CN105647432A - Fast setting epoxy system for bonding engineering plastic and preparing method of fast setting epoxy system - Google Patents
Fast setting epoxy system for bonding engineering plastic and preparing method of fast setting epoxy system Download PDFInfo
- Publication number
- CN105647432A CN105647432A CN201610042039.9A CN201610042039A CN105647432A CN 105647432 A CN105647432 A CN 105647432A CN 201610042039 A CN201610042039 A CN 201610042039A CN 105647432 A CN105647432 A CN 105647432A
- Authority
- CN
- China
- Prior art keywords
- component
- epoxy system
- engineering plastics
- curable epoxy
- fast setting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J121/00—Adhesives based on unspecified rubbers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/5006—Amines aliphatic
- C08G59/5013—Amines aliphatic containing more than seven carbon atoms, e.g. fatty amines
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
Abstract
The invention relates to the technical field of high polymer material application, and discloses a fast setting epoxy system for bonding engineering plastic and a preparing method of the fast setting epoxy system. The fast setting epoxy system for bonding engineering plastic is prepared from monofunctional epoxy resin, multifunctional acrylic, polyamine-modified epoxy resin, fatty amine polyamine, a tertiary amine accelerator and non-chelation anion metal salt. All the components are optimized and combined so as to complement each other in performance and are in synergic cooperation to form the double-component epoxy resin system superior in comprehensive performance. The preparing method of the fast setting epoxy system comprises the steps that all the raw materials are mixed according to the corresponding mass percentage and heated to obtain a component A and a component B, and then the component A and the component B are smeared to engineering plastic for bonding according to the corresponding mass percentage. By means of the fast setting epoxy system for bonding engineering plastic and the preparing method of the fast setting epoxy system, the peel resistance strength of epoxy glue to engineering plastic is obviously improved, the setting time is shortened, the pungent odor of acrylic is reduced, and the bonding quality of engineering plastic is improved.
Description
Technical field
The present invention relates to macromolecular material applied technical field, in particular to fast setting, a kind of fast curable epoxy system for the engineering plastics that bond possessing high-adhesive-strength and preparation method thereof.
Background technology
Along with the development of plastics industry, various model engineering plastic materials continue to bring out, and its driving force mostlys come from auto industry and consumer electronics industry, frequently weeding out the old and bring forth the new of such as notebook computer, panel computer, smart mobile phone etc. Therefore, how by these engineering plastic materials in packaging technology process effectively bonding, to adapt to high efficiency, the demand of high production processing procedure, become the problem that instantly should solve.
Bicomponent structure glue is of many uses in bonding application, and it is a kind of normal temperature storage, system solvent-free, easy to use, has the adhesive property of excellence.
Such as acrylic and polyurethane two-component structure glue just have good adhesive property, but volatilize pungent taste in use, as quencher, oxygen can cause that porous media (such as plastics) adhesive solidification is incomplete, be unsuitable for dust free room scale and assemble; Polyurethane is again to moisture-sensitive; Although acrylic and polyurethane two-component structure glue system can fast setting, but non-refractory.
The firming agent of dual-component structural adhesive of epoxy resin is substantially based on amine, and the curing rate of these systems is slower, it usually needs within several hours, just can start to solidify.
Summary of the invention
It is an object of the invention to provide a kind of fast curable epoxy system for the engineering plastics that bond and preparation method thereof; slower to solve conventional epoxy bicomponent structure adhesive curing speed; it is pungent that bi-component glue taste is made every effort to overcome in Asia; it is unsuitable for dust free room scale assembling and polyurethane two-component structure glue to moisture-sensitive, the problem causing adhesive strength poor stability.
For solving the problems referred to above, the technical solution used in the present invention is:
A kind of fast curable epoxy system for the engineering plastics that bond, it includes the mass ratio of component A and B component, component A and B component is 1-4:1;
Wherein in component A, the mass percentage content of each raw material is:
Epoxy resin 10-50%, toughener 5-25%, cross-linking agent 0.1-2%, diluent 1-20%, acrylic 1-25%, polyurethane 1-20%, reinforcer 1-15%;
In B component, the mass percentage content of each raw material is:
Aliphatic amine polyamine 20-60%, epoxy-aliphatic amine copolymer 1 0-30%, toughener 5-20%, non-chelated anionic metal calcium salt 1-8%, tertiary amine accelerator 1-10%, reinforcer 1-20%.
Preferably, described epoxy resin one or more combinations in following epoxy resin:
Epoxy resin DER331: its epoxide equivalent is 182-192g/eq, viscosity when 25 DEG C is 11000-15000cps;
Or epoxy resin JER983U: its epoxide equivalent is 165-185g/eq, viscosity when 25 DEG C is 3000-7000cps;
Or Polyurethane modified epoxy EPU-78-13S: its epoxide equivalent is 210g/eq, viscosity when 25 DEG C is 25000-35000cps.
Preferably, described toughener is that one or more in core shell rubbers MX267 or block copolymer XMB301 or end carboxyl liquid nitrile rubber Hypro1300X13CTBN combine.
Preferably, described acrylic is that one or more in multifunctional acrylate Mcure100 or multifunctional acrylate Mcure200 or multifunctional acrylate Mcure300 or multifunctional acrylate Mcure400 combine.
Preferably, described diluent is that one or more in the polyhydric alcohol containing 3-oxobutanoic acid esters functional group or tertiary butyl glycidyl ether combine.
Preferably, described aliphatic amine polyamine is 4,7,10-tri-oxygen-1, and 13-tridecane diamine or one or more in polyether diamine Ancamine1922A combine.
Preferably, described non-chelated anionic metal calcium salt be calcium nitrate, calcium chloride, aliphatic sulfonic calcium one or more.
Preferably, described reinforcer is one or more the combination in triple superphosphate or silicon calcium chlorate or silica fibre or aerosil.
Preferably, in described reinforcer, the mass percentage content of each raw material is: triple superphosphate 1-12%, silicon calcium chlorate 1-10%, silica fibre 1-8%, aerosil 0.1-3%.
The preparation method of above-mentioned a kind of fast curable epoxy system for the engineering plastics that bond, comprises the following steps:
(a) according to component A epoxy resin, toughener, cross-linking agent, diluent, acrylic, polyurethane mass percentage content weigh, put in plastic tank, stirring deaeration machine on stir;
B () adds reinforcer, be uniformly mixed, namely obtain component A;
C () will weigh after aliphatic amine polyamine is heated to 70 DEG C according to the mass percentage content of aliphatic amine polyamine in B component, under nitrogen protection stirring, it is gradually added epoxy-aliphatic amine copolymer, allow its polyreaction 1 hour, and keep temperature stabilization at 70 DEG C;
D () adds non-chelated anionic metal calcium salt after the polyreaction described in step (c) completes in reactant, stirring is until it all dissolves; When reducing the temperature to 40 DEG C, add tertiary amine accelerator and stir; Add reinforcer, be uniformly mixed, namely obtain B component;
E () namely can be used for the bonding of engineering plastics according to the ratio that mass ratio is 1-4:1 after the component A prepared by step (b) and the B component prepared by step (d) being mixed.
The invention have the benefit that
A kind of fast curable epoxy system for the engineering plastics that bond of the present invention, comprise: the epoxy resin of simple function, the acrylic of function groups, the epoxy resin that Polyurethane is modified, aliphatic amine polyamine, tertiary amine accelerator and non-chelated anionic metal salt, by each component is optimized combination, thus can performance complement, coordinated forms the two component epoxy system that combination property is superior, significantly improve the epoxy glue peel strength to engineering plastics, shorten hardening time, reduce the penetrating odor of acrylic, improve the bond quality of engineering plastics.
Detailed description of the invention
Embodiment 1
A kind of fast curable epoxy system for the engineering plastics that bond, it includes the mass ratio of component A and B component, component A and B component is 2:1;
Wherein in component A, the mass percentage content of each raw material is:
In B component, the mass percentage content of each raw material is:
The preparation method of above-mentioned a kind of fast curable epoxy system for the engineering plastics that bond, comprises the following steps:
(a) according to component A epoxy resin, toughener, cross-linking agent, diluent, acrylic, polyurethane mass percentage content weigh, put in plastic tank, stirring deaeration machine on stir;
B () adds dicalcium powder, after being uniformly mixed, add aerosil, be uniformly mixed, namely obtain component A;
C () will weigh after aliphatic amine polyamine is heated to 70 DEG C according to the mass percentage content of aliphatic amine polyamine in B component, under nitrogen protection stirring, it is gradually added epoxy-aliphatic amine copolymer, allow its polyreaction 1 hour, and keep temperature stabilization at 70 DEG C;
D () adds non-chelated anionic metal calcium salt after the polyreaction described in step (c) completes in reactant, stirring is until it all dissolves; When reducing the temperature to 40 DEG C, add tertiary amine accelerator and stir; Add dicalcium powder, after being uniformly mixed, add aerosil, be uniformly mixed, namely obtain B component;
E () namely can be used for the bonding of engineering plastics according to the ratio that mass ratio is 2:1 after the component A prepared by step (b) and the B component prepared by step (d) being mixed.
Embodiment 2
A kind of fast curable epoxy system for the engineering plastics that bond, it includes the mass ratio of component A and B component, component A and B component is 2:1;
Wherein in component A, the mass percentage content of each raw material is:
In B component, the mass percentage content of each raw material is:
The preparation method of above-mentioned a kind of fast curable epoxy system for the engineering plastics that bond is with the method described in embodiment 1.
Comparative experiments example 1 (without polyurethane modified epoxy resin)
A kind of fast curable epoxy system for the engineering plastics that bond, it includes the mass ratio of component A and B component, component A and B component is 2:1;
Wherein in component A, the mass percentage content of each raw material is:
In B component, the mass percentage content of each raw material is:
The preparation method of above-mentioned a kind of fast curable epoxy system for the engineering plastics that bond is with the method described in embodiment 1.
Comparative experiments example 2 (without acrylic multifunctional acrylate Mcure400)
A kind of fast curable epoxy system for the engineering plastics that bond, it includes the mass ratio of component A and B component, component A and B component is 2:1;
Wherein in component A, the mass percentage content of each raw material is:
In B component, the mass percentage content of each raw material is:
The preparation method of above-mentioned a kind of fast curable epoxy system for the engineering plastics that bond is with the method described in embodiment 1.
Comparative experiments example 3 (without 3-ketobutyric acid ester polyol)
A kind of fast curable epoxy system for the engineering plastics that bond, it includes the mass ratio of component A and B component, component A and B component is 2:1;
Wherein in component A, the mass percentage content of each raw material is:
In B component, the mass percentage content of each raw material is:
The preparation method of above-mentioned a kind of fast curable epoxy system for the engineering plastics that bond is with the method described in embodiment 1.
1. test hardening time
The epoxy systems in this invention setting time under room temperature (25 DEG C) is by testing with controlled strain type flow graph. Component A prepared by above-described embodiment 1, embodiment 2, comparative test example 1, comparative experiments example 2, comparative experiments example 3, B component are tested after 2:1 mix homogeneously with mass ratio, all measuring samples are placed on 25 millimeters of parallel disks of diameter, and gap thickness is 0.5 millimeter. Measuring condition: dynamic mode (1Hz), starting point is from 5% pulling force. Automatic tension and automatic pulling force arrange and are used for controlling measurement process intermediate gap and torsion. Gel time is defined as when G ' value is more than G " value time position, cross point time.
Upper table number is it was demonstrated that 3-ketobutyric acid ester polyol, non-chelated anionic metal calcium salt are in conjunction with the functional consolidation effect serving intensifier ring oxygen system of polyamine, rather than the effect of simple function compound.
Fast curable epoxy system in this invention also has the feature being rapidly achieved working strength. With embodiment 1, wiping one's face, to amass be 25 �� 12mm2Aluminium sheet, its bonding thickness controls with 0.1 millimeter of tinsel, and the shear strength data under different time interval are as follows:
| Time (minute) | 10 | 15 | 20 | 25 | 30 |
| Shear strength (MPa) | 0.01 | 0.05 | 0.29 | 0.31 | 0.35 |
Embodiment of the present invention just can reach the working strength of 0.35MPa in 30 minutes as can be seen from the above table.
2. adhesion strength test
By the component A prepared by above-described embodiment 1, embodiment 2, comparative test example 1, comparative experiments example 2, comparative experiments example 3, B component with mass ratio for 2:1 mix homogeneously, being applied to respectively on engineering plastic PC/ABS and IXEF test board that electronic product uses, application area is 25 �� 12mm2, and pressurize with structural clips, it being placed in baking oven and solidify, carry out shear strength test afterwards, test result is as shown in the table.
| Title material | Embodiment 1 | Embodiment 2 | Comparative experiments 1 | Comparative experiments 2 | Comparative experiments 3 |
| PC/ABS | Test board ruptures | Test board ruptures | 465 | 498 | Test board ruptures |
| IXEF | 912 | Test board ruptures | 765 | 678 | 902 |
The fast curable epoxy system for the engineering plastics that bond that as can be seen from the above table prepared by embodiment of the present invention, cooperation by each component, satisfactory result can be reached in bonding engineering plastics, thus it is crisp to overcome conventional epoxy system colloidality, to the defect such as plastic bonding peel strength is weak, and the cold curing time is short, it is beneficial to raising consumer electronics packaging efficiency, meets production demand.
Claims (10)
1., for a fast curable epoxy system for the engineering plastics that bond, it includes the mass ratio of component A and B component, component A and B component is 1-4:1; Wherein in component A, the mass percentage content of each raw material is: epoxy resin 10-50%, toughener 5-25%, cross-linking agent 0.1-2%, diluent 1-20%, acrylic 1-25%, polyurethane 1-20%, reinforcer 1-15%; In B component, the mass percentage content of each raw material is: aliphatic amine polyamine 20-60%, epoxy-aliphatic amine copolymer 1 0-30%, toughener 5-20%, non-chelated anionic metal calcium salt 1-8%, tertiary amine accelerator 1-10%, reinforcer 1-20%.
2. a kind of fast curable epoxy system for the engineering plastics that bond according to claim 1, it is characterized in that: described epoxy resin one or more combination: epoxy resin DER331: its epoxide equivalent is 182-192g/eq in following epoxy resin, 250Viscosity during C is 11000-15000cps; Or epoxy resin JER983U: its epoxide equivalent is 165-185g/eq, 250Viscosity during C is 3000-7000cps; Or Polyurethane modified epoxy EPU-78-13S: its epoxide equivalent is 210g/eq, 250Viscosity during C is 25000-35000cps.
3. a kind of fast curable epoxy system for the engineering plastics that bond according to claim 1 and 2, it is characterised in that: described toughener is that one or more in core shell rubbers MX267 or block copolymer XMB301 or end carboxyl liquid nitrile rubber Hypro1300X13CTBN combine.
4. a kind of fast curable epoxy system for the engineering plastics that bond according to claim 3, it is characterised in that: described acrylic is that one or more in multifunctional acrylate Mcure100 or multifunctional acrylate Mcure200 or multifunctional acrylate Mcure300 or multifunctional acrylate Mcure400 combine.
5. a kind of fast curable epoxy system for the engineering plastics that bond according to claim 4, it is characterised in that: described diluent is that one or more in the polyhydric alcohol containing 3-oxobutanoic acid esters functional group or tertiary butyl glycidyl ether combine.
6. a kind of fast curable epoxy system for the engineering plastics that bond according to claim 5, it is characterized in that: described aliphatic amine polyamine is 4,7,10-tri-oxygen-1,13-tridecane diamine or one or more in polyether diamine Ancamine1922A combine.
7. a kind of fast curable epoxy system for the engineering plastics that bond according to claim 6, it is characterised in that: described non-chelated anionic metal calcium salt be calcium nitrate, calcium chloride, aliphatic sulfonic calcium one or more.
8. a kind of fast curable epoxy system for the engineering plastics that bond according to claim 7, it is characterised in that: described reinforcer is one or more the combination in triple superphosphate or silicon calcium chlorate or silica fibre or aerosil.
9. a kind of fast curable epoxy system for the engineering plastics that bond according to claim 7, it is characterized in that: in described reinforcer, the mass percentage content of each raw material is: triple superphosphate 1-12%, silicon calcium chlorate 1-10%, silica fibre 1-8%, aerosil 0.1-3%.
10. the preparation method of above-mentioned a kind of fast curable epoxy system for the engineering plastics that bond, comprises the following steps:
(a) according to component A epoxy resin, toughener, cross-linking agent, diluent, acrylic, polyurethane mass percentage content weigh, put in plastic tank, stirring deaeration machine on stir;
B () adds reinforcer, be uniformly mixed, namely obtain component A;
C () will weigh aliphatic amine polyamine according to the mass percentage content of aliphatic amine polyamine in B component and be heated to 700After C, under nitrogen protection stirring, it is gradually added epoxy-aliphatic amine copolymer, allows its polyreaction 1 hour, and keep temperature stabilization 700C;
D () adds non-chelated anionic metal calcium salt after the polyreaction described in step (c) completes in reactant, stirring is until it all dissolves; Reduce the temperature to 400During C, add tertiary amine accelerator and stir;Add reinforcer, be uniformly mixed, namely obtain B component;
E () namely can be used for the bonding of engineering plastics according to the ratio that mass ratio is 1-4:1 after the component A prepared by step (b) and the B component prepared by step (d) being mixed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610042039.9A CN105647432A (en) | 2016-01-21 | 2016-01-21 | Fast setting epoxy system for bonding engineering plastic and preparing method of fast setting epoxy system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610042039.9A CN105647432A (en) | 2016-01-21 | 2016-01-21 | Fast setting epoxy system for bonding engineering plastic and preparing method of fast setting epoxy system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105647432A true CN105647432A (en) | 2016-06-08 |
Family
ID=56487756
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610042039.9A Pending CN105647432A (en) | 2016-01-21 | 2016-01-21 | Fast setting epoxy system for bonding engineering plastic and preparing method of fast setting epoxy system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105647432A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107722885A (en) * | 2017-10-26 | 2018-02-23 | 东莞市科惠工业材料有限公司 | A kind of acrylic bathtub docking adhesive and its application |
| JP2018518554A (en) * | 2015-04-30 | 2018-07-12 | ヘンケル・アクチェンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト・アウフ・アクチェンＨｅｎｋｅｌ ＡＧ ＆ Ｃｏ． ＫＧａＡ | One-component curable adhesive composition and use thereof |
| CN111777977A (en) * | 2020-07-22 | 2020-10-16 | 北京高盟新材料股份有限公司 | Room-temperature fast-curing transparent epoxy adhesive for bonding engineering plastics and preparation method thereof |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0527706A1 (en) * | 1991-08-12 | 1993-02-17 | Ciba-Geigy Ag | High performance epoxy adhesive composition with high flexibility and toughness |
| CN103068946A (en) * | 2010-08-10 | 2013-04-24 | 3M创新有限公司 | Epoxy structural adhesive |
| CN103305170A (en) * | 2012-03-16 | 2013-09-18 | 比亚迪股份有限公司 | Bi-component adhesive composition and preparation method thereof |
| CN104479607A (en) * | 2014-12-31 | 2015-04-01 | 烟台泰盛精化科技有限公司 | Low-stress transparent epoxy resin adhesive capable of curing fast at room temperature |
| CN105062395A (en) * | 2015-08-21 | 2015-11-18 | 广州市白云化工实业有限公司 | Two-component epoxy glue and preparation method thereof |
-
2016
- 2016-01-21 CN CN201610042039.9A patent/CN105647432A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0527706A1 (en) * | 1991-08-12 | 1993-02-17 | Ciba-Geigy Ag | High performance epoxy adhesive composition with high flexibility and toughness |
| CN103068946A (en) * | 2010-08-10 | 2013-04-24 | 3M创新有限公司 | Epoxy structural adhesive |
| CN103305170A (en) * | 2012-03-16 | 2013-09-18 | 比亚迪股份有限公司 | Bi-component adhesive composition and preparation method thereof |
| CN104479607A (en) * | 2014-12-31 | 2015-04-01 | 烟台泰盛精化科技有限公司 | Low-stress transparent epoxy resin adhesive capable of curing fast at room temperature |
| CN105062395A (en) * | 2015-08-21 | 2015-11-18 | 广州市白云化工实业有限公司 | Two-component epoxy glue and preparation method thereof |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018518554A (en) * | 2015-04-30 | 2018-07-12 | ヘンケル・アクチェンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト・アウフ・アクチェンＨｅｎｋｅｌ ＡＧ ＆ Ｃｏ． ＫＧａＡ | One-component curable adhesive composition and use thereof |
| CN107722885A (en) * | 2017-10-26 | 2018-02-23 | 东莞市科惠工业材料有限公司 | A kind of acrylic bathtub docking adhesive and its application |
| CN111777977A (en) * | 2020-07-22 | 2020-10-16 | 北京高盟新材料股份有限公司 | Room-temperature fast-curing transparent epoxy adhesive for bonding engineering plastics and preparation method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105647432A (en) | Fast setting epoxy system for bonding engineering plastic and preparing method of fast setting epoxy system | |
| CN103436212B (en) | Room-temperature-curing structural adhesive for composite plates | |
| CN107189732B (en) | A kind of high durable thermoplastic polyolefin water-proof coiled material hot-fusible pressure-sensitive adhesive and preparation method thereof | |
| CN101613586A (en) | A kind of reaction type polyurethane hot-melt adhesive and preparation method thereof | |
| CN105567145A (en) | Double-component structural adhesive and preparation method thereof | |
| CN105885739A (en) | Water-based adhesive and preparation method thereof | |
| CN102250320A (en) | Preparation method of modified epoxy resin curing agent and epoxy varnish paint | |
| CN103923557A (en) | Special prime coat for spraying polyurea elastomer and preparation method of special prime coat | |
| CN112795350B (en) | Oil-acid-resistant reactive polyurethane hot melt adhesive | |
| CN103113819A (en) | Primer coating for polyurethane sealant and preparation method thereof | |
| CN107674629A (en) | A kind of single-component moisture curing polyurethane furniture edge sealing glue and preparation method thereof | |
| CN104449508A (en) | Flexible epoxy structural adhesive and preparation method thereof | |
| CN104205236A (en) | Wash-off resistant epoxy adhesive composition and pre-gelled adhesive | |
| CN103333623B (en) | Hot-pressed adhesive film and preparation method thereof | |
| CN108102596A (en) | PU structural adhesive that a kind of working life is long, intensity rising is fast and preparation method thereof | |
| CN102977830B (en) | Epoxy resin adhesive and preparation method and applications thereof | |
| CN102796474A (en) | Water-based adhesive and preparation method thereof | |
| CN105646838B (en) | A kind of preparation method of newtrex based polyurethanes performed polymer | |
| CN107286885B (en) | Anisotropic conductive adhesive film and preparation method thereof | |
| CN102504742B (en) | Bonding glue quickly solidified at room temperature | |
| CN109266296A (en) | A kind of anaerobic type structure glue and preparation method thereof | |
| CN108424731A (en) | A kind of preparation method of pressure sensitive adhesive | |
| CN104130739A (en) | Low stripping force PET (polyethylene terephthalate) protective film pressure sensitive adhesive and preparation method thereof | |
| CN103694937A (en) | Epoxy resin adhesive with fast curing speed and good mechanical properties | |
| CN103320077A (en) | Organosilicon modified high-strength polyester hot melt adhesive |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20160608 |