperature is raised to 60 ℃, stirring is carried out for 20min, vacuumizing is carried out for 20min, and packaging and discharging are carried out.
And (3) preparation of a component B: 65 parts of a Dow chemical polyamide curing agent (model 125) and 8 parts of 1,3 cyclohexanediamine are added into a reaction kettle, stirring is started, heating is carried out to 60 ℃, 27 parts of DDM is added for dissolution, stirring is carried out for 20min after dissolution is finished, vacuum pumping is carried out for 20min at 60 ℃, and packaging and discharging are carried out.
The component A and the component B are fully and uniformly stirred according to the weight ratio of 100:40 and then are coated on the parts to be bonded, the parts are fixed and then are cured for 24 hours at normal temperature, the parts can be normally used for subsequent operation, and 7 days are required for complete curing. Preheating for 1h at the working temperature (80 ℃) of the parts, and then starting up.
The adhesive prepared in example 1 had the following properties:
| test item | Actual measurement value | Detection unit | Detection conditions |
| Glass transition temperature 1 | 143 | ℃ | After 24 hours at normal temperature, curing for 1 hour at 80 DEG C |
| Shear strength 2 /120℃ | 12.3 | MPa | After 24 hours at normal temperature, curing for 1 hour at 80 DEG C |
| Tensile Strength 3 /25℃ | 56.5 | MPa | After 24 hours at normal temperature, curing for 1 hour at 80 DEG C |
| Compressive Strength 4 /25℃ | 82.0 | MPa | After 24 hours at normal temperature, curing for 1 hour at 80 DEG C |
1 represents a DSC test using an instrument;
2 represents the shear strength of the steel sheet to the steel sheet, according to GBT 7124-2008 test;
3 represents the tensile strength of steel sheet to steel sheet, tested according to GBT 7124-2008;
4 represents the compression strength of the adhesive cured product itself.
Example 2
And (3) preparation of the component A: 97 parts of bisphenol A type epoxy resin 128 and 3 parts of KH560 silane coupling agent are added into a reaction kettle, stirring and heating are started to 60 ℃, stirring is carried out for 20min, vacuumizing is carried out for 20min, and packaging and discharging are carried out.
And (3) preparation of a component B: 65 parts of a Dow chemical polyamide curing agent (model 125) and 5 parts of 1,3 cyclohexanediamine are added into a reaction kettle, stirring is started, heating is carried out to 60 ℃, 30 parts of DDM is added for dissolution, stirring is carried out for 20min after dissolution is finished, vacuum pumping is carried out for 20min at 60 ℃, and packaging and discharging are carried out.
The component A and the component B are fully and uniformly stirred according to the weight ratio of 100:40 and then are coated on the parts to be bonded, the parts are fixed and then are cured for 24 hours at normal temperature, the parts can be normally used for subsequent operation, and 7 days are required for complete curing. The performance of the device is shown in the table below, and the device is started after the device is preheated for 1h at the working temperature (the working temperature is 80 ℃ and the preheating temperature is 110 ℃) exceeding the working temperature of the parts, so that the high-temperature resistance of the device is improved along with the increase of the service temperature and the increase of the service time, and the high-temperature resistance of the device can be highlighted when the service time is longer at high temperature.
The adhesive prepared in example 2 had the following properties:
| test item | Actual measurement value | Detection unit | Detection conditions |
| Glass transition temperature | 150 | ℃ | After 24 hours at normal temperature, curing for 1 hour at 110 DEG C |
| Shear Strength/120 DEG C | 13.5 | MPa | After 24 hours at normal temperature, curing for 1 hour at 110 DEG C |
| Tensile Strength/25 DEG C | 58.5 | MPa | After 24 hours at normal temperature, curing for 1 hour at 110 DEG C |
| Compressive Strength/25 DEG C | 85.0 | MPa | After 24 hours at normal temperature, curing for 1 hour at 110 DEG C |
The invention aims at providing a three-component epoxy resin adhesive with normal temperature curing, high bonding strength and high glass transition temperature, which is formed by mixing a component A, a component B and a component C, wherein the weight ratio of the component A to the component B to the component C is 100:40:5.
The component A comprises the following substances in parts by mass: 97-99 parts of bisphenol A type epoxy resin and 1-3 parts of silane coupling agent.
The component B comprises the following substances in parts by mass: 60-70 parts of polyamide curing agent, 25-30 parts of diaminodiphenyl methane and 5-10 parts of 1, 3-cyclohexanediamine.
The component C is trifluoroacetyl isocyanate.
Preferably, the epoxy resin is bisphenol a epoxy resin 128.
Preferably, the silane coupling agent is KH560 silane coupling agent.
Preferably, the polyamide curing agent is a Dow chemical polyamide 125.
The invention aims to provide a method for using the three-component epoxy resin adhesive, which comprises the steps of firstly mixing the component A and the component B according to the proportion, then adding the component C, mixing, coating the mixture on a part to be bonded, fixing the part, and then curing at normal temperature.
In the invention, epoxy resin reacts with amine curing agent to generate hydroxyl, trifluoroacetyl isocyanate is added to react with hydroxyl, F is introduced on epoxy resin molecular chain 3 The C-CO-NH-CO-O-group further improves the bonding effect of the adhesive under the high temperature condition.
Example 3
And (3) preparation of the component A: 98.5 parts of bisphenol A epoxy resin 128 and 1.5 parts of KH560 silane coupling agent are added into a reaction kettle, stirring is started, the temperature is raised to 60 ℃, stirring is carried out for 20min, vacuumizing is carried out for 20min, and packaging and discharging are carried out.
And (3) preparation of a component B: 65 parts of a Dow chemical polyamide curing agent (model 125) and 8 parts of 1,3 cyclohexanediamine are added into a reaction kettle, stirring is started, heating is carried out to 60 ℃, 27 parts of DDM is added for dissolution, stirring is carried out for 20min after dissolution is finished, vacuum pumping is carried out for 20min at 60 ℃, and packaging and discharging are carried out.
Stirring the component A and the component B for 30min according to the weight ratio of 100:40, adding trifluoroacetyl isocyanate as the component C, wherein the weight ratio of the component A to the component C is 100:5, fully and uniformly stirring, then coating the mixture on a part to be bonded, fixing the part, and then curing the part at normal temperature for 24 hours, wherein the part can be normally used for subsequent operation after 24 hours, and 7 days are required for complete curing. Preheating for 1h at the working temperature (80 ℃) of the parts, and then starting up.
The adhesive prepared in example 3 had the following properties:
| test item | Actual measurement value | Detection unit | Detection conditions |
| Glass transition temperature | 154 | ℃ | After 24 hours at normal temperature, curing for 1 hour at 80 DEG C |
| Shear Strength/120 DEG C | 13.2 | MPa | After 24 hours at normal temperature, curing for 1 hour at 80 DEG C |
| Tensile Strength/25 DEG C | 58.0 | MPa | After 24 hours at normal temperature, curing for 1 hour at 80 DEG C |
| Compressive Strength/25 DEG C | 83.7 | MPa | After 24 hours at normal temperature, curing for 1 hour at 80 DEG C |
The foregoing has shown and described the basic principles and main features of the present invention and the advantages of the present invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, and that the above embodiments and descriptions are merely illustrative of the principles of the present invention, and various changes and modifications may be made without departing from the spirit and scope of the invention, which is defined in the appended claims. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (4)
1. A three-component epoxy resin adhesive with normal temperature solidification, high bonding strength and high glass transition temperature is characterized in that: the three-component epoxy resin adhesive is formed by mixing a component A, a component B and a component C, wherein the weight ratio of the component A to the component B to the component C is 100:40:5;
the component A comprises the following substances in parts by mass: 97-99 parts of bisphenol A type epoxy resin and 1-3 parts of silane coupling agent;
the component B comprises the following substances in parts by mass: 60-70 parts of polyamide curing agent, 25-30 parts of diaminodiphenyl methane and 5-10 parts of 1, 3-cyclohexanediamine;
the component C is trifluoroacetyl isocyanate.
2. The three-component epoxy adhesive of claim 1, wherein: the bisphenol a type epoxy resin is bisphenol a type epoxy resin 128.
3. The three-component epoxy adhesive of claim 1, wherein: the silane coupling agent is KH560 silane coupling agent.
4. The three-component epoxy adhesive of claim 1, wherein: the polyamide curing agent is a Dow chemical polyamide 125.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210779206.3A CN115124956B (en) | 2022-07-04 | 2022-07-04 | Epoxy resin adhesive with normal temperature solidification, high bonding strength and high glass transition temperature |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210779206.3A CN115124956B (en) | 2022-07-04 | 2022-07-04 | Epoxy resin adhesive with normal temperature solidification, high bonding strength and high glass transition temperature |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN115124956A CN115124956A (en) | 2022-09-30 |
| CN115124956B true CN115124956B (en) | 2023-12-05 |
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| CN202210779206.3A Active CN115124956B (en) | 2022-07-04 | 2022-07-04 | Epoxy resin adhesive with normal temperature solidification, high bonding strength and high glass transition temperature |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102850978A (en) * | 2011-06-28 | 2013-01-02 | 上海市合成树脂研究所 | Room temperature cured high-temperature resistant epoxy adhesive |
| CN109705785A (en) * | 2018-12-03 | 2019-05-03 | 上海康达化工新材料股份有限公司 | A kind of room curing and high temperature resistant type epoxy glue and preparation method thereof |
| CN110963944A (en) * | 2019-11-30 | 2020-04-07 | 华南理工大学 | Novel low-free TDI polyurethane curing agent containing fluorocarbon chains and preparation method thereof |
| CN111204094A (en) * | 2020-01-09 | 2020-05-29 | 苏州市新广益电子有限公司 | TPEE acoustic film and production method thereof |
-
2022
- 2022-07-04 CN CN202210779206.3A patent/CN115124956B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102850978A (en) * | 2011-06-28 | 2013-01-02 | 上海市合成树脂研究所 | Room temperature cured high-temperature resistant epoxy adhesive |
| CN109705785A (en) * | 2018-12-03 | 2019-05-03 | 上海康达化工新材料股份有限公司 | A kind of room curing and high temperature resistant type epoxy glue and preparation method thereof |
| CN110963944A (en) * | 2019-11-30 | 2020-04-07 | 华南理工大学 | Novel low-free TDI polyurethane curing agent containing fluorocarbon chains and preparation method thereof |
| CN111204094A (en) * | 2020-01-09 | 2020-05-29 | 苏州市新广益电子有限公司 | TPEE acoustic film and production method thereof |
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| CN115124956A (en) | 2022-09-30 |
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