CN109128582B - Soldering flux for reducing waste gas emission treatment - Google Patents
Soldering flux for reducing waste gas emission treatment Download PDFInfo
- Publication number
- CN109128582B CN109128582B CN201811169884.8A CN201811169884A CN109128582B CN 109128582 B CN109128582 B CN 109128582B CN 201811169884 A CN201811169884 A CN 201811169884A CN 109128582 B CN109128582 B CN 109128582B
- Authority
- CN
- China
- Prior art keywords
- rosin
- acid
- resin
- ester
- soldering flux
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000005476 soldering Methods 0.000 title claims abstract description 25
- 230000004907 flux Effects 0.000 title claims abstract description 18
- 239000002912 waste gas Substances 0.000 title description 4
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 claims abstract description 34
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 claims abstract description 34
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 claims abstract description 34
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 claims abstract description 20
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 claims abstract description 20
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 claims abstract description 20
- 150000002148 esters Chemical class 0.000 claims abstract description 15
- -1 acrylic ester modified butadiene Chemical class 0.000 claims abstract description 13
- NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical group NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 claims abstract description 13
- DUIOKRXOKLLURE-UHFFFAOYSA-N 2-octylphenol Chemical compound CCCCCCCCC1=CC=CC=C1O DUIOKRXOKLLURE-UHFFFAOYSA-N 0.000 claims abstract description 10
- 239000005711 Benzoic acid Substances 0.000 claims abstract description 10
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 claims abstract description 10
- 229960004543 anhydrous citric acid Drugs 0.000 claims abstract description 10
- 235000010233 benzoic acid Nutrition 0.000 claims abstract description 10
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 claims abstract description 10
- 229940051841 polyoxyethylene ether Drugs 0.000 claims abstract description 10
- 229920000056 polyoxyethylene ether Polymers 0.000 claims abstract description 10
- 239000004698 Polyethylene Substances 0.000 claims abstract description 8
- 229920005546 furfural resin Polymers 0.000 claims abstract description 8
- 229920002857 polybutadiene Polymers 0.000 claims abstract description 8
- 239000004814 polyurethane Substances 0.000 claims abstract description 8
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 claims abstract description 7
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 claims abstract description 7
- 239000012964 benzotriazole Substances 0.000 claims abstract description 7
- 229920005989 resin Polymers 0.000 claims abstract description 6
- 239000011347 resin Substances 0.000 claims abstract description 6
- 229920013716 polyethylene resin Polymers 0.000 claims abstract description 5
- 229920005749 polyurethane resin Polymers 0.000 claims abstract description 5
- 239000012744 reinforcing agent Substances 0.000 claims abstract description 5
- 239000012190 activator Substances 0.000 claims abstract description 4
- 150000007524 organic acids Chemical class 0.000 claims abstract description 4
- 238000003756 stirring Methods 0.000 claims description 12
- 239000011812 mixed powder Substances 0.000 claims description 6
- 229960004365 benzoic acid Drugs 0.000 claims description 3
- 238000000034 method Methods 0.000 claims description 3
- 229920000573 polyethylene Polymers 0.000 claims description 3
- 229920002635 polyurethane Polymers 0.000 claims description 3
- 239000010935 stainless steel Substances 0.000 claims description 3
- 229910001220 stainless steel Inorganic materials 0.000 claims description 3
- RSWGJHLUYNHPMX-ONCXSQPRSA-N abietic acid Chemical compound C([C@@H]12)CC(C(C)C)=CC1=CC[C@@H]1[C@]2(C)CCC[C@@]1(C)C(O)=O RSWGJHLUYNHPMX-ONCXSQPRSA-N 0.000 claims description 2
- 239000002253 acid Substances 0.000 claims description 2
- 229920005862 polyol Polymers 0.000 claims description 2
- 239000007787 solid Substances 0.000 claims description 2
- 239000002994 raw material Substances 0.000 claims 1
- 238000005303 weighing Methods 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 abstract description 5
- 239000002904 solvent Substances 0.000 abstract 1
- 238000003466 welding Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 229910001128 Sn alloy Inorganic materials 0.000 description 1
- 239000013543 active substance Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 150000004820 halides Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 239000000779 smoke Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/40—Making wire or rods for soldering or welding
Abstract
The invention relates to a soldering flux for reducing exhaust emission treatment, which is modified rosin resin formed by rosin and rosin ester; the acrylic ester modified butadiene resin, polyethylene, polyurethane and furfural resin form a film-forming reinforcing agent; the octyl phenol polyoxyethylene ether, the succinic acid, the anhydrous citric acid, the benzoic acid and the dimethylbenzene are compounded to form an organic acid activator; dimethyl methanol, benzotriazole and hexamethylenediamine form a solvent; the invention can improve workshop environment, prevent soldering tin from being oxidized in a large amount, improve production efficiency and save labor cost for enterprises.
Description
Technical Field
The invention relates to a soldering flux for reducing exhaust emission treatment.
Background
The traditional soldering process uses an open type soldering furnace, a soldering wire and a common soldering flux, wherein the soldering wire is generally composed of two parts of tin alloy and the common soldering flux, and the common soldering flux has the effects of improving auxiliary heat conduction of the soldering wire in the welding process, removing oxidation, reducing the surface tension of a welded material, removing greasy dirt on the surface of the welded material and increasing the welding area; the flux is usually a rosin resin flux composed of rosin, resin, halide-containing active agent, additive and organic solvent. The soldering flux has good weldability and low cost, but waste gas is filled in the air when soldering tin exists after soldering, so that soldering tin in a production workshop is very sharp in smoke smell, and the environment of the workshop is bad while the soldering tin is wasted, thereby affecting the physical health of workers.
Disclosure of Invention
The technical problem to be solved by the invention is to provide the soldering flux for reducing the exhaust emission treatment, which can reduce the exhaust emission treatment, improve the production efficiency, save the labor cost for enterprises and improve the product quality. Namely: the production efficiency is improved by 30%, the product quality is improved by 18%, and the air index reaches PM2.5.
In contrast, the soldering flux for reducing the exhaust emission treatment provided by the invention is transparent smokeless washing-free type; the preparation method comprises the following steps of: 10% of rosin, 10% of rosin ester, 7% of acrylate modified butadiene resin, 5% of polyethylene, 5% of polyurethane, 5% of furfural resin, 1% of octyl phenol polyoxyethylene ether, 2% of succinic acid, 1.6% of anhydrous citric acid, 1% of benzoic acid, 0.4% of dimethylbenzene, 50% of dimethyl methanol, 1% of benzotriazole and 1% of hexamethylenediamine; wherein the rosin and rosin ester are formed as a modified rosin resin; the acrylic ester modified butadiene resin, polyethylene, polyurethane and furfural resin form a film-forming reinforcing agent; the octyl phenol polyoxyethylene ether, the succinic acid, the anhydrous citric acid, the benzoic acid and the dimethylbenzene are compounded to form an organic acid activator;
crushing rosin and rosin ester by a crusher, wherein the crushing fineness is 100 meshes; mixing octyl phenol polyoxyethylene ether, succinic acid, anhydrous citric acid, benzoic acid and dimethylbenzene according to the component formula ratio at normal temperature, pouring into a stainless steel container filled with dimethyl methanol, stirring for 0.5 hour, adding benzotriazole and hexamethylenediamine, and stirring for 0.5 hour; standing for 1 hour; and adding the mixed powder of rosin and rosin ester while stirring until the mixed powder is completely dissolved, stopping stirring, and standing for 4-6 hours to obtain the transparent smokeless washing-free soldering flux.
Compared with the prior art, the invention has the beneficial effects that: the invention adopts a film forming reinforcing agent composed of acrylate modified butadiene resin, polyethylene, polyurethane and furfural resin, has proper softening point, and the softening point is 90-100 ℃, and the welding spot is not yellow and transparent and clean after welding. The waste gas generated during soldering tin is very little, the production efficiency is improved, the workshop environment is improved, the energy is saved, the environment is protected, the damage to the physical health of workers is avoided, the product quality is improved, the production efficiency is improved by 30%, the product quality is improved by 18%, and the air index reaches PM2.5.
Detailed Description
Preferred embodiments of the present invention are described in further detail below.
In this regard, the flux used in the present embodiment is a flux dedicated to an oxidation-resistant solder pot, and is a transparent smokeless no-clean formulation; the preparation method comprises the following steps of: 10% of rosin, 10% of rosin ester, 7% of acrylate modified butadiene resin, 5% of polyethylene, 5% of polyurethane, 5% of furfural resin, 1% of octyl phenol polyoxyethylene ether, 2% of succinic acid, 1.6% of anhydrous citric acid, 1% of benzoic acid, 0.4% of dimethylbenzene, 50% of dimethyl methanol, 1% of benzotriazole and 1% of hexamethylenediamine; wherein the rosin and rosin ester are formed as a modified rosin resin; the acrylic ester modified butadiene resin, polyethylene, polyurethane and furfural resin form a film-forming reinforcing agent; the octyl phenol polyoxyethylene ether, the succinic acid, the anhydrous citric acid, the benzoic acid and the dimethylbenzene are compounded to form an organic acid activator;
crushing rosin and rosin ester by a crusher, wherein the crushing fineness is 100 meshes; mixing octyl phenol polyoxyethylene ether, succinic acid, anhydrous citric acid, benzoic acid and dimethylbenzene according to the component formula ratio at normal temperature, pouring into a stainless steel container filled with dimethyl methanol, stirring for 0.5 hour, adding benzotriazole and hexamethylenediamine, and stirring for 0.5 hour; standing for 1 hour; and adding the mixed powder of rosin and rosin ester while stirring until the mixed powder is completely dissolved, stopping stirring, and standing for 4-6 hours to obtain the transparent smokeless washing-free soldering flux.
The rosin ester is polyol ester of rosin acid, is light yellow transparent solid, has a softening point of 90-110 ℃ and an acid value of 10-20.
The foregoing is a further detailed description of the invention in connection with the preferred embodiments, and it is not intended that the invention be limited to the specific embodiments described. It will be apparent to those skilled in the art that several simple deductions or substitutions may be made without departing from the spirit of the invention, and these should be considered to be within the scope of the invention.
Claims (1)
1. A soldering flux for reducing exhaust emission treatment is transparent smokeless washing-free type; the method is characterized in that: weighing the following raw materials in percentage by weight: 10% of rosin, 10% of rosin ester, 7% of acrylate modified butadiene resin, 5% of polyethylene, 5% of polyurethane, 5% of furfural resin, 1% of octyl phenol polyoxyethylene ether, 2% of succinic acid, 1.6% of anhydrous citric acid, 1% of benzoic acid, 0.4% of dimethylbenzene, 50% of dimethyl methanol, 1% of benzotriazole and 1% of hexamethylenediamine; wherein the rosin and rosin ester are formed as a modified rosin resin; the acrylic ester modified butadiene resin, polyethylene, polyurethane and furfural resin form a film-forming reinforcing agent; the octyl phenol polyoxyethylene ether, the succinic acid, the anhydrous citric acid, the benzoic acid and the dimethylbenzene are compounded to form an organic acid activator;
crushing rosin and rosin ester by a crusher, wherein the crushing fineness is 100 meshes; mixing octyl phenol polyoxyethylene ether, succinic acid, anhydrous citric acid, benzoic acid and dimethylbenzene according to the component formula ratio at normal temperature, pouring into a stainless steel container filled with dimethyl methanol, stirring for 0.5 hour, adding benzotriazole and hexamethylenediamine, and stirring for 0.5 hour; standing for 1 hour; adding the mixed powder of rosin and rosin ester while stirring until the mixed powder is completely dissolved, stopping stirring, and standing for 4-6 hours to obtain the transparent smokeless washing-free soldering flux:
the rosin ester is polyol ester of rosin acid, is light yellow transparent solid, has a softening point of 90-110 ℃ and an acid value of 10-20.
Priority Applications (1)
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CN201811169884.8A CN109128582B (en) | 2018-10-08 | 2018-10-08 | Soldering flux for reducing waste gas emission treatment |
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CN201811169884.8A CN109128582B (en) | 2018-10-08 | 2018-10-08 | Soldering flux for reducing waste gas emission treatment |
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CN109128582A CN109128582A (en) | 2019-01-04 |
CN109128582B true CN109128582B (en) | 2024-02-09 |
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CN201811169884.8A Active CN109128582B (en) | 2018-10-08 | 2018-10-08 | Soldering flux for reducing waste gas emission treatment |
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Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
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CN109014484B (en) * | 2018-10-08 | 2024-02-23 | 资兴市慧华电子有限公司 | Full-automatic anti-oxidation soldering tin stove for reducing exhaust emission treatment and special soldering flux |
CN110877171B (en) * | 2019-11-11 | 2021-03-30 | 华南理工大学 | Soldering flux for solder wire and preparation method thereof |
CN111777944A (en) * | 2020-07-01 | 2020-10-16 | 云南锡业锡材有限公司 | Solder ball surface treating agent for chip packaging and preparation method thereof |
Citations (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5127968A (en) * | 1989-08-16 | 1992-07-07 | Yuho Chemicals Inc. | Additive for fluxes and soldering pastes |
US5382299A (en) * | 1993-02-01 | 1995-01-17 | Cookson Group Plc | Soldering flux |
CN101062536A (en) * | 2007-06-01 | 2007-10-31 | 中南大学 | Non-halide cleaning-free welding flux for leadless solder |
CN101073862A (en) * | 2007-06-08 | 2007-11-21 | 北京工业大学 | Low-rosin and cleaning-free welding accessory without halogen for lead-free welding grease |
CN101214594A (en) * | 2007-12-28 | 2008-07-09 | 潘惠凯 | Environment-friendly type lead-free solder water-based scaling powder and preparation thereof |
CN101239428A (en) * | 2008-03-05 | 2008-08-13 | 东莞市普赛特电子科技有限公司 | Mildew resistant antimicrobial type low corrosion water-based scaling powder |
CN101653876A (en) * | 2009-08-19 | 2010-02-24 | 浙江一远电子材料研究院 | Low-silver halogen free soldering paste |
CN102350599A (en) * | 2011-08-25 | 2012-02-15 | 华南理工大学 | Halogen-free high-impedance water-based washing-free scaling powder as well as preparation method and application thereof |
CN103008920A (en) * | 2012-12-13 | 2013-04-03 | 郴州金箭焊料有限公司 | Leadless rosin core no-clean scaling powder |
CN103128461A (en) * | 2011-11-23 | 2013-06-05 | 郴州金箭焊料有限公司 | Scaling powder for lead-free solder wire |
JP2013173156A (en) * | 2012-02-24 | 2013-09-05 | Mitsubishi Materials Corp | Method for producing solder paste, and the solder paste produced by the same |
CN106271217A (en) * | 2016-09-23 | 2017-01-04 | 工业和信息化部电子第五研究所华东分所 | A kind of disposable halogen-free scaling powder and low temperature solder stick |
CN107175431A (en) * | 2017-07-04 | 2017-09-19 | 合肥市大卓电力有限责任公司 | A kind of efficient scaling powder and preparation method thereof |
CN108526756A (en) * | 2018-04-11 | 2018-09-14 | 苏州龙腾万里化工科技有限公司 | A kind of cleaning-free scaling powder |
-
2018
- 2018-10-08 CN CN201811169884.8A patent/CN109128582B/en active Active
Patent Citations (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5127968A (en) * | 1989-08-16 | 1992-07-07 | Yuho Chemicals Inc. | Additive for fluxes and soldering pastes |
US5382299A (en) * | 1993-02-01 | 1995-01-17 | Cookson Group Plc | Soldering flux |
CN101062536A (en) * | 2007-06-01 | 2007-10-31 | 中南大学 | Non-halide cleaning-free welding flux for leadless solder |
CN101073862A (en) * | 2007-06-08 | 2007-11-21 | 北京工业大学 | Low-rosin and cleaning-free welding accessory without halogen for lead-free welding grease |
CN101214594A (en) * | 2007-12-28 | 2008-07-09 | 潘惠凯 | Environment-friendly type lead-free solder water-based scaling powder and preparation thereof |
CN101239428A (en) * | 2008-03-05 | 2008-08-13 | 东莞市普赛特电子科技有限公司 | Mildew resistant antimicrobial type low corrosion water-based scaling powder |
CN101653876A (en) * | 2009-08-19 | 2010-02-24 | 浙江一远电子材料研究院 | Low-silver halogen free soldering paste |
CN102350599A (en) * | 2011-08-25 | 2012-02-15 | 华南理工大学 | Halogen-free high-impedance water-based washing-free scaling powder as well as preparation method and application thereof |
CN103128461A (en) * | 2011-11-23 | 2013-06-05 | 郴州金箭焊料有限公司 | Scaling powder for lead-free solder wire |
JP2013173156A (en) * | 2012-02-24 | 2013-09-05 | Mitsubishi Materials Corp | Method for producing solder paste, and the solder paste produced by the same |
CN103008920A (en) * | 2012-12-13 | 2013-04-03 | 郴州金箭焊料有限公司 | Leadless rosin core no-clean scaling powder |
CN106271217A (en) * | 2016-09-23 | 2017-01-04 | 工业和信息化部电子第五研究所华东分所 | A kind of disposable halogen-free scaling powder and low temperature solder stick |
CN107175431A (en) * | 2017-07-04 | 2017-09-19 | 合肥市大卓电力有限责任公司 | A kind of efficient scaling powder and preparation method thereof |
CN108526756A (en) * | 2018-04-11 | 2018-09-14 | 苏州龙腾万里化工科技有限公司 | A kind of cleaning-free scaling powder |
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