CN106825978A - A kind of solder and welding method for welding for china with metal - Google Patents
A kind of solder and welding method for welding for china with metal Download PDFInfo
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- CN106825978A CN106825978A CN201710103807.1A CN201710103807A CN106825978A CN 106825978 A CN106825978 A CN 106825978A CN 201710103807 A CN201710103807 A CN 201710103807A CN 106825978 A CN106825978 A CN 106825978A
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- welding
- metal
- solder
- china
- ceramics
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- 229910052751 metal Inorganic materials 0.000 title claims abstract description 52
- 239000002184 metal Substances 0.000 title claims abstract description 52
- 238000003466 welding Methods 0.000 title claims abstract description 46
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 37
- 238000000034 method Methods 0.000 title claims abstract description 32
- 239000000919 ceramic Substances 0.000 claims abstract description 47
- 239000011521 glass Substances 0.000 claims abstract description 27
- 239000000463 material Substances 0.000 claims abstract description 18
- 239000000654 additive Substances 0.000 claims abstract description 16
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 14
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims abstract description 14
- WMWLMWRWZQELOS-UHFFFAOYSA-N bismuth(III) oxide Inorganic materials O=[Bi]O[Bi]=O WMWLMWRWZQELOS-UHFFFAOYSA-N 0.000 claims abstract description 8
- 229910052681 coesite Inorganic materials 0.000 claims abstract description 7
- 229910052906 cristobalite Inorganic materials 0.000 claims abstract description 7
- 239000000377 silicon dioxide Substances 0.000 claims abstract description 7
- 229910052682 stishovite Inorganic materials 0.000 claims abstract description 7
- 229910052905 tridymite Inorganic materials 0.000 claims abstract description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 20
- 239000010949 copper Substances 0.000 claims description 20
- 229910052802 copper Inorganic materials 0.000 claims description 20
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims description 11
- 229910052797 bismuth Inorganic materials 0.000 claims description 10
- 229910017083 AlN Inorganic materials 0.000 claims description 8
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 claims description 8
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 8
- 238000005476 soldering Methods 0.000 claims description 8
- 239000006071 cream Substances 0.000 claims description 7
- 239000000203 mixture Substances 0.000 claims description 7
- 239000002245 particle Substances 0.000 claims description 6
- RBNWAMSGVWEHFP-UHFFFAOYSA-N trans-p-Menthane-1,8-diol Chemical compound CC(C)(O)C1CCC(C)(O)CC1 RBNWAMSGVWEHFP-UHFFFAOYSA-N 0.000 claims description 6
- 235000019325 ethyl cellulose Nutrition 0.000 claims description 5
- 229920001249 ethyl cellulose Polymers 0.000 claims description 5
- 239000000843 powder Substances 0.000 claims description 5
- 239000004332 silver Substances 0.000 claims description 5
- 229910052709 silver Inorganic materials 0.000 claims description 5
- 239000001856 Ethyl cellulose Substances 0.000 claims description 4
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 claims description 4
- 229910052757 nitrogen Inorganic materials 0.000 claims description 4
- 230000003134 recirculating effect Effects 0.000 claims description 4
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 3
- 239000004411 aluminium Substances 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 239000002127 nanobelt Substances 0.000 claims description 3
- 239000002105 nanoparticle Substances 0.000 claims description 3
- 239000002070 nanowire Substances 0.000 claims description 3
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 3
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 2
- 230000008014 freezing Effects 0.000 claims description 2
- 238000007710 freezing Methods 0.000 claims description 2
- 239000001257 hydrogen Substances 0.000 claims description 2
- 229910052739 hydrogen Inorganic materials 0.000 claims description 2
- 239000011261 inert gas Substances 0.000 claims description 2
- 238000002156 mixing Methods 0.000 claims description 2
- 239000001913 cellulose Substances 0.000 claims 1
- 229920002678 cellulose Polymers 0.000 claims 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 claims 1
- 229910052574 oxide ceramic Inorganic materials 0.000 claims 1
- 239000011224 oxide ceramic Substances 0.000 claims 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 239000000126 substance Substances 0.000 abstract description 3
- 229910000416 bismuth oxide Inorganic materials 0.000 abstract description 2
- TYIXMATWDRGMPF-UHFFFAOYSA-N dibismuth;oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Bi+3].[Bi+3] TYIXMATWDRGMPF-UHFFFAOYSA-N 0.000 abstract description 2
- 230000003993 interaction Effects 0.000 abstract description 2
- 238000005245 sintering Methods 0.000 abstract description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 23
- 230000006872 improvement Effects 0.000 description 12
- 238000010992 reflux Methods 0.000 description 6
- 229910000510 noble metal Inorganic materials 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 238000005219 brazing Methods 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000002425 crystallisation Methods 0.000 description 2
- 230000008025 crystallization Effects 0.000 description 2
- 239000002071 nanotube Substances 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- 240000007594 Oryza sativa Species 0.000 description 1
- 235000007164 Oryza sativa Nutrition 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000004100 electronic packaging Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 229910001338 liquidmetal Inorganic materials 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000004021 metal welding Methods 0.000 description 1
- 235000012149 noodles Nutrition 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 235000009566 rice Nutrition 0.000 description 1
- 238000013517 stratification Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000010408 sweeping Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/19—Soldering, e.g. brazing, or unsoldering taking account of the properties of the materials to be soldered
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/16—Composite materials, e.g. fibre reinforced
Abstract
The invention provides a kind of solder and welding method for welding for china with metal, the solder for welding for china with metal is bi-based glass material, and the component and its mass percent that the bi-based glass material is included are Bi2O360 80%, B2O35 20%, ZnO 7 20%, remaining is trace additives；The trace additives include SiO2、TiO2, one or more in MgO.Technical scheme, chemical interaction based on metal Yu bismuth oxide, obtain bond strength higher, ceramics different from the past and the simple glassy bond of metal and the connection method of high temperature sintering, the method is simple, low cost, it is workable, for microdevice manufacture provides another practicable method.
Description
Technical field
It is the invention belongs to process for fabrication of semiconductor device technical field more particularly to a kind of for welding for china with metal
Solder and welding method.
Background technology
Ceramics have important application with the field of semiconductor manufacture that is connected to of metal.Ceramics are packaged with metal, are
By the important step of ceramic applications to electrical part.Produced heat is mainly and is covered by ceramics in high power density Electronic Packaging
Metallic plate is transmitted to shell and distributes, most commonly ceramic copper-clad, and current ceramic copper-clad plate mainly passes through high connductivity
Oxygen-free copper is bonded directly to ceramic surface and is formed at high temperature.It had both had high-termal conductivity, high electrical insulating properties, the machine high of ceramics
The characteristics such as tool intensity, low bulk, and the high conductivity with anaerobic copper metal and excellent welding performance, and can be as PCB circuits
Plate equally etches various figures, is the critical material of field of power electronics power module package connection chip and heat radiation substrate.
But this method high cost, and complex operation, are not easy to control.
Another ceramics are active metal brazing methods with the interconnection technique of metal, because it has applied widely, connection
Intensity is high, low production cost, high efficient and reliable the advantages of, and enjoy the favor of people.This method is generally using containing appropriate living
Property element special solder, be directly connected under vacuum ceramics and metal.In brazing process, the active element in solder exists
There is metallurgical reaction with ceramics under uniform temperature, formed at ceramics/solder interface certain thickness can be moistened by liquid metal solder
Wet transition zone, so as to realize the chemical bond of ceramics and metal.But the method commonly uses substantial amounts of silver, silver is in solder
In accounting more than 70%, it is with high costs.This method does not use noble metal, with low cost, and can reach bonding strength higher,
For the connection of ceramic copper-clad provides a kind of new method again.
But, the bond strength that the above method is obtained still has much room for improvement, and the former high cost, complex operation, inconvenience
In control.
The content of the invention
For above technical problem, the invention discloses a kind of solder and welding method for welding for china with metal,
The method breaches the conventional method for preparing ceramic copper-clad, reduces preparation cost.
In this regard, the technical solution adopted by the present invention is：
A kind of solder for welding for china with metal, it is bi-based glass material, component that the bi-based glass material is included and its
Mass percent is：Bi2O360-80%, B2O35-20%, ZnO 7-20%, remaining is trace additives；The micro addition
Element includes SiO2、TiO2, one or more in MgO.Technical scheme, using containing oxidation bi content high
Bi-based glass material is chemically reacted using bismuth glass crystallization under high temperature as Electroplating welding materials with metal so that welding solidification
Afterwards intensity higher is obtained between ceramics and metal.
As a further improvement on the present invention, the mass percent of the trace additives is 2 ~ 6%；Preferably, it is described
The mass percent of trace additives is 3 ~ 5%.
As a further improvement on the present invention, the component and its mass percent that it is included be：Bi2O365-75%, B2O3
8-18%, ZnO 10-16%, remaining is trace additives.The trace additives comprise at least SiO2、TiO2、MgO。
As a further improvement on the present invention, the profile of the solder for welding for china with metal be bulk, film,
Micro wire, micro belt, micron tube, micron particles, nano wire, nanobelt, nanotube or nano particle.
As a further improvement on the present invention, the ceramics are aluminium oxide ceramics, aluminium nitride ceramics or silicon nitride ceramics.
As a further improvement on the present invention, the metal is copper, aluminium or silver.For the metal more active than bismuth, using this
The technical scheme of invention, bismuth glass crystallization chemically reacts with metal under being conducive to high temperature, after solidification between ceramics and metal
Obtain the welding of higher intensity.
As a further improvement on the present invention, it uses following steps to prepare paste solder：By the bi-based glass
It is 10 ~ 50 μm of powder of particle diameter that material grinds, and is then 1 with mass ratio:（2~4）Ethyl cellulose and terpinol mixture prepare
Bismuth-containing glass cream must be made, the bi-based glass material is 7 with the mixing quality ratio of ethyl cellulose and the mixture of terpinol:3.
Present invention also offers a kind of welding method for welding for china with metal, it is used described in as above any one
The solder for welding for china with metal, by the solder for welding for china with metal be placed in ceramics and metal between enter
Row reflow soldering, the maximum temperature of the reflow soldering is 600-1000 DEG C.
As a further improvement on the present invention, the described solder for welding for china with metal can be bulk, film, micro-
The shapes such as rice noodles, micro belt, micron tube, micron particles, nano wire, nanobelt, nanotube or nano particle.
As a further improvement on the present invention, the ceramics are aluminium oxide ceramics, aluminium nitride ceramics or silicon nitride ceramics.
As a further improvement on the present invention, the metal is copper, aluminium or silver.
As a further improvement on the present invention, the reflow soldering includes scaling powder volatilization area, recirculating zone and freezing range,
The temperature of the recirculating zone is 500-1000 DEG C.
As a further improvement on the present invention, the reflow soldering is in air, vacuum, nitrogen, hydrogen or inert gas gas
Carried out in atmosphere.
Compared with prior art, beneficial effects of the present invention are：
Technical scheme, the chemical interaction based on metal Yu bismuth oxide, obtains bond strength higher, no
Ceramics in the past and the simple glassy bond of metal and the connection method of high temperature sintering are same as, the method is simple, and low cost is operable
Property it is strong, for microdevice manufacture provides another practicable method.
Brief description of the drawings
Fig. 1 is the grip device structural representation that potsherd and sheet metal are fixed in embodiment.In figure：1- pressing plates；2- holds
Microscope carrier；3- fixing nuts.
Fig. 2 is the grip device top view of embodiment 1.
Fig. 3 is the scanning electron microscope (SEM) photograph that aluminium oxide ceramics is connected with copper sheet in embodiment 1.
Fig. 4 is that bonding strength changes over time curve in embodiment 1.
The scanning electron microscope (SEM) photograph that Fig. 5 is connected for aluminium nitride ceramics in embodiment 2 with copper sheet.
Specific embodiment
Preferably embodiment of the invention is described in further detail below.
Refluxing unit used includes sample stationary fixture and reflow ovens in following examples, and the sample stationary fixture is preferred
Structure as depicted in figs. 1 and 2, the device include pressing plate 1, sample stage 2 and fastening bolt 3；Pressing plate 1 and sample stage 2 are by tight
Fixing bolt 3 is connected.
Above-mentioned sample stationary fixture is placed in reflow ovens, and high temperature reflux, prepared ceramics cover metal connecting structure.
Embodiment 1
A kind of solder for welding for china with metal, it is bi-based glass material, and its component for including and its mass percent are：
Bi2O370%, B2O315%, ZnO 12%, remaining is trace additives；The trace additives include SiO2、TiO2、
MgO, its mass percent is respectively 1%, 1%, 1%.
The solder for welding for china with metal is prepared paste solder using following steps：
It is 20 μm of powder of particle diameter that first the bi-based glass material is ground, and is then 1 with mass ratio:3 ethyl celluloses and terpinol
Mixture match somebody with somebody organic binder bond mixture be obtained, the bi-based glass material is mixed with the mixture of ethyl cellulose and terpinol
It is 7 to close mass ratio:3, it is made bismuth-containing glass cream.
It is welding raw material with the bismuth-containing glass cream for preparing, pure copper sheet and aluminium oxide ceramics are welding base metal.Pars intermedia
It is divided into bismuth-containing glass cream, top is copper sheet, bottom is alumina ceramic plate, copper sheet and aluminium oxide ceramics chip size be 5 × 5 ×
1mm.By on glass cream brush to the alumina ceramic plate, then copper sheet is covered on glass cream.
The sample of above-mentioned bonding is placed on the sample stage of fixture, fastening screw makes compressing tablet compress sample.Then, by fixture
It is placed in reflow ovens and sets reflux temperature as 700,800,850 and 900 DEG C respectively, nitrogen is led in reflux course, protects copper sheet
It is not oxidized, subsequent furnace cooling.
After by resulting ceramic copper-clad pattern handling, electronic microscope photos is scanned to it, fig. 3, it is shown that
Solder and ceramics there occurs metallurgical reaction, form a stratification compound；Compound is not formed between copper sheet and solder, but is leaned on
Nearly copper side, forms one layer of bismuth metal in solder, bismuth is formd with copper and combined closely.And copper surface is corroded to form groove by bismuth
Shape structure, also increases bond strength.Stretched experimental test, as shown in figure 4, the structure is in 850 DEG C of tensile strength maximums,
Up to 12MPa, illustrate that the method can effectively connect aluminium oxide ceramics and copper.With the direct-connected method of existing ceramic copper-clad（DBC）Phase
Than the method connection temperature only has 850 DEG C of 1060 DEG C much smaller than DBC；Active metal welding uses substantial amounts of noble metal
It is welding raw material, by comparison, the method does not use noble metal, and cost is very low；Simple glass sealing (bonding) resistance to compression is not
Tension, by comparison, the method has stronger tensile property, is better than glass sealing (bonding).
Embodiment 2
（1）From the structure in embodiment 1 as raw material matrix, aluminium oxide ceramics is changed to aluminium nitride ceramics, makes sample.
（2）Sample production method is similar with embodiment 1, and reflux temperature is 850 DEG C, nitrogen is led in reflux course, with stove
Cooling.
Sample is obtained through surface sweeping electron microscopic observation, as shown in figure 5, forming fine and close tissue, stretched experimental test, the knot
Structure tensile strength illustrates that the method can effectively connect aluminium nitride ceramics and copper also up to 10MPa.
Embodiment 3
On the basis of embodiment 1, the component and its mass percent that the bi-based glass material is included are：Bi2O380%, B2O3
7%, ZnO 9%, remaining is trace additives；The trace additives include SiO2、TiO2, MgO, its mass percent point
Wei 1%, 1%, 2%.The preparation method of the solder for welding for china with metal is with embodiment 1.
Solder for welding for china with metal obtained above is used for the connection of copper sheet and aluminium nitride ceramics, by drawing
Experimental test is stretched, the construction stretch intensity is 8.2MPa.
Embodiment 4
On the basis of embodiment 1, the component and its mass percent that the bi-based glass material is included are：Bi2O360%, B2O3
18%, ZnO 19%, remaining is trace additives；The trace additives include SiO2、TiO2, MgO, its mass percent
Respectively 1%, 1%, 1%.The preparation method of the solder for welding for china with metal is with embodiment 1.
Solder for welding for china with metal obtained above is used for the connection of copper sheet and aluminium nitride ceramics, by drawing
Experimental test is stretched, the construction stretch intensity is up to 7.6MPa.
Above content is to combine specific preferred embodiment further description made for the present invention, it is impossible to assert
Specific implementation of the invention is confined to these explanations.For general technical staff of the technical field of the invention,
On the premise of not departing from present inventive concept, some simple deduction or replace can also be made, should be all considered as belonging to of the invention
Protection domain.
Claims (9)
1. a kind of solder for welding for china with metal, it is characterised in that：It is bi-based glass material, the bi-based glass material bag
The component and its mass percent for containing be：Bi2O360-80%, B2O35-20%, ZnO 7-20%, remaining is trace additives；
The trace additives include SiO2、TiO2, one or more in MgO.
2. the solder for welding for china with metal according to claim 1, it is characterised in that：Its component for including and its
Mass percent is：Bi2O365-75%, B2O38-18%, ZnO 10-16%, remaining is trace additives.
3. the solder for welding for china with metal according to claim 1, it is characterised in that：It is described for ceramics and golden
The profile for belonging to the solder of welding is bulk, film, micro wire, micro belt, micron tube, micron particles, nano wire, nanobelt, receive
Mitron or nano particle.
4. the solder for welding for china with metal according to claim 1, it is characterised in that：The ceramics are aluminum oxide
Ceramics, aluminium nitride ceramics or silicon nitride ceramics.
5. the solder for welding for china with metal according to claim 4, it is characterised in that：The metal is copper, aluminium
Or silver.
6. the solder for welding for china with metal according to claim 1 ~ 5 any one, it is characterised in that：It is used
Following steps prepare paste solder：It is 10 ~ 50 μm of powder of particle diameter that the bi-based glass material is ground, and is then with mass ratio
1:（2~4）Ethyl cellulose and terpinol mixture with being made bismuth-containing glass cream, the bi-based glass material and ethyl
The mixing quality ratio of the mixture of cellulose and terpinol is 7:3.
7. a kind of welding method for welding for china with metal, it is characterised in that：It is used such as claim 1 ~ 6 any one
The described solder for welding for china with metal, by the solder for welding for china with metal be placed in ceramics with metal it
Between carry out reflow soldering, the maximum temperature of the reflow soldering is 600-1000 DEG C.
8. the welding method for welding for china with metal according to claim 7, it is characterised in that：The reflow soldering
Including scaling powder volatilization area, recirculating zone and freezing range, the temperature of the recirculating zone is 500-1000 DEG C.
9. the welding method for welding for china with metal according to claim 8, it is characterised in that：The reflow soldering
Carried out in air, vacuum, nitrogen, hydrogen or inert gas atmosphere.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710103807.1A CN106825978B (en) | 2017-02-24 | 2017-02-24 | A kind of solder and welding method for welding for china with metal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710103807.1A CN106825978B (en) | 2017-02-24 | 2017-02-24 | A kind of solder and welding method for welding for china with metal |
Publications (2)
| Publication Number | Publication Date |
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| CN106825978A true CN106825978A (en) | 2017-06-13 |
| CN106825978B CN106825978B (en) | 2019-08-27 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110369904A (en) * | 2019-06-27 | 2019-10-25 | 天通（嘉兴）新材料有限公司 | A kind of sintering method of laser pipe cap |
| CN110524079A (en) * | 2019-07-31 | 2019-12-03 | 常熟市银洋陶瓷器件有限公司 | The silver-copper brazing alloy layer preparation method being brazed for metallized ceramic and metal parts |
| CN111566074A (en) * | 2018-01-25 | 2020-08-21 | 三菱综合材料株式会社 | Copper-ceramic joined body, insulated circuit board, method for producing copper-ceramic joined body, and method for producing insulated circuit board |
| CN112170997A (en) * | 2020-09-25 | 2021-01-05 | 西华大学 | Glass brazing filler metal for brazing MCT microwave dielectric ceramic and metal and brazing method thereof |
| CN112191968A (en) * | 2020-10-14 | 2021-01-08 | 哈尔滨工业大学（深圳） | Packaging method for enhancing metallurgy of nano solder interface |
| CN114940004A (en) * | 2022-04-14 | 2022-08-26 | 天诺光电材料股份有限公司 | Copper-clad nitride ceramic substrate and preparation method thereof |
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111566074A (en) * | 2018-01-25 | 2020-08-21 | 三菱综合材料株式会社 | Copper-ceramic joined body, insulated circuit board, method for producing copper-ceramic joined body, and method for producing insulated circuit board |
| CN111566074B (en) * | 2018-01-25 | 2022-04-22 | 三菱综合材料株式会社 | Copper-ceramic joined body, insulated circuit board, method for producing copper-ceramic joined body, and method for producing insulated circuit board |
| CN110369904A (en) * | 2019-06-27 | 2019-10-25 | 天通（嘉兴）新材料有限公司 | A kind of sintering method of laser pipe cap |
| CN110524079A (en) * | 2019-07-31 | 2019-12-03 | 常熟市银洋陶瓷器件有限公司 | The silver-copper brazing alloy layer preparation method being brazed for metallized ceramic and metal parts |
| CN112170997A (en) * | 2020-09-25 | 2021-01-05 | 西华大学 | Glass brazing filler metal for brazing MCT microwave dielectric ceramic and metal and brazing method thereof |
| CN112191968A (en) * | 2020-10-14 | 2021-01-08 | 哈尔滨工业大学（深圳） | Packaging method for enhancing metallurgy of nano solder interface |
| CN112191968B (en) * | 2020-10-14 | 2022-05-10 | 哈尔滨工业大学（深圳） | Packaging method for enhancing metallurgy of nano solder interface |
| CN114940004A (en) * | 2022-04-14 | 2022-08-26 | 天诺光电材料股份有限公司 | Copper-clad nitride ceramic substrate and preparation method thereof |
| CN114940004B (en) * | 2022-04-14 | 2023-12-22 | 天诺光电材料股份有限公司 | Copper-clad nitride ceramic substrate and preparation method thereof |
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| CN106825978B (en) | 2019-08-27 |
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