CN103128461A - Scaling powder for lead-free solder wire - Google Patents
Scaling powder for lead-free solder wire Download PDFInfo
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- CN103128461A CN103128461A CN 201110373846 CN201110373846A CN103128461A CN 103128461 A CN103128461 A CN 103128461A CN 201110373846 CN201110373846 CN 201110373846 CN 201110373846 A CN201110373846 A CN 201110373846A CN 103128461 A CN103128461 A CN 103128461A
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- scaling powder
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- free soldering
- soldering wire
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Abstract
The invention relates to scaling powder for a lead-free solder wire. The content of the scaling powder includes, by weight, 30-45% of rosin resin, 1-12% of organic acid activating agents, 0-1% of activating agent fortifier, 5-18% of protective agents, 0.1-1% of surface active agent, 0.5-1% of corrosion inhibitor, and the balance solvents. According to the scaling powder, smog is little, pungent smells do not exist, welding residues are few, washing is easy, and good welding effects are achieved.
Description
Technical field
The present invention designs a kind of lead-free soldering wire scaling powder, especially makes modification for its welding fume and residue.
Background technology
Along with the generally application of high speed development and the lead-free product of electronic product, people's environmental consciousness is strong all the more, to the increasingly stringent that requires of pb-free solder, this impel people from the formula of scolding tin and solder flux to making improvement without lead solder.
Tin solder can carry out modification by adding metallic element, and as trace element, the performance that also can regulate scolder by changing alloy proportion can also be by mode and then improvement such as optimized production process, and like that, method is numerous.
And to the optimization of solder flux or the improvement of novelty, can improve to a great extent the effect of welding.Solder flux has the oxide of removing bus and solder alloy surface in welding, prevent secondary oxidation, reduces solder surface tension force, improves the effects such as ability of wetting mother metal.
And scaling powder mainly is the impact of welding process and people life: welding residue later, can become electrolyte and cause electromigration under the condition of humidity, thereby affect the insulation life of wiring board, smoothness and the full degree of same solder joint also can produce a very large impact welding effect, moreover the smog that produces of welding process also is harmful to people's health.
Be that the halogen-free flux that in CN101352789B, disclosed a kind of lead-free soldering wire is used is to be made by the component prescription of not containing halide at publication number, although solved the problem of halogen residue, clearly the activity of solder flux is far away less than the solder flux that contains micro-halogen.
Be solid soldering flux and the preparation method that in CN102039499A, disclosed unleaded medicine core solder stick is used at publication number, made improvement for suitable high activity temperature and residue stability, make at high temperature weld residue can variable color, but the way of feasibility the amount that reduces residue is not proposed.
Summary of the invention
For the generation smog that solves unleaded tin silk welding and the problem of residue, the invention provides a kind of lead-free soldering wire scaling powder.The smog that scaling powder of the present invention produces when welding is little, the residue nondiscolouring, and wetting effect is good, is applicable to the unleaded tin silk manual welding.
Lead-free soldering wire provided by the present invention with component and the quality percentage composition of scaling powder is:
Abietic resin: 30 ~ 45%
Organic acid for activating agent: 1 ~ 12wt%
Active reinforcing agent: 0 ~ 1.0wt%
Protective agent: 5 ~ 8wt%
Surfactant: 0.1 ~ 1wt%
Corrosion inhibiter: 0.5 ~ 1wt%
Solvent: surplus
Wherein, described abietic resin comprises one or more in the modified rosins such as water-white rosin, newtrex, disproportionated rosin, Foral.
Described organic acid for activating agent is one or more in succinic acid, adipic acid, glutaric acid, suberic acid, dodecoic acid, stearic acid, stearic acid, p-tert-butyl benzoic acid, palmitic acid, effectively remove the oxide of pad or solder surface, promote the wetting of scolder.
Described active reinforcing agent is one or more compositions of the ethylenediamine-hydrochloride that contains a small amount of halogen, TBAB, cyclohexylamine hydrobromide, and catalyst activator discharges activity.
Described protective agent is polyethylene glycol, and its molecular weight is between 1000 ~ 6000.
Described surfactant is that non-ionic surface active agent is a kind of of NPE and fatty acid ester surfactant dimethyl succinate or both compositions, the surface tension that produces in the time of can reducing scolder and contact with the terminal pin metal, strengthen moistened surface power, strengthen the penetration of organic acid for activating agent.
Described corrosion inhibiter is one or more of BTA, benzothiazole, triethylamine, can suppress molten copper and the corrosion of metal level.
Described solvent is surplus, comprises one or more in ethanol, acetone, ethyl acetate, deionized water.
The scaling powder that a kind of solder stick of the present invention is used can be prepared from accordance with the following methods:
At first, a certain proportion of solvent and abietic resin are joined in solvent, add thermal agitation and dissolve, 135
oUnder C, constant temperature is 45 minutes; Then add successively organic acid for activating agent, active reinforcing agent, protective agent, constant temperature is stirred to dissolving fully; Add at last surfactant and corrosion inhibiter, constant temperature stirred 30 ~ 45 minutes, put into rosin size cooking kettle and can be directly used in filling core technique.
Solder stick provided by the invention in test can reach the consumption that following effect: A. strictly controls active reinforcing agent with scaling powder, has reduced the content of halogen, has kept simultaneously wettability and removal oxide ability preferably; B. welding process smog is little, near nothing, has greatly reduced the injury to operating personnel; C. weld residue few, little to the infringement of wiring board, easy cleaning.
The specific embodiment
The scaling powder of lead-free soldering wire described in the present invention being used below in conjunction with specific embodiment describes, but the present invention is not limited only to embodiment.
Embodiment 1
The composition of scaling powder and quality per distribution ratio are as follows:
Water-white rosin 8 wt %, newtrex 25 wt %, glutaric acid 2 wt %, stearic acid 6 wt %, dodecoic acid 3 wt %, TBAB 0.5wt%, polyethylene glycol 8wt%, NPE 0.8wt%, BTA 0.5wt%, the solvent of surplus.
Embodiment 2
The composition of scaling powder and quality per distribution ratio are as follows:
Disproportionated rosin 15 wt %, Foral 20 wt %, stearic acid 6wt %, stearic acid 4 wt %, cyclohexylamine hydrobromide 0.4wt%, polyethylene glycol 8wt%, dimethyl succinate 0.8wt%, benzothiazole 0.6wt%, the solvent of surplus.
Embodiment 3
The composition of scaling powder and quality per distribution ratio are as follows:
Water-white rosin 12 wt %, Foral 25 wt %, succinic acid 5wt %, p-tert-butyl benzoic acid 6 wt %, ethylenediamine-hydrochloride 0.8wt%, polyethylene glycol 8wt%, NPE 0.6wt%, triethylamine 0.8wt%, the solvent of surplus.
Embodiment 4
The composition of scaling powder and quality per distribution ratio are as follows:
Water-white rosin 6 wt %, disproportionated rosin 10wt %, newtrex 22 wt %, adipic acid 2 wt %, glutaric acid 2 wt %, suberic acid 5wt %, TBAB 0.2wt%, polyethylene glycol 6wt%, dimethyl succinate 0.6wt%, BTA 0.8wt%, the solvent of surplus.
Embodiment 5
The composition of scaling powder and quality per distribution ratio are as follows:
Foral 10 wt %, disproportionated rosin 10wt %, newtrex 20 wt %, succinic acid 4 wt %, glutaric acid 2 wt %, stearic acid 4wt %, cyclohexylamine hydrobromide 0.5wt%, polyethylene glycol 4wt%, NPE 0.4wt%, BTA 0.6wt%, the solvent of surplus.
Embodiment 6
The composition of scaling powder and quality per distribution ratio are as follows:
Water-white rosin 15 wt %, newtrex 20 wt %, succinic acid 2 wt %, dodecoic acid 2wt %, stearic acid 4wt %, cyclohexylamine hydrobromide 0.2wt%, polyethylene glycol 6wt%, dimethyl succinate 0.4wt%, triethylamine 0.6wt%, the solvent of surplus.
Adopt above embodiment, test respectively the rate of spread, wetting time, corrosivity, surface insulation resistance, the smog size of scaling powder, evaluation result sees Table 1, and as seen, the performance of the solder flux of embodiment and traditional solder flux have obvious advantage generally.
| Case | The rate of spread | Wetting time | Surface insulation resistance/10 8Ω | The bronze mirror corrosion | Residue | Smog |
| Embodiment 1 | 89% | <1s | 3.6 | Corrode without penetrability | Nothing | Nothing |
| Embodiment 2 | 85% | <1s | 3.8 | Corrode without penetrability | Seldom | Little |
| Embodiment 3 | 91% | <1s | 3.8 | Corrode without penetrability | Few | Very little |
| Embodiment 4 | 79% | <1s | 3.6 | Corrode without penetrability | Nothing | Little |
| Embodiment 5 | 88% | <1s | 3.2 | Corrode without penetrability | Few | Little |
| Embodiment 6 | 80% | <1s | 3.4 | Corrode without penetrability | Nothing | Nothing |
Claims (8)
1. lead-free soldering wire scaling powder; comprise abietic resin, additive and solvent, the mass percent that it is characterized in that additive is that 1 ~ 20% its composition and mass percent are respectively organic acid for activating agent 1 ~ 12wt%, active reinforcing agent 0 ~ 1.0wt%, protective agent 5 ~ 8wt%, surfactant 0.1 ~ 1wt%, corrosion inhibiter 0.5 ~ 1wt%.
2. a kind of lead-free soldering wire scaling powder according to claim 1, is characterized in that the mass percent of described abietic resin is 30 ~ 45%, comprises one or more in the modified rosins such as water-white rosin, newtrex, disproportionated rosin, Foral.
3. a kind of lead-free soldering wire scaling powder according to claim 1, is characterized in that described organic acid for activating agent is one or more in succinic acid, adipic acid, glutaric acid, suberic acid, dodecoic acid, stearic acid, stearic acid, p-tert-butyl benzoic acid, palmitic acid.
4. a kind of lead-free soldering wire scaling powder according to claim 1 is characterized in that described active reinforcing agent is one or more compositions of the ethylenediamine-hydrochloride that contains a small amount of halogen, TBAB, cyclohexylamine hydrobromide.
5. a kind of lead-free soldering wire scaling powder according to claim 1, is characterized in that described protective agent is polyethylene glycol, and its molecular weight is between 1000 ~ 6000.
6. a kind of lead-free soldering wire scaling powder according to claim 1, is characterized in that described surfactant is that non-ionic surface active agent is a kind of of NPE and fatty acid ester surfactant dimethyl succinate or both compositions.
7. a kind of lead-free soldering wire scaling powder according to claim 1 is characterized in that described corrosion inhibiter is one or more of BTA, benzothiazole, triethylamine.
8. a kind of lead-free soldering wire scaling powder according to claim 1, is characterized in that described solvent is surplus, comprises one or more in ethanol, acetone, ethyl acetate, deionized water.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110373846 CN103128461A (en) | 2011-11-23 | 2011-11-23 | Scaling powder for lead-free solder wire |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110373846 CN103128461A (en) | 2011-11-23 | 2011-11-23 | Scaling powder for lead-free solder wire |
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| CN103128461A true CN103128461A (en) | 2013-06-05 |
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| CN 201110373846 Pending CN103128461A (en) | 2011-11-23 | 2011-11-23 | Scaling powder for lead-free solder wire |
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Cited By (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103447716A (en) * | 2013-08-23 | 2013-12-18 | 吴江龙硕金属制品有限公司 | Halogen-free soldering flux and preparation method thereof |
| CN104191108A (en) * | 2014-08-28 | 2014-12-10 | 华南理工大学 | Halogen-free high-activity low-splatter solder wire soldering flux and preparing method thereof |
| CN104985357A (en) * | 2015-07-01 | 2015-10-21 | 芜湖市爱德运输机械有限公司 | Halogenless soldering aid and preparation method thereof |
| CN104985356A (en) * | 2015-07-01 | 2015-10-21 | 芜湖市爱德运输机械有限公司 | No-halogen scaling powder and preparation method thereof |
| CN104985355A (en) * | 2015-07-01 | 2015-10-21 | 芜湖市爱德运输机械有限公司 | Lead-free solder scaling powder and preparation method thereof |
| CN105458552A (en) * | 2015-12-31 | 2016-04-06 | 深圳市兴鸿泰锡业有限公司 | High-performance tin wire soldering flux for automatic tin soldering and preparation method of high-performance tin wire soldering flux |
| CN105921911A (en) * | 2016-05-31 | 2016-09-07 | 深圳市唯特偶新材料股份有限公司 | Soldering flux which generates few concaves after welding and is used for pre-formed soldering lug |
| CN106271221A (en) * | 2016-09-09 | 2017-01-04 | 成都九十度工业产品设计有限公司 | A kind of scaling powder for leadless soldering tin paste |
| CN106493487A (en) * | 2016-12-08 | 2017-03-15 | 深圳市合明科技有限公司 | Water-based scaling powder and preparation method and application |
| CN109128582A (en) * | 2018-10-08 | 2019-01-04 | 资兴市慧华电子有限公司 | A kind of scaling powder reducing exhaust gas treatment |
| CN110653519A (en) * | 2019-10-23 | 2020-01-07 | 宁波新锦春新材料科技有限公司 | Formula and production process of environment-friendly soldering flux |
| CN112235964A (en) * | 2020-10-15 | 2021-01-15 | 江苏新安电器股份有限公司 | Welding method of BTC element |
| CN112548251A (en) * | 2020-12-07 | 2021-03-26 | 镇江百永电气设备有限公司 | High-heat-resistance high-conductivity flexible connection and preparation process thereof |
| CN112582853A (en) * | 2020-12-11 | 2021-03-30 | 镇江百永电气设备有限公司 | High-conductivity strong copper bar flexible connection and preparation process thereof |
| CN114434047A (en) * | 2021-11-25 | 2022-05-06 | 浙江亚通焊材有限公司 | Soldering flux for indium-based solder low-temperature welding and preparation method thereof |
| CN114535864A (en) * | 2020-11-25 | 2022-05-27 | 海太半导体（无锡）有限公司 | Catalyst for prolonging activity of soldering flux |
| JP7239865B1 (en) | 2022-08-26 | 2023-03-15 | 千住金属工業株式会社 | Method for manufacturing flux and bonded body |
-
2011
- 2011-11-23 CN CN 201110373846 patent/CN103128461A/en active Pending
Cited By (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103447716A (en) * | 2013-08-23 | 2013-12-18 | 吴江龙硕金属制品有限公司 | Halogen-free soldering flux and preparation method thereof |
| CN104191108A (en) * | 2014-08-28 | 2014-12-10 | 华南理工大学 | Halogen-free high-activity low-splatter solder wire soldering flux and preparing method thereof |
| CN104985357A (en) * | 2015-07-01 | 2015-10-21 | 芜湖市爱德运输机械有限公司 | Halogenless soldering aid and preparation method thereof |
| CN104985356A (en) * | 2015-07-01 | 2015-10-21 | 芜湖市爱德运输机械有限公司 | No-halogen scaling powder and preparation method thereof |
| CN104985355A (en) * | 2015-07-01 | 2015-10-21 | 芜湖市爱德运输机械有限公司 | Lead-free solder scaling powder and preparation method thereof |
| CN105458552B (en) * | 2015-12-31 | 2018-07-17 | 深圳市兴鸿泰锡业有限公司 | A kind of automatic soldering high-performance solder stick scaling powder and preparation method thereof |
| CN105458552A (en) * | 2015-12-31 | 2016-04-06 | 深圳市兴鸿泰锡业有限公司 | High-performance tin wire soldering flux for automatic tin soldering and preparation method of high-performance tin wire soldering flux |
| CN105921911A (en) * | 2016-05-31 | 2016-09-07 | 深圳市唯特偶新材料股份有限公司 | Soldering flux which generates few concaves after welding and is used for pre-formed soldering lug |
| CN106271221B (en) * | 2016-09-09 | 2018-08-17 | 成都九十度工业产品设计有限公司 | A kind of scaling powder for leadless soldering tin paste |
| CN106271221A (en) * | 2016-09-09 | 2017-01-04 | 成都九十度工业产品设计有限公司 | A kind of scaling powder for leadless soldering tin paste |
| CN106493487A (en) * | 2016-12-08 | 2017-03-15 | 深圳市合明科技有限公司 | Water-based scaling powder and preparation method and application |
| CN109128582A (en) * | 2018-10-08 | 2019-01-04 | 资兴市慧华电子有限公司 | A kind of scaling powder reducing exhaust gas treatment |
| CN109128582B (en) * | 2018-10-08 | 2024-02-09 | 资兴市慧华电子有限公司 | Soldering flux for reducing waste gas emission treatment |
| CN110653519A (en) * | 2019-10-23 | 2020-01-07 | 宁波新锦春新材料科技有限公司 | Formula and production process of environment-friendly soldering flux |
| CN112235964A (en) * | 2020-10-15 | 2021-01-15 | 江苏新安电器股份有限公司 | Welding method of BTC element |
| CN114535864A (en) * | 2020-11-25 | 2022-05-27 | 海太半导体（无锡）有限公司 | Catalyst for prolonging activity of soldering flux |
| CN112548251A (en) * | 2020-12-07 | 2021-03-26 | 镇江百永电气设备有限公司 | High-heat-resistance high-conductivity flexible connection and preparation process thereof |
| CN112582853A (en) * | 2020-12-11 | 2021-03-30 | 镇江百永电气设备有限公司 | High-conductivity strong copper bar flexible connection and preparation process thereof |
| CN112582853B (en) * | 2020-12-11 | 2022-08-02 | 镇江百永电气设备有限公司 | High-conductivity strong copper bar flexible connection and preparation process thereof |
| CN114434047B (en) * | 2021-11-25 | 2023-02-28 | 浙江亚通新材料股份有限公司 | Soldering flux for indium-based solder low-temperature welding and preparation method thereof |
| CN114434047A (en) * | 2021-11-25 | 2022-05-06 | 浙江亚通焊材有限公司 | Soldering flux for indium-based solder low-temperature welding and preparation method thereof |
| JP7239865B1 (en) | 2022-08-26 | 2023-03-15 | 千住金属工業株式会社 | Method for manufacturing flux and bonded body |
| JP2024031546A (en) * | 2022-08-26 | 2024-03-07 | 千住金属工業株式会社 | Flux and manufacturing method of joined body |
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Application publication date: 20130605 |