CN104416252A - Preparation method of preferred orientation texture welding spots - Google Patents
Preparation method of preferred orientation texture welding spots Download PDFInfo
- Publication number
- CN104416252A CN104416252A CN201310383142.6A CN201310383142A CN104416252A CN 104416252 A CN104416252 A CN 104416252A CN 201310383142 A CN201310383142 A CN 201310383142A CN 104416252 A CN104416252 A CN 104416252A
- Authority
- CN
- China
- Prior art keywords
- magnetic field
- solder joint
- preparation
- preferred orientation
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 238000002360 preparation method Methods 0.000 title claims abstract description 18
- 238000003466 welding Methods 0.000 title claims abstract description 7
- 229910000679 solder Inorganic materials 0.000 claims abstract description 56
- 238000000034 method Methods 0.000 claims abstract description 26
- 239000002994 raw material Substances 0.000 claims abstract description 6
- 239000000463 material Substances 0.000 claims abstract description 5
- 238000010992 reflux Methods 0.000 claims description 19
- 238000001816 cooling Methods 0.000 claims description 7
- 238000007710 freezing Methods 0.000 claims description 4
- 230000008014 freezing Effects 0.000 claims description 4
- 238000004377 microelectronic Methods 0.000 claims description 4
- 238000009713 electroplating Methods 0.000 claims description 2
- 239000002127 nanobelt Substances 0.000 claims description 2
- 239000002105 nanoparticle Substances 0.000 claims description 2
- 239000002071 nanotube Substances 0.000 claims description 2
- 239000002070 nanowire Substances 0.000 claims description 2
- 239000002245 particle Substances 0.000 claims description 2
- 239000000843 powder Substances 0.000 claims description 2
- 230000003134 recirculating effect Effects 0.000 claims description 2
- 238000005476 soldering Methods 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 239000004065 semiconductor Substances 0.000 abstract description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 abstract 1
- 238000013508 migration Methods 0.000 abstract 1
- 230000010399 physical interaction Effects 0.000 abstract 1
- 230000002035 prolonged effect Effects 0.000 abstract 1
- 238000007711 solidification Methods 0.000 abstract 1
- 230000008023 solidification Effects 0.000 abstract 1
- 229910000969 tin-silver-copper Inorganic materials 0.000 description 6
- PQIJHIWFHSVPMH-UHFFFAOYSA-N [Cu].[Ag].[Sn] Chemical compound [Cu].[Ag].[Sn] PQIJHIWFHSVPMH-UHFFFAOYSA-N 0.000 description 5
- 238000002389 environmental scanning electron microscopy Methods 0.000 description 4
- 239000011159 matrix material Substances 0.000 description 4
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 4
- 229910010271 silicon carbide Inorganic materials 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000003384 imaging method Methods 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 229910020888 Sn-Cu Inorganic materials 0.000 description 1
- 229910019204 Sn—Cu Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- JWVAUCBYEDDGAD-UHFFFAOYSA-N bismuth tin Chemical compound [Sn].[Bi] JWVAUCBYEDDGAD-UHFFFAOYSA-N 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000001887 electron backscatter diffraction Methods 0.000 description 1
- 238000004100 electronic packaging Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- RHZWSUVWRRXEJF-UHFFFAOYSA-N indium tin Chemical compound [In].[Sn] RHZWSUVWRRXEJF-UHFFFAOYSA-N 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 238000000053 physical method Methods 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/008—Soldering within a furnace
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention relates to a preparation method of a preferred orientation texture welding spots and belongs to the technical field of the manufacturing process of semiconductor devices. In the method, a tin-based lead-free solder is used as the raw material; preferred orientation welding spots or structures or devices with above material microstructures are prepared by applying a magnetic field in a solidification process; the preferred orientation can be changed by adjusting the magnetic field direction, so that the electro-migration resistance and other anisotropic performances can be influenced. Based on the physical interaction between the magnetic filed and the material, the preparation method differs from the present preparation method of the welding spots, is simple and has strong operability; the service life of the welding spots can be prolonged greatly and an operable method is provided to the manufacturing of micro devices.
Description
Technical field
The present invention relates to metal material preparation and process for fabrication of semiconductor device technical field, be specifically related to a kind of preparation method of preferred orientation texture solder joint, what can realize materials and structures device determines orientation processing preparation.
Background technology
Tin-base lead-free solder joint has environment friendly, is therefore paid close attention to widely in Electronic Packaging industry and applies.Tu etc. study discovery, and the grain orientation of solder joint has crucial effect for the deelectric transferred performance of solder joint and electromigration invalidation mode.At present, at identical conditions, the solder joint electromigration invalidation time difference of identical component is huge, because its orientation difference causes.Tin-base lead-free solder joint prepared by common reflow method all has These characteristics at present, and the service life of whole device is decided by the solder joint that its life-span is the shortest exactly.So, adopt new method to make all samples all have close orientation, and make this orientation be partial to the good direction of deelectric transferred performance, be just provided with important Research Significance.
Summary of the invention
The object of the present invention is to provide a kind of preparation method of preferred orientation texture solder joint, the method breaches the conventional method preparing solder joint, and prepared solder joint has the preferred orientation relevant to magnetic field.
Technical scheme of the present invention is:
A preparation method for preferred orientation texture solder joint, the method take tin-base lead-free solder as raw material, is carrying out adopting magnetic field auxiliary reflux in the technical process of Reflow Soldering to it, and tin-base lead-free solder solidifies the rear obtained solder joint with preferred orientation texture.Specifically comprise the steps:
(1) microelectronic product to be welded adopts tin-base lead-free solder as Electroplating welding materials.
(2) microelectronic product to be welded is placed in can applies in the refluxing unit in magnetic field, determined the position of orientation needed for solder joint to be prepared by adjustment sample position or magnetic direction;
(3) suitable reflux temperature curve is chosen according to the temperature requirements of each temperature range, then sample is made successively through different temperature ranges, be respectively scaling powder volatilization district, recirculating zone and freezing range, in backflow and process of setting, apply magnetic field, after cooling, obtain solder joint or the structure of required orientation.
Described in step (1), tin-base lead-free solder is the shapes such as bulk, film, micro wire, micro belt, micron tube, micron particles, nano wire, nanobelt, nanotube or nano particle.
The direction and the size that apply magnetic field in step (3) are adjustable.
In step (3), reflux temperature interval is 100-400 DEG C, and cooling velocity is 0.1-100K/min, and applying magnetic field intensity is 0.01-20T.
Utilize magnetic field auxiliary reflux to prepare the physical method of solder joint in the present invention, solve in existing reflow method and there is the problems such as orientation complexity, out-of-service time difference be huge.With adopt at present extensively compared with common reflow method, the present invention has the following advantages:
1, present invention process is simple, and be easy to operation, controllability is strong.
2, the present invention can prepare the solder joint with specific preferred orientation by controlling magnetic field, can obtain the solder joint with different directions texture by changing magnetic direction.
3, utilize the inventive method to obtain to have the solder joint of good deelectric transferred performance.
4, the present invention can realize the controlled synthesis with specific orientation solder joint in different atmosphere, and atmosphere can be the various atmosphere such as air, vacuum, nitrogen.
Accompanying drawing explanation
Fig. 1 is the apparatus structure schematic diagram in its applying magnetic field of refluxing unit that can apply magnetic field in embodiment.
Fig. 2 is the side view of the device in its applying magnetic field of refluxing unit that can apply magnetic field in embodiment.
Fig. 3 is the top view of the device in its applying magnetic field of refluxing unit that can apply magnetic field in embodiment.
In figure: 1-kicker magnet; 2-plummer; 3-support body; 4-placing rack; 5-central shaft; 6-sample stage; 7-hold-down nut.
Fig. 4 is the analog chip structure adopted in embodiment 1; In figure: 11-analog chip; 12-tin-silver-copper solder; 13-substrate.
Fig. 5 is the reflux temperature curve adopted in embodiment 1.
Fig. 6 is the soldered ball ESEM imaging utilizing tin-silver-copper solder to prepare in embodiment 1.
Fig. 7 (a) is the distribution of orientations figure of soldered ball on magnetic direction in embodiment 1; Fig. 7 (b) is the inverse pole figure of soldered ball on magnetic direction in embodiment 1.
Fig. 8 is the ESEM imaging after the soldered ball electromigration of preparation in embodiment 2.
Fig. 9 is the ESEM imaging after not adding the soldered ball electromigration prepared in magnetic field in comparative example 1.
Detailed description of the invention
Below in conjunction with drawings and Examples, the present invention is described in further detail.
In following examples, the refluxing unit that can apply magnetic field used comprises the device and reflow ovens that apply magnetic field, as Figure 1-3, this device comprises kicker magnet 1, placing rack 4, magnet fixed mount, central shaft 5 and sample stage 6 to the preferred structure of device one in described applying magnetic field; Magnet fixed mount is made up of support body 3 and the plummer 2 being fixedly arranged on support body 3 two ends, each placement kicker magnet 1 on each plummer 2, kicker magnet 1 utilizes the magnetic of self to be fixed on placed plummer 2, and the space between two plummers 2 forms uniform magnetic field; Described central shaft 5 is rotationally connected with described support body 3, and this is arranged so that magnet fixed mount can do around central shaft 5 and rotates at any angle, after adjusting angle, then is fixed on central shaft 5 by magnet fixed mount by hold-down nut 7.The two ends of central shaft 5 are connected on placing rack 4 (fixed by nut or other are fixedly connected with mode), and the plane that placing rack 4 makes magnet fixed mount and whole device place keeps certain distance, makes it freely rotate.Described sample stage 6 is welded in the centre position of central shaft 5, and is in uniform magnetic field.
Described support body 3 is two, and sample stage 6 is located between two support bodys 3.
The placing rack of this device is fixed on the conveyer belt of reflow ovens by fixture by the device in above-mentioned applying magnetic field, kicker magnet is put on two plummers of magnet fixed mount, by magnet fixed mount around central axis extremely required angle, make the sample on sample stage (tin-base lead-free solder) be in the magnetic field in required direction, then by holding screw, support and central shaft are fixed.
The device applying magnetic field is placed in reflow ovens, for sample provides high-intensity magnetic field in reflux course, changes the institutional framework after back flow of sample, improves reliability.
Embodiment 1
(1) select the analog chip connected using tin-silver-copper solder (SAC soldered ball) as raw material matrix, Diameter of Solder Ball is about 300 μm, analog chip as shown in Figure 4, middle circle head is tin-silver-copper solder 12, it is the soldered ball of Sn3.0Ag0.5Cu in the present embodiment, the top of tin-silver-copper solder 12 connects chip 11, the bottom connection substrate (pcb board) 13 of tin-silver-copper solder.
(2) select the reflow ovens that can apply magnetic field as sample preparation device, matrix material is put into stove, setting reflux temperature curve, solder flux volatilization silicon carbide is 180 DEG C, and backflow silicon carbide is 240 DEG C; Freezing range temperature is 180 DEG C, and cooling velocity is 22.5K/min, Fig. 5 is the reflux temperature curve adopted in embodiment 1.In whole process, sample is placed in the magnetic field of applying, and magnetic field intensity is 0.3T, and direction, as shown in Figure 4 perpendicular to pcb board and chip, prepares soldered ball (solder joint), and Fig. 6 is the vertical cross-section diagram of soldered ball.
After obtained soldered ball process, analyze its crystal orientation, Fig. 7 is EBSD inverse pole figure corresponding to z-axis direction, as can be seen from inverse pole figure, defines typical texture in soldered ball, illustrate the method can change solder re-flow after the tissue orientating that formed; Analyze its orientation, can find out that this soldered ball texture is perpendicular to c-axis direction, the solder joint of this orientation has better deelectric transferred performance and longer life-span, illustrates that the method can improve the reliability of solder joint.
Embodiment 2
(1) select analog chip in embodiment 1 as raw material matrix, make sample.
(2) similar in sample production method and embodiment 1, solder flux volatilization silicon carbide is 180 DEG C, and backflow silicon carbide is 240 DEG C; Freezing range temperature is 180 DEG C, and cooling velocity is 22.5K/min, applies magnetic field in whole process, and magnetic field intensity is 0.5T, obtains analog chip after cooling.
(3) analog chip obtained that refluxes through magnetic field is energized, current density 10KA/cm
2, conduction time 200h, energising completes, cross-sectional after observe under ESEM, apply magnetic field sample as shown in Figure 8, do not observe obvious polar effect, prove that this solder joint has good deelectric transferred performance.
Select using the analog chip of Sn-Cu solder, tin-bismuth solder or tin indium solder connection as raw material matrix, sample preparation is carried out according to the method described above in the reflow ovens that can apply magnetic field, reflux temperature curve sets according to concrete solder, magnetic field intensity is 0.3T, direction is perpendicular to pcb board and chip, analyze gained soldered ball orientation, texture is equally perpendicular to c-axis direction, and this solder joint has better deelectric transferred performance and longer life-span.
Comparative example 1
Difference from Example 2 is, does not apply magnetic field in reflow process to sample.Gained analog chip is energized, does not add magnetic field sample as shown in Figure 9, in sample, there occurs the stripping of obvious polar effect and compound.
The embodiment more than provided is only explain the mode illustrated, should not think to limit scope of the present invention, and any method being equal to replacement according to technical scheme of the present invention and inventive concept thereof or changing, all should be encompassed within protection scope of the present invention.
Claims (5)
1. the preparation method of a preferred orientation texture solder joint, it is characterized in that: the method take tin-base lead-free solder as raw material, carrying out it adopting magnetic field auxiliary reflux in technical process of Reflow Soldering, tin-base lead-free solder solidifies the rear obtained solder joint with preferred orientation texture.
2. the preparation method of preferred orientation texture solder joint according to claim 1, is characterized in that: the method comprises the steps:
(1) microelectronic product to be welded adopts tin-base lead-free solder as Electroplating welding materials.
(2) microelectronic product to be welded is placed in can applies in the refluxing unit in magnetic field, determined the position of orientation needed for solder joint to be prepared by adjustment sample position or magnetic direction;
(3) suitable reflux temperature curve is chosen according to the temperature requirements of each temperature range, then sample is made successively through different temperature ranges, be respectively scaling powder volatilization district, recirculating zone and freezing range, in backflow and process of setting, apply magnetic field simultaneously, after cooling, obtain solder joint or the structure of required orientation.
3. the preparation method of preferred orientation texture solder joint according to claim 2, is characterized in that: tin-base lead-free solder described in step (1) is bulk, film, micro wire, micro belt, micron tube, micron particles, nano wire, nanobelt, nanotube or nano particle shape.
4. the preparation method of preferred orientation texture solder joint according to claim 2, is characterized in that: the direction and the size that apply magnetic field in step (3) are adjustable.
5. the preparation method of preferred orientation texture solder joint according to claim 2, is characterized in that: in step (3), reflux temperature interval is 100-400 DEG C, and cooling velocity is 0.1-100K/min, and applying magnetic field intensity is 0.01-20T.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310383142.6A CN104416252B (en) | 2013-08-28 | 2013-08-28 | A kind of preparation method of preferred orientation texture solder joint |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310383142.6A CN104416252B (en) | 2013-08-28 | 2013-08-28 | A kind of preparation method of preferred orientation texture solder joint |
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| Publication Number | Publication Date |
|---|---|
| CN104416252A true CN104416252A (en) | 2015-03-18 |
| CN104416252B CN104416252B (en) | 2016-08-10 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201310383142.6A Active CN104416252B (en) | 2013-08-28 | 2013-08-28 | A kind of preparation method of preferred orientation texture solder joint |
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| Country | Link |
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| CN (1) | CN104416252B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106513890A (en) * | 2016-11-17 | 2017-03-22 | 大连理工大学 | Method for preparing electronic packaging microscale solder joints |
| CN106825978A (en) * | 2017-02-24 | 2017-06-13 | 哈尔滨工业大学深圳研究生院 | A kind of solder and welding method for welding for china with metal |
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| CN103056347A (en) * | 2013-01-09 | 2013-04-24 | 上海大学 | Method for controlling dendritic crystal orientation of oriented solidification structure by high-intensity magnetic field |
-
2013
- 2013-08-28 CN CN201310383142.6A patent/CN104416252B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| US6799712B1 (en) * | 2001-02-21 | 2004-10-05 | Electronic Controls Design, Inc. | Conveyor oven profiling system |
| CN101396751A (en) * | 2007-09-27 | 2009-04-01 | 比亚迪股份有限公司 | Solder-reflow soldering method |
| CN102703986A (en) * | 2012-06-21 | 2012-10-03 | 上海大学 | Method for transforming columnar crystal-orienting isometric crystal of directional solidified alloy with strong static magnetic field induction |
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Non-Patent Citations (1)
| Title |
|---|
| 许家誉等: "基于晶粒取向的无铅互连焊点可靠性研究", 《金属学报》, vol. 48, no. 9, 11 September 2012 (2012-09-11), pages 1042 - 1047 * |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106513890A (en) * | 2016-11-17 | 2017-03-22 | 大连理工大学 | Method for preparing electronic packaging microscale solder joints |
| CN106513890B (en) * | 2016-11-17 | 2019-01-01 | 大连理工大学 | A kind of preparation method of Electronic Packaging microbonding point |
| CN106825978A (en) * | 2017-02-24 | 2017-06-13 | 哈尔滨工业大学深圳研究生院 | A kind of solder and welding method for welding for china with metal |
| CN106825978B (en) * | 2017-02-24 | 2019-08-27 | 哈尔滨工业大学深圳研究生院 | A kind of solder and welding method for welding for china with metal |
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| Publication number | Publication date |
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| CN104416252B (en) | 2016-08-10 |
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Effective date of registration: 20191030 Address after: Room 725, 7 / F, building 2, No. 169 Binhai Road, aoshanwei office, Jimo District, Qingdao, Shandong Province Patentee after: Qingdao MALIANG shenbi Network Technology Co., Ltd Address before: 110016 Shenyang, Liaoning Province Cultural Road, No. 72, Shenhe Patentee before: Institute of Metals, Chinese Academy of Sciences |
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