CN105290641A - Cleaning-free soldering tin bar - Google Patents
Cleaning-free soldering tin bar Download PDFInfo
- Publication number
- CN105290641A CN105290641A CN201510850533.3A CN201510850533A CN105290641A CN 105290641 A CN105290641 A CN 105290641A CN 201510850533 A CN201510850533 A CN 201510850533A CN 105290641 A CN105290641 A CN 105290641A
- Authority
- CN
- China
- Prior art keywords
- content
- tin bar
- soldering tin
- rare earth
- rosin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a cleaning-free soldering tin bar. The cleaning-free soldering tin bar comprises, by weight, 0.1%-0.15% of bismuth, 0.055%-0.065% of antimony, 4.2%-5.5% of silver, 7.5%-8.5% of rare earth, 5.5%-7% of rosin, and the balance tin. In this way, since a certain amount of the rare earth and the rosin is added to the cleaning-free soldering tin bar, the soldering tin bar is high in liquidity and soldering performance, little dross is generated when the soldering tin bar is melted, the soldering effect is excellent, and the soldering tin bar does not need to be cleaned before soldering.
Description
Technical field
The present invention relates to soldering tin bar field, particularly relate to a kind of No clean soldering tin bar.
Background technology
During with tin welding object, must wipe on the surface that will weld with sulfuric acid or solder(ing) paste, object is used to clean face of weld, could use scolding tin like this, such handled easily person operation.
Summary of the invention
The technical problem that the present invention mainly solves is to provide that a kind of mobility is high, weldability is strong, scum silica frost seldom, does not need the No clean soldering tin bar cleaned when melting.
For solving the problems of the technologies described above, the invention provides a kind of No clean soldering tin bar, comprise tin, bismuth, antimony, silver, rare earth and rosin element, described bi content is 0.1-0.15%, and described antimony content is 0.055-0.065%, and described silver content is 4.2-5.5%, described content of rare earth is 7.5-8.5%, described rosin content is 5.5-7%, and all the other are tin, and described content is weight percentage.
In a preferred embodiment of the present invention, described bi content is 0.1%, and described antimony content is 0.065%, and described silver content is 4.2%, and described content of rare earth is 8.5%, and described rosin content is 5.5%, and all the other are tin, and described content is weight percentage.
In a preferred embodiment of the present invention, described bi content is 0.15%, and described antimony content is 0.055%, and described silver content is 5.5%, and described content of rare earth is 7.5%, and described rosin content is 7%, and all the other are tin, and described content is weight percentage.
In a preferred embodiment of the present invention, described bi content is 0.12%, and described antimony content is 0.06%, and described silver content is 5%, and described content of rare earth is 8%, and described rosin content is 6.2%, and all the other are tin, and described content is weight percentage.
The invention has the beneficial effects as follows: No clean soldering tin bar of the present invention, owing to adding a certain amount of rare earth and rosin, makes the mobility of soldering tin bar high, weldability is strong, and during thawing, scum silica frost is few, and welding effect is splendid, and does not need cleaning before welding.
Detailed description of the invention
Be clearly and completely described to the technical scheme in the embodiment of the present invention below, obviously, described embodiment is only a part of embodiment of the present invention, instead of whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art, not making other embodiments all obtained under creative work prerequisite, belong to the scope of protection of the invention.
Embodiment 1
A kind of No clean soldering tin bar, comprise tin, bismuth, antimony, silver, rare earth and rosin element, described bi content is 0.1%, described antimony content is 0.065%, and described silver content is 4.2%, and described content of rare earth is 8.5%, described rosin content is 5.5%, and all the other are tin, and described content is weight percentage.
Embodiment 2
A kind of No clean soldering tin bar, comprise tin, bismuth, antimony, silver, rare earth and rosin element, described bi content is 0.15%, described antimony content is 0.055%, and described silver content is 5.5%, and described content of rare earth is 7.5%, described rosin content is 7%, and all the other are tin, and described content is weight percentage.
Embodiment 3
A kind of No clean soldering tin bar, comprise tin, bismuth, antimony, silver, rare earth and rosin element, described bi content is 0.12%, described antimony content is 0.06%, and described silver content is 5%, and described content of rare earth is 8%, described rosin content is 6.2%, and all the other are tin, and described content is weight percentage.
Be different from prior art, No clean soldering tin bar of the present invention, owing to adding a certain amount of rare earth and rosin, makes the mobility of soldering tin bar high, and weldability is strong, and during thawing, scum silica frost is few, and welding effect is splendid, and does not need cleaning before welding.
The foregoing is only embodiments of the invention; not thereby the scope of the claims of the present invention is limited; every utilize description of the present invention to do equivalent structure or equivalent flow process conversion; or be directly or indirectly used in other relevant technical field, be all in like manner included in scope of patent protection of the present invention.
Claims (4)
1. a No clean soldering tin bar, it is characterized in that, comprise tin, bismuth, antimony, silver, rare earth and rosin element, described bi content is 0.1-0.15%, and described antimony content is 0.055-0.065%, and described silver content is 4.2-5.5%, described content of rare earth is 7.5-8.5%, described rosin content is 5.5-7%, and all the other are tin, and described content is weight percentage.
2. No clean soldering tin bar according to claim 1, is characterized in that, described bi content is 0.1%, described antimony content is 0.065%, and described silver content is 4.2%, and described content of rare earth is 8.5%, described rosin content is 5.5%, and all the other are tin, and described content is weight percentage.
3. No clean soldering tin bar according to claim 1, is characterized in that, described bi content is 0.15%, described antimony content is 0.055%, and described silver content is 5.5%, and described content of rare earth is 7.5%, described rosin content is 7%, and all the other are tin, and described content is weight percentage.
4. No clean soldering tin bar according to claim 1, is characterized in that, described bi content is 0.12%, described antimony content is 0.06%, and described silver content is 5%, and described content of rare earth is 8%, described rosin content is 6.2%, and all the other are tin, and described content is weight percentage.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510850533.3A CN105290641A (en) | 2015-11-30 | 2015-11-30 | Cleaning-free soldering tin bar |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510850533.3A CN105290641A (en) | 2015-11-30 | 2015-11-30 | Cleaning-free soldering tin bar |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105290641A true CN105290641A (en) | 2016-02-03 |
Family
ID=55188823
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510850533.3A Pending CN105290641A (en) | 2015-11-30 | 2015-11-30 | Cleaning-free soldering tin bar |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105290641A (en) |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001047276A (en) * | 1999-06-02 | 2001-02-20 | Sony Corp | Soldering material |
| CN1346728A (en) * | 2001-09-19 | 2002-05-01 | 大连理工大学 | Lead-free alloy solder containing rare-earth and more alloy components |
| CN1712176A (en) * | 2005-07-22 | 2005-12-28 | 沈阳工业大学 | Lead-free soft brazing alloy containing mixed rare earth and production thereof |
| CN1762645A (en) * | 2005-10-28 | 2006-04-26 | 亚通电子有限公司 | Lead free solder |
| CN101081463A (en) * | 2006-05-30 | 2007-12-05 | 何礼君 | Sn-Ag-Cu-Dy Lead-free solder alloy |
| CN101342641A (en) * | 2008-08-25 | 2009-01-14 | 天津大学 | Tin-silver-zinc system leadless soldering plaster and method of producing the same |
| JP2009082986A (en) * | 2007-09-13 | 2009-04-23 | Topy Ind Ltd | Lead-free solder alloy for manual soldering |
| CN104526190A (en) * | 2014-12-23 | 2015-04-22 | 苏州龙腾万里化工科技有限公司 | Novel tin bar manufacturing method |
| CN104625464A (en) * | 2014-12-23 | 2015-05-20 | 苏州龙腾万里化工科技有限公司 | Novel lead-free tin bar |
-
2015
- 2015-11-30 CN CN201510850533.3A patent/CN105290641A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001047276A (en) * | 1999-06-02 | 2001-02-20 | Sony Corp | Soldering material |
| CN1346728A (en) * | 2001-09-19 | 2002-05-01 | 大连理工大学 | Lead-free alloy solder containing rare-earth and more alloy components |
| CN1712176A (en) * | 2005-07-22 | 2005-12-28 | 沈阳工业大学 | Lead-free soft brazing alloy containing mixed rare earth and production thereof |
| CN1762645A (en) * | 2005-10-28 | 2006-04-26 | 亚通电子有限公司 | Lead free solder |
| CN101081463A (en) * | 2006-05-30 | 2007-12-05 | 何礼君 | Sn-Ag-Cu-Dy Lead-free solder alloy |
| JP2009082986A (en) * | 2007-09-13 | 2009-04-23 | Topy Ind Ltd | Lead-free solder alloy for manual soldering |
| CN101342641A (en) * | 2008-08-25 | 2009-01-14 | 天津大学 | Tin-silver-zinc system leadless soldering plaster and method of producing the same |
| CN104526190A (en) * | 2014-12-23 | 2015-04-22 | 苏州龙腾万里化工科技有限公司 | Novel tin bar manufacturing method |
| CN104625464A (en) * | 2014-12-23 | 2015-05-20 | 苏州龙腾万里化工科技有限公司 | Novel lead-free tin bar |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20160203 |
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| RJ01 | Rejection of invention patent application after publication |