CN112280249A - Low-viscosity underwater quick-setting elastic epoxy plugging grouting material and application thereof - Google Patents
Low-viscosity underwater quick-setting elastic epoxy plugging grouting material and application thereof Download PDFInfo
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- CN112280249A CN112280249A CN202011247626.4A CN202011247626A CN112280249A CN 112280249 A CN112280249 A CN 112280249A CN 202011247626 A CN202011247626 A CN 202011247626A CN 112280249 A CN112280249 A CN 112280249A
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- 239000004593 Epoxy Substances 0.000 title claims abstract description 53
- 239000000463 material Substances 0.000 title claims abstract description 26
- KDYFGRWQOYBRFD-UHFFFAOYSA-N succinic acid Chemical compound OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 claims abstract description 67
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 claims abstract description 36
- 239000003822 epoxy resin Substances 0.000 claims abstract description 34
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 34
- -1 AGE Substances 0.000 claims abstract description 33
- 239000001384 succinic acid Substances 0.000 claims abstract description 29
- 239000000126 substance Substances 0.000 claims abstract description 27
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 claims abstract description 24
- MECNWXGGNCJFQJ-UHFFFAOYSA-N 3-piperidin-1-ylpropane-1,2-diol Chemical compound OCC(O)CN1CCCCC1 MECNWXGGNCJFQJ-UHFFFAOYSA-N 0.000 claims abstract description 13
- 239000006087 Silane Coupling Agent Substances 0.000 claims abstract description 13
- 239000002518 antifoaming agent Substances 0.000 claims abstract description 12
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims abstract description 11
- 150000001412 amines Chemical class 0.000 claims abstract description 9
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 claims abstract description 9
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 6
- 238000002156 mixing Methods 0.000 claims abstract description 6
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 6
- 239000010703 silicon Substances 0.000 claims abstract description 6
- WBHQBSYUUJJSRZ-UHFFFAOYSA-M sodium bisulfate Chemical compound [Na+].OS([O-])(=O)=O WBHQBSYUUJJSRZ-UHFFFAOYSA-M 0.000 claims abstract description 6
- 229910000342 sodium bisulfate Inorganic materials 0.000 claims abstract description 6
- 238000006243 chemical reaction Methods 0.000 claims description 28
- 239000002002 slurry Substances 0.000 claims description 27
- WVDDGKGOMKODPV-UHFFFAOYSA-N Benzyl alcohol Chemical group OCC1=CC=CC=C1 WVDDGKGOMKODPV-UHFFFAOYSA-N 0.000 claims description 24
- HFJRKMMYBMWEAD-UHFFFAOYSA-N dodecanal Chemical compound CCCCCCCCCCCC=O HFJRKMMYBMWEAD-UHFFFAOYSA-N 0.000 claims description 20
- 239000002994 raw material Substances 0.000 claims description 20
- 239000003795 chemical substances by application Substances 0.000 claims description 18
- 238000003756 stirring Methods 0.000 claims description 15
- 230000000694 effects Effects 0.000 claims description 13
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 13
- FAGUFWYHJQFNRV-UHFFFAOYSA-N tetraethylenepentamine Chemical compound NCCNCCNCCNCCN FAGUFWYHJQFNRV-UHFFFAOYSA-N 0.000 claims description 10
- 150000001299 aldehydes Chemical class 0.000 claims description 8
- 235000019445 benzyl alcohol Nutrition 0.000 claims description 8
- 238000002360 preparation method Methods 0.000 claims description 7
- 238000001816 cooling Methods 0.000 claims description 6
- AHDSRXYHVZECER-UHFFFAOYSA-N 2,4,6-tris[(dimethylamino)methyl]phenol Chemical compound CN(C)CC1=CC(CN(C)C)=C(O)C(CN(C)C)=C1 AHDSRXYHVZECER-UHFFFAOYSA-N 0.000 claims description 5
- UYQMSQMCIYSXOW-UHFFFAOYSA-N benzene-1,2,4,5-tetrol Chemical compound OC1=CC(O)=C(O)C=C1O UYQMSQMCIYSXOW-UHFFFAOYSA-N 0.000 claims description 4
- 238000007599 discharging Methods 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 3
- 230000035484 reaction time Effects 0.000 claims description 3
- 238000007711 solidification Methods 0.000 claims description 3
- 230000008023 solidification Effects 0.000 claims description 3
- JOLVYUIAMRUBRK-UHFFFAOYSA-N 11',12',14',15'-Tetradehydro(Z,Z-)-3-(8-Pentadecenyl)phenol Natural products OC1=CC=CC(CCCCCCCC=CCC=CCC=C)=C1 JOLVYUIAMRUBRK-UHFFFAOYSA-N 0.000 claims description 2
- VILCJCGEZXAXTO-UHFFFAOYSA-N 2,2,2-tetramine Chemical compound NCCNCCNCCN VILCJCGEZXAXTO-UHFFFAOYSA-N 0.000 claims description 2
- YLKVIMNNMLKUGJ-UHFFFAOYSA-N 3-Delta8-pentadecenylphenol Natural products CCCCCCC=CCCCCCCCC1=CC=CC(O)=C1 YLKVIMNNMLKUGJ-UHFFFAOYSA-N 0.000 claims description 2
- JOLVYUIAMRUBRK-UTOQUPLUSA-N Cardanol Chemical compound OC1=CC=CC(CCCCCCC\C=C/C\C=C/CC=C)=C1 JOLVYUIAMRUBRK-UTOQUPLUSA-N 0.000 claims description 2
- FAYVLNWNMNHXGA-UHFFFAOYSA-N Cardanoldiene Natural products CCCC=CCC=CCCCCCCCC1=CC=CC(O)=C1 FAYVLNWNMNHXGA-UHFFFAOYSA-N 0.000 claims description 2
- RPNUMPOLZDHAAY-UHFFFAOYSA-N Diethylenetriamine Chemical compound NCCNCCN RPNUMPOLZDHAAY-UHFFFAOYSA-N 0.000 claims description 2
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 claims description 2
- 239000005977 Ethylene Substances 0.000 claims description 2
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 claims description 2
- IGFHQQFPSIBGKE-UHFFFAOYSA-N Nonylphenol Natural products CCCCCCCCCC1=CC=C(O)C=C1 IGFHQQFPSIBGKE-UHFFFAOYSA-N 0.000 claims description 2
- 229930040373 Paraformaldehyde Natural products 0.000 claims description 2
- PTFIPECGHSYQNR-UHFFFAOYSA-N cardanol Natural products CCCCCCCCCCCCCCCC1=CC=CC(O)=C1 PTFIPECGHSYQNR-UHFFFAOYSA-N 0.000 claims description 2
- 239000008098 formaldehyde solution Substances 0.000 claims description 2
- SNQQPOLDUKLAAF-UHFFFAOYSA-N nonylphenol Chemical compound CCCCCCCCCC1=CC=CC=C1O SNQQPOLDUKLAAF-UHFFFAOYSA-N 0.000 claims description 2
- 229920002866 paraformaldehyde Polymers 0.000 claims description 2
- WVDDGKGOMKODPV-ZQBYOMGUSA-N phenyl(114C)methanol Chemical compound O[14CH2]C1=CC=CC=C1 WVDDGKGOMKODPV-ZQBYOMGUSA-N 0.000 claims description 2
- 229920000768 polyamine Polymers 0.000 claims description 2
- 150000003242 quaternary ammonium salts Chemical class 0.000 claims description 2
- 229960001124 trientine Drugs 0.000 claims description 2
- 125000002485 formyl group Chemical class [H]C(*)=O 0.000 abstract 1
- CYIDZMCFTVVTJO-UHFFFAOYSA-N pyromellitic acid Chemical compound OC(=O)C1=CC(C(O)=O)=C(C(O)=O)C=C1C(O)=O CYIDZMCFTVVTJO-UHFFFAOYSA-N 0.000 description 10
- 235000011187 glycerol Nutrition 0.000 description 9
- HYHCSLBZRBJJCH-UHFFFAOYSA-M sodium hydrosulfide Chemical compound [Na+].[SH-] HYHCSLBZRBJJCH-UHFFFAOYSA-M 0.000 description 6
- 238000010276 construction Methods 0.000 description 4
- 239000003085 diluting agent Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 150000004982 aromatic amines Chemical class 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000004567 concrete Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 231100000053 low toxicity Toxicity 0.000 description 1
- NJTGANWAUPEOAX-UHFFFAOYSA-N molport-023-220-454 Chemical compound OCC(O)CO.OCC(O)CO NJTGANWAUPEOAX-UHFFFAOYSA-N 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 238000010125 resin casting Methods 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 239000012745 toughening agent Substances 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
- C08G59/621—Phenols
- C08G59/623—Aminophenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
Abstract
The invention belongs to the field of building grouting materials, and discloses a low-viscosity underwater quick-setting elastic epoxy plugging grouting material and application thereof. The material is formed by mixing a component A and a component B in a mass ratio of (2-3) to 1; the component A is prepared from succinic acid modified epoxy, trimethylolpropane triglycidyl ether, 6350 tough epoxy resin, AGE, glycerol and KH-560 silane coupling agent; the succinic acid modified epoxy is prepared from succinic acid, E51 epoxy resin, cyclohexanone and sodium bisulfate. The component B is prepared from phenolic aldehyde amine, an accelerator and a BYK-141 organic silicon defoaming agent; the phenolic aldehyde amine is prepared from organic amine, aldehyde substances and phenolic substances. The grouting material prepared by the invention is suitable for rapid leakage treatment engineering of subway tunnels and basements.
Description
Technical Field
The invention belongs to the field of building grouting materials, and particularly relates to a low-viscosity underwater quick-setting elastic epoxy plugging grouting material and application thereof.
Background
Epoxy resin appears in the 50 th century, is paid attention to due to good physical and chemical properties, and is widely applied. However, epoxy cured bodies also have some disadvantages, such as greater brittleness of the cured body and difficulty in curing at normal temperature. At present, most manufacturers directly use single epoxy resin as grouting material, so that the viscosity is high, the construction is difficult, and the rigidity of a cured body has residual elasticity. Therefore, there is a strong need to develop an elastic epoxy resin which has a low viscosity and is rapidly cured in water.
Disclosure of Invention
In order to overcome the defects and shortcomings in the prior art, the invention mainly aims to provide a low-viscosity underwater quick-setting elastic epoxy plugging grouting material.
The invention also aims to provide application of the quick-setting elastic epoxy plugging grouting material in low-viscosity water.
The purpose of the invention is realized by the following technical scheme:
the low-viscosity underwater quick-setting elastic epoxy plugging grouting material is formed by mixing a component A and a component B in a mass ratio of (2-3) to 1, wherein the component A is modified epoxy, and the component B is a phenolic aldehyde amine curing agent.
Preferably, the mass ratio of the component A to the component B is 2: 1.
The component A is prepared from the following raw materials in parts by weight: 50-56 parts of succinic acid modified epoxy, 5-10 parts of trimethylolpropane triglycidyl ether, 20-25 parts of 6350 tough epoxy resin and C12-1410-20 parts of Alkyl Glycidyl Ether (AGE), 3-5 parts of glycerol and 1-3 parts of KH-560 silane coupling agent; the succinic acid modified epoxy is prepared from the following raw materials in parts by weight: 3 parts of succinic acid, 86.9 parts of E51 epoxy resin, 10 parts of cyclohexanone and 0.1 part of sodium bisulfate.
The trimethylolpropane triglycidyl ether is a polyfunctional epoxy reactive diluent, and can be used as a reactive diluent to enhance the mechanical strength of an epoxy cured body and improve the heat resistance of the cured body.
The 6350 tough epoxy resin is flexible epoxy resin, and can enhance the elasticity of a cured body and reduce the viscosity to a certain extent, so that the construction is facilitated.
The glycerol (glycerin) is an accelerant.
The KH-560 silane coupling agent is used for enhancing the bonding of the epoxy resin and the inorganic material.
The preparation method of the component A comprises the following steps: sequentially adding E51 epoxy resin and cyclohexanone into a reaction kettle; under the conditions of stirring and heating to 90 ℃, adding succinic acid and sodium bisulfate into a reaction kettle, reacting for 5 hours, cooling and discharging to obtain succinic acid modified epoxy; and sequentially adding trimethylolpropane triglycidyl ether, 6350 flexible epoxy resin, AGE, glycerol and KH-560 silane coupling agent into succinic acid modified epoxy, and stirring for 30-60 min to obtain the component A. The succinic acid modified epoxy is succinic acid modified epoxy containing two epoxy groups for end capping.
The component B is prepared from the following raw materials in parts by weight: 94.5-98.9 parts of phenolic aldehyde amine, 1-5 parts of accelerator and 0.5 part of BYK-141 organic silicon defoaming agent; the phenolic aldehyde amine is prepared from the following raw materials in parts by weight: 30-37 parts of organic amine, 45-50 parts of aldehyde substances and 18-20 parts of phenolic substances; the accelerant is at least one of benzyl alcohol, DMP-30(2, 4, 6-tri (dimethylaminomethyl) phenol) and quaternary ammonium salt.
The organic amine is at least one of diethylenetriamine, triethylene tetramine, tetraethylene pentamine and ethylene polyamine, and preferably tetraethylene pentamine; the aldehyde substance is at least one of low-concentration formaldehyde solution, paraformaldehyde and dodecanal, preferably dodecanal, has low toxicity, and can increase the elasticity of the epoxy curing body by introducing a long chain through reaction; the phenolic substance is at least one of cardanol, nonylphenol and 1, 2, 4, 5-benzenetetraol, preferably 1, 2, 4, 5-benzenetetraol is used as the phenolic substance, and more phenolic hydroxyl groups are introduced to improve the activity of the product and accelerate the curing rate.
The promoter is preferably benzyl alcohol and DMP-30 in a mass ratio of 7: 3.
The preparation method of the component B comprises the following steps: adding organic amine into a reaction kettle; continuously adding phenolic substances into the reaction kettle under the stirring condition, and reacting for 6-8 h; after the reaction is finished, adding aldehyde substances into the reaction kettle for 4 times at intervals of 1h, keeping the temperature at 60-70 ℃, controlling the total reaction time at 4-7 h, and then cooling to normal temperature to obtain the phenolic aldehyde amine; and (3) sequentially adding an accelerator and a BYK-141 organic silicon defoaming agent into the phenolic aldehyde amine, and stirring for 30-60 min to obtain a component B.
The application of the low-viscosity underwater quick-setting elastic epoxy plugging grouting material in quick leakage treatment engineering of subway tunnels and basements comprises the following operation steps: when the plugging agent is used, the component A and the component B are mixed according to the mass ratio of (2-3) to 1 to obtain slurry with the initial viscosity of 95-135 mPa & s, then a high-pressure electric grouting pump or a manual grouting pump is used for injecting the slurry into a leakage point, the slurry is reacted for initial solidification after 40-60 minutes, and a solidified body is formed after 28 days of complete reaction, so that the plugging effect is realized. The plugging grouting material is suitable for being used in an environment with the temperature of 0-40 ℃.
The principle of the invention is as follows:
the phenolic aldehyde amine curing agent prepared by the invention can improve the elasticity of the epoxy cured body, can also enable the epoxy cured body to be rapidly cured under moist and low temperature, and ensures the plugging effect. The curing agent prepared by the invention has the characteristics of aliphatic amine and aromatic amine, can cure epoxy resin at normal temperature, and has reaction activity meeting the requirement. Meanwhile, in order to overcome the problem of brittleness of the epoxy cured body, the epoxy resin is modified by a chemical method, and the elasticity of the cured body is further improved by adding a toughening agent. The epoxy resin solidified body with low viscosity, convenient construction and better elasticity can be finally obtained by the invention, and the grouting material is suitable for leakage water plugging of subway tunnels and basements.
Compared with the prior art, the invention has the following advantages and effects:
(1) the slurry obtained by the invention has low viscosity and is convenient to pour.
(2) The grouting material has high bonding strength of a wet base surface and quick solidification in water, and can improve the plugging effect.
(3) After the epoxy resin is cured, the mechanical strength is high, the brittleness of epoxy is overcome, and the elasticity is greatly improved.
(4) The invention has simple preparation process, does not relate to high temperature and high pressure, and reduces the danger of synthesis.
Detailed Description
The present invention will be described in further detail with reference to examples, but the embodiments of the present invention are not limited thereto.
The preparation of the A component described in the following examples follows the following steps: sequentially adding E51 epoxy resin and cyclohexanone into a reaction kettle; under the conditions of stirring and heating to 90 ℃, adding succinic acid and sodium bisulfate into a reaction kettle, reacting for 5 hours, cooling and discharging to obtain succinic acid modified epoxy; and sequentially adding trimethylolpropane triglycidyl ether, 6350 flexible epoxy resin, AGE, glycerol and KH-560 silane coupling agent into succinic acid modified epoxy, and stirring for 30-60 min to obtain the component A.
The preparation of component B as described in the following examples follows the steps of: adding organic amine into a reaction kettle; continuously adding phenolic substances into the reaction kettle under the stirring condition, and reacting for 6-8 h; after the reaction is finished, adding aldehyde substances into the reaction kettle for 4 times at intervals of 1h, keeping the temperature at 60-70 ℃, controlling the total reaction time at 4-7 h, and then cooling to normal temperature to obtain the phenolic aldehyde amine; and (3) sequentially adding an accelerator and a BYK-141 organic silicon defoaming agent into the phenolic aldehyde amine, and stirring for 30-60 min to obtain a component B.
Example 1:
the component A comprises the following components in percentage by mass: 56g of succinic acid modified epoxy, 10g of trimethylolpropane triglycidyl ether, 20g of 6350 tough epoxy resin, 10g of AGE, 3g of glycerol and 1g of KH-560 silane coupling agent. The succinic acid modified epoxy raw material comprises the following components in parts by mass: 3g of succinic acid, 86.9g of E51 epoxy resin, 10g of cyclohexanone and 0.1g of sodium hydrosulfide.
The mass ratio of the component B is as follows: 97g of phenolic aldehyde amine curing agent, 2.5g of accelerator and 0.5g of BYK-141 defoaming agent. The phenolic aldehyde amine curing agent comprises the following raw materials in percentage by mass: 37g of tetraethylenepentamine, 18g of 1, 2, 4, 5-benzenetetraphenol and 45g of dodecanal. The accelerator comprises the following substances: 1.75g of benzyl alcohol and 300.75 g of DMP-300.75 g.
The component A and the component B are mixed according to the mass ratio of 2:1, uniformly mixing and stirring to obtain slurry with the initial viscosity of 95-135 mPa & s, then injecting the slurry into a leakage point by using a high-pressure electric grouting pump or a manual grouting pump, reacting for 40-60 minutes to initially solidify the slurry, and completely reacting for 28d (20 +/-3 ℃) to form a solidified body so as to realize the plugging effect.
Example 2:
the component A comprises the following components in percentage by mass: 52g of succinic acid modified epoxy, 5g of trimethylolpropane triglycidyl ether, 22g of 6350 tough epoxy resin, 15g of AGE, 4g of glycerol and 2g of KH-560 silane coupling agent. The succinic acid modified epoxy raw material comprises the following components in parts by mass: 3g of succinic acid, 86.9g of E51 epoxy resin, 10g of cyclohexanone and 0.1g of sodium hydrosulfide.
The mass ratio of the component B is as follows: 95.5g of phenolic aldehyde amine curing agent, 4g of accelerator and 0.5g of BYK-141 defoaming agent. The phenolic aldehyde amine curing agent comprises the following raw materials in percentage by mass: 34g of tetraethylenepentamine, 20g of 1, 2, 4, 5-benzenetetracarboxylic acid and 46g of dodecanal. The accelerator comprises the following substances: benzyl alcohol 2.8g, DMP-301.2 g.
The component A and the component B are mixed according to the mass ratio of 2:1, uniformly mixing and stirring to obtain slurry with the initial viscosity of 95-135 mPa & s, then injecting the slurry into a leakage point by using a high-pressure electric grouting pump or a manual grouting pump, reacting for 40-60 minutes to initially solidify the slurry, and completely reacting for 28d (20 +/-3 ℃) to form a solidified body so as to realize the plugging effect.
Example 3:
the component A comprises the following components in percentage by mass: 50g of succinic acid modified epoxy, 5g of trimethylolpropane triglycidyl ether, 25g of 6350 tough epoxy resin, 12g of AGE, 5g of glycerol and 3g of KH-560 silane coupling agent. The succinic acid modified epoxy raw material comprises the following components in parts by mass: 3g of succinic acid, 86.9g of E51 epoxy resin, 10g of cyclohexanone and 0.1g of sodium hydrosulfide.
The mass ratio of the component B is as follows: 94.5g of phenolic aldehyde amine curing agent main body, 5g of accelerator and 0.5g of BYK-141 defoaming agent. The phenolic aldehyde amine curing agent comprises the following raw materials in percentage by mass: 34g of tetraethylenepentamine, 18g of 1, 2, 4, 5-benzenetetracarboxylic acid and 48g of dodecanal. The accelerator comprises the following substances: 3.5g of benzyl alcohol and 3.5g of DMP-301.5 g.
The component A and the component B are mixed according to the mass ratio of 2:1, uniformly mixing and stirring to obtain slurry with the initial viscosity of 95-135 mPa & s, then injecting the slurry into a leakage point by using a high-pressure electric grouting pump or a manual grouting pump, reacting for 40-60 minutes to initially solidify the slurry, and completely reacting for 28d (20 +/-3 ℃) to form a solidified body so as to realize the plugging effect.
Example 4:
the component A comprises the following components in percentage by mass: 50g of succinic acid modified epoxy, 6g of trimethylolpropane triglycidyl ether, 20g of 6350 flexible epoxy resin, 20g of AGE, 3g of glycerol and 1g of KH-560 silane coupling agent. The succinic acid modified epoxy raw material comprises the following components in parts by mass: 3g of succinic acid, 86.9g of E51 epoxy resin, 10g of cyclohexanone and 0.1g of sodium hydrosulfide.
The mass ratio of the component B is as follows: 96.5g of phenolic aldehyde amine curing agent, 3.0g of accelerator and 0.5g of BYK-141 defoaming agent. The phenolic aldehyde amine curing agent comprises the following main raw materials in percentage by mass: 30g of tetraethylenepentamine, 20g of 1, 2, 4, 5-benzenetetracarboxylic acid and 50g of dodecanal. The accelerator comprises the following substances: 2.1g of benzyl alcohol and 300.9 g of DMP-300.9 g.
The component A and the component B are uniformly mixed and stirred according to the mass ratio of 2:1 to obtain slurry with the initial viscosity of 95-135 mPa & s, then the slurry is injected into a leakage point by using a high-pressure electric grouting pump or a manual grouting pump, the slurry is initially solidified after reaction for 40-60 minutes, and a solidified body is formed after complete reaction for 28d (20 +/-3 ℃), so that the plugging effect is realized.
Example 5:
the component A comprises the following components in percentage by mass: 53g of succinic acid modified epoxy, 5g of trimethylolpropane triglycidyl ether, 20g of 6350 tough epoxy resin, 16g of AGE, 4g of glycerol and 2g of KH-560 silane coupling agent. The succinic acid modified epoxy raw material comprises the following components in parts by mass: 3g of succinic acid, 86.9g of E51 epoxy resin, 10g of cyclohexanone and 0.1g of sodium hydrosulfide.
The mass ratio of the component B is as follows: 98.5g of phenolic aldehyde amine curing agent main body, 1g of accelerator and 0.5g of BYK-141 defoaming agent. The phenolic aldehyde amine curing agent comprises the following main raw materials in percentage by mass: 36g of tetraethylenepentamine, 19g of 1, 2, 4, 5-benzenetetracarboxylic acid and 45g of dodecanal. The accelerator comprises the following substances: benzyl alcohol 0.7g, DMP-300.3 g.
The component A and the component B are uniformly mixed and stirred according to the mass ratio of 2:1 to obtain slurry with the initial viscosity of 95-135 mPa & s, then the slurry is injected into a leakage point by using a high-pressure electric grouting pump or a manual grouting pump, the slurry is initially solidified after reaction for 40-60 minutes, and a solidified body is formed after complete reaction for 28d (20 +/-3 ℃), so that the plugging effect is realized.
Example 6:
the component A comprises the following components in percentage by mass: 50g of succinic acid modified epoxy, 5g of trimethylolpropane triglycidyl ether, 21g of 6350 tough epoxy resin, 16g of AGE, 5g of glycerol and 3g of KH-560 silane coupling agent. The succinic acid modified epoxy raw material comprises the following components in parts by mass: 3g of succinic acid, 86.9g of E51 epoxy resin, 10g of cyclohexanone and 0.1g of sodium hydrosulfide.
The mass ratio of the component B is as follows: 98.0g of phenolic aldehyde amine curing agent main body, 1.5g of accelerator and 0.5g of BYK-141 defoaming agent. The phenolic aldehyde amine curing agent comprises the following main raw materials in percentage by mass: 30g of tetraethylenepentamine, 20g of 1, 2, 4, 5-benzenetetracarboxylic acid and 50g of dodecanal. The accelerator comprises the following substances: 1.05g of benzyl alcohol and 300.45 g of DMP-300.45 g.
The component A and the component B are uniformly mixed and stirred according to the mass ratio of 2:1 to obtain slurry with the initial viscosity of 95-135 mPa & s, then the slurry is injected into a leakage point by using a high-pressure electric grouting pump or a manual grouting pump, the slurry is initially solidified after reaction for 40-60 minutes, and a solidified body is formed after complete reaction for 28d (20 +/-3 ℃), so that the plugging effect is realized.
The product properties of examples 1-6 are shown in Table 1, wherein the initial viscosity test was performed according to GB/T2794-; the physical and mechanical properties are measured according to GB/T2567-2008 (resin casting body performance test method); the initial gel time was determined according to GB/T7193-2008 [ unsaturated polyester resin test methods ].
As can be seen from Table 1, the slurry has low viscosity of less than 200mPa · s, is convenient for construction, has short curing time, has good compressive strength and elasticity after being cured, the compressive strength in water can reach 80-100 MPa, the bonding strength in water can reach 1.5-2.0 MPa, and the elongation at break can reach more than 50%.
TABLE 1 technical Performance indices of the slurries and concretes
The above embodiments are preferred embodiments of the present invention, but the present invention is not limited to the above embodiments, and any other changes, modifications, substitutions, combinations, and simplifications which do not depart from the spirit and principle of the present invention should be construed as equivalents thereof, and all such changes, modifications, substitutions, combinations, and simplifications are intended to be included in the scope of the present invention.
Claims (10)
1. A low-viscosity underwater quick-setting elastic epoxy plugging grouting material is characterized in that: the material is formed by mixing a component A and a component B in a mass ratio of (2-3) to 1, wherein the component A is modified epoxy, and the component B is a phenolic aldehyde amine curing agent.
2. The low-viscosity in-water quick-setting elastic epoxy plugging grouting material as claimed in claim 1, wherein: the mass ratio of the component A to the component B is 2: 1.
3. The low-viscosity in-water quick-setting elastic epoxy plugging grouting material as claimed in claim 1, wherein: the component A is prepared from the following raw materials in parts by weight: 50-56 parts of succinic acid modified epoxy, 5-10 parts of trimethylolpropane triglycidyl ether, 20-25 parts of 6350 tough epoxy resin and C12-1410-20 parts of alkyl glycidyl ether, 3-5 parts of glycerol and 1-3 parts of KH-560 silane coupling agent; the succinic acid modified epoxy is prepared from the following raw materials in parts by weight: 3 parts of succinic acid, 86.9 parts of E51 epoxy resin, 10 parts of cyclohexanone and 0.1 part of sodium bisulfate.
4. The low-viscosity in-water quick-setting elastic epoxy plugging grouting material as claimed in claim 3, wherein: the preparation method of the component A comprises the following steps: sequentially adding E51 epoxy resin and cyclohexanone into a reaction kettle; under the conditions of stirring and heating to 90 ℃, adding succinic acid and sodium bisulfate into a reaction kettle, reacting for 5 hours, cooling and discharging to obtain succinic acid modified epoxy; and sequentially adding trimethylolpropane triglycidyl ether, 6350 flexible epoxy resin, AGE, glycerol and KH-560 silane coupling agent into succinic acid modified epoxy, and stirring for 30-60 min to obtain the component A.
5. The low-viscosity in-water quick-setting elastic epoxy plugging grouting material as claimed in claim 1, wherein: the component B is prepared from the following raw materials in parts by weight: 94.5-98.9 parts of phenolic aldehyde amine, 1-5 parts of accelerator and 0.5 part of BYK-141 organic silicon defoaming agent; the phenolic aldehyde amine is prepared from the following raw materials in parts by weight: 30-37 parts of organic amine, 45-50 parts of aldehyde substances and 18-20 parts of phenolic substances; the promoter is at least one of benzyl alcohol, DMP-30 and quaternary ammonium salt.
6. The low-viscosity in-water quick-setting elastic epoxy plugging grouting material as claimed in claim 5, wherein: the organic amine is at least one of diethylenetriamine, triethylene tetramine, tetraethylene pentamine and ethylene polyamine; the aldehyde substance is at least one of low-concentration formaldehyde solution, paraformaldehyde and dodecanal; the phenolic substance is at least one of cardanol, nonylphenol and 1, 2, 4, 5-benzenetetraol; the accelerant is benzyl alcohol and DMP-30 in a mass ratio of 7: 3.
7. The low-viscosity in-water quick-setting elastic epoxy plugging grouting material as claimed in claim 6, wherein: the organic amine is tetraethylenepentamine; the aldehyde substance is dodecanal; the phenolic substance is 1, 2, 4, 5-benzenetetraol.
8. The low-viscosity in-water quick-setting elastic epoxy plugging grouting material as claimed in claim 5, wherein: the preparation method of the component B comprises the following steps: adding organic amine into a reaction kettle; continuously adding phenolic substances into the reaction kettle under the stirring condition, and reacting for 6-8 h; after the reaction is finished, adding aldehyde substances into the reaction kettle for 4 times at intervals of 1h, keeping the temperature at 60-70 ℃, controlling the total reaction time at 4-7 h, and then cooling to normal temperature to obtain the phenolic aldehyde amine; and (3) sequentially adding an accelerator and a BYK-141 organic silicon defoaming agent into the phenolic aldehyde amine, and stirring for 30-60 min to obtain a component B.
9. The application of the low-viscosity underwater quick-setting elastic epoxy plugging grouting material in the quick leakage treatment engineering of subway tunnels and basements as claimed in claim 1, wherein: the application comprises the following operation steps: when the plugging agent is used, the component A and the component B are mixed according to the mass ratio of (2-3) to 1 to obtain slurry with the initial viscosity of 95-135 mPa & s, then a high-pressure electric grouting pump or a manual grouting pump is used for injecting the slurry into a leakage point, the slurry is reacted for initial solidification after 40-60 minutes, and a solidified body is formed after 28 days of complete reaction, so that the plugging effect is realized.
10. Use according to claim 9, characterized in that: the application is carried out in an environment of 0-40 ℃.
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