CN104087223A - Single-component shock-resistant low-viscosity structural adhesive and preparation method thereof - Google Patents
Single-component shock-resistant low-viscosity structural adhesive and preparation method thereof Download PDFInfo
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- CN104087223A CN104087223A CN201410329451.XA CN201410329451A CN104087223A CN 104087223 A CN104087223 A CN 104087223A CN 201410329451 A CN201410329451 A CN 201410329451A CN 104087223 A CN104087223 A CN 104087223A
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- shock resistance
- low viscosity
- epoxy resin
- structure glue
- component shock
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Abstract
The invention relates to a structural adhesive and particularly relates to a single-component shock-resistant low-viscosity structural adhesive and a preparation method thereof, wherein the single-component shock-resistant low-viscosity structural adhesive is suitable for bonding motors and other structures. The preparation method comprises the following steps of (1) mixing liquid epoxy resin (40-80 parts) and a toughening agent (7-15 parts), and stirring at the temperature of 15-30 DEG C for 1h; (2) adding a curing agent (9-13.5 parts) while stirring, and continuing to stir at the temperature of 15-30 DEG C for 1h until uniformly mixing; (3) adding an accelerant (7-8 parts) while stirring, and continuing to stir at the temperature of 15-30 DEG C for 0.5h until uniformly mixing; and (4) adding a coupling agent (0-0.5 part) and pigment (0-1 part), and stirring at the temperature of 15-30 DEG C for 1h until uniformly mixing. Compared with the prior art, the single-component shock-resistant low-viscosity structural adhesive has the advantages that the toughening agent used by the invention is polyether amine, so that the high adhesive strength and temperature resistance of an epoxy system are remained, the viscosity of the system is reduced, and the flexibility and impact resistance of the adhesive are improved. The single-component shock-resistant low-viscosity structural adhesive is low in viscosity, and the adhesive can be coated on elements which are small in bonding gap and not easy to coat through self-permeation, so that the work efficiency can be greatly increased. A synthesis reaction process is simple, easy to operate and low in cost, and a product is wide in application range.
Description
Technical field
The present invention relates to structure glue, relate in particular to a kind of single-component shock resistance low viscosity structure glue and preparation method thereof, be applicable to the structures such as motor bonding.
Background technology
Most is all made up of two components for the bonding structure glue of electric machine structure, if publication number is 102977802A, name is called a kind of Chinese invention patent of the acrylic ester structure adhesive that does not corrode copper, be applied to association area as the publication number of building field be CN101709208A, name is called the building structure gluing agent that a kind of impact and peeling strength is high, publication number is CN10724368A, name is called a kind of anti-impact epoxy structural rubber, these structure glue have good toughness, good shock resistance, but owing to needing that in use two-pack is mixed by a certain percentage, single-component glue complex operation relatively, efficiency is lower, importantly due to the difference of the technology of workmen own and sense of responsibility, cause the ratio of two-pack unstable, affect the consistence of quality product.The toughness reinforcing great majority of these sizing agents are selected the toughner of modified rubber simultaneously, nucleocapsid microcapsule toughner, and the toughner viscosity of these several classes is relatively high, and expensive.Reduce system viscosity and can add non-activated thinner, can reduce again heat resistance and bonding strength.
Summary of the invention
The object of the invention is to overcome the deficiency of above-mentioned prior art, a kind of single-component shock resistance low viscosity structure glue is provided.Mainly solve existing bicomponent structural adhesive capacity high, the problem that fragility is large.Another object of the present invention is to provide a kind of making method of single-component shock resistance low viscosity structure glue.
In order to achieve the above object, the present invention is achieved in that this single-component shock resistance low viscosity structure glue, is made up unlike the prior art of the raw material that comprises following weight parts: liquid-state epoxy resin 40-80 part, toughner 2-20 part, solidifying agent 5-20 part, coupling agent 0-5, thinner 0-20 part and pigment 0-3 part.
The method of preparing this single-component shock resistance low viscosity structure glue is:
(1) liquid-state epoxy resin and toughened resin are mixed, stir 1 hour, control temperature at 15-30 DEG C;
(2) add while stirring solidifying agent, continue to stir 1 hour to mixing, control temperature at 15-30 DEG C;
(3) add coupling agent and pigment, stir 1 hour to mixing, control temperature at 15-30 DEG C.
(4) add while stirring solidifying agent, continue to stir 1 hour to mixing, control temperature at 15-30 DEG C;
What further, described toughner was selected is polyetheramine.
Described liquid-state epoxy resin is the combination of bisphenol A type epoxy resin, bisphenol f type epoxy resin, resol or bisphenol A type epoxy resin and bisphenol f type epoxy resin, or the combination of bisphenol A type epoxy resin and resol, or the combination of the combination of bisphenol f type epoxy resin and resol or bisphenol A type epoxy resin, bisphenol f type epoxy resin, resol.
Described solidifying agent is Dyhard RU 100 latent curing agent.
Described promotor is that promotor is ureas and derivative or amine and derivative thereof.
Described coupling agent is silane coupling agent.
Compared with prior art, the beneficial effect of product of the present invention is:
(1) toughner that shock resistance low viscosity structure glue of the present invention is used is polyetheramine, has retained high bonding force and the heat resistance of epoxy systems, has reduced again the viscosity of system, has improved snappiness and the shock resistance of glue.
(2) shock resistance low viscosity structure glue viscosity of the present invention is low, and for the little element that is difficult for gluing in bonding gap, glue can, by permeating and carry out applying glue voluntarily, can increase substantially working efficiency.
(3) preparation method's of the present invention feature is the simple easily operation of synthesis process, and cost is low, and product application is extensive.
Embodiment
Below in conjunction with specific embodiment, the present invention will be further described.According to formula of the present invention, prepare single-component shock resistance low viscosity structure glue by different proportionings:
Embodiment 1: join and following steps preparation single-component shock resistance low viscosity structure glue according to following table.
(1) 35g resol, 30g Bisphenol F resin EP-4901E, 18g toughner polyetheramine D2000 are mixed, stir 1 hour, control temperature at 15 DEG C-30 DEG C.
(2) add while stirring 9g dicy-curing agent, add rear continuation to stir 1 hour, control temperature at 15 DEG C-30 DEG C.
(3) add while stirring 7g benzyl dimethyl urea promotor, stir 0.5h, control temperature at 15 DEG C-30 DEG C.
(4) add 8g1,6-hexanediol diglycidyl ether thinner, 0.5gKH550 (γ aminopropyltriethoxy silane) coupling agent and 0.5g titanium dioxide, obtain shock resistance low viscosity structure glue.
Embodiment 2: join and following steps preparation single-component shock resistance low viscosity structure glue according to following table.
(1) 40g bisphenol A epoxide resin EPON828,10g Bisphenol F resin EP-4901E, 20g toughner polyetheramine D400 are mixed, stir 1 hour, control temperature at 15 DEG C-30 DEG C.
(2) add while stirring 9g dicy-curing agent, add rear continuation to stir 1 hour, control temperature at 15 DEG C-30 DEG C.
(3) add while stirring 8g Fuji chemistry 1020 latent amine promoters, stir 0.5h, control temperature at 15 DEG C-30 DEG C.
(4) add 0.5gKH560 (glycidoxy Trimethoxy silane) coupling agent and 0.5g titanium dioxide, obtain shock resistance low viscosity structure glue.
Embodiment 3: according to following table proportioning and according to embodiment 1 step preparation single-component shock resistance low viscosity structure glue.
Embodiment 4: according to following table proportioning and according to embodiment 1 step preparation single-component shock resistance low viscosity structure glue.
Embodiment 5: according to following table proportioning and according to embodiment 1 step preparation single-component shock resistance low viscosity structure glue.
Embodiment 6: increase toughness by nucleocapsid toughner, reduce viscosity by thinner, according to following proportioning and according to embodiment 1 step preparation single-component shock resistance low viscosity structure glue.
Embodiment 7: increase toughness by nucleocapsid toughner, reduce viscosity by thinner, according to following proportioning and according to embodiment 1 step preparation single-component shock resistance low viscosity structure glue.
Concrete testing method is as follows:
1, use the viscosity at 25 DEG C of Bush viscometer tests.
2, second-order transition temperature test: 150 DEG C, 10min solidifies, is used TMA test TG point.
3,150 DEG C of heatproof tests: 150 DEG C of curing 10min, place 30min heat in 150 DEG C of baking ovens and survey.
4, shock strength: solidify the sample of 10min at impacting 150 DEG C, test shock strength after 25 DEG C of placement 24h at 25 DEG C.
Test result is as following table:
| ? | Example 1 | Example 2 | Example 3 | Example 4 | Example 5 | Example 6 | Example 7 |
| Viscosity (mpa.s) | 3000 | 3200 | 2800 | 3000 | 2700 | 3300 | 4500 |
| TG(℃) | 102 | 90 | 95 | 98 | 100 | 80 | 90 |
| 150 DEG C of heatproofs (Mpa) | 6.5 | 5 | 5.5 | 6 | 5 | 3 | 4 |
| Shock strength (kj/ ㎡) | 48 | 47 | 45 | 46 | 45 | 40 | 42 |
Conventional structure adhesive capacity is high, poor toughness, and after reduction viscosity, heat resistance is not good, two component sizing agent operational difficultys, the present invention has avoided this point completely, adopts polyetheramine to reduce viscosity, increases the snappiness of system, retains heat resistance.
The above, it is only preferred embodiment of the present invention, not the present invention is done to any pro forma restriction, any simple modification, equivalent variations and modification that every foundation technical spirit of the present invention is done above embodiment, all still belong in the scope of technical solution of the present invention.
Claims (7)
1. a single-component shock resistance low viscosity structure glue, is characterized in that being made up of the raw material that comprises following weight parts: liquid-state epoxy resin 40-80 part, toughner 7-15 part, solidifying agent 9-13.5 part, promotor 7-8, coupling agent 0-0.5 and pigment 0-1 part.
2. the method for preparation described a kind of single-component shock resistance low viscosity structure glue claimed in claim 1, is characterized in that comprising following processing step:
(1) liquid-state epoxy resin and toughner are mixed, stir 1 hour, control temperature at 15-30 DEG C;
(2) add while stirring solidifying agent, continue to stir 1 hour to mixing, control temperature at 15-30 DEG C
(3) add while stirring promotor, continue to stir 0.5 hour to mixing, control temperature at 15-30 DEG C;
(4) add coupling agent and pigment, stir 1 hour to mixing, control temperature at 15-30 DEG C.
3. the preparation method of a kind of single-component shock resistance low viscosity structure glue according to claim 1 or this single-component shock resistance low viscosity structure glue claimed in claim 2, is characterized in that described toughner is polyetheramine.
4. the preparation method of a kind of single-component shock resistance low viscosity structure glue according to claim 1 or this single-component shock resistance low viscosity structure glue claimed in claim 2, it is characterized in that, described liquid-state epoxy resin is the combination of bisphenol A type epoxy resin, bisphenol f type epoxy resin, resol or bisphenol A type epoxy resin and bisphenol f type epoxy resin, or the combination of bisphenol A type epoxy resin and resol, or the combination of the combination of bisphenol f type epoxy resin and resol or bisphenol A type epoxy resin, bisphenol f type epoxy resin, resol.
5. the preparation method of a kind of single-component shock resistance low viscosity structure glue according to claim 1 or this single-component shock resistance low viscosity structure glue claimed in claim 2, is characterized in that described solidifying agent is Dyhard RU 100 latent curing agent.
6. the preparation method of a kind of single-component shock resistance low viscosity structure glue according to claim 1 or this single-component shock resistance low viscosity structure glue claimed in claim 2, is characterized in that described promotor is ureas and derivative or amine and derivative thereof.
7. the preparation method of a kind of single-component shock resistance low viscosity structure glue according to claim 1 or this single-component shock resistance low viscosity structure glue claimed in claim 2, is characterized in that described coupling agent is silane coupling agent.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201410329451.XA CN104087223A (en) | 2014-03-31 | 2014-07-11 | Single-component shock-resistant low-viscosity structural adhesive and preparation method thereof |
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| CN201410124243 | 2014-03-31 | ||
| CN201410124243.6 | 2014-03-31 | ||
| CN201410329451.XA CN104087223A (en) | 2014-03-31 | 2014-07-11 | Single-component shock-resistant low-viscosity structural adhesive and preparation method thereof |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105331316A (en) * | 2015-11-20 | 2016-02-17 | 烟台信友新材料股份有限公司 | One-component flexible epoxy adhesive and preparation method thereof |
| WO2016081376A1 (en) * | 2014-11-21 | 2016-05-26 | 3M Innovative Properties Company | Epoxy adhesive, automotive member, and method for manufacturing same |
| CN106928891A (en) * | 2015-12-30 | 2017-07-07 | 卡本复合材料（天津）有限公司 | A kind of high-strength adhesive of epoxies low temperature curing type |
| CN109233716A (en) * | 2018-09-12 | 2019-01-18 | 无锡海特新材料研究院有限公司 | A kind of aluminum honeycomb sandwich epoxy adhesive, preparation method and the application of high adhesion force |
| CN109321186A (en) * | 2018-10-15 | 2019-02-12 | 航天材料及工艺研究所 | It a kind of semi-solid preparation epoxy jelly membrane and preparation method thereof and uses |
| CN109439247A (en) * | 2018-09-26 | 2019-03-08 | 北京航空航天大学 | It is a kind of can the epoxyn that is recycled of low temperature and high/low temperature |
| CN113583604A (en) * | 2021-07-05 | 2021-11-02 | 东风汽车集团股份有限公司 | Low-viscosity high-impact-peel-strength structural adhesive and preparation method thereof |
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| CN1546590A (en) * | 2003-12-04 | 2004-11-17 | 四川大学 | Preparation method of room temperature cured high temperature tolerant flexible epoxy adhesive |
| CN101724368A (en) * | 2009-11-24 | 2010-06-09 | 烟台德邦科技有限公司 | Anti-impact epoxy structural rubber and preparation method thereof |
| CN101818037A (en) * | 2009-02-27 | 2010-09-01 | 汉高（中国）投资有限公司 | Room-temperature curing epoxy structural adhesive composition and preparation method thereof |
| CN102977828A (en) * | 2011-09-07 | 2013-03-20 | 蓝星(北京)化工机械有限公司 | High-efficient epoxy resin adhesive and preparation method and applications thereof. |
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| CN1546590A (en) * | 2003-12-04 | 2004-11-17 | 四川大学 | Preparation method of room temperature cured high temperature tolerant flexible epoxy adhesive |
| CN101818037A (en) * | 2009-02-27 | 2010-09-01 | 汉高（中国）投资有限公司 | Room-temperature curing epoxy structural adhesive composition and preparation method thereof |
| CN101724368A (en) * | 2009-11-24 | 2010-06-09 | 烟台德邦科技有限公司 | Anti-impact epoxy structural rubber and preparation method thereof |
| CN102977828A (en) * | 2011-09-07 | 2013-03-20 | 蓝星(北京)化工机械有限公司 | High-efficient epoxy resin adhesive and preparation method and applications thereof. |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016081376A1 (en) * | 2014-11-21 | 2016-05-26 | 3M Innovative Properties Company | Epoxy adhesive, automotive member, and method for manufacturing same |
| CN105331316A (en) * | 2015-11-20 | 2016-02-17 | 烟台信友新材料股份有限公司 | One-component flexible epoxy adhesive and preparation method thereof |
| CN105331316B (en) * | 2015-11-20 | 2017-08-15 | 烟台信友新材料股份有限公司 | A kind of one-component flexible epoxy adhesive and preparation method thereof |
| CN106928891A (en) * | 2015-12-30 | 2017-07-07 | 卡本复合材料（天津）有限公司 | A kind of high-strength adhesive of epoxies low temperature curing type |
| CN109233716A (en) * | 2018-09-12 | 2019-01-18 | 无锡海特新材料研究院有限公司 | A kind of aluminum honeycomb sandwich epoxy adhesive, preparation method and the application of high adhesion force |
| CN109439247A (en) * | 2018-09-26 | 2019-03-08 | 北京航空航天大学 | It is a kind of can the epoxyn that is recycled of low temperature and high/low temperature |
| CN109321186A (en) * | 2018-10-15 | 2019-02-12 | 航天材料及工艺研究所 | It a kind of semi-solid preparation epoxy jelly membrane and preparation method thereof and uses |
| CN113583604A (en) * | 2021-07-05 | 2021-11-02 | 东风汽车集团股份有限公司 | Low-viscosity high-impact-peel-strength structural adhesive and preparation method thereof |
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Address after: 264000 workshop No. 12, No. 3 middle Wolong Road, Zhifu District, Shandong, Yantai Applicant after: YANTAI SEAYU NEW MATERIALS CORP., LTD. Address before: 264000 workshop No. 12, No. 3 middle Wolong Road, Zhifu District, Shandong, Yantai Applicant before: Yantai Seayu Electronic Co., Ltd. |
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Application publication date: 20141008 |
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