CN103128460A

CN103128460A - No-clean scaling powder used for lead-free solder wires

Info

Publication number: CN103128460A
Application number: CN 201110386166
Authority: CN
Inventors: 胡洁
Original assignee: CHENZHOU GOLD ARROW SOLDER Co Ltd
Current assignee: CHENZHOU GOLD ARROW SOLDER Co Ltd
Priority date: 2011-11-29
Filing date: 2011-11-29
Publication date: 2013-06-05

Abstract

The invention discloses no-clean scaling powder used for lead-free solder wires. The no-clean scaling powder comprises, 35-50wt% of rosin resin, 5-15wt% of organic acid activating agents, 5-12wt% of protective agents, 0.1-1.0wt% of surface active agents, 0.5-1.0wt% of corrosion inhibitors, and the balance of solvent. The no-clean scaling powder is free of halogen, clean, environment-friendly, good in wettability, small in the number of residues, needless of cleaning and high in insulation resistance, and has a good welding effect.

Description

A kind of lead-free soldering wire no-clean scaling powder

Technical field

The present invention relates to a kind of lead-free soldering wire no-clean scaling powder, is the medicine core for the no-cleaning leadless solder of manual welding specifically.

Background technology

Along with people recognize that more and more environmental protection is in the importance of technical field of electronic encapsulation, unleaded process is in continuous propelling, a lot of harmful substances temporarily is in exemption, waiting for the replacing of new substitute, when the plumbous solder stick of traditional tin is replaced by lead-free soldering wire, corresponding tin silk medicine core has also had countless selections, this wherein, reduce content of halogen, improve flux activity, exempt to clean, improve medicine core mobility, reduce residue, improving insulaion resistance etc. is all the lead-free soldering wire improved direction of scaling powder.

Publication number is the halogen-free flux that a kind of lead-free soldering wire of the patent of invention of CN101352789 is used, and provides a kind of rosin matrix complete halogen-free flux, has abandoned rosin, far away from the welding performance of traditional rosin scaling powder.

To be that the patent of invention of CN102069324 is a kind of exempt to clean the low spatter lead-free soldering wire with scaling powder and preparation method thereof to publication number, disclosing a kind of the minimizing splashes, active high, the postwelding insulaion resistance is high, the tin silk medicine core that reliability is high, wherein a large amount of uses of organic amine activating agent although come reliable activity for the tin silk ribbon, have brought heavier amine stink in welding.

Summary of the invention

The purpose of this invention is to provide a kind of lead-free soldering wire and help weldering with exempting to clean, this film of flux residue is few, can not turn black, and welding has no irritating odor, and is difficult for fried tin, has exempted the step that postwelding cleans, and has good activity, environmental protection, and solderability is good.

For achieving the above object, the present invention adopts following technical scheme:

A kind of lead-free soldering wire no-clean scaling powder; comprise abietic resin, solvent and additive; calculate by mass percentage; abietic resin is 35 ~ 50wt%; the high boiling solvent of surplus, the composition of additive and mass percent are respectively organic acid ester activator 5 ~ 15wt%, protective agent 5 ~ 12 wt %; surfactant 0.1 ~ 1.0 wt %, corrosion inhibiter 0.5 ~ 1.0 wt %.

Wherein, described abietic resin is modified rosin, is comprised of one or more of newtrex, Foral, water-white rosin and maleic rosin.

Described high boiling solvent is that dimethyl succinate, dimethyl glutarate, hexanedioic acid dimethyl ester are a kind of at least, and effect is the dissolved solid composition, forms homogeneous solution, also foul capable of washing and metal surface greasy dirt.

Described organic acid for activating agent is at least a kind of to succinic acid, adipic acid, hexadecylic acid, stearic acid, stearic acid, maleic acid, lactic acid, dihydromethyl propionic acid, effect is away oxide on terminal pin and the oxide of solder surface, strengthens wetability.

Described protective agent is polyethylene glycol, and its molecular weight is between 600-2000.

Described surfactant is a kind of of organic silicon surfactant DC-5211 or non-ionic surface active agent OPEO, and the surface tension that produces in the time of can reducing scolder and terminal pin Metal Contact increases wettability, strengthens the penetration of activator.

Described corrosion inhibiter is a kind of of BTA, benzothiazole or triethylamine, can prevent reoxidizing of metal, suppresses corrosion.

Lead-free soldering wire of the present invention can be prepared from by following methods with no-clean scaling powder.

Add a certain amount of high boiling solvent in smelting furnace, be heated to 150 ^oC under constant temperature, adds the abietic resin of respective amount, is stirred to and dissolves, and continues constant temperature and stirs 30min.

Add successively organic acid ester activator, activation reinforcing agent, protective agent, surfactant under constant temperature, stir, constant temperature 45min pours rosin bucket into, waits for and fills with core.

Lead-free soldering wire provided by the invention has following characteristics with no-clean scaling powder after testing: a. selects organic acid activator, and is not halogen-containing, and welding process smog is little, and environmental protection is without harm; B., wettability and removal oxide ability are preferably arranged; C. weld residue few, little to the infringement of wiring board, need not clean; D. insulaion resistance is high.

The specific embodiment

Lead-free soldering wire of the present invention helps weldering to further illustrate in conjunction with following specific embodiment with exempting to clean, but is not limited only to the following stated embodiment.

Embodiment 1

The lead-free soldering wire of the present embodiment helps weldering with exempting to clean, and the mass percent of its material content is:

Newtrex 40%;

The dimethyl succinate surplus;

Succinic acid 12%;

Polyethylene glycol 8%;

DC-5211?1.0%；

BTA 0.8%.

Embodiment 2

Foral 45%;

The dimethyl glutarate surplus;

Maleic acid 15%;

Polyethylene glycol 6%;

DC-5211?0.6%；

Benzothiazole 1.0%.

Embodiment 3

Water-white rosin 38%;

Hexanedioic acid dimethyl ester surplus;

Dihydromethyl propionic acid 10%;

Polyethylene glycol 7%;

OPEO 0.8 %;

Triethylamine 0.5%.

Embodiment 4

Maleic rosin 48%;

The dimethyl succinate surplus;

Lactic acid 8%;

Adipic acid 5%;

Polyethylene glycol 5%;

OPEO 0.5%;

Triethylamine 0.8%.

Embodiment 5

Foral 25%;

Water-white rosin 15%;

Hexanedioic acid dimethyl ester surplus;

Hexadecylic acid 10%;

Polyethylene glycol 8%;

DC-5211?0.5%；

Benzothiazole 0.5%.

Adopt above embodiment, test respectively the rate of spread, wetting time, corrosivity, surface insulation resistance, the residue of scaling powder, evaluation result sees Table 1, and as seen, lead-free soldering wire provided by the invention has obvious advantage with the performance of no-clean scaling powder and traditional solder flux.

Table 1

Case	The rate of spread	Wetting time	Surface insulation resistance/10 ⁸Ω	The bronze mirror corrosion	Residue
						Embodiment 1	88%	<1s	3.8	Corrode without penetrability	Seldom
Embodiment 2	89%	<1s	3.9	Corrode without penetrability	Nothing
						Embodiment 3	91%	<1s	3.8	Corrode without penetrability	Nothing
Embodiment 4	93%	<1s	3.6	Corrode without penetrability	Seldom
						Embodiment 5	89%	<1s	3.8	Corrode without penetrability	Nothing

Claims

1. a lead-free soldering wire no-clean scaling powder, is characterized in that its composition and mass percent are respectively abietic resin 35 ~ 50wt%, organic acid for activating agent 5 ~ 15wt%; protective agent 5 ~ 12 wt %; surfactant 0.1 ~ 1.0 wt %, corrosion inhibiter 0.5 ~ 1.0 wt %, high boiling solvent is surplus.

2. a kind of lead-free soldering wire no-clean scaling powder according to claim 1, is characterized in that described abietic resin is modified rosin, is comprised of one or more of newtrex, Foral, water-white rosin and maleic rosin.

3. a kind of lead-free soldering wire no-clean scaling powder according to claim 1, is characterized in that described high boiling solvent, is that dimethyl succinate, dimethyl glutarate, hexanedioic acid dimethyl ester are a kind of at least.

4. a kind of lead-free soldering wire no-clean scaling powder according to claim 1 is characterized in that described organic acid for activating agent is at least a kind of to succinic acid, adipic acid, hexadecylic acid, stearic acid, stearic acid, maleic acid, lactic acid, dihydromethyl propionic acid.

5. a kind of lead-free soldering wire no-clean scaling powder according to claim 1, is characterized in that described protective agent is polyethylene glycol, and its molecular weight is between 600-2000.

6. a kind of lead-free soldering wire no-clean scaling powder according to claim 1, is characterized in that described surfactant is a kind of of organic silicon surfactant DC-5211 or non-ionic surface active agent OPEO.

7. a kind of lead-free soldering wire no-clean scaling powder according to claim 1, is characterized in that described corrosion inhibiter is a kind of of BTA, benzothiazole or triethylamine.