CN110449771A - A kind of no rosin is low to remain solvent type scaling powder free of cleaning admittedly - Google Patents
A kind of no rosin is low to remain solvent type scaling powder free of cleaning admittedly Download PDFInfo
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- CN110449771A CN110449771A CN201910824730.6A CN201910824730A CN110449771A CN 110449771 A CN110449771 A CN 110449771A CN 201910824730 A CN201910824730 A CN 201910824730A CN 110449771 A CN110449771 A CN 110449771A
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/362—Selection of compositions of fluxes
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Preventing Corrosion Or Incrustation Of Metals (AREA)
- Detergent Compositions (AREA)
Abstract
Admittedly solvent type scaling powder free of cleaning is remained the invention discloses no rosin is low, and component and mass percent are as follows: activating agent 1.5% ~ 6%, surfactant 0% ~ 0.15%；Antioxidant 0.05% ~ 1.5%, corrosion inhibiter 0.05% ~ 0.5%；Additive 0.15% ~ 1.2%, foaming agent 0% ~ 1.5%, remaining is solvent, and full constituent gross mass is 100%.Of the invention to remain solvent type scaling powder free of cleaning admittedly without rosin is low, Halogen compound is nontoxic, will not generate penetrating odor, will not generate harm to human body and natural environment, considerably reduce the corrosivity to circuit board；It is active high, it helps weldering effect obvious, there is preferable wetability, solder joint, without tin phenomenon is fried, is suitble to high integration encapsulation, does not need to cause other ancillary equipments satisfactorily without retraction；The extremely low residual of circuit board surface, solder joint is beautiful, bright, does not need to introduce cleaning process；Versatility is good, to Sn-Ag, Sn-Cu system or Low-silver lead-free solder alloy.
Description
Technical field
The present invention relates to the chemical substance fields that technical field of electronic encapsulation uses, and in particular to a kind of no rosin is low solid residual
Stay solvent type scaling powder free of cleaning.
Background technique
With the miniaturization of electronic product, densification and multidimensional development, the encapsulation of product require to become increasingly
Height, in Electronic Packaging field, since the performance of scaling powder has differences, the selection of scaling powder will also determine the longevity of entire product
Life.Traditional rosin based scaling powder will withdraw from the market, and on the one hand: traditional scaling powder postwelding residue is attached to pad surface, cause
The problems such as keeping pad surface dim, also causing the decline of electronic product electrical insulation properties and short circuit, lead to product section function
The even entire product of failure is scrapped.On the other hand: parts of traditional rosin based scaling powder contains halogen, not only aggravates butt welding point
Corrosion, and harm can be generated to natural environment and staff.
The scaling powder that the country uses is various in style, there is presently no classifying according to a stringent standard, Yi Xiegao
Gu traditional scaling powder must introduce cleaning process because later period residue is more, increase the production cost of electronic product, Er Qiechuan
The process window of system scaling powder is narrow, and the scope of application is narrow, poor with no-lead assembling compatibility, is unfavorable for pushing away for lead-free brazing
Extensively.Ideal effect is not achieved in part New Flux during actual welding, and if its wetability is poor, solder joint lacks gloss
And it is not full, tin is fried in welding process seriously waits series of problems.
Solvent type (alcohols) scaling powder can not only reach compared to traditional scaling powder and similarly help weldering effect, be applicable in
Range is more wide, is under normal conditions in colourless transparent liquid, will not corrode without containing halogen with lead-free brazing good compatibility
Solder joint helps weldering residue that can volatilize with solvent, and postwelding must not clean, and is more applicable for multidimensional encapsulation more burning hot at present
With etc. other High Density Packaging Technologies, for current present Research, alcohol solvent type scaling powder has good application prospect.
Summary of the invention
The present invention invents that a kind of no rosin is low to be remained solvent type free of cleaning admittedly and help weldering in order to solve the deficiency of above-mentioned technology
Agent, the flux activity is high, helps weldering effect good, and halogen-free, no rosin, the scope of application is wide, good compatibility, solder joint beauty and postwelding
It does not need to introduce cleaning process, solves that existing scaling powder wetability is poor, and postwelding residue is more, solder joint seriously corroded, cost
The disadvantages of high.
To achieve the above object, the present invention provides the following technical solutions, and a kind of no rosin is low to remain solvent type free of cleaning admittedly
Scaling powder, it is characterised in that: each component and mass percent are as follows
Activating agent 1.5% ~ 6%, surfactant 0% ~ 0.15%；Antioxidant 0.05% ~ 1.5%, corrosion inhibiter 0.05% ~ 0.5%；
Additive 0.15% ~ 1.2%, foaming agent 0% ~ 1.5%, remaining is solvent, and full constituent gross mass is 100%.
The activating agent is salicylic acid, adipic acid, caprylic acid, acetic acid, lactic acid, oxalic acid, glutamic acid, dihydroxymethyl third
Acid, it is any in tetradecylic acid or any two, or wantonly three kinds, or wantonly four kinds, or wantonly five kinds, or wantonly six kinds, or wantonly seven kinds, or appoint
It eight kinds, or all nine kinds, is mixed with the mass percent for being each greater than percent 0, the activating agent is weak acid, acid model
PH=4.2 ~ 6.8 are enclosed, to abolish the oxidation film of materials to be welded and base material surface, generate water and other gases, during the reaction
Volatilization, content must not be lower than the 1.5% of gross mass percentage；
The surfactant is nonionic surfactant, and surfactant plays the effect for reducing solid liquid interface surface tension
Fruit effectively raises the weldering property energy of scaling powder；
The antioxidant be dibutyl hydroxy toluene, hydroquinone, any one of butylated hydroxy anisole or any two,
Or three kinds, it is mixed with the mass percent for being each greater than percent 0, the addition of antioxidant is so that the invention is being used for
The oxidation of solder powder is effectively prevent in tin cream production, meanwhile, guarantee that welding part has certain make under severe operating conditions
Use the service life.
The corrosion inhibiter is benzotriazole, the metal that the reactive group and corrosion process on benzotriazole molecule generate
Ionic interaction and form precipitation membrane or insoluble cooperation film, further polymerize in metal surface and form precipitating protective film,
To prevent the process of oxidation corrosion.
The additive is one of triethanolamine or coco-nut oil fatty acid diacetayl amide or two kinds with each greater than
Percent 0 mass percent is obtained by mixing；Wherein triethanolamine inherently belongs to amine substance, and scaling powder can be promoted living
Property, itself it is in alkalescent at the same time, the acid-base property of scaling powder system is adjusted.Coco-nut oil fatty acid diacetayl amide, itself has
There are good foaming and foam stabilizing effect, it may have dirt-removing power, the alkalescent of its own can balance the soda acid of scaling powder system
Property, catabolite is carbon dioxide and water.
The foaming agent is gleditsin, lauryl sodium sulfate, neopelex, dodecyl polyoxyethylene ether
Any one of sulfate, enuatrol or any two, or wantonly three kinds, or wantonly four kinds or five kinds, to be each greater than percent 0
Mass percent compounds；Foam is the multiphase coarse dispersion that numerous air-bubble is opened by liquid separation, and foaming agent has reduction table
The effect of face tension, surface tension is lower, is more conducive to blister, and the addition of foaming agent is so that its operation strategies is more extensive.
The solvent is alcohol organic solvent, and moderate boiling point guarantees H+There is preferable ionization environment；Containing it is a large amount of-
OH hydrophilic radical effectively raises the activity function of active acid；With viscosity appropriate, welding and postwelding have face of weld
There is protective effect, wherein the content of solvent must not be lower than the 90% of gross mass percentage.
Further, the solvent is diethylene glycol (DEG), tetrahydrofurfuryl alcohol, isopropanol, glycerine, and 1.2 propylene glycol are any in alcohol
Kind or any two, or wantonly three kinds, or wantonly four kinds or five kinds, mixed with the mass percent for being each greater than percent 0.
Further, the surfactant is alkyl phenol polyoxyethylene ether -10(OP-10), alkyl phenol polyoxyethylene ether -9
(NP-9), fatty alcohol polyoxyethylene ether -9(AEO-9) in any or any two or three kinds be each greater than percent 0 matter
Amount percentage mixes.
Preferably, in preferred embodiment, the optimal compounding of solvent is than being 3:7.
Preferably, in preferred embodiment, active acid is two kinds therein with respective mass percent 1:4 mixing
When, effect is best.
It is of the invention to remain solvent type scaling powder free of cleaning admittedly without rosin is low, it has a characteristic that
1. Halogen compound, nontoxic, penetrating odor will not be generated, harm will not be generated to human body and natural environment, significantly dropped
The low corrosivity to circuit board；
2. it is active high, it helps weldering effect obvious, there is preferable wetability, solder joint, without tin phenomenon is fried, is suitble to high collection satisfactorily without retraction
It is encapsulated at degree and preparation method is simple, do not need to cause other ancillary equipments；
3. the extremely low residual of circuit board surface, solder joint is beautiful, bright, does not need to introduce cleaning process；
4. applicable window is wide, versatility is good, to Sn-Ag, Sn-Cu system or Low-silver lead-free solder alloy.
Specific embodiment
Below in conjunction with specific embodiment, the present invention is described in detail.
A kind of no rosin is low to remain solvent type scaling powder free of cleaning admittedly, and each component mass percent is as follows:
Activating agent 1.5% ~ 6%, surfactant 0% ~ 0.15%；Antioxidant 0.05% ~ 1.5%, corrosion inhibiter 0.05% ~ 0.5%；
Additive 0.15% ~ 1.2%, foaming agent 0% ~ 1.5%, remaining is solvent, and full constituent gross mass is 100%.
The activating agent is salicylic acid, adipic acid, caprylic acid, acetic acid, lactic acid, oxalic acid, glutamic acid, dihydroxymethyl third
Acid, it is any in tetradecylic acid or any two, or wantonly three kinds, until all nine kinds, to be each greater than percent 0 quality percentage
Than mixing, the activating agent is weak acid, acid range PH=4.2 ~ 6.8, to abolish the oxygen of materials to be welded and base material surface
Change film, generate water and other gases, volatilize during the reaction, content must not be lower than the 1.5% of gross mass percentage；
The surfactant is nonionic surfactant, and surfactant plays the effect for reducing solid liquid interface surface tension
Fruit effectively raises the weldering property energy of scaling powder；
The antioxidant be dibutyl hydroxy toluene, hydroquinone, any one of butylated hydroxy anisole or any two,
Or three kinds, it is mixed with the mass percent for being each greater than percent 0, the addition of antioxidant is so that the invention is being used for
The oxidation of solder powder is effectively prevent in tin cream production, meanwhile, guarantee that welding part has certain make under severe operating conditions
Use the service life.
The corrosion inhibiter is benzotriazole, the metal that the reactive group and corrosion process on benzotriazole molecule generate
Ionic interaction and form precipitation membrane or insoluble cooperation film, further polymerize in metal surface and form precipitating protective film,
To prevent the process of oxidation corrosion.
The additive is one of triethanolamine or coco-nut oil fatty acid diacetayl amide or two kinds with respective weight
Percentage is greater than 0 mixing, and wherein triethanolamine inherently belongs to amine substance, can promote flux activity, at the same time, from
Body is in alkalescent, and the acid-base property of scaling powder system is adjusted.Coco-nut oil fatty acid diacetayl amide, itself have it is good foaming and
Foam stabilizing effect, it may have dirt-removing power, the alkalescent of its own can balance the acid-base property of scaling powder system, catabolite two
Carbonoxide and water.
The foaming agent is gleditsin, lauryl sodium sulfate, neopelex, dodecyl polyoxyethylene ether
Any one of sulfate, enuatrol or any two, or wantonly three kinds, or wantonly four kinds or five kinds, to be each greater than percent 0
Mass percent compounds, and foam is the multiphase coarse dispersion that numerous air-bubble is opened by liquid separation, and foaming agent has reduction table
The effect of face tension, surface tension is lower, is more conducive to blister, and the addition of foaming agent is so that its operation strategies is more extensive.
The solvent is alcohol organic solvent, and moderate boiling point guarantees H+There is preferable ionization environment；Containing it is a large amount of-
OH hydrophilic radical effectively raises the activity function of active acid；With viscosity appropriate, welding and postwelding have face of weld
There is protective effect, wherein the content of solvent must not be lower than the 90% of gross mass percentage.
Further, the solvent is diethylene glycol (DEG), tetrahydrofurfuryl alcohol, isopropanol, glycerine, and 1.2 propylene glycol are any in alcohol
Kind or any two, or wantonly three kinds, or wantonly four kinds or five kinds, mixed with the mass percent for being each greater than percent 0.
Further, the surfactant is alkyl phenol polyoxyethylene ether -10, alkyl phenol polyoxyethylene ether -9, fatty alcohol
Any or any two or three kinds are mixed in polyoxyethylene ether -9 with the mass percent for being each greater than percent 0.
Wherein, content ratio indicates not adding this substance in some specific scaling powder for 0%.
Activating agent of the invention, selectable specific mass percent are as follows: 1.5%, 2%, 2.5%, 3%, 3.5%, 4%,
4.5%, 5%, 5.5%, 6% etc., needs of the invention can be met；Surfactant, selectable specific mass percent
Are as follows: 0%, 0.01%, 0.02%, 0.03%, 0.04%, 0.05%, 0.06%, 0.08%, 0.1%, 0.12%, 0.13%, 0.14%, 0.15%
Deng needs of the invention can be met；Antioxidant of the invention, selectable specific mass percent are as follows: 0.05%,
0.1%, 0.2%, 0.3%, 0.4%, 0.5%, 0.6%, 0.7%, 0.8%, 0.9%, 1.0%, 1.1%, 1.2%, 1.3%, 1.4%, 1.5% etc.,
Needs of the invention can be met；Corrosion inhibiter of the invention, selectable specific mass percent are as follows: 0.05%, 0.1%,
0.12%、0.15%、0.18%、0.2%、0.22%、0.25%、0.28%、0. 3%、0.32%、0.35%、0.4%、0. 45%、0.48%、
0.5% etc., needs of the invention can be met；Additive of the invention, selectable specific mass percent are as follows:
0.15%、0.18%、0.2%、0.22%、0.25%、0.28%、0. 3%、0.35%、0.38%、0.4%、0.45%、0.5%、0.52%、
0.55%、0.58%、0. 6%、0.65%、0.68%、0.7%、0.75%、0.8%、0.85%、0.9%、0.95%、1. 0%、1.1%、
1.2% etc., needs of the invention can be met；Foaming agent of the invention, selectable specific mass percent are as follows: 0%,
0.05%、0.1%、0.2%、0.3%、0.4%、0.5%、0.6%、0.7%、0.8%、0.9%、1.0%、1.1%、1.2%、1.3%、1.4%、
1.5% etc., needs of the invention can be met.
Embodiment 1
A kind of no rosin is low to remain solvent type scaling powder free of cleaning admittedly, and ingredient percent is as follows:
Activating agent salicylic acid: adipic acid=1:9 accounting 1.5%；Surfactant NP-9 0.15%；Antioxidant butylated hydroxy-a
Benzene 1.5%；Corrosion inhibiter benzotriazole 0.5%；Additive triethanolamine 0.15%；Foaming agent gleditsin 1.5%, remaining is solvent liquor
Essence, each component gross mass 100%.
Embodiment 2
A kind of no rosin is low to remain solvent type scaling powder free of cleaning admittedly, and ingredient percent is as follows:
Activating agent acetic acid: caprylic acid=2:8 accounting 1.7%；Surfactant NP-9 0.13%；Antioxidant hydroquinone 0.12%；
Corrosion inhibiter benzotriazole 0.45%；Additive coco-nut oil fatty acid diacetayl amide 0.2%；Foaming agent neopelex
1.2%, remaining is solvent isopropanol, each component gross mass 100%.
Embodiment 3
A kind of no rosin is low to remain solvent type scaling powder free of cleaning admittedly, and ingredient percent is as follows:
Activating agent oxalic acid: glutamic acid=3:7 accounting 2.5%；Surfactant NP-9 0.1%；Antioxidant dibutyl hydroxy toluene
0.15%；Corrosion inhibiter benzotriazole 0.15%；Additive triethanolamine 0.25%；Foaming agent lauryl sodium sulfate 1.0%, remaining
For solvent glycerine, each component gross mass 100%.
Embodiment 4
A kind of no rosin is low to remain solvent type scaling powder free of cleaning admittedly, and ingredient percent is as follows:
Activating agent acetic acid: lactic acid=4:6 accounting 3%；Surfactant OP -10 0.08%；Antioxidant dibutyl hydroxy toluene
0.2%；Corrosion inhibiter benzotriazole 0.2%；Additive triethanolamine 0.4%；Foaming agent Sodium dodecylpolyoxyethylene sulfate
0.8% remaining be solvent, solvent is the mixture that tetrahydrofurfuryl alcohol and diethylene glycol (DEG) are mixed with the mass ratio of 1:1, each component gross mass
100%。
Embodiment 5
A kind of no rosin is low to remain solvent type scaling powder free of cleaning admittedly, and ingredient percent is as follows:
Activating agent dihydromethyl propionic acid: tetradecylic acid=1:1 accounts for gross mass percentage 4.5%；Surfactant OP -10 0.05%；It is anti-
Oxidant hydroquinone 0.25%；Corrosion inhibiter benzotriazole 0.25%；Additive coco-nut oil fatty acid diacetayl amide 0.5%；Foaming
Agent enuatrol 0.6%, remaining is solvent, and solvent is 1.2 propylene glycol and the mixture that tetrahydrofurfuryl alcohol is mixed to get with 1:2 mass ratio,
Each component gross mass 100%.
Embodiment 6
A kind of no rosin is low to remain solvent type scaling powder free of cleaning admittedly, and ingredient percent is as follows:
Activating agent salicylic acid: glutamic acid=6:4 accounts for gross mass percentage 5%；Surfactant OP -10 0.03%；Antioxidant pair
Benzenediol 0.35%；Corrosion inhibiter benzotriazole 0.35%；Additive coco-nut oil fatty acid diacetayl amide 0.8%；Foaming agent Chinese honey locust
Element: lauryl sodium sulfate=2:1 accounting 0.4%, remaining is solvent, and solvent is that diethylene glycol (DEG) is mixed with glycerine with 1:3 mass ratio
Obtained mixture, each component gross mass 100%.
Embodiment 7
A kind of no rosin is low to remain solvent type scaling powder free of cleaning admittedly, and ingredient percent is as follows:
Activating agent acetic acid: tetradecylic acid=8:2 accounts for gross mass percentage 5.5%；Surfactant OP -10 0.1%；Antioxidant pair
Benzenediol 1%；Corrosion inhibiter benzotriazole 0.45%；Additive coco-nut oil fatty acid diacetayl amide 1%；Foaming agent detergent alkylate
Sodium sulfonate: enuatrol=3:1 accounting 0.2%, remaining is solvent, and solvent is diethylene glycol (DEG), isopropanol and tetrahydrofurfuryl alcohol with 1:1:1 mass
Than the mixture being mixed to get, each component gross mass 100%.
Embodiment 8
A kind of no rosin is low to remain solvent type scaling powder free of cleaning admittedly, and ingredient percent is as follows:
Activating agent adipic acid: glutamic acid=9:1 accounts for gross mass percentage 6%；Surfactant OP -10 0.15%；Antioxidant pair
Benzenediol 1.5%；Corrosion inhibiter benzotriazole 0.5%；Additive triethanolamine 1.2%；Foaming agent 0%, remaining is solvent, and solvent is
The mixture that diethylene glycol (DEG), isopropanol, tetrahydrofurfuryl alcohol and glycerine are mixed to get with 1:1:1:1 mass ratio, each component gross mass
100%。
When preparing successful scaling powder using above embodiments, preparation method is simple, helps weldering effect good, does not contain halogen
Element, non-corrosive product, applicable window is wide, good compatibility, and solder joint is beautiful and postwelding does not need to introduce cleaning process, and raw material are easy
, it is at low cost, solve that existing scaling powder wetability is poor, and postwelding residue is more, solder joint seriously corroded, it is at high cost the disadvantages of.
Claims (3)
1. a kind of no rosin is low to remain solvent type scaling powder free of cleaning admittedly, it is characterised in that: each component and mass percent are as follows
Activating agent 1.5% ~ 6%；Surfactant 0% ~ 0.15%；Antioxidant 0.05% ~ 1.5%；Corrosion inhibiter 0.05% ~ 0.5%；
Additive 0.15% ~ 1.2%；Foaming agent 0% ~ 1.5%, remaining is solvent, and full constituent gross mass is 100%；
The activating agent be salicylic acid, adipic acid, caprylic acid, acetic acid, lactic acid, oxalic acid, glutamic acid, dihydromethyl propionic acid, ten
In tetracid it is any or any two, or wantonly three kinds, until all nine kinds, to be each greater than percent 0 mass percent mixing
It forms, activating agent acid range PH=4.2 ~ 6.8；
The surfactant is nonionic surfactant；
The antioxidant be dibutyl hydroxy toluene, hydroquinone, any one of butylated hydroxy anisole or any two,
Or three kinds, it is mixed with the mass percent for being each greater than percent 0；
The corrosion inhibiter is benzotriazole；
The additive is one of triethanolamine or coco-nut oil fatty acid diacetayl amide or two kinds to be each greater than percentage
0 mass percent be obtained by mixing；
The foaming agent is gleditsin, lauryl sodium sulfate, neopelex, dodecyl polyoxyethylene ether sulfuric acid
Any one of salt, enuatrol or any two, or wantonly three kinds, or wantonly four kinds or five kinds, to be each greater than percent 0 quality
Percentage compounds；
The solvent is alcohol organic solvent, and the content of solvent is not less than the 90% of gross mass percentage.
2. a kind of no rosin according to claim 1 is low to remain solvent type scaling powder free of cleaning admittedly, it is characterised in that: solvent
For diethylene glycol (DEG), tetrahydrofurfuryl alcohol, isopropanol, glycerine, 1.2 propylene glycol, it is any in alcohol or any two, or wantonly three kinds, or appoint
It four kinds or five kinds, is mixed with the mass percent for being each greater than percent 0.
3. a kind of no rosin according to claim 1 or 2 is low to remain solvent type scaling powder free of cleaning admittedly, it is characterised in that:
The surfactant is alkyl phenol polyoxyethylene ether -10, appoints in alkyl phenol polyoxyethylene ether -9, fatty alcohol polyoxyethylene ether -9
One kind or any two or three kinds are mixed with the mass percent for being each greater than percent 0.
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| Application Number | Priority Date | Filing Date | Title |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115815882A (en) * | 2022-12-23 | 2023-03-21 | 深圳市福英达工业技术有限公司 | Solvent-free rosin-free soldering flux for micro-bump welding and preparation and soldering assisting methods thereof |
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|---|---|---|---|---|
| US4738732A (en) * | 1987-02-04 | 1988-04-19 | Hughes Aircraft Co. | Self cleaning liquid solder flux |
| CN101062536A (en) * | 2007-06-01 | 2007-10-31 | 中南大学 | Non-halide cleaning-free welding flux for leadless solder |
| CN101352788A (en) * | 2008-09-12 | 2009-01-28 | 上海华实纳米材料有限公司 | Scaling powder for leadless soldering tin |
| CN104874940A (en) * | 2015-06-18 | 2015-09-02 | 重庆理工大学 | Non-cleaning flux for low-silver lead-free brazing filler metal and preparation method of non-cleaning flux |
| CN109175793A (en) * | 2018-09-14 | 2019-01-11 | 深圳市中南环保科技控股有限公司 | Solvent type no-clean scaling powder |
-
2019
- 2019-09-02 CN CN201910824730.6A patent/CN110449771A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4738732A (en) * | 1987-02-04 | 1988-04-19 | Hughes Aircraft Co. | Self cleaning liquid solder flux |
| CN101062536A (en) * | 2007-06-01 | 2007-10-31 | 中南大学 | Non-halide cleaning-free welding flux for leadless solder |
| CN101352788A (en) * | 2008-09-12 | 2009-01-28 | 上海华实纳米材料有限公司 | Scaling powder for leadless soldering tin |
| CN104874940A (en) * | 2015-06-18 | 2015-09-02 | 重庆理工大学 | Non-cleaning flux for low-silver lead-free brazing filler metal and preparation method of non-cleaning flux |
| CN109175793A (en) * | 2018-09-14 | 2019-01-11 | 深圳市中南环保科技控股有限公司 | Solvent type no-clean scaling powder |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115815882A (en) * | 2022-12-23 | 2023-03-21 | 深圳市福英达工业技术有限公司 | Solvent-free rosin-free soldering flux for micro-bump welding and preparation and soldering assisting methods thereof |
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Application publication date: 20191115 |
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