CN110449768A - A kind of halogen-free no rosin solvent type scaling powder free of cleaning - Google Patents

A kind of halogen-free no rosin solvent type scaling powder free of cleaning Download PDF

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Publication number
CN110449768A
CN110449768A CN201910824118.9A CN201910824118A CN110449768A CN 110449768 A CN110449768 A CN 110449768A CN 201910824118 A CN201910824118 A CN 201910824118A CN 110449768 A CN110449768 A CN 110449768A
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China
Prior art keywords
free
kinds
acid
scaling powder
percent
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CN201910824118.9A
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Chinese (zh)
Inventor
甘贵生
曹华东
刘歆
田谧哲
江兆琪
蒋刘杰
许乾柱
陈仕琦
何豪
杨栋华
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Chongqing University of Technology
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Chongqing University of Technology
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Priority to CN201910824118.9A priority Critical patent/CN110449768A/en
Publication of CN110449768A publication Critical patent/CN110449768A/en
Pending legal-status Critical Current

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/362Selection of compositions of fluxes

Abstract

The invention discloses halogen-free no rosin solvent type scaling powder free of cleaning, component and mass percent are as follows: activating agent 1.3% ~ 6%, surfactant 0.05% ~ 0.17%;Antioxidant 0.05% ~ 1.5%, corrosion inhibiter 0.05% ~ 0.5%;Brightener 0.1% ~ 1%, foaming agent 0% ~ 1.5%, remaining is solvent, and full constituent gross mass is 100%.Scaling powder of the invention, Halogen compound is nontoxic, will not generate penetrating odor, will not generate harm to human body and natural environment, considerably reduce the corrosivity to circuit board;It is active high, it helps weldering effect obvious, there is preferable wetability, solder joint, without tin phenomenon is fried, is suitble to high integration encapsulation, does not need to cause other ancillary equipments satisfactorily without retraction;The extremely low residual of circuit board surface, solder joint is beautiful, bright, does not need to introduce cleaning process;Versatility is good, to Sn-Ag, Sn-Cu system or Low-silver lead-free solder alloy.

Description

A kind of halogen-free no rosin solvent type scaling powder free of cleaning
Technical field
The present invention relates to the chemical substance fields that technical field of electronic encapsulation uses, and in particular to a kind of halogen-free no rosin Solvent type scaling powder free of cleaning.
Background technique
With the miniaturization of electronic product, densification and multidimensional development, the encapsulation of product require to become increasingly Height, in Electronic Packaging field, since the performance of scaling powder has differences, the selection of scaling powder will also determine the longevity of entire product Life.Traditional rosin based scaling powder will withdraw from the market, and on the one hand: traditional scaling powder postwelding residue is attached to pad surface, cause The problems such as keeping pad surface dim, also causing the decline of electronic product electrical insulation properties and short circuit, lead to product section function The even entire product of failure is scrapped.On the other hand: parts of traditional rosin based scaling powder contains halogen, not only aggravates butt welding point Corrosion, and harm can be generated to natural environment and staff.
The scaling powder that the country uses is various in style, there is presently no classifying according to a stringent standard, Yi Xiegao Gu traditional scaling powder must introduce cleaning process because later period residue is more, increase the production cost of electronic product, Er Qiechuan The process window of system scaling powder is narrow, and the scope of application is narrow, poor with no-lead assembling compatibility, is unfavorable for pushing away for lead-free brazing Extensively.Ideal effect is not achieved in part New Flux during actual welding, and if its wetability is poor, solder joint lacks gloss And it is not full, tin is fried in welding process seriously waits series of problems.
Solvent type (alcohols) scaling powder can not only reach compared to traditional scaling powder and similarly help weldering effect, be applicable in Range is more wide, is under normal conditions in colourless transparent liquid, will not corrode without containing halogen with lead-free brazing good compatibility Solder joint helps weldering residue that can volatilize with solvent, and postwelding must not clean, and is more applicable for multidimensional encapsulation more burning hot at present With etc. other High Density Packaging Technologies, for current present Research, alcohol solvent type scaling powder has good application prospect.
Summary of the invention
The present invention invents a kind of efficiently solvent type scaling powder free of cleaning in order to solve the deficiency of above-mentioned technology, and weldering is helped to imitate Fruit is obvious, does not contain halogen, does not contain rosin, applied widely, good compatibility, satisfactorily without retraction, postwelding does not need to draw solder joint Into cleaning process, solve that existing scaling powder wetability is poor, and postwelding residue is more, solder joint seriously corroded, it is at high cost the disadvantages of.
To achieve the above object, the present invention provides the following technical solutions, and the halogen-free no rosin solvent type free of cleaning of one kind helps Solder flux, it is characterised in that: each component and mass percent are as follows
Activating agent 1.3% ~ 6%, surfactant 0.05% ~ 0.17%;Antioxidant 0.05% ~ 1.5%, corrosion inhibiter 0.05% ~ 0.5%;Brightener 0.1% ~ 1%, foaming agent 0% ~ 1.5%, remaining is solvent, and full constituent gross mass is 100%.
The activating agent is DL-malic acid, and dihydromethyl propionic acid, ethanedioic acid, maleic acid, oilstone is sour, succinic acid, formic acid, Union II propionic acid, any one of oxalic acid or any two, or wantonly three kinds, until all nine kinds, to be each greater than percent 0 matter Amount percentage mixes, and the activating agent is weak acid, acid range PH=4.5 ~ 7.0, to abolish materials to be welded and base material table The oxidation film in face generates water and other gases, volatilizees during the reaction, and content must not be lower than gross mass percentage 1.3%;
The surfactant is nonionic surfactant, and surfactant plays the effect for reducing solid liquid interface surface tension Fruit effectively raises the weldering property energy of scaling powder;
The antioxidant be dibutyl hydroxy toluene, hydroquinone, any one of butylated hydroxy anisole or any two, Or wantonly three kinds, mixed with the mass percent for being each greater than percent 0, the addition of antioxidant be so that the invention with The oxidation of solder powder is effectively prevent in tin cream production, meanwhile, it is certain to guarantee that welding part has under severe operating conditions Service life.
The corrosion inhibiter is benzotriazole, the metal that the reactive group and corrosion process on benzotriazole molecule generate Ionic interaction and form precipitation membrane or insoluble cooperation film, further polymerize in metal surface and form precipitating protective film, To prevent the process of oxidation corrosion.
The brightener is triethanolamine, inherently belongs to amine substance, can promote flux activity, at the same time, Itself it is in alkalescent, the acid-base property of scaling powder system is adjusted.
The foaming agent is gleditsin, lauryl sodium sulfate, neopelex, dodecyl polyoxyethylene ether Any one of sulfate, enuatrol or any two, or wantonly three kinds, or wantonly four kinds or five kinds, to be each greater than percent 0 Mass percent compounds;Foam is the multiphase coarse dispersion that numerous air-bubble is opened by liquid separation, and foaming agent has reduction table The effect of face tension, surface tension is lower, is more conducive to blister, and the addition of foaming agent is so that its operation strategies is more extensive.
The solvent is alcohol organic solvent, and moderate boiling point guarantees H+There is preferable ionization environment;Containing it is a large amount of- OH hydrophilic radical effectively raises the activity function of active acid;With viscosity appropriate, welding and postwelding have face of weld There is protective effect, wherein the content of solvent must not be lower than the 90% of gross mass percentage.
Further, solvent is diethylene glycol (DEG), tetrahydrofurfuryl alcohol, isopropanol, glycerine, 1.2 propylene glycol, any in alcohol, or Any two, are mixed with the mass percent for being each greater than percent 0 by or wantonly three kinds, or wantonly four kinds or five kinds.
Further, the halogen-free no rosin solvent type scaling powder free of cleaning of one kind, it is characterised in that: the surface is living Property agent be alkyl phenol polyoxyethylene ether -10(OP-10), alkyl phenol polyoxyethylene ether -9(NP-9), fatty alcohol polyoxyethylene ether -9 (AEO-9) wherein appoint that one kind taken or appoint takes two kinds and two or more percent 0 mass percents of being greater than mix.
Preferably, in preferred embodiment, the solvent is two kinds therein and compounds, optimal compounding ratio For 8:2.
Preferably, in preferred embodiment, active acid is two kinds therein with respective mass percent 2:8 mixing When, effect is best.
The halogen-free no rosin solvent type scaling powder free of cleaning of one kind of the invention, has a characteristic that
1. Halogen compound, nontoxic, penetrating odor will not be generated, harm will not be generated to human body and natural environment, significantly dropped The low corrosivity to circuit board;
2. it is active high, it helps weldering effect obvious, there is preferable wetability, solder joint, without tin phenomenon is fried, is suitble to high collection satisfactorily without retraction It is encapsulated at degree and preparation method is simple, do not need to cause other ancillary equipments;
3. the extremely low residual of circuit board surface, solder joint is beautiful, bright, does not need to introduce cleaning process;
4. applicable window is wide, versatility is good, to Sn-Ag, Sn-Cu system or Low-silver lead-free solder alloy.
Specific embodiment
Below in conjunction with specific embodiment, the present invention is described in detail.
A kind of halogen-free no rosin solvent type scaling powder free of cleaning, each component mass percent are as follows:
Activating agent 1.3% ~ 6%, surfactant 0.05% ~ 0.17%;Antioxidant 0.05% ~ 1.5%, corrosion inhibiter 0.05% ~ 0.5%;Brightener 0.1% ~ 1%, foaming agent 0% ~ 1.5%, remaining is solvent, and full constituent gross mass is 100%.
The activating agent is DL-malic acid, and dihydromethyl propionic acid, ethanedioic acid, maleic acid, oilstone is sour, succinic acid, formic acid, Union II propionic acid, any one of oxalic acid or any two, or wantonly three kinds, or wantonly four kinds, or wantonly five kinds, or wantonly six kinds, or wantonly seven Kind, or wantonly eight kinds, or all nine kinds, mixed with the mass percent for being each greater than percent 0, the activating agent is weak Acid, acid range PH=4.5 ~ 7.0 generate water and other gases, In to abolish the oxidation film of materials to be welded and base material surface It volatilizees in reaction process, content must not be lower than the 1.3% of gross mass percentage;
The surfactant is nonionic surfactant, and surfactant plays the effect for reducing solid liquid interface surface tension Fruit effectively raises the weldering property energy of scaling powder;
The antioxidant be dibutyl hydroxy toluene, hydroquinone, any one of butylated hydroxy anisole or any two, Or wantonly three kinds, mixed with the mass percent for being each greater than percent 0, the addition of antioxidant be so that the invention with The oxidation of solder powder is effectively prevent in tin cream production, meanwhile, it is certain to guarantee that welding part has under severe operating conditions Service life.
The corrosion inhibiter is benzotriazole, the metal that the reactive group and corrosion process on benzotriazole molecule generate Ionic interaction and form precipitation membrane or insoluble cooperation film, further polymerize in metal surface and form precipitating protective film, To prevent the process of oxidation corrosion.
The brightener is triethanolamine, inherently belongs to amine substance, can promote flux activity, at the same time, Itself it is in alkalescent, the acid-base property of scaling powder system is adjusted.
The foaming agent is gleditsin, lauryl sodium sulfate, neopelex, dodecyl polyoxyethylene ether Any one of sulfate, enuatrol or any two, or wantonly three kinds, or wantonly four kinds or five kinds, to be each greater than percent 0 Mass percent compounds, and foam is the multiphase coarse dispersion that numerous air-bubble is opened by liquid separation, and foaming agent has reduction table The effect of face tension, surface tension is lower, is more conducive to blister, and the addition of foaming agent is so that its operation strategies is more extensive.
The solvent is alcohol organic solvent, and moderate boiling point guarantees H+There is preferable ionization environment;Containing it is a large amount of- OH hydrophilic radical effectively raises the activity function of active acid;With viscosity appropriate, welding and postwelding have face of weld There is protective effect, wherein the content of solvent must not be lower than the 90% of gross mass percentage.
Further, the halogen-free no rosin solvent type scaling powder free of cleaning of one kind, it is characterised in that: solvent is two sweet Alcohol, tetrahydrofurfuryl alcohol, isopropanol, glycerine, 1.2 propylene glycol, alcohol wherein appoint one kind taken or appoint to take two kinds and two or more big Mass percent in percent 0 mixes.
Further, the halogen-free no rosin solvent type scaling powder free of cleaning of one kind, it is characterised in that: the surface is living Property agent be alkyl phenol polyoxyethylene ether -10, alkyl phenol polyoxyethylene ether -9, it is any in fatty alcohol polyoxyethylene ether -9, or appoint Two kinds or three kinds are mixed with the mass percent for being each greater than percent 0.
Wherein, content ratio is not add this substance in the 0% a certain scaling powder of expression.
Activating agent of the invention, selectable specific mass percent are as follows: 1.3%, 1.5%, 2%, 2.5%, 3%, 3.5%, 4%, 4.5%, 5%, 5.5%, 6% etc., needs of the invention can be met;Surfactant, selectable specific matter Measure percentage are as follows: 0.05%, 0.06%, 0.08%, 0.1%, 0.12%, 0.13%, 0.14%, 0.15%, 0.16%, 0.17% etc., it can Meet needs of the invention;Antioxidant of the invention, selectable specific mass percent are as follows: 0.05%, 0.1%, 0.2%, 0.3%, 0.4%, 0.5%, 0.6%, 0.7%, 0.8%, 0.9%, 1.0%, 1.1%, 1.2%, 1.3%, 1.4%, 1.5% etc., it can Meet needs of the invention;Corrosion inhibiter of the invention, selectable specific mass percent are as follows: 0.05%, 0.1%, 0.12%、0.15%、0.18%、0.2%、0.22%、0.25%、0.28%、0. 3%、0.32%、0.35%、0.4%、0. 45%、0.48%、 0.5% etc., needs of the invention can be met;Brightener of the invention, selectable specific mass percent are as follows: 0.1%、0.12%、0.15%、0.18%、0.2%、0.22%、0.25%、0.28%、0. 3%、0.35%、0.38%、0.4%、0.45%、 0.5%、0.52%、0.55%、0.58%、0. 6%、0.65%、0.68%、0.7%、0.75%、0.8%、0.85%、0.9%、0.95%、1. 0% etc., needs of the invention can be met;Foaming agent of the invention, selectable specific mass percent are as follows: 0%, 0.05%、0.1%、0.2%、0.3%、0.4%、0.5%、0.6%、0.7%、0.8%、0.9%、1.0%、1.1%、1.2%、1.3%、1.4%、 1.5% etc., needs of the invention can be met.
Embodiment 1
A kind of halogen-free no rosin solvent type scaling powder free of cleaning, ingredient percent are as follows:
Activating agent dihydromethyl propionic acid: ethanedioic acid=1:9 accounting 1.3%;Surfactant NP-9 0.17%;Antioxidant dibutyl Hydroxy-methylbenzene 1.5%;Corrosion inhibiter benzotriazole 0.5%;Brightener triethanolamine 0.15%;Foaming agent gleditsin 1.5%, remaining is Solvent alcohol, each component gross mass 100%.
Embodiment 2
A kind of halogen-free no rosin solvent type scaling powder free of cleaning, ingredient percent are as follows:
Activating agent maleic acid: DL-malic acid=2:8 accounting 1.5%;Surfactant NP-9 0.15%;Antioxidant hydroquinone 0.12%;Corrosion inhibiter benzotriazole 0.45%;Brightener triethanolamine 0.2%;Foaming agent neopelex 1.2%, Remaining is solvent isopropanol, each component gross mass 100%.
Embodiment 3
A kind of halogen-free no rosin solvent type scaling powder free of cleaning, ingredient percent are as follows:
Activating agent oilstone acid: maleic acid=3:7 accounting 2.5%;Surfactant NP-9 0.12%;Antioxidant butylated hydroxy-a Benzene 0.15%;Corrosion inhibiter benzotriazole 0.15%;Brightener triethanolamine 0.25%;Foaming agent lauryl sodium sulfate 1.0%, Remaining is solvent glycerine, each component gross mass 100%.
Embodiment 4
A kind of halogen-free no rosin solvent type scaling powder free of cleaning, ingredient percent are as follows:
Activating agent DL-malic acid: succinic acid=4:6 accounting 3%;Surfactant OP -10 0.08%;Antioxidant dibutyl hydroxy Toluene 0.2%;Corrosion inhibiter benzotriazole 0.2%;Brightener triethanolamine 0.4%;Foaming agent dodecyl polyoxyethylene ether sulfuric acid Remaining is solvent to salt 0.8%, and solvent is the mixture that tetrahydrofurfuryl alcohol and diethylene glycol (DEG) are mixed with the mass ratio of 1:1, each component gross mass 100%。
Embodiment 5
A kind of halogen-free no rosin solvent type scaling powder free of cleaning, ingredient percent are as follows:
Activating agent dihydromethyl propionic acid: succinic acid=1:1 accounts for gross mass percentage 4.5%;Surfactant OP -10 0.05%;It is anti- Oxidant hydroquinone 0.25%;Corrosion inhibiter benzotriazole 0.25%;Brightener triethanolamine 0.5%;Foaming agent enuatrol 0.6%, remaining is solvent, and solvent is 1.2 propylene glycol and the mixture that tetrahydrofurfuryl alcohol is mixed to get with 1:2 mass ratio, and each component is total Quality 100%.
Embodiment 6
A kind of halogen-free no rosin solvent type scaling powder free of cleaning, ingredient percent are as follows:
Activating agent union II propionic acid: formic acid=6:4 accounts for gross mass percentage 5%;Surfactant OP -10 0.07%;Antioxidant pair Benzenediol 0.35%;Corrosion inhibiter benzotriazole 0.35%;Brightener triethanolamine 0.8%;Foaming agent gleditsin: dodecyl sulphur Sour sodium=2:1 accounting 0.4%, remaining is solvent, and solvent is the mixture that diethylene glycol (DEG) and glycerine are mixed to get with 1:3 mass ratio, Each component gross mass 100%.
Embodiment 7
A kind of halogen-free no rosin solvent type scaling powder free of cleaning, ingredient percent are as follows:
Activating agent ethanedioic acid: oxalic acid=8:2 accounts for gross mass percentage 5.5%;Surfactant OP -10 0.1%;Antioxidant pair Benzenediol 1%;Corrosion inhibiter benzotriazole 0.45%;Brightener triethanolamine 0.95%;Foaming agent neopelex: oil Sour sodium=3:1 accounting 0.2%, remaining is solvent, and solvent is diethylene glycol (DEG), isopropanol is mixed with tetrahydrofurfuryl alcohol with 1:1:1 mass ratio The mixture arrived, each component gross mass 100%.
Embodiment 8
A kind of halogen-free no rosin solvent type scaling powder free of cleaning, ingredient percent are as follows:
Activating agent oilstone acid: union II propionic acid=9:1 accounts for gross mass percentage 6%;Surfactant OP -10 0.15%;Antioxidant Hydroquinone 1.5%;Corrosion inhibiter benzotriazole 0.5%;Brightener triethanolamine 1%;Foaming agent 0%, remaining is solvent, and solvent is The mixture that diethylene glycol (DEG), isopropanol, tetrahydrofurfuryl alcohol and glycerine are mixed to get with 1:1:1:1 mass ratio, each component gross mass 100%。
When preparing successful scaling powder using above embodiments, preparation method is simple, helps weldering effect good, does not contain halogen Element, non-corrosive product, applicable window is wide, good compatibility, and solder joint is beautiful and postwelding does not need to introduce cleaning process, and raw material are easy , it is at low cost, solve that existing scaling powder wetability is poor, and postwelding residue is more, solder joint seriously corroded, it is at high cost the disadvantages of.

Claims (3)

1. a kind of halogen-free no rosin solvent type scaling powder free of cleaning, it is characterised in that: each component and mass percent are as follows
Activating agent 1.3% ~ 6%, surfactant 0.05% ~ 0.17%;Antioxidant 0.05% ~ 1.5%, corrosion inhibiter 0.05% ~ 0.5%;Brightener 0.1% ~ 1%, foaming agent 0% ~ 1.5%, remaining is solvent, and full constituent gross mass is 100%;
The activating agent is DL-malic acid, dihydromethyl propionic acid, ethanedioic acid, maleic acid, oilstone acid, succinic acid, formic acid, union II Propionic acid, any one of oxalic acid or any two, or wantonly three kinds, until all nine kinds, to be each greater than percent 0 quality hundred Ratio is divided to mix, activating agent acid range PH=4.5 ~ 7.0;
The surfactant is nonionic surfactant;
The antioxidant be dibutyl hydroxy toluene, hydroquinone, any one of butylated hydroxy anisole or any two, Or wantonly three kinds, it is mixed with the mass percent for being each greater than percent 0;
The corrosion inhibiter is benzotriazole;
The brightener is triethanolamine;
The foaming agent is gleditsin, lauryl sodium sulfate, neopelex, dodecyl polyoxyethylene ether sulfuric acid Any one of salt, enuatrol or any two, or wantonly three kinds, or wantonly four kinds or five kinds, to be each greater than percent 0 quality Percentage compounds;
The solvent is alcohol organic solvent, and the content of solvent is not less than the 90% of gross mass percentage.
2. the halogen-free no rosin solvent type scaling powder free of cleaning of one kind according to claim 1, it is characterised in that: described molten Agent is diethylene glycol (DEG), tetrahydrofurfuryl alcohol, isopropanol, glycerine, 1.2 propylene glycol, it is any in alcohol or any two, or wantonly three kinds, or It wantonly four kinds or five kinds, is mixed with the mass percent for being each greater than percent 0.
3. the halogen-free no rosin solvent type scaling powder free of cleaning of one kind according to claim 1 or 2, it is characterised in that: institute It is any in alkyl phenol polyoxyethylene ether -10, alkyl phenol polyoxyethylene ether -9, fatty alcohol polyoxyethylene ether -9 for stating surfactant Kind or any two or three kinds mixed with the mass percent for being each greater than percent 0.
CN201910824118.9A 2019-09-02 2019-09-02 A kind of halogen-free no rosin solvent type scaling powder free of cleaning Pending CN110449768A (en)

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Publication number Priority date Publication date Assignee Title
US4738732A (en) * 1987-02-04 1988-04-19 Hughes Aircraft Co. Self cleaning liquid solder flux
CN1843684A (en) * 2006-04-30 2006-10-11 北京市航天焊接材料厂 Low-solid content water based clean-free welding flux without volatile organic substance and halogen
CN101049661A (en) * 2007-05-11 2007-10-10 北京工业大学 Free from cleaning soldering flux without halogen and rosin in use for solder without lead
CN101062536A (en) * 2007-06-01 2007-10-31 中南大学 Non-halide cleaning-free welding flux for leadless solder
CN101352788A (en) * 2008-09-12 2009-01-28 上海华实纳米材料有限公司 Scaling powder for leadless soldering tin
CN101690997A (en) * 2009-10-12 2010-04-07 宁波喜汉锡焊料有限公司 Non-halogen cleaning-free soldering flux
CN102357748A (en) * 2011-10-18 2012-02-22 苏州之侨新材料科技有限公司 Halogen-and-rosin-free antibacterial no-clean soldering flux for lead-free solder
CN102825398A (en) * 2012-08-08 2012-12-19 北京工业大学 Soldering flux matched with lead-free solder
CN104874940A (en) * 2015-06-18 2015-09-02 重庆理工大学 Non-cleaning flux for low-silver lead-free brazing filler metal and preparation method of non-cleaning flux
CN107378313A (en) * 2017-08-01 2017-11-24 东莞市盟纬电子有限公司 A kind of low-solid content is without rosin halogen-free scaling powder and preparation method thereof
CN109175793A (en) * 2018-09-14 2019-01-11 深圳市中南环保科技控股有限公司 Solvent type no-clean scaling powder

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4738732A (en) * 1987-02-04 1988-04-19 Hughes Aircraft Co. Self cleaning liquid solder flux
CN1843684A (en) * 2006-04-30 2006-10-11 北京市航天焊接材料厂 Low-solid content water based clean-free welding flux without volatile organic substance and halogen
CN101049661A (en) * 2007-05-11 2007-10-10 北京工业大学 Free from cleaning soldering flux without halogen and rosin in use for solder without lead
CN101062536A (en) * 2007-06-01 2007-10-31 中南大学 Non-halide cleaning-free welding flux for leadless solder
CN101352788A (en) * 2008-09-12 2009-01-28 上海华实纳米材料有限公司 Scaling powder for leadless soldering tin
CN101690997A (en) * 2009-10-12 2010-04-07 宁波喜汉锡焊料有限公司 Non-halogen cleaning-free soldering flux
CN102357748A (en) * 2011-10-18 2012-02-22 苏州之侨新材料科技有限公司 Halogen-and-rosin-free antibacterial no-clean soldering flux for lead-free solder
CN102825398A (en) * 2012-08-08 2012-12-19 北京工业大学 Soldering flux matched with lead-free solder
CN104874940A (en) * 2015-06-18 2015-09-02 重庆理工大学 Non-cleaning flux for low-silver lead-free brazing filler metal and preparation method of non-cleaning flux
CN107378313A (en) * 2017-08-01 2017-11-24 东莞市盟纬电子有限公司 A kind of low-solid content is without rosin halogen-free scaling powder and preparation method thereof
CN109175793A (en) * 2018-09-14 2019-01-11 深圳市中南环保科技控股有限公司 Solvent type no-clean scaling powder

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