CN102504742B - Bonding glue quickly solidified at room temperature - Google Patents
Bonding glue quickly solidified at room temperature Download PDFInfo
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- CN102504742B CN102504742B CN201110340344.3A CN201110340344A CN102504742B CN 102504742 B CN102504742 B CN 102504742B CN 201110340344 A CN201110340344 A CN 201110340344A CN 102504742 B CN102504742 B CN 102504742B
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- component
- coupling agent
- room temperature
- promotor
- bonded adhesives
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- Adhesives Or Adhesive Processes (AREA)
- Epoxy Resins (AREA)
Abstract
The invention discloses bonding glue quickly solidified at room temperature, which comprises bisphenol-A epoxy resin, glycidyl ester resin, amine hardener, imidazole, coupling agent and accelerator. Firstly, the bisphenol-A epoxy resin and the glycidyl ester resin are proportionally mixed into a component A; secondly, the amine hardener, the imidazole, the coupling agent and the accelerator are well mixed into a component B; and thirdly, the component A and the component B are well mixed into the bonding glue quickly solidified. The processes are all performed at the normal temperature and under normal pressure. The bonding glue has good adhesion property within room-temperature shelf life and an initial solidifying time, and is applicable to batch production, and work efficiency is improved.
Description
Technical field
The invention belongs to a kind of tackiness agent, be specifically related to a kind of room temperature fast-curing bonded adhesives that uses at the high speed rotating machine.
Background technology
Use at bonded adhesives a plurality of positions in the high speed rotating machine, mainly plays bonding effect.Along with the increasing of high speed rotating machine production lot and the adjustment of production technique, now on man-hour, work efficiency, can not satisfy the demand of actual production fully with glue, therefore, the demand that adapts to production, needing that development is a kind of can the shorter time self-vulcanizing, simultaneously, the bonded adhesives that satisfies the demands such as adhesiveproperties and processing performance.
Summary of the invention
The present invention proposes in order to overcome the shortcoming that exists in the prior art, and its objective is provides a kind of room temperature fast-curing bonded adhesives preparation method.
Technical scheme of the present invention is: a kind of room temperature fast-curing bonded adhesives, and its preparation method may further comprise the steps:
(i) comprise following component by weight percentage:
Bisphenol A type epoxy resin 48%～67%
Racemic glycidol esters resin 3%～12%
Amine curing agent 18%～30%
Imidazoles 3%～7%
Coupling agent 1.5%～3%
Promotor 2%～3%
(ⅱ) by said components bisphenol A type epoxy resin and Racemic glycidol esters resin are mixed and be prepared into the A component, amine curing agent, imidazoles, silane coupling agent and tertiary amines promotor mixed be prepared into the B component, then A component and B component are mixed and be prepared into the fast setting bonded adhesives;
Above steps is all carried out under normal temperature and normal pressure.
Bisphenol A type epoxy resin wherein is E-44 Resins, epoxy, and Racemic glycidol esters resin wherein is 711 Resins, epoxy, and amine curing agent wherein is low molecular polyamides, and coupling agent wherein is silane coupling agent, and promotor wherein is tertiary amines promotor.
Amine curing agent wherein is 600 type polyamide resins, and coupling agent wherein is the KH-550 silane coupling agent, and promotor wherein is DMP-30 promotor.
Have good adhesiveproperties in bonded adhesives of the present invention working life at room temperature and first set time, be suitable for producing in batches, improved working efficiency.
Embodiment
Below, in conjunction with the embodiments room temperature fast-curing bonded adhesives of the present invention is elaborated:
A kind of room temperature fast-curing bonded adhesives, its preparation method may further comprise the steps:
(i) comprise following component by weight percentage:
Bisphenol A type epoxy resin 48%～67%
Racemic glycidol esters resin 3%～12%
Amine curing agent 18%～30%
Imidazoles 3%～7%
Coupling agent 1.5%～3%
Promotor 2%～3%
(ⅱ) by said components bisphenol A type epoxy resin and Racemic glycidol esters resin are mixed and be prepared into the A component, amine curing agent, imidazoles, silane coupling agent and tertiary amines promotor mixed be prepared into the B component, then A component and B component are mixed and be prepared into the fast setting bonded adhesives;
Above steps is all carried out under normal temperature and normal pressure.
During preparation such as room temperature be lower than 30 ℃, resin can be put into 40 ℃～50 ℃ of air dry ovens heating half an hour to one hour down, increase its flowability, raw material mixes when being beneficial to prepare.
Bisphenol A type epoxy resin wherein is E-44 Resins, epoxy, and Racemic glycidol esters resin wherein is 711 Resins, epoxy, and amine curing agent wherein is low molecular polyamides, and coupling agent wherein is silane coupling agent, and promotor wherein is tertiary amines promotor.
Amine curing agent wherein is 600 type polyamide resins, and coupling agent wherein is the KH-550 silane coupling agent, and promotor wherein is DMP-30 promotor.
Room temperature fast-curing bonded adhesives of the present invention can adopt the method for conventional coating to be coated with, for example convenient and equably this bonded adhesives is applied in the high-speed rotating machine component surface by craft or automated method, form glue-line through self-vulcanizing again, the about 0.1mm of glue-line mean thickness, this glue-line has good mechanical performance, thermotolerance etc., and it is bonding to can be used for part.
Embodiment 1
Under normal temperature and normal pressure, each component by appointment in the table 1 is incorporated in E-44 Resins, epoxy in 711 Resins, epoxy respectively, is uniformly dispersed with dispersion machine, obtains component A.
600 type polyamide resins, imidazoles, KH-550 silane coupling agent and DMP-30 promotor promotor are mixed, obtain B component.
After component A and B component mixing and stirring, coat on the base material, and at room temperature solidify, thereby obtain the glue-line that thickness is 0.1mm.Working life, first set time and the tensile shear strength of test glue layer have been listed test result in table 1.
Embodiment 2
Press the method for each component concentration repetition embodiment 1 of appointment in the table 1, but the embodiment 2 that each component ratio is pressed in the table 1 is listed, has listed test result in table 1.
Embodiment 3
Press the method for each component concentration repetition embodiment 1 of appointment in the table 1, but the embodiment 3 that each component ratio is pressed in the table 1 is listed, has listed test result in table 1.
Table 1
In embodiment and the Comparative Examples, the working life of bonded adhesives and the first curing speed of representing said composition set time, this numerical value is more little, illustrates that curing speed is more fast; Represent the bonding force of glue-line and matrix with tensile shear strength, this numerical value is more high, illustrates that glue-line and basal body binding force are more good.
Have good adhesiveproperties in bonded adhesives of the present invention working life at room temperature and first set time, be suitable for producing in batches, improved working efficiency.
Claims (3)
1. room temperature fast-curing bonded adhesives, it is characterized in that: its preparation method may further comprise the steps:
(i) comprise following component by weight percentage:
Wherein, described bisphenol A type epoxy resin is E-44 Resins, epoxy, and described Racemic glycidol esters resin is 711 Resins, epoxy, and described amine curing agent is lower molecular weight 600 type polyamide resins;
(ⅱ) by said components bisphenol A type epoxy resin and Racemic glycidol esters resin are mixed and be prepared into the A component, amine curing agent, imidazoles, silane coupling agent and tertiary amines promotor mixed be prepared into the B component, then A component and B component are mixed and be prepared into the fast setting bonded adhesives;
Above steps is all carried out under normal temperature and normal pressure.
2. room temperature fast-curing bonded adhesives according to claim 1, it is characterized in that: described coupling agent is silane coupling agent, described promotor is tertiary amines promotor.
3. room temperature fast-curing bonded adhesives according to claim 1, it is characterized in that: described coupling agent is the KH-550 silane coupling agent, described promotor is DMP-30 promotor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110340344.3A CN102504742B (en) | 2011-11-02 | 2011-11-02 | Bonding glue quickly solidified at room temperature |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110340344.3A CN102504742B (en) | 2011-11-02 | 2011-11-02 | Bonding glue quickly solidified at room temperature |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102504742A CN102504742A (en) | 2012-06-20 |
| CN102504742B true CN102504742B (en) | 2013-08-28 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110340344.3A Expired - Fee Related CN102504742B (en) | 2011-11-02 | 2011-11-02 | Bonding glue quickly solidified at room temperature |
Country Status (1)
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| CN (1) | CN102504742B (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102898989A (en) * | 2012-09-25 | 2013-01-30 | 苏州汾湖电梯有限公司 | Epoxy adhesive drying rapidly at room temperature |
| CN103333623B (en) * | 2013-06-27 | 2014-05-28 | 烟台德邦科技有限公司 | Hot-pressed adhesive film and preparation method thereof |
| CN107828360A (en) * | 2017-11-16 | 2018-03-23 | 西安长峰机电研究所 | A kind of normal temperature cure solid rocket motor nozzle structural adhesive |
| CN110746854B (en) * | 2019-11-08 | 2021-11-30 | 核工业理化工程研究院 | Room temperature fast curing coating with high infrared radiation coating as cured product and preparation method thereof |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1197098A (en) * | 1997-04-24 | 1998-10-28 | 中国科学院低温技术实验中心 | Low temp. adhesive and firming agent used for low temp. adhesive |
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2011
- 2011-11-02 CN CN201110340344.3A patent/CN102504742B/en not_active Expired - Fee Related
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| Publication number | Publication date |
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| CN102504742A (en) | 2012-06-20 |
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