CN101062536A - Non-halide cleaning-free welding flux for leadless solder - Google Patents
Non-halide cleaning-free welding flux for leadless solder Download PDFInfo
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- CN101062536A CN101062536A CN 200710035046 CN200710035046A CN101062536A CN 101062536 A CN101062536 A CN 101062536A CN 200710035046 CN200710035046 CN 200710035046 CN 200710035046 A CN200710035046 A CN 200710035046A CN 101062536 A CN101062536 A CN 101062536A
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Abstract
The invention relates to a lead free soldering clean free soldering flux with the mass percentage of organic acid activating agent 1. 5-3. 5%, surface active agent 0. 04-0. 6%, organic amine and derivant 2. 0-5. 0%, with the rest being film forming matter. The said organic acid could be one or more of the aliphatic acid mono acid or bi-acid, aromatic acid, or amino acid. The said surface active agent is one or more of the nonion surface active agent, and the said organic amine and the derivant being ethanediamine, tetramethylenediamine, diethyl ethanolamine and so on, with the said film forming material being diethyl ethanolamine or resin. The soldering flux does not have halogen, being environmental protective, good in welding, welding spot being full and luminous, without residue, no corrosion, high in isolation resistance.
Description
Technical field
The present invention relates to scaling powder, relate in particular to the halogen-free scaling powder of exempting to clean that the Pb-free solder line is used.
Background technology
At present, be used for scaling powder manual or the Pb-free solder line of welding automatically in the electronics industry and contain the halide activating agent mostly, its residue is not only many but also corrosivity is bigger, can have a strong impact on reliability of products.Need use solvent clean for guaranteeing product quality, and the cleaning agent major part of using now is a hydrocarbon compound fluorine-containing, chlorine substituent, as CFC113 and trichloroethanes, these materials have serious destruction to atmospheric ozone layer, can bring serious destruction to human ecological environment, be forbidden producing and using by the United Nations.Therefore, along with the develop rapidly of electron trade and human lifting to environmental protection consciousness, the trend that to develop halogen-free scaling powder of exempting to clean be the scolding tin industry development.
The Chinese patent publication number is the neutral scaling powder that a kind of soldering tin core of CN 1110204A is used, and this scaling powder contains the organic carboxyl acid of percetage by weight 1～20%, 1～22% alkyl alcoholamine, and the hydrochloride of 1～20% amine or its hydrobromate, surplus is a water; Another kind of scaling powder also contains 1～15% alcohol except that mentioned component, its method for making is with organic carboxyl acid and alkyl alcoholamine heating fusion, adds the hydrochloride of amine or the aqueous solution of its hydrobromate, and the water of insulated and stirred adding surplus or alcohol and water carry out emulsification and forms.Though this scaling powder helps the weldering effect good, contain hydrochloride or its hydrobromate of organic amine, postwelding ion residues height, bigger to the corrosion of plate face, insulaion resistance is not high yet.
Summary of the invention
The purpose of this invention is to provide non-halide cleaning-free welding flux in a kind of Pb-free solder line, this halogen-free flux solderability is good, and ion residues is few, and the plate face is not had corrosion, the surface insulation resistance height.
The component of scaling powder of the present invention is by mass percentage:
Organic acid activator 1.5～3.5%
Non-ionic surface active agent 0.04～0.6%
Organic amine and derivative 2.0～5.0% thereof
Surplus is a film forming matter;
Described organic acid activator is meant one or more in aliphatic monoacid, binary acid, aromatic acid and the amino acid.Preferred acetate, propionic acid, succinic acid, adipic acid, glutaric acid, palmitic acid, stearic acid, benzoic acid, malic acid, salicylic acid, glutamic acid, glycine, the amino M-phthalic acid of 5-, dodecoic acid, p-tert-butyl benzoic acid, optional one or more mixing wherein.This type of activating agent has enough welding activity, can decompose or distil under welding temperature, makes the noresidue of pcb board postwelding plate face, does not have corrosion.
Described surfactant is a non-ionic surface active agent, preferred NPE, APES, OPEO, dibromo butene glycol, non-ion fluorin surfactant (as FSN, FSO etc.), optional one or more mixing wherein.This type of surfactant belongs to nonionic surface active agent, can effectively reduce the surface tension of scolder between pad, strengthen wetability, and postwelding does not have ion residues.
Described organic amine and derivative thereof are meant ethylenediamine, succinic acid amine, diethanol amine, triethanolamine, aniline, salamide, cyclohexane diamine, cyclobutane diamines, divinyl hydrazine, can select one kind or multiple mixing for use.This type of amine and derivative thereof can be regulated the pH value of scaling powder, reduce corrosivity.Improve in the welding process and help weldering active, and volatilize under welding temperature, decomposition is not stayed residual.
Described film forming matter is one or more mixing in rosin or resin, particularly modified rosin, modified propylene resin, modified epoxy, the maleic acid abietic resin.Film forming matter mass-energy plays the effect that coats residue and prevent to reoxidize at postwelding, does not absorb water the insulaion resistance height.
For satisfying the needs of different purposes, non-halide cleaning-free welding flux can also add 0.05～1.0% corrosion inhibiter in the Pb-free solder line of the present invention.Corrosion inhibiter is nitrogen-containing heterocycle compound or organic amine, particularly BTA.Corrosion inhibiter can play antopxidation, reduces the corrosion of solder flux to wiring board.
Scaling powder of the present invention has following advantage: halogen-free, and be the environment-friendly type scaling powder; Solderability is good, the postwelding noresidue, exempts to clean, and the plate face is not had corrosion, the full light of solder joint; The insulaion resistance height.With the JIS Z 3197-1999 of Japanese Industrial Standards this scaling powder is detected, its rate of spread 〉=80%, wetting time was less than 2 seconds, and constant temperature and humidity rear surface insulaion resistance is greater than 3 * 10
11Ω, the bronze mirror corrosion does not have.Therefore, this scaling powder can satisfy the welding process requirement of various wiring boards such as post and telecommunications, computer, Aero-Space, colour TV, refrigeration fully.
The specific embodiment
Embodiment 1: with the film forming matter in the raw material, promptly rosin or resin join in the stainless steel rosin bucket and are heated to about 130 ℃, and it is melted fully; (the mixed solvent mass percent is an isopropyl alcohol 75% by 1: 2 usefulness isopropyl alcohol of mass ratio or isopropyl alcohol and ethanol mixed solvent with each all the other each component, ethanol 25%) slowly join in the rosin or resin of fusing after the dissolving fully, and constantly stir, medicament is uniformly dispersed.Treat with hydraulic press the medicament for preparing to be compressed into solder after solvent volatilizees fully.Pulling into all size line scolding tin line directly by wire drawing machine at last gets final product.
The concrete mass percent of each raw material components is:
Palmitic acid 0.7%
Salicylic acid 2.8%
Dibromo butene glycol 0.3%
Aniline 2.0%
Triethanolamine 1.2%
The Foral surplus
Non-halide cleaning-free welding flux is applicable to manual or welding automatically in the Pb-free solder line of the present invention, and welding temperature can be controlled in 370-420 ℃.
This programme scaling powder rate of spread 83%, wetting time be less than 2 seconds, constant temperature and humidity rear surface insulaion resistance 5 * 10
11Ω, the bronze mirror corrosion does not have, and reaches the JIS Z 3197-1999 of Japanese Industrial Standards fully.
Embodiment 2: preparation method and using method are with embodiment 1.
The concrete mass percent of each raw material components is:
Salicylic acid 2.5%
P-tert-butyl benzoic acid 1.0%
Dibromo butene glycol 0.4%
Divinyl hydrazine 2.0%
Triethanolamine 1.0%
FSN 0.04％
The Foral surplus
This programme scaling powder rate of spread 82%, wetting time be less than 2 seconds, constant temperature and humidity rear surface insulaion resistance 5 * 10
11Ω, the bronze mirror corrosion does not have.Reach the JIS Z 3197-1999 of Japanese Industrial Standards fully.
Embodiment 3: preparation method and using method are with embodiment 1.
Adipic acid 2.5%
Malic acid 1.0%
TX-10 0.06％
Aniline 2.0%
Ethylenediamine 1.2%
Maleic acid abietic resin surplus
This programme scaling powder detects by the JIS Z 3197-1999 of Japanese Industrial Standards, and the rate of spread 80%, wetting time be less than 2 seconds, constant temperature and humidity rear surface insulaion resistance 3 * 10
11Ω, the bronze mirror corrosion does not have.
Embodiment 4: preparation method and using method are with embodiment 1.
Benzoic acid 2.8%
The amino M-phthalic acid 0.7% of 5-
Dibromo butene glycol 0.4%
Cyclohexane diamine 2.0%
Ethylenediamine 1.2%
Foral 92.9%
This programme scaling powder detects by the JIS Z 3197-1999 of Japanese Industrial Standards, and the rate of spread 80%, wetting time be less than 2 seconds, constant temperature and humidity rear surface insulaion resistance 2 * 10
11Ω, the bronze mirror corrosion does not have.Can satisfy various post and telecommunications, Aero-Space, refrigeration, computer, the welding of wiring boards such as colour TV.
Embodiment 5: preparation method and using method are with embodiment 1.
Adipic acid 1.5%
FSO 0.06％
Triethanolamine 1.2%
Cyclobutane diamines 1.5%
BTA 0.05%
The modified propylene resin surplus
This programme scaling powder detects by the JIS Z 3197-1999 of Japanese Industrial Standards, and the rate of spread 82%, wetting time be less than 2 seconds, constant temperature and humidity rear surface insulaion resistance 3 * 10
11Ω, the bronze mirror corrosion does not have.
Embodiment 6: preparation method and using method are with embodiment 1.
Adipic acid 0.8%
P-tert-butyl benzoic acid 2.0%
TX-10 0.06％
Divinyl hydrazine 2.0%
FSO 0.04％
The Foral surplus
This programme scaling powder detects by the JIS Z 3197-1999 of Japanese Industrial Standards, and the rate of spread 80%, wetting time be less than 2 seconds, constant temperature and humidity rear surface insulaion resistance 4 * 10
11Ω, the bronze mirror corrosion does not have.
Embodiment 7: preparation method and using method are with embodiment 1.
Propionic acid 0.5%
Glutamic acid 1.0%
Dibromo butene glycol 0.3%
FSN 0.06％
Aniline 3.0%
The modified epoxy surplus
This programme scaling powder detects by the JIS Z 3197-1999 of Japanese Industrial Standards, and the rate of spread 80%, wetting time be less than 2 seconds, constant temperature and humidity rear surface insulaion resistance 2 * 10
11Ω, the bronze mirror corrosion does not have.
Embodiment 8: preparation method and using method are with embodiment 1.
P-tert-butyl benzoic acid 2.5%
Dibromo butene glycol 0.4%
Divinyl hydrazine 2.0%
Aniline 3.0%
Maleic acid abietic resin surplus
This programme scaling powder detects by the JIS Z 3197-1999 of Japanese Industrial Standards, and the rate of spread 82%, wetting time be less than 2 seconds, constant temperature and humidity rear surface insulaion resistance 6 * 10
11Ω, the bronze mirror corrosion does not have.
Claims (6)
1. non-halide cleaning-free welding flux for leadless solder, the component of this scaling powder is by mass percentage:
Organic acid activator 1.5～3.5%
Surfactant 0.04～0.6%
Organic amine and derivative 2.0～5.0% thereof
Surplus is a film forming matter;
Described organic acid activator is one or more in aliphatic monoacid, aliphatic dibasic acid, aromatic acid, the amino acid; Described surfactant is one or more of non-ionic surface active agent; Described organic amine and derivative thereof are one or more mixing in ethylenediamine, succinic acid amine, diethanol amine, triethanolamine, aniline, salamide, cyclohexane diamine, cyclobutane diamines, the divinyl hydrazine; Described film forming matter is rosin or resin.
2. scaling powder as claimed in claim 1 is characterized in that: described organic acid activator is one or more in acetate, propionic acid, succinic acid, adipic acid, glutaric acid, palmitic acid, stearic acid, malic acid, benzoic acid, salicylic acid, glutamic acid, glycine, the amino M-phthalic acid of 5-, dodecoic acid, the p-tert-butyl benzoic acid.
3. scaling powder as claimed in claim 1 is characterized in that: described non-ionic surface active agent is one or more among NPE, APES, OPEO, dibromo butene glycol, FSN, the FSO.
4. scaling powder as claimed in claim 1 is characterized in that: described film forming matter is one or more in modified rosin, modified propylene resin, modified epoxy, the maleic acid abietic resin.
5. scaling powder as claimed in claim 1 is characterized in that: also comprise percentage by weight in the described scaling powder and be 0.05～1.0% corrosion inhibiter, described corrosion inhibiter is nitrogen-containing heterocycle compound or organic amine.
6. scaling powder as claimed in claim 5 is characterized in that: described corrosion inhibiter is a BTA.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200710035046 CN101062536A (en) | 2007-06-01 | 2007-06-01 | Non-halide cleaning-free welding flux for leadless solder |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200710035046 CN101062536A (en) | 2007-06-01 | 2007-06-01 | Non-halide cleaning-free welding flux for leadless solder |
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| CN101062536A true CN101062536A (en) | 2007-10-31 |
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| CN 200710035046 Pending CN101062536A (en) | 2007-06-01 | 2007-06-01 | Non-halide cleaning-free welding flux for leadless solder |
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| CN101456105A (en) * | 2008-12-24 | 2009-06-17 | 杨嘉骥 | Water-soluble flux using rosin as carrier and preparation method thereof |
| CN101983828A (en) * | 2010-11-29 | 2011-03-09 | 力创(台山)电子科技有限公司 | Soldering flux and preparation method thereof |
| CN102059477A (en) * | 2010-11-29 | 2011-05-18 | 广州有色金属研究院 | Halogen-free soldering flux applicable to silver-free and lead-free solder |
| CN102218624A (en) * | 2011-04-14 | 2011-10-19 | 深圳市宝力科技有限公司 | Flux for leadless solder paste and preparing method thereof |
| CN101596656B (en) * | 2009-07-02 | 2011-11-02 | 东莞市中实焊锡有限公司 | Aqueous cleaning soldering flux for lead-free soldering and preparation method thereof |
| CN102284809A (en) * | 2009-10-12 | 2011-12-21 | 宁波喜汉锡焊料有限公司 | No-halogen cleaning-free soldering flux for tin wire core |
| CN102642101A (en) * | 2010-12-02 | 2012-08-22 | 罗门哈斯电子材料有限公司 | Amine flux composition and method of soldering |
| CN103071944A (en) * | 2013-02-04 | 2013-05-01 | 江苏科技大学 | Halogen-free low-splash solder wire and preparation method of halogen-free low-splash solder wire |
| CN103264241A (en) * | 2013-06-17 | 2013-08-28 | 北京朝铂航科技有限公司 | Cored solder wire solid soldering flux capable of reducing flyoff |
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| CN103817461A (en) * | 2014-03-17 | 2014-05-28 | 苏州龙腾万里化工科技有限公司 | Resin-core soldering flux |
| CN104117786A (en) * | 2014-07-25 | 2014-10-29 | 宁国新博能电子有限公司 | Scaling powder |
| CN104364046A (en) * | 2012-06-11 | 2015-02-18 | 千住金属工业株式会社 | Flux composition, liquid flux, resin flux cored solder, and solder paste |
| CN104400257A (en) * | 2014-10-29 | 2015-03-11 | 重庆理工大学 | Scaling powder for no-clean lead-free low-silver welding paste |
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| CN104858571A (en) * | 2015-06-10 | 2015-08-26 | 深圳市同方电子新材料有限公司 | Halogen-free soldering agent for tin bismuth system unleaded tin paste and preparation method thereof |
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| CN111360446A (en) * | 2020-04-28 | 2020-07-03 | 深圳市邦大科技有限公司 | Halogen-free lead-free soldering paste and preparation method thereof |
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2007
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| CN101456105B (en) * | 2008-12-24 | 2012-12-05 | 杨嘉骥 | Water-soluble flux using rosin as carrier and preparation method thereof |
| CN101596656B (en) * | 2009-07-02 | 2011-11-02 | 东莞市中实焊锡有限公司 | Aqueous cleaning soldering flux for lead-free soldering and preparation method thereof |
| CN102284809B (en) * | 2009-10-12 | 2015-04-15 | 宁波喜汉锡焊料有限公司 | No-halogen cleaning-free soldering flux for tin wire core |
| CN102284809A (en) * | 2009-10-12 | 2011-12-21 | 宁波喜汉锡焊料有限公司 | No-halogen cleaning-free soldering flux for tin wire core |
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