CN109128582B - Soldering flux for reducing waste gas emission treatment - Google Patents

Soldering flux for reducing waste gas emission treatment Download PDF

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Publication number
CN109128582B
CN109128582B CN201811169884.8A CN201811169884A CN109128582B CN 109128582 B CN109128582 B CN 109128582B CN 201811169884 A CN201811169884 A CN 201811169884A CN 109128582 B CN109128582 B CN 109128582B
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Prior art keywords
rosin
acid
resin
ester
soldering flux
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CN201811169884.8A
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CN109128582A (en
Inventor
陈祖生
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Zixing Huihua Electronics Co ltd
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Zixing Huihua Electronics Co ltd
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/40Making wire or rods for soldering or welding

Abstract

The invention relates to a soldering flux for reducing exhaust emission treatment, which is modified rosin resin formed by rosin and rosin ester; the acrylic ester modified butadiene resin, polyethylene, polyurethane and furfural resin form a film-forming reinforcing agent; the octyl phenol polyoxyethylene ether, the succinic acid, the anhydrous citric acid, the benzoic acid and the dimethylbenzene are compounded to form an organic acid activator; dimethyl methanol, benzotriazole and hexamethylenediamine form a solvent; the invention can improve workshop environment, prevent soldering tin from being oxidized in a large amount, improve production efficiency and save labor cost for enterprises.

Description

Soldering flux for reducing waste gas emission treatment
Technical Field
The invention relates to a soldering flux for reducing exhaust emission treatment.
Background
The traditional soldering process uses an open type soldering furnace, a soldering wire and a common soldering flux, wherein the soldering wire is generally composed of two parts of tin alloy and the common soldering flux, and the common soldering flux has the effects of improving auxiliary heat conduction of the soldering wire in the welding process, removing oxidation, reducing the surface tension of a welded material, removing greasy dirt on the surface of the welded material and increasing the welding area; the flux is usually a rosin resin flux composed of rosin, resin, halide-containing active agent, additive and organic solvent. The soldering flux has good weldability and low cost, but waste gas is filled in the air when soldering tin exists after soldering, so that soldering tin in a production workshop is very sharp in smoke smell, and the environment of the workshop is bad while the soldering tin is wasted, thereby affecting the physical health of workers.
Disclosure of Invention
The technical problem to be solved by the invention is to provide the soldering flux for reducing the exhaust emission treatment, which can reduce the exhaust emission treatment, improve the production efficiency, save the labor cost for enterprises and improve the product quality. Namely: the production efficiency is improved by 30%, the product quality is improved by 18%, and the air index reaches PM2.5.
In contrast, the soldering flux for reducing the exhaust emission treatment provided by the invention is transparent smokeless washing-free type; the preparation method comprises the following steps of: 10% of rosin, 10% of rosin ester, 7% of acrylate modified butadiene resin, 5% of polyethylene, 5% of polyurethane, 5% of furfural resin, 1% of octyl phenol polyoxyethylene ether, 2% of succinic acid, 1.6% of anhydrous citric acid, 1% of benzoic acid, 0.4% of dimethylbenzene, 50% of dimethyl methanol, 1% of benzotriazole and 1% of hexamethylenediamine; wherein the rosin and rosin ester are formed as a modified rosin resin; the acrylic ester modified butadiene resin, polyethylene, polyurethane and furfural resin form a film-forming reinforcing agent; the octyl phenol polyoxyethylene ether, the succinic acid, the anhydrous citric acid, the benzoic acid and the dimethylbenzene are compounded to form an organic acid activator;
crushing rosin and rosin ester by a crusher, wherein the crushing fineness is 100 meshes; mixing octyl phenol polyoxyethylene ether, succinic acid, anhydrous citric acid, benzoic acid and dimethylbenzene according to the component formula ratio at normal temperature, pouring into a stainless steel container filled with dimethyl methanol, stirring for 0.5 hour, adding benzotriazole and hexamethylenediamine, and stirring for 0.5 hour; standing for 1 hour; and adding the mixed powder of rosin and rosin ester while stirring until the mixed powder is completely dissolved, stopping stirring, and standing for 4-6 hours to obtain the transparent smokeless washing-free soldering flux.
Compared with the prior art, the invention has the beneficial effects that: the invention adopts a film forming reinforcing agent composed of acrylate modified butadiene resin, polyethylene, polyurethane and furfural resin, has proper softening point, and the softening point is 90-100 ℃, and the welding spot is not yellow and transparent and clean after welding. The waste gas generated during soldering tin is very little, the production efficiency is improved, the workshop environment is improved, the energy is saved, the environment is protected, the damage to the physical health of workers is avoided, the product quality is improved, the production efficiency is improved by 30%, the product quality is improved by 18%, and the air index reaches PM2.5.
Detailed Description
Preferred embodiments of the present invention are described in further detail below.
In this regard, the flux used in the present embodiment is a flux dedicated to an oxidation-resistant solder pot, and is a transparent smokeless no-clean formulation; the preparation method comprises the following steps of: 10% of rosin, 10% of rosin ester, 7% of acrylate modified butadiene resin, 5% of polyethylene, 5% of polyurethane, 5% of furfural resin, 1% of octyl phenol polyoxyethylene ether, 2% of succinic acid, 1.6% of anhydrous citric acid, 1% of benzoic acid, 0.4% of dimethylbenzene, 50% of dimethyl methanol, 1% of benzotriazole and 1% of hexamethylenediamine; wherein the rosin and rosin ester are formed as a modified rosin resin; the acrylic ester modified butadiene resin, polyethylene, polyurethane and furfural resin form a film-forming reinforcing agent; the octyl phenol polyoxyethylene ether, the succinic acid, the anhydrous citric acid, the benzoic acid and the dimethylbenzene are compounded to form an organic acid activator;
crushing rosin and rosin ester by a crusher, wherein the crushing fineness is 100 meshes; mixing octyl phenol polyoxyethylene ether, succinic acid, anhydrous citric acid, benzoic acid and dimethylbenzene according to the component formula ratio at normal temperature, pouring into a stainless steel container filled with dimethyl methanol, stirring for 0.5 hour, adding benzotriazole and hexamethylenediamine, and stirring for 0.5 hour; standing for 1 hour; and adding the mixed powder of rosin and rosin ester while stirring until the mixed powder is completely dissolved, stopping stirring, and standing for 4-6 hours to obtain the transparent smokeless washing-free soldering flux.
The rosin ester is polyol ester of rosin acid, is light yellow transparent solid, has a softening point of 90-110 ℃ and an acid value of 10-20.
The foregoing is a further detailed description of the invention in connection with the preferred embodiments, and it is not intended that the invention be limited to the specific embodiments described. It will be apparent to those skilled in the art that several simple deductions or substitutions may be made without departing from the spirit of the invention, and these should be considered to be within the scope of the invention.

Claims (1)

1. A soldering flux for reducing exhaust emission treatment is transparent smokeless washing-free type; the method is characterized in that: weighing the following raw materials in percentage by weight: 10% of rosin, 10% of rosin ester, 7% of acrylate modified butadiene resin, 5% of polyethylene, 5% of polyurethane, 5% of furfural resin, 1% of octyl phenol polyoxyethylene ether, 2% of succinic acid, 1.6% of anhydrous citric acid, 1% of benzoic acid, 0.4% of dimethylbenzene, 50% of dimethyl methanol, 1% of benzotriazole and 1% of hexamethylenediamine; wherein the rosin and rosin ester are formed as a modified rosin resin; the acrylic ester modified butadiene resin, polyethylene, polyurethane and furfural resin form a film-forming reinforcing agent; the octyl phenol polyoxyethylene ether, the succinic acid, the anhydrous citric acid, the benzoic acid and the dimethylbenzene are compounded to form an organic acid activator;
crushing rosin and rosin ester by a crusher, wherein the crushing fineness is 100 meshes; mixing octyl phenol polyoxyethylene ether, succinic acid, anhydrous citric acid, benzoic acid and dimethylbenzene according to the component formula ratio at normal temperature, pouring into a stainless steel container filled with dimethyl methanol, stirring for 0.5 hour, adding benzotriazole and hexamethylenediamine, and stirring for 0.5 hour; standing for 1 hour; adding the mixed powder of rosin and rosin ester while stirring until the mixed powder is completely dissolved, stopping stirring, and standing for 4-6 hours to obtain the transparent smokeless washing-free soldering flux:
the rosin ester is polyol ester of rosin acid, is light yellow transparent solid, has a softening point of 90-110 ℃ and an acid value of 10-20.
CN201811169884.8A 2018-10-08 2018-10-08 Soldering flux for reducing waste gas emission treatment Active CN109128582B (en)

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CN109128582B true CN109128582B (en) 2024-02-09

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Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109014484B (en) * 2018-10-08 2024-02-23 资兴市慧华电子有限公司 Full-automatic anti-oxidation soldering tin stove for reducing exhaust emission treatment and special soldering flux
CN110877171B (en) * 2019-11-11 2021-03-30 华南理工大学 Soldering flux for solder wire and preparation method thereof
CN111777944A (en) * 2020-07-01 2020-10-16 云南锡业锡材有限公司 Solder ball surface treating agent for chip packaging and preparation method thereof

Citations (14)

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US5127968A (en) * 1989-08-16 1992-07-07 Yuho Chemicals Inc. Additive for fluxes and soldering pastes
US5382299A (en) * 1993-02-01 1995-01-17 Cookson Group Plc Soldering flux
CN101062536A (en) * 2007-06-01 2007-10-31 中南大学 Non-halide cleaning-free welding flux for leadless solder
CN101073862A (en) * 2007-06-08 2007-11-21 北京工业大学 Low-rosin and cleaning-free welding accessory without halogen for lead-free welding grease
CN101214594A (en) * 2007-12-28 2008-07-09 潘惠凯 Environment-friendly type lead-free solder water-based scaling powder and preparation thereof
CN101239428A (en) * 2008-03-05 2008-08-13 东莞市普赛特电子科技有限公司 Mildew resistant antimicrobial type low corrosion water-based scaling powder
CN101653876A (en) * 2009-08-19 2010-02-24 浙江一远电子材料研究院 Low-silver halogen free soldering paste
CN102350599A (en) * 2011-08-25 2012-02-15 华南理工大学 Halogen-free high-impedance water-based washing-free scaling powder as well as preparation method and application thereof
CN103008920A (en) * 2012-12-13 2013-04-03 郴州金箭焊料有限公司 Leadless rosin core no-clean scaling powder
CN103128461A (en) * 2011-11-23 2013-06-05 郴州金箭焊料有限公司 Scaling powder for lead-free solder wire
JP2013173156A (en) * 2012-02-24 2013-09-05 Mitsubishi Materials Corp Method for producing solder paste, and the solder paste produced by the same
CN106271217A (en) * 2016-09-23 2017-01-04 工业和信息化部电子第五研究所华东分所 A kind of disposable halogen-free scaling powder and low temperature solder stick
CN107175431A (en) * 2017-07-04 2017-09-19 合肥市大卓电力有限责任公司 A kind of efficient scaling powder and preparation method thereof
CN108526756A (en) * 2018-04-11 2018-09-14 苏州龙腾万里化工科技有限公司 A kind of cleaning-free scaling powder

Patent Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5127968A (en) * 1989-08-16 1992-07-07 Yuho Chemicals Inc. Additive for fluxes and soldering pastes
US5382299A (en) * 1993-02-01 1995-01-17 Cookson Group Plc Soldering flux
CN101062536A (en) * 2007-06-01 2007-10-31 中南大学 Non-halide cleaning-free welding flux for leadless solder
CN101073862A (en) * 2007-06-08 2007-11-21 北京工业大学 Low-rosin and cleaning-free welding accessory without halogen for lead-free welding grease
CN101214594A (en) * 2007-12-28 2008-07-09 潘惠凯 Environment-friendly type lead-free solder water-based scaling powder and preparation thereof
CN101239428A (en) * 2008-03-05 2008-08-13 东莞市普赛特电子科技有限公司 Mildew resistant antimicrobial type low corrosion water-based scaling powder
CN101653876A (en) * 2009-08-19 2010-02-24 浙江一远电子材料研究院 Low-silver halogen free soldering paste
CN102350599A (en) * 2011-08-25 2012-02-15 华南理工大学 Halogen-free high-impedance water-based washing-free scaling powder as well as preparation method and application thereof
CN103128461A (en) * 2011-11-23 2013-06-05 郴州金箭焊料有限公司 Scaling powder for lead-free solder wire
JP2013173156A (en) * 2012-02-24 2013-09-05 Mitsubishi Materials Corp Method for producing solder paste, and the solder paste produced by the same
CN103008920A (en) * 2012-12-13 2013-04-03 郴州金箭焊料有限公司 Leadless rosin core no-clean scaling powder
CN106271217A (en) * 2016-09-23 2017-01-04 工业和信息化部电子第五研究所华东分所 A kind of disposable halogen-free scaling powder and low temperature solder stick
CN107175431A (en) * 2017-07-04 2017-09-19 合肥市大卓电力有限责任公司 A kind of efficient scaling powder and preparation method thereof
CN108526756A (en) * 2018-04-11 2018-09-14 苏州龙腾万里化工科技有限公司 A kind of cleaning-free scaling powder

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