CN112280249B - Low-viscosity in-water quick-setting elastic epoxy plugging grouting material and application thereof - Google Patents
Low-viscosity in-water quick-setting elastic epoxy plugging grouting material and application thereof Download PDFInfo
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- CN112280249B CN112280249B CN202011247626.4A CN202011247626A CN112280249B CN 112280249 B CN112280249 B CN 112280249B CN 202011247626 A CN202011247626 A CN 202011247626A CN 112280249 B CN112280249 B CN 112280249B
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- 239000004593 Epoxy Substances 0.000 title claims abstract description 50
- 239000000463 material Substances 0.000 title claims abstract description 28
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 title claims abstract description 19
- KDYFGRWQOYBRFD-UHFFFAOYSA-N succinic acid Chemical compound OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 claims abstract description 73
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 claims abstract description 36
- 239000001384 succinic acid Substances 0.000 claims abstract description 35
- 239000003822 epoxy resin Substances 0.000 claims abstract description 34
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 34
- -1 AGE Substances 0.000 claims abstract description 33
- 239000000126 substance Substances 0.000 claims abstract description 27
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 claims abstract description 24
- MECNWXGGNCJFQJ-UHFFFAOYSA-N 3-piperidin-1-ylpropane-1,2-diol Chemical compound OCC(O)CN1CCCCC1 MECNWXGGNCJFQJ-UHFFFAOYSA-N 0.000 claims abstract description 13
- 239000006087 Silane Coupling Agent Substances 0.000 claims abstract description 13
- 239000013530 defoamer Substances 0.000 claims abstract description 12
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims abstract description 11
- 150000001412 amines Chemical class 0.000 claims abstract description 9
- 238000002156 mixing Methods 0.000 claims abstract description 6
- WBHQBSYUUJJSRZ-UHFFFAOYSA-M sodium bisulfate Chemical compound [Na+].OS([O-])(=O)=O WBHQBSYUUJJSRZ-UHFFFAOYSA-M 0.000 claims abstract description 6
- 229910000342 sodium bisulfate Inorganic materials 0.000 claims abstract description 6
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 claims abstract description 3
- 238000006243 chemical reaction Methods 0.000 claims description 29
- 239000002002 slurry Substances 0.000 claims description 27
- WVDDGKGOMKODPV-UHFFFAOYSA-N Benzyl alcohol Chemical group OCC1=CC=CC=C1 WVDDGKGOMKODPV-UHFFFAOYSA-N 0.000 claims description 24
- HFJRKMMYBMWEAD-UHFFFAOYSA-N dodecanal Chemical compound CCCCCCCCCCCC=O HFJRKMMYBMWEAD-UHFFFAOYSA-N 0.000 claims description 20
- 239000002994 raw material Substances 0.000 claims description 20
- 239000003795 chemical substances by application Substances 0.000 claims description 17
- 238000003756 stirring Methods 0.000 claims description 15
- 230000000694 effects Effects 0.000 claims description 13
- UHOVQNZJYSORNB-UHFFFAOYSA-N benzene Substances C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 claims description 10
- FAGUFWYHJQFNRV-UHFFFAOYSA-N tetraethylenepentamine Chemical compound NCCNCCNCCNCCN FAGUFWYHJQFNRV-UHFFFAOYSA-N 0.000 claims description 10
- 150000001299 aldehydes Chemical class 0.000 claims description 8
- 235000019445 benzyl alcohol Nutrition 0.000 claims description 8
- 238000002360 preparation method Methods 0.000 claims description 7
- 238000001816 cooling Methods 0.000 claims description 6
- AHDSRXYHVZECER-UHFFFAOYSA-N 2,4,6-tris[(dimethylamino)methyl]phenol Chemical compound CN(C)CC1=CC(CN(C)C)=C(O)C(CN(C)C)=C1 AHDSRXYHVZECER-UHFFFAOYSA-N 0.000 claims description 5
- 238000007599 discharging Methods 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 3
- 230000035484 reaction time Effects 0.000 claims description 3
- JOLVYUIAMRUBRK-UHFFFAOYSA-N 11',12',14',15'-Tetradehydro(Z,Z-)-3-(8-Pentadecenyl)phenol Natural products OC1=CC=CC(CCCCCCCC=CCC=CCC=C)=C1 JOLVYUIAMRUBRK-UHFFFAOYSA-N 0.000 claims description 2
- VILCJCGEZXAXTO-UHFFFAOYSA-N 2,2,2-tetramine Chemical compound NCCNCCNCCN VILCJCGEZXAXTO-UHFFFAOYSA-N 0.000 claims description 2
- YLKVIMNNMLKUGJ-UHFFFAOYSA-N 3-Delta8-pentadecenylphenol Natural products CCCCCCC=CCCCCCCCC1=CC=CC(O)=C1 YLKVIMNNMLKUGJ-UHFFFAOYSA-N 0.000 claims description 2
- JOLVYUIAMRUBRK-UTOQUPLUSA-N Cardanol Chemical compound OC1=CC=CC(CCCCCCC\C=C/C\C=C/CC=C)=C1 JOLVYUIAMRUBRK-UTOQUPLUSA-N 0.000 claims description 2
- FAYVLNWNMNHXGA-UHFFFAOYSA-N Cardanoldiene Natural products CCCC=CCC=CCCCCCCCC1=CC=CC(O)=C1 FAYVLNWNMNHXGA-UHFFFAOYSA-N 0.000 claims description 2
- RPNUMPOLZDHAAY-UHFFFAOYSA-N Diethylenetriamine Chemical compound NCCNCCN RPNUMPOLZDHAAY-UHFFFAOYSA-N 0.000 claims description 2
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 claims description 2
- IGFHQQFPSIBGKE-UHFFFAOYSA-N Nonylphenol Natural products CCCCCCCCCC1=CC=C(O)C=C1 IGFHQQFPSIBGKE-UHFFFAOYSA-N 0.000 claims description 2
- 229930040373 Paraformaldehyde Natural products 0.000 claims description 2
- PTFIPECGHSYQNR-UHFFFAOYSA-N cardanol Natural products CCCCCCCCCCCCCCCC1=CC=CC(O)=C1 PTFIPECGHSYQNR-UHFFFAOYSA-N 0.000 claims description 2
- 239000008098 formaldehyde solution Substances 0.000 claims description 2
- SNQQPOLDUKLAAF-UHFFFAOYSA-N nonylphenol Chemical compound CCCCCCCCCC1=CC=CC=C1O SNQQPOLDUKLAAF-UHFFFAOYSA-N 0.000 claims description 2
- 229920002866 paraformaldehyde Polymers 0.000 claims description 2
- WVDDGKGOMKODPV-ZQBYOMGUSA-N phenyl(114C)methanol Chemical compound O[14CH2]C1=CC=CC=C1 WVDDGKGOMKODPV-ZQBYOMGUSA-N 0.000 claims description 2
- 150000003242 quaternary ammonium salts Chemical class 0.000 claims description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 1
- 229910052710 silicon Inorganic materials 0.000 claims 1
- 239000010703 silicon Substances 0.000 claims 1
- 125000002485 formyl group Chemical class [H]C(*)=O 0.000 abstract 1
- HYHCSLBZRBJJCH-UHFFFAOYSA-M sodium hydrosulfide Chemical compound [Na+].[SH-] HYHCSLBZRBJJCH-UHFFFAOYSA-M 0.000 description 6
- 238000007711 solidification Methods 0.000 description 5
- 230000008023 solidification Effects 0.000 description 5
- 238000010276 construction Methods 0.000 description 4
- 239000003085 diluting agent Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 150000004982 aromatic amines Chemical class 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000004567 concrete Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 231100000053 low toxicity Toxicity 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- NJTGANWAUPEOAX-UHFFFAOYSA-N molport-023-220-454 Chemical compound OCC(O)CO.OCC(O)CO NJTGANWAUPEOAX-UHFFFAOYSA-N 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
- 238000010125 resin casting Methods 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 239000012745 toughening agent Substances 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
- C08G59/621—Phenols
- C08G59/623—Aminophenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The invention belongs to the field of building grouting materials, and discloses a low-viscosity in-water quick-setting elastic epoxy plugging grouting material and application thereof. The material is formed by mixing a component A and a component B in a mass ratio of (2-3) to 1; the component A is prepared from succinic acid modified epoxy, trimethylolpropane triglycidyl ether, 6350 toughness epoxy resin, AGE, glycerol and KH-560 silane coupling agent; the succinic acid modified epoxy is prepared from succinic acid, E51 epoxy resin, cyclohexanone and sodium bisulfate. The component B is prepared from phenolic aldehyde amine, an accelerator and BYK-141 organosilicon defoamer; the phenolic amine is prepared from organic amine, aldehyde substances and phenol substances. The grouting material prepared by the invention is suitable for the rapid seepage control engineering of subway tunnels and basements.
Description
Technical Field
The invention belongs to the field of building grouting materials, and particularly relates to a low-viscosity in-water quick-setting elastic epoxy plugging grouting material and application thereof.
Background
Epoxy resins have been in the last 50 th century and have been of great interest for their good physical and chemical properties, and have found wide use. However, the epoxy cured product has some disadvantages such as high brittleness and difficulty in curing at room temperature. And most of factories directly use single epoxy resin as grouting material at present, so that the grouting material has high viscosity, difficult construction and insufficient rigidity and elasticity of a solidified body. There is therefore an urgent need to develop an elastomeric epoxy resin which has a low viscosity and which cures rapidly in water.
Disclosure of Invention
In order to overcome the defects and shortcomings in the prior art, the primary purpose of the invention is to provide a low-viscosity in-water quick-setting elastic epoxy plugging grouting material.
The invention also aims to provide an application of the low-viscosity in-water quick-setting elastic epoxy plugging grouting material.
The aim of the invention is achieved by the following technical scheme:
a low-viscosity in-water quick-setting elastic epoxy plugging grouting material is prepared by mixing a component A and a component B in a mass ratio of (2-3) to 1, wherein the component A is modified epoxy, and the component B is phenolic aldehyde amine curing agent.
Preferably, the mass ratio of the component A to the component B is 2:1.
The component A is prepared from the following raw materials in parts by weight: 50-56 parts of succinic acid modified epoxy, 5-10 parts of trimethylolpropane triglycidyl ether, 20-25 parts of 6350 ductile epoxy resin and C 12-14 10-20 parts of Alkyl Glycidyl Ether (AGE), 3-5 parts of glycerol and 1-3 parts of KH-560 silane coupling agent; the succinic acid modified epoxy is prepared from the following raw materials in parts by weight: 3 parts of succinic acid, 86.9 parts of E51 epoxy resin, 10 parts of cyclohexanone and 0.1 part of sodium bisulfate.
The trimethylolpropane triglycidyl ether is a multifunctional epoxy reactive diluent, and can be used as a reactive diluent to not only enhance the mechanical strength of an epoxy cured body, but also improve the heat resistance of the cured body.
The 6350 ductile epoxy resin is flexible epoxy resin, which can enhance the elasticity of the cured body, reduce the viscosity to a certain extent and facilitate construction.
The glycerol (glycerol) is an accelerator.
The KH-560 silane coupling agent is used for strengthening the adhesion between the epoxy resin and the inorganic material.
The preparation method of the component A comprises the following steps: sequentially adding E51 epoxy resin and cyclohexanone into a reaction kettle; adding succinic acid and sodium bisulfate into a reaction kettle under the conditions of stirring and heating to 90 ℃, reacting for 5 hours, cooling and discharging to obtain succinic acid modified epoxy; sequentially adding trimethylolpropane triglycidyl ether, 6350 flexible epoxy resin, AGE, glycerol and KH-560 silane coupling agent into succinic acid modified epoxy, and stirring for 30-60 min to obtain the component A. The succinic acid modified epoxy is succinic acid modified epoxy with two end caps of epoxy groups.
The component B is prepared from the following raw materials in parts by weight: 94.5 to 98.9 parts of phenolic aldehyde amine, 1 to 5 parts of accelerator and 0.5 part of BYK-141 organosilicon defoamer; the phenolic amine is prepared from the following raw materials in parts by weight: 30-37 parts of organic amine, 45-50 parts of aldehyde substances and 18-20 parts of phenol substances; the promoter is at least one of benzyl alcohol, DMP-30 (2, 4, 6-tri (dimethylaminomethyl) phenol) and quaternary ammonium salt.
The organic amine is at least one of diethylenetriamine, triethylenetetramine, tetraethylenepentamine and ethylene polyamine, and preferably tetraethylenepentamine; the aldehyde substance is at least one of low-concentration formaldehyde solution, paraformaldehyde and dodecanal, preferably dodecanal, has low toxicity and can increase the elasticity of the epoxy solidified body by introducing long chains through reaction; the phenolic substance is at least one of cardanol, nonylphenol and 1,2,4, 5-benzene tetraphenol, preferably 1,2,4, 5-benzene tetraphenol is used as the phenolic substance, and more phenolic hydroxyl groups are introduced to improve the activity of the product and accelerate the curing rate.
The accelerator is preferably 7:3 of benzyl alcohol and DMP-30.
The preparation method of the component B comprises the following steps: adding organic amine into a reaction kettle; adding phenolic substances into the reaction kettle continuously under the stirring condition, and reacting for 6-8 h; after the reaction is finished, adding aldehyde substances into the reaction kettle for 4 times at intervals of 1h, keeping the temperature at 60-70 ℃, controlling the total reaction time at 4-7 h, and then cooling to normal temperature to obtain the phenolic amine; sequentially adding the accelerator and the BYK-141 organosilicon defoamer into the phenolic aldehyde amine, and stirring for 30-60 min to obtain the component B.
The application of the low-viscosity in-water quick-fixing elastic epoxy plugging grouting material in the quick-seepage treatment engineering of subway tunnels and basements comprises the following operation steps: when in use, the component A and the component B are mixed according to the mass ratio (2-3) of 1 to obtain slurry with the initial viscosity of 95-135 mPa.s, then the slurry is injected into a leakage point by using a high-pressure electric grouting pump or a manual grouting pump, the slurry is initially solidified after 40-60 minutes of reaction, and then a solidified body is formed after 28d complete reaction, so that the plugging effect is realized. The plugging grouting material is suitable for being used in an environment of 0-40 ℃.
The principle of the invention is as follows:
the phenolic aldehyde amine curing agent prepared by the invention not only can improve the elasticity of the epoxy curing body, but also can enable the epoxy curing body to be cured rapidly under the conditions of humidity and low temperature, thereby ensuring the plugging effect. The curing agent prepared by the invention has the characteristics of aliphatic amine and aromatic amine, can cure epoxy resin at normal temperature, and can meet the requirement of reaction activity. Meanwhile, in order to overcome the problem of brittleness of the epoxy cured body, the invention also uses a chemical method to modify the epoxy resin and adds a toughening agent to further improve the elasticity of the cured body. The invention can finally obtain the epoxy resin solidified body with low viscosity, convenient construction and better elasticity, and the grouting material is suitable for leakage water shutoff of subway tunnels and basements.
Compared with the prior art, the invention has the following advantages and effects:
(1) The slurry obtained by the invention has lower viscosity and is convenient for pouring.
(2) The grouting material disclosed by the invention has the advantages of high bonding strength of a wet basal plane, quick solidification in water and capability of improving the plugging effect.
(3) The epoxy resin of the invention has high mechanical strength after solidification, overcomes the brittleness of epoxy and greatly improves the elasticity.
(4) The preparation process is simple, high temperature and high pressure are not involved, and the synthesis risk is reduced.
Detailed Description
The present invention will be described in further detail with reference to examples, but embodiments of the present invention are not limited thereto.
The preparation method of the A component in the following examples comprises the following steps: sequentially adding E51 epoxy resin and cyclohexanone into a reaction kettle; adding succinic acid and sodium bisulfate into a reaction kettle under the conditions of stirring and heating to 90 ℃, reacting for 5 hours, cooling and discharging to obtain succinic acid modified epoxy; sequentially adding trimethylolpropane triglycidyl ether, 6350 flexible epoxy resin, AGE, glycerol and KH-560 silane coupling agent into succinic acid modified epoxy, and stirring for 30-60 min to obtain the component A.
The preparation method of the component B in the following examples comprises the following steps: adding organic amine into a reaction kettle; adding phenolic substances into the reaction kettle continuously under the stirring condition, and reacting for 6-8 h; after the reaction is finished, adding aldehyde substances into the reaction kettle for 4 times at intervals of 1h, keeping the temperature at 60-70 ℃, controlling the total reaction time at 4-7 h, and then cooling to normal temperature to obtain the phenolic amine; sequentially adding the accelerator and the BYK-141 organosilicon defoamer into the phenolic aldehyde amine, and stirring for 30-60 min to obtain the component B.
Example 1:
the component A comprises the following components in percentage by mass: 56g of succinic acid modified epoxy, 10g of trimethylolpropane triglycidyl ether, 20g of 6350 toughness epoxy resin, 10g of AGE, 3g of glycerol and 1g of KH-560 silane coupling agent. The mass ratio of the succinic acid modified epoxy raw materials is as follows: succinic acid 3g, E51 epoxy resin 86.9g, cyclohexanone 10g and sodium hydrosulfide 0.1g.
The mass ratio of the component B is as follows: 97g of phenolic aldehyde amine curing agent, 2.5g of accelerator and 0.5g of BYK-141 defoamer. The phenolic aldehyde amine curing agent comprises the following raw materials in parts by mass: 37g of tetraethylenepentamine, 18g of 1,2,4, 5-benzene tetraphenol and 45g of dodecanal. The accelerator comprises the following substances: benzyl alcohol 1.75g, DMP-30.75 g.
The mass ratio of the component A to the component B is 2:1, mixing and stirring uniformly to obtain slurry with initial viscosity of 95-135 mPa.s, then injecting the slurry into a leakage point by using a high-pressure electric grouting pump or a manual grouting pump, reacting the slurry for 40-60 minutes to perform initial solidification, and then performing a complete reaction for 28d (20+/-3 ℃) to form a solidified body, thereby realizing a plugging effect.
Example 2:
the component A comprises the following components in percentage by mass: 52g of succinic acid modified epoxy, 5g of trimethylolpropane triglycidyl ether, 22g of 6350 toughness epoxy resin, 15g of AGE, 4g of glycerol and 2g of KH-560 silane coupling agent. The mass ratio of the succinic acid modified epoxy raw materials is as follows: succinic acid 3g, E51 epoxy resin 86.9g, cyclohexanone 10g and sodium hydrosulfide 0.1g.
The mass ratio of the component B is as follows: 95.5g of phenolic amine curing agent, 4g of accelerator and 0.5g of BYK-141 defoamer. The phenolic aldehyde amine curing agent comprises the following raw materials in parts by mass: 34g of tetraethylenepentamine, 20g of 1,2,4, 5-benzene tetraphenol and 46g of dodecanal. The accelerator comprises the following substances: benzyl alcohol 2.8g, DMP-30.2 g.
The mass ratio of the component A to the component B is 2:1, mixing and stirring uniformly to obtain slurry with initial viscosity of 95-135 mPa.s, then injecting the slurry into a leakage point by using a high-pressure electric grouting pump or a manual grouting pump, reacting the slurry for 40-60 minutes to perform initial solidification, and then performing a complete reaction for 28d (20+/-3 ℃) to form a solidified body, thereby realizing a plugging effect.
Example 3:
the component A comprises the following components in percentage by mass: 50g of succinic acid modified epoxy, 5g of trimethylolpropane triglycidyl ether, 25g of 6350 toughness epoxy resin, 12g of AGE, 5g of glycerol and 3g of KH-560 silane coupling agent. The mass ratio of the succinic acid modified epoxy raw materials is as follows: succinic acid 3g, E51 epoxy resin 86.9g, cyclohexanone 10g and sodium hydrosulfide 0.1g.
The mass ratio of the component B is as follows: 94.5g of phenolic amine curing agent main body, 5g of accelerator and 0.5g of BYK-141 defoamer. The phenolic aldehyde amine curing agent comprises the following raw materials in parts by mass: 34g of tetraethylenepentamine, 18g of 1,2,4, 5-benzene tetraphenol and 48g of dodecanal. The accelerator comprises the following substances: benzyl alcohol 3.5g, DMP-30.5 g.
The mass ratio of the component A to the component B is 2:1, mixing and stirring uniformly to obtain slurry with initial viscosity of 95-135 mPa.s, then injecting the slurry into a leakage point by using a high-pressure electric grouting pump or a manual grouting pump, reacting the slurry for 40-60 minutes to perform initial solidification, and then performing a complete reaction for 28d (20+/-3 ℃) to form a solidified body, thereby realizing a plugging effect.
Example 4:
the component A comprises the following components in percentage by mass: 50g of succinic acid modified epoxy, 6g of trimethylolpropane triglycidyl ether, 20g of 6350 flexible epoxy resin, 20g of AGE, 3g of glycerol and 1g of KH-560 silane coupling agent. The mass ratio of the succinic acid modified epoxy raw materials is as follows: succinic acid 3g, E51 epoxy resin 86.9g, cyclohexanone 10g and sodium hydrosulfide 0.1g.
The mass ratio of the component B is as follows: 96.5g of phenolic amine curing agent, 3.0g of accelerator and 0.5g of BYK-141 defoamer. The phenolic amine curing agent comprises the following main raw materials in parts by mass: 30g of tetraethylenepentamine, 20g of 1,2,4, 5-benzene tetraphenol and 50g of dodecanal. The accelerator comprises the following substances: benzyl alcohol 2.1g, DMP-30.9 g.
The component A and the component B are mixed and stirred uniformly according to the mass ratio of 2:1 to obtain slurry with the initial viscosity of 95-135 mPa.s, then the slurry is injected into a leakage point by using a high-pressure electric grouting pump or a manual grouting pump, the slurry is initially solidified after 40-60 minutes, and then the solidified body is formed after the reaction of 28d (20+/-3 ℃), so that the plugging effect is realized.
Example 5:
the component A comprises the following components in percentage by mass: 53g of succinic acid modified epoxy, 5g of trimethylolpropane triglycidyl ether, 20g of 6350 toughness epoxy resin, 16g of AGE, 4g of glycerol and 2g of KH-560 silane coupling agent. The mass ratio of the succinic acid modified epoxy raw materials is as follows: succinic acid 3g, E51 epoxy resin 86.9g, cyclohexanone 10g and sodium hydrosulfide 0.1g.
The mass ratio of the component B is as follows: 98.5g of phenolic amine curing agent main body, 1g of accelerator and 0.5g of BYK-141 defoamer. The phenolic amine curing agent comprises the following main raw materials in parts by mass: 36g of tetraethylenepentamine, 19g of 1,2,4, 5-benzene tetraphenol and 45g of dodecanal. The accelerator comprises the following substances: benzyl alcohol 0.7g, DMP-30.3 g.
The component A and the component B are mixed and stirred uniformly according to the mass ratio of 2:1 to obtain slurry with the initial viscosity of 95-135 mPa.s, then the slurry is injected into a leakage point by using a high-pressure electric grouting pump or a manual grouting pump, the slurry is initially solidified after 40-60 minutes, and then the solidified body is formed after the reaction of 28d (20+/-3 ℃), so that the plugging effect is realized.
Example 6:
the component A comprises the following components in percentage by mass: 50g of succinic acid modified epoxy, 5g of trimethylolpropane triglycidyl ether, 21g of 6350 toughness epoxy resin, 16g of AGE, 5g of glycerol and 3g of KH-560 silane coupling agent. The mass ratio of the succinic acid modified epoxy raw materials is as follows: succinic acid 3g, E51 epoxy resin 86.9g, cyclohexanone 10g and sodium hydrosulfide 0.1g.
The mass ratio of the component B is as follows: 98.0g of phenolic amine curing agent main body, 1.5g of accelerator and 0.5g of BYK-141 defoamer. The phenolic amine curing agent comprises the following main raw materials in parts by mass: 30g of tetraethylenepentamine, 20g of 1,2,4, 5-benzene tetraphenol and 50g of dodecanal. The accelerator comprises the following substances: benzyl alcohol 1.05g, DMP-30.45 g.
The component A and the component B are mixed and stirred uniformly according to the mass ratio of 2:1 to obtain slurry with the initial viscosity of 95-135 mPa.s, then the slurry is injected into a leakage point by using a high-pressure electric grouting pump or a manual grouting pump, the slurry is initially solidified after 40-60 minutes, and then the solidified body is formed after the reaction of 28d (20+/-3 ℃), so that the plugging effect is realized.
The product properties of examples 1-6 are shown in Table 1, where the initial viscosity test was performed according to GB/T2794-2013 [ Single Cylinder rotational viscometer for measurement of adhesive viscosity ]; the physical and mechanical properties are measured according to GB/T2567-2008 [ method for testing the performance of a resin casting body ]; initial gel time was measured according to GB/T7193-2008 [ unsaturated polyester resin test method ].
From Table 1, it can be seen that the slurry has low viscosity of less than 200 mPas, convenient construction, short curing time, good compressive strength and elasticity after curing, 80-100 MPa in water, 1.5-2.0 MPa in water, and more than 50% of elongation at break.
TABLE 1 specification of technical Properties of slurries and concretes
The above examples are preferred embodiments of the present invention, but the embodiments of the present invention are not limited to the above examples, and any other changes, modifications, substitutions, combinations, and simplifications that do not depart from the spirit and principle of the present invention should be made in the equivalent manner, and the embodiments are included in the protection scope of the present invention.
Claims (7)
1. A low-viscosity in-water quick-setting elastic epoxy plugging grouting material is characterized in that: the material is prepared by mixing a component A and a component B in a mass ratio of (2-3) 1, wherein the component A is modified epoxy, and the component B is phenolic aldehyde amine curing agent;
the component A is prepared from the following raw materials in parts by weight: 50-56 parts of succinic acid modified epoxy, 5-10 parts of trimethylolpropane triglycidyl ether, 20-25 parts of 6350 ductile epoxy resin and C 12-14 10-20 parts of alkyl glycidyl ether, 3-5 parts of glycerol and 1-3 parts of KH-560 silane coupling agent; the succinic acid modified epoxy is prepared from the following raw materials in parts by weight: 3 parts of succinic acid, 86.9 parts of E51 epoxy resin, 10 parts of cyclohexanone and 0.1 part of sodium bisulfate;
the component B is prepared from the following raw materials in parts by weight: 94.5-98.9 parts of phenolic amine, 1-5 parts of accelerator and 0.5 part of BYK-141 organosilicon defoamer; the phenolic amine is prepared from the following raw materials in parts by weight: 30-37 parts of organic amine, 45-50 parts of aldehyde substances and 18-20 parts of phenol substances; the promoter is at least one of benzyl alcohol, DMP-30 and quaternary ammonium salt;
the organic amine is at least one of diethylenetriamine, triethylenetetramine and tetraethylenepentamine; the aldehyde substance is at least one of low-concentration formaldehyde solution, paraformaldehyde and dodecanal; the phenolic substance is at least one of cardanol, nonylphenol and 1,2,4, 5-benzene tetraphenol; the accelerator is benzyl alcohol and DMP-30 in a mass ratio of 7:3.
2. The low-viscosity in-water quick-setting elastic epoxy plugging grouting material according to claim 1, wherein the grouting material is characterized in that: the mass ratio of the component A to the component B is 2:1.
3. The low-viscosity in-water quick-setting elastic epoxy plugging grouting material according to claim 1, wherein the grouting material is characterized in that: the preparation method of the component A comprises the following steps: sequentially adding E51 epoxy resin and cyclohexanone into a reaction kettle; adding succinic acid and sodium bisulfate into a reaction kettle under the conditions of stirring and heating to 90 ℃, reacting for 5 hours, cooling and discharging to obtain succinic acid modified epoxy; and sequentially adding trimethylolpropane triglycidyl ether, 6350 flexible epoxy resin, AGE, glycerol and KH-560 silane coupling agent into succinic acid modified epoxy, and stirring for 30-60 min to obtain a component A.
4. The low-viscosity in-water quick-setting elastic epoxy plugging grouting material according to claim 1, wherein the grouting material is characterized in that: the organic amine is tetraethylenepentamine; the aldehyde substance is dodecanal; the phenolic substance is 1,2,4, 5-benzene tetraphenol.
5. The low-viscosity in-water quick-setting elastic epoxy plugging grouting material according to claim 1, wherein the grouting material is characterized in that: the preparation method of the component B comprises the following steps: adding organic amine into a reaction kettle; continuously adding phenolic substances into the reaction kettle under the stirring condition, and reacting for 6-8 hours; after the reaction is finished, adding aldehyde substances into the reaction kettle for 4 times at intervals of 1h, keeping the temperature at 60-70 ℃, controlling the total reaction time at 4-7 h, and then cooling to normal temperature to obtain phenolic amine; and sequentially adding the accelerator and the BYK-141 organic silicon defoamer into the phenolic aldehyde amine, and stirring for 30-60 min to obtain the component B.
6. The application of the low-viscosity in-water quick-setting elastic epoxy plugging grouting material in the quick seepage control engineering of subway tunnels and basements, according to claim 1, which is characterized in that: the application comprises the following operation steps: when the plugging agent is used, the component A and the component B are mixed according to the mass ratio (2-3) of 1 to obtain slurry with the initial viscosity of 95-135 mPa.s, then the slurry is injected into a leakage point by using a high-pressure electric grouting pump or a manual grouting pump, the slurry is initially solidified after 40-60 minutes, and then the solidified body is formed after 28d complete reaction, so that the plugging effect is realized.
7. The use according to claim 6, characterized in that: the application is performed in an environment of 0-40 ℃.
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