CN115124956A - Epoxy resin adhesive with normal temperature curing, high bonding strength and high glass transition temperature - Google Patents
Epoxy resin adhesive with normal temperature curing, high bonding strength and high glass transition temperature Download PDFInfo
- Publication number
- CN115124956A CN115124956A CN202210779206.3A CN202210779206A CN115124956A CN 115124956 A CN115124956 A CN 115124956A CN 202210779206 A CN202210779206 A CN 202210779206A CN 115124956 A CN115124956 A CN 115124956A
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- component
- epoxy resin
- parts
- temperature
- adhesive
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- 239000000853 adhesive Substances 0.000 title claims abstract description 39
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 39
- 239000003822 epoxy resin Substances 0.000 title claims abstract description 33
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 33
- 230000009477 glass transition Effects 0.000 title claims abstract description 16
- 238000002360 preparation method Methods 0.000 claims abstract description 13
- 238000000034 method Methods 0.000 claims abstract description 9
- 238000003756 stirring Methods 0.000 claims description 20
- 239000004952 Polyamide Substances 0.000 claims description 15
- 239000006087 Silane Coupling Agent Substances 0.000 claims description 15
- 239000003795 chemical substances by application Substances 0.000 claims description 15
- 229920002647 polyamide Polymers 0.000 claims description 15
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 14
- 239000000126 substance Substances 0.000 claims description 13
- 238000006243 chemical reaction Methods 0.000 claims description 10
- SVYKKECYCPFKGB-UHFFFAOYSA-N N,N-dimethylcyclohexylamine Chemical compound CN(C)C1CCCCC1 SVYKKECYCPFKGB-UHFFFAOYSA-N 0.000 claims description 8
- 238000010438 heat treatment Methods 0.000 claims description 7
- ZZTCPWRAHWXWCH-UHFFFAOYSA-N diphenylmethanediamine Chemical compound C=1C=CC=CC=1C(N)(N)C1=CC=CC=C1 ZZTCPWRAHWXWCH-UHFFFAOYSA-N 0.000 claims description 5
- 238000002156 mixing Methods 0.000 claims description 5
- 239000000203 mixture Substances 0.000 claims description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 229910021485 fumed silica Inorganic materials 0.000 claims description 3
- 229920006332 epoxy adhesive Polymers 0.000 claims 5
- 230000000694 effects Effects 0.000 abstract description 5
- 230000006872 improvement Effects 0.000 abstract description 2
- 238000001514 detection method Methods 0.000 description 6
- 238000007599 discharging Methods 0.000 description 6
- 238000004806 packaging method and process Methods 0.000 description 6
- 229910000831 Steel Inorganic materials 0.000 description 4
- 239000010959 steel Substances 0.000 description 4
- GDCXCDOQEWMQSO-UHFFFAOYSA-N 2,2,2-trifluoroacetyl isocyanate Chemical compound FC(F)(F)C(=O)N=C=O GDCXCDOQEWMQSO-UHFFFAOYSA-N 0.000 description 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000011417 postcuring Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 230000009974 thixotropic effect Effects 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Epoxy Resins (AREA)
Abstract
The invention discloses an epoxy resin adhesive with normal temperature curing, high bonding strength and high glass transition temperature, a preparation method and a use method thereof, relating to the technical field of epoxy resin adhesives, wherein the adhesive has excellent bonding effect under the high-temperature condition, the glass transition temperature of the part reaches 143 ℃ after the part is preheated for 1h at the working temperature (80 ℃), and the shear strength reaches 12.3Mpa at 120 ℃; the glass transition temperature of the part is up to 150 ℃ after the part is preheated for 1h at 110 ℃, the shear strength is up to 13.5Mpa at 120 ℃, the high temperature resistance of the part is improved along with the improvement of the use temperature and the increase of the use time, and the better performance of the part can be highlighted as the time is longer at high temperature, so that the problems of poor use of the existing adhesive and low high-low temperature cycle frequency are solved.
Description
The technical field is as follows:
the invention relates to the technical field of epoxy resin adhesives, in particular to an epoxy resin adhesive which is cured at normal temperature, has high bonding strength and high glass transition temperature, and a preparation method and a use method thereof.
Background art:
the two-component epoxy resin adhesive has wide application in the aspect of adhesives, is mainly used for bonding materials such as metal products, ceramics, copper parts, glass and the like, and mainly plays roles of bonding, sealing, temperature resistance and the like after being cured. With the updating of products, higher requirements are made on the temperature resistance and the bonding strength of the adhesive.
There are many problems in view of the methods of using the current common adhesives. Firstly, the construction time is short, the post-curing speed is general, and the curing process is poor; secondly, the temperature resistance is poor, the bonding strength is low under the environment of 120 ℃, and meanwhile, the common adhesive can be circulated for only 5000 times at high and low temperatures, so that the requirement of the production process is difficult to meet.
The invention content is as follows:
the invention aims to solve the technical problem of providing a two-component epoxy resin adhesive and a preparation method thereof, wherein parts cured and bonded by the adhesive at normal temperature are preheated for 1h at the working temperature (above 80 ℃), the parts can work at the high temperature of 120 ℃, the bonding strength is high, the glass transition temperature is 143 ℃, and the problems of poor temperature resistance, low bonding strength at high temperature and the like of the adhesive in the market can be solved.
The technical problem to be solved by the invention is realized by adopting the following technical scheme:
the invention aims to provide a two-component epoxy resin adhesive which is cured at normal temperature, has high bonding strength and high glass transition temperature, and is formed by mixing a component A and a component B, wherein the weight ratio of the component A to the component B is 100: 40.
The component A comprises the following substances in parts by mass: 97-99 parts of bisphenol A type epoxy resin and 1-3 parts of silane coupling agent.
The component B comprises the following substances in parts by mass: 60-70 parts of polyamide curing agent, 25-30 parts of diaminodiphenylmethane (DDM) and 5-10 parts of 1, 3-cyclohexyldimethylamine.
Preferably, the epoxy resin is bisphenol a type epoxy resin 128.
Preferably, the silane coupling agent is KH560 silane coupling agent.
Preferably, the polyamide curing agent is a dow chemical polyamide 125.
The second purpose of the invention is to provide a preparation method of the double-component epoxy resin adhesive, which comprises the following steps:
(1) pouring epoxy resin and a silane coupling agent into a reaction kettle, stirring and vacuumizing to prepare a component A;
(2) adding a polyamide curing agent and 1, 3-cyclohexyldimethylamine into a reaction kettle, stirring and heating, adding diaminodiphenylmethane, stirring, and vacuumizing to obtain the component B.
The invention also aims to provide a using method of the two-component epoxy resin adhesive, which comprises the steps of mixing the component A and the component B according to a ratio, coating the mixture on a part to be bonded, fixing the part, and curing at normal temperature.
If the adhesive is required to have thixotropy, 3-5 parts of fumed silica is added into the component A and the component B respectively to achieve good thixotropic effect. Correspondingly, 3-5 parts of fumed silica are added to the A component and the B component respectively in the preparation method of the adhesive.
In the invention, the curing agent adopts the Dow chemical polyamide curing agent 125 which has high curing speed, high bonding strength and high temperature resistance, the DDM curing agent is added to mainly further enhance the high temperature resistance of the adhesive, and the KH560 silane coupling agent is added to mainly further enhance the bonding effect of the adhesive.
The invention has the beneficial effects that: the invention provides a two-component epoxy resin adhesive which is cured at normal temperature, has high bonding strength and high glass transition temperature, and a preparation method and a use method thereof, the adhesive has excellent bonding effect under the high-temperature condition, the glass transition temperature of the adhesive reaches 143 ℃ after the adhesive is preheated for 1h at the working temperature (80 ℃) of parts, and the shear strength of the adhesive reaches 12.3Mpa at 120 ℃; the glass transition temperature of the part is up to 150 ℃ after the part is preheated for 1h at 110 ℃, the shear strength is up to 13.5Mpa at 120 ℃, the high temperature resistance of the part is improved along with the improvement of the use temperature and the increase of the use time, and the better performance of the part can be highlighted as the time is longer at high temperature, so that the problems of poor use of the existing adhesive and low high-low temperature cycle frequency are solved.
The specific implementation mode is as follows:
in order to make the technical means, the creation characteristics, the achievement purposes and the effects of the invention easy to understand, the invention is further described with the specific embodiments.
In the following examples, "part" means a unit of weight ratio, and means an arbitrary unit weight, for example, 100g, 1kg, or 100 kg.
Example 1
Preparation of component A: adding 98.5 parts of bisphenol A type epoxy resin 128 and 1.5 parts of KH560 silane coupling agent into a reaction kettle, stirring, heating to 60 ℃, stirring for 20min, vacuumizing for 20min, packaging and discharging.
Preparation of the component B: adding 65 parts of Dow chemical polyamide curing agent (model 125) and 8 parts of 1, 3-cyclohexyldimethylamine into a reaction kettle, stirring and heating to 60 ℃, adding 27 parts of DDM for dissolving, stirring for 20min after the DDM is dissolved, vacuumizing for 20min at 60 ℃, packaging and discharging.
The component A and the component B are fully and uniformly stirred according to the weight ratio of 100:40, then the mixture is coated on a part to be bonded, the part is fixed and then is cured at normal temperature for 24 hours, the part can be normally used for subsequent operation after 24 hours, and 7 days are needed for complete curing. Preheating for 1h at the working temperature (80 ℃) of the parts and then carrying out starting operation.
The adhesive prepared in example 1 had the following properties:
| test items | Measured value | Detection unit | Detection conditions |
| Glass transition temperature 1 | 143 | ℃ | Curing at 80 ℃ for 1h after 24h at normal temperature |
| Shear strength 2 /120℃ | 12.3 | MPa | Curing at 80 ℃ for 1h after 24h at normal temperature |
| Tensile strength 3 /25℃ | 56.5 | MPa | After 24 hours at normal temperature, curing at 80 ℃ for 1 hour |
| Compressive strength 4 /25℃ | 82.0 | MPa | Curing at 80 ℃ for 1h after 24h at normal temperature |
1 is measured by using an instrument DSC;
2, the shearing strength of the steel sheet to the steel sheet is tested according to GBT 7124-;
3, the tensile strength of the steel sheet to the steel sheet is tested according to GBT 7124-;
4 represents the compressive strength of the cured adhesive.
Example 2
Preparation of the component A: 97 parts of bisphenol A type epoxy resin 128 and 3 parts of KH560 silane coupling agent are added into a reaction kettle, stirring is started, the temperature is raised to 60 ℃, stirring is carried out for 20min, then vacuum pumping is carried out for 20min, and packaging and discharging are carried out.
Preparation of the component B: adding 65 parts of Dow chemical polyamide curing agent (model 125) and 5 parts of 1, 3-cyclohexyldimethylamine into a reaction kettle, stirring and heating to 60 ℃, adding 30 parts of DDM for dissolving, stirring for 20min after the DDM is dissolved, vacuumizing for 20min at 60 ℃, packaging and discharging.
The component A and the component B are fully and uniformly stirred according to the weight ratio of 100:40, then the mixture is coated on a part to be bonded, the part is fixed and then is cured at normal temperature for 24 hours, the part can be normally used for subsequent operation after 24 hours, and 7 days are needed for complete curing. After the parts are preheated for 1 hour at the working temperature (the working temperature is 80 ℃ and the preheating temperature is 110 ℃) of the parts, the starting operation is carried out, and the performances are as shown in the table below, so the high-temperature resistance of the parts is improved along with the increase of the use temperature and the use time, and the longer the time is, the higher the high-temperature resistance of the parts is.
The adhesive prepared in example 2 had the following properties:
| test item | Measured value | Detection unit | Detection conditions |
| Glass transition temperature | 150 | ℃ | After 24 hours at normal temperature, curing for 1 hour at 110 DEG C |
| Shear strength/120 deg.C | 13.5 | MPa | Curing at 110 ℃ for 1h after 24h at normal temperature |
| Tensile strength/25 deg.C | 58.5 | MPa | Curing at 110 ℃ for 1h after 24h at normal temperature |
| Compressive strength/25℃ | 85.0 | MPa | After 24 hours at normal temperature, curing for 1 hour at 110 DEG C |
The invention also provides a three-component epoxy resin adhesive which is cured at normal temperature, has high bonding strength and high glass transition temperature, and is formed by mixing the component A, the component B and the component C in a weight ratio of 100:40: 5.
The component A comprises the following substances in parts by mass: 97-99 parts of bisphenol A type epoxy resin and 1-3 parts of silane coupling agent.
The component B comprises the following substances in parts by mass: 60-70 parts of polyamide curing agent, 25-30 parts of diaminodiphenylmethane and 5-10 parts of 1, 3-cyclohexyl dimethylamine.
And the component C is trifluoroacetyl isocyanate.
Preferably, the epoxy resin is bisphenol a type epoxy resin 128.
Preferably, the silane coupling agent is KH560 silane coupling agent.
Preferably, the polyamide curing agent is a dow chemical polyamide 125.
The fifth purpose of the invention is to provide a using method of the three-component epoxy resin adhesive, the component A and the component B are mixed according to the proportion, the component C is added and mixed, the mixture is coated on the part to be bonded, the part is fixed and then the part is cured at normal temperature.
In the invention, epoxy resin reacts with amine curing agent to generate hydroxyl, trifluoroacetyl isocyanate is added to react with the hydroxyl, and F is introduced to the molecular chain of the epoxy resin 3 C-CO-NH-CO-O-group, further improving the bonding effect of the adhesive under the high temperature condition.
Example 3
Preparation of component A: adding 98.5 parts of bisphenol A type epoxy resin 128 and 1.5 parts of KH560 silane coupling agent into a reaction kettle, stirring, heating to 60 ℃, stirring for 20min, vacuumizing for 20min, packaging and discharging.
Preparation of the component B: adding 65 parts of Dow chemical polyamide curing agent (model 125) and 8 parts of 1, 3-cyclohexyldimethylamine into a reaction kettle, stirring and heating to 60 ℃, adding 27 parts of DDM for dissolving, stirring for 20min after the DDM is dissolved, vacuumizing for 20min at 60 ℃, packaging and discharging.
Stirring the component A and the component B for 30min according to the weight ratio of 100:40, adding trifluoroacetyl isocyanate as a component C, wherein the weight ratio of the component A to the component C is 100:5, fully and uniformly stirring, coating the components to be bonded, fixing the components, curing at normal temperature for 24h, normally using the components for subsequent operation after 24h, and requiring 7 days for complete curing. Preheating for 1h at the working temperature (80 ℃) of the parts and then carrying out starting operation.
The adhesive prepared in example 3 had the following properties:
| test items | Measured value | Detection unit | Detection conditions |
| Glass transition temperature | 154 | ℃ | Curing at 80 ℃ for 1h after 24h at normal temperature |
| Shear strength/120 deg.C | 13.2 | MPa | After 24 hours at normal temperature, curing at 80 ℃ for 1 hour |
| Tensile strength/25 deg.C | 58.0 | MPa | Curing at 80 ℃ for 1h after 24h at normal temperature |
| Compressive Strength/25 deg.C | 83.7 | MPa | After 24 hours at normal temperature, curing at 80 ℃ for 1 hour |
The foregoing shows and describes the general principles and broad features of the present invention and advantages thereof. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the invention as claimed. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (7)
1. The two-component epoxy resin adhesive is cured at normal temperature, has high bonding strength and high glass transition temperature, is formed by mixing a component A and a component B, and is characterized in that:
the component A comprises the following substances in parts by mass: 97-99 parts of bisphenol A type epoxy resin and 1-3 parts of silane coupling agent;
the component B comprises the following substances in parts by mass: 60-70 parts of polyamide curing agent, 25-30 parts of diaminodiphenylmethane and 5-10 parts of 1, 3-cyclohexyldimethylamine;
the weight ratio of the component A to the component B is 100: 40.
2. The two-part epoxy adhesive of claim 1, wherein: the epoxy resin is bisphenol A type epoxy resin 128.
3. The two-part epoxy adhesive of claim 1, wherein: the silane coupling agent is KH560 silane coupling agent.
4. The two-part epoxy adhesive of claim 1, wherein: the polyamide curing agent is Dow chemical polyamide 125.
5. The method of preparing the two-part epoxy adhesive of claim 1, comprising the steps of:
(1) pouring epoxy resin and a silane coupling agent into a reaction kettle, stirring and vacuumizing to prepare a component A;
(2) adding a polyamide curing agent and 1, 3-cyclohexyldimethylamine into a reaction kettle, stirring and heating, adding diaminodiphenylmethane, stirring, and vacuumizing to obtain the component B.
6. The use method of the two-component epoxy resin adhesive according to claim 1 or the two-component epoxy resin adhesive obtained by the preparation method according to claim 5 is characterized in that: and mixing the component A and the component B according to the proportion, coating the mixture on a part to be bonded, fixing the part, and curing at normal temperature.
7. The two-part epoxy adhesive of claim 1, wherein: the component A and the component B also comprise 3-5 parts of fumed silica.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210779206.3A CN115124956B (en) | 2022-07-04 | 2022-07-04 | Epoxy resin adhesive with normal temperature solidification, high bonding strength and high glass transition temperature |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210779206.3A CN115124956B (en) | 2022-07-04 | 2022-07-04 | Epoxy resin adhesive with normal temperature solidification, high bonding strength and high glass transition temperature |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN115124956A true CN115124956A (en) | 2022-09-30 |
| CN115124956B CN115124956B (en) | 2023-12-05 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202210779206.3A Active CN115124956B (en) | 2022-07-04 | 2022-07-04 | Epoxy resin adhesive with normal temperature solidification, high bonding strength and high glass transition temperature |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102850978A (en) * | 2011-06-28 | 2013-01-02 | 上海市合成树脂研究所 | Room temperature cured high-temperature resistant epoxy adhesive |
| CN109705785A (en) * | 2018-12-03 | 2019-05-03 | 上海康达化工新材料股份有限公司 | A kind of room curing and high temperature resistant type epoxy glue and preparation method thereof |
| CN110963944A (en) * | 2019-11-30 | 2020-04-07 | 华南理工大学 | Novel low-free TDI polyurethane curing agent containing fluorocarbon chains and preparation method thereof |
| CN111204094A (en) * | 2020-01-09 | 2020-05-29 | 苏州市新广益电子有限公司 | TPEE acoustic film and production method thereof |
-
2022
- 2022-07-04 CN CN202210779206.3A patent/CN115124956B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102850978A (en) * | 2011-06-28 | 2013-01-02 | 上海市合成树脂研究所 | Room temperature cured high-temperature resistant epoxy adhesive |
| CN109705785A (en) * | 2018-12-03 | 2019-05-03 | 上海康达化工新材料股份有限公司 | A kind of room curing and high temperature resistant type epoxy glue and preparation method thereof |
| CN110963944A (en) * | 2019-11-30 | 2020-04-07 | 华南理工大学 | Novel low-free TDI polyurethane curing agent containing fluorocarbon chains and preparation method thereof |
| CN111204094A (en) * | 2020-01-09 | 2020-05-29 | 苏州市新广益电子有限公司 | TPEE acoustic film and production method thereof |
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| CN115124956B (en) | 2023-12-05 |
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