CN1709638A - Rosin halogen-free scaling powder for lead-free soldering paste - Google Patents
Rosin halogen-free scaling powder for lead-free soldering paste Download PDFInfo
- Publication number
- CN1709638A CN1709638A CN 200510090259 CN200510090259A CN1709638A CN 1709638 A CN1709638 A CN 1709638A CN 200510090259 CN200510090259 CN 200510090259 CN 200510090259 A CN200510090259 A CN 200510090259A CN 1709638 A CN1709638 A CN 1709638A
- Authority
- CN
- China
- Prior art keywords
- acid
- free
- rosin
- lead
- flux
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005476 soldering Methods 0.000 title claims description 95
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 title claims description 40
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 title claims description 39
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 title claims description 39
- 239000000843 powder Substances 0.000 title abstract description 3
- 150000007524 organic acids Chemical class 0.000 claims abstract description 19
- 239000002253 acid Substances 0.000 claims abstract description 11
- 239000004359 castor oil Substances 0.000 claims abstract description 11
- 235000019438 castor oil Nutrition 0.000 claims abstract description 11
- ZEMPKEQAKRGZGQ-XOQCFJPHSA-N glycerol triricinoleate Natural products CCCCCC[C@@H](O)CC=CCCCCCCCC(=O)OC[C@@H](COC(=O)CCCCCCCC=CC[C@@H](O)CCCCCC)OC(=O)CCCCCCCC=CC[C@H](O)CCCCCC ZEMPKEQAKRGZGQ-XOQCFJPHSA-N 0.000 claims abstract description 11
- 238000009835 boiling Methods 0.000 claims abstract description 9
- 230000004907 flux Effects 0.000 claims description 61
- 229910000679 solder Inorganic materials 0.000 claims description 48
- 239000002904 solvent Substances 0.000 claims description 17
- 239000012188 paraffin wax Substances 0.000 claims description 12
- 239000002202 Polyethylene glycol Substances 0.000 claims description 11
- 229920001223 polyethylene glycol Polymers 0.000 claims description 11
- 229940051841 polyoxyethylene ether Drugs 0.000 claims description 11
- 229920000056 polyoxyethylene ether Polymers 0.000 claims description 11
- 239000004094 surface-active agent Substances 0.000 claims description 11
- 239000000203 mixture Substances 0.000 claims description 10
- YGSDEFSMJLZEOE-UHFFFAOYSA-N salicylic acid Chemical compound OC(=O)C1=CC=CC=C1O YGSDEFSMJLZEOE-UHFFFAOYSA-N 0.000 claims description 10
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 claims description 9
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 claims description 8
- JVTAAEKCZFNVCJ-UHFFFAOYSA-N lactic acid Chemical compound CC(O)C(O)=O JVTAAEKCZFNVCJ-UHFFFAOYSA-N 0.000 claims description 8
- 239000012190 activator Substances 0.000 claims description 7
- IGFHQQFPSIBGKE-UHFFFAOYSA-N Nonylphenol Natural products CCCCCCCCCC1=CC=C(O)C=C1 IGFHQQFPSIBGKE-UHFFFAOYSA-N 0.000 claims description 6
- SNQQPOLDUKLAAF-UHFFFAOYSA-N nonylphenol Chemical compound CCCCCCCCCC1=CC=CC=C1O SNQQPOLDUKLAAF-UHFFFAOYSA-N 0.000 claims description 6
- 238000002156 mixing Methods 0.000 claims description 5
- FJKROLUGYXJWQN-UHFFFAOYSA-N papa-hydroxy-benzoic acid Natural products OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 claims description 5
- 229960004889 salicylic acid Drugs 0.000 claims description 5
- 239000013008 thixotropic agent Substances 0.000 claims description 5
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 claims description 4
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 claims description 4
- 239000004310 lactic acid Substances 0.000 claims description 4
- 235000014655 lactic acid Nutrition 0.000 claims description 4
- 239000003381 stabilizer Substances 0.000 claims description 4
- RRQYJINTUHWNHW-UHFFFAOYSA-N 1-ethoxy-2-(2-ethoxyethoxy)ethane Chemical compound CCOCCOCCOCC RRQYJINTUHWNHW-UHFFFAOYSA-N 0.000 claims description 3
- OAYXUHPQHDHDDZ-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethanol Chemical compound CCCCOCCOCCO OAYXUHPQHDHDDZ-UHFFFAOYSA-N 0.000 claims description 3
- SBASXUCJHJRPEV-UHFFFAOYSA-N 2-(2-methoxyethoxy)ethanol Chemical compound COCCOCCO SBASXUCJHJRPEV-UHFFFAOYSA-N 0.000 claims description 3
- DUIOKRXOKLLURE-UHFFFAOYSA-N 2-octylphenol Chemical compound CCCCCCCCC1=CC=CC=C1O DUIOKRXOKLLURE-UHFFFAOYSA-N 0.000 claims description 3
- -1 amide compound Chemical class 0.000 claims description 3
- 229940019778 diethylene glycol diethyl ether Drugs 0.000 claims description 3
- XXJWXESWEXIICW-UHFFFAOYSA-N diethylene glycol monoethyl ether Chemical compound CCOCCOCCO XXJWXESWEXIICW-UHFFFAOYSA-N 0.000 claims description 3
- 239000004135 Bone phosphate Substances 0.000 claims description 2
- DSLZVSRJTYRBFB-UHFFFAOYSA-N Galactaric acid Natural products OC(=O)C(O)C(O)C(O)C(O)C(O)=O DSLZVSRJTYRBFB-UHFFFAOYSA-N 0.000 claims description 2
- 125000001931 aliphatic group Chemical group 0.000 claims description 2
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 claims description 2
- DSLZVSRJTYRBFB-DUHBMQHGSA-N galactaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)[C@@H](O)[C@H](O)C(O)=O DSLZVSRJTYRBFB-DUHBMQHGSA-N 0.000 claims description 2
- 150000001261 hydroxy acids Chemical class 0.000 claims description 2
- 239000002674 ointment Substances 0.000 claims description 2
- 235000005985 organic acids Nutrition 0.000 claims description 2
- 229940057838 polyethylene glycol 4000 Drugs 0.000 claims description 2
- 229940093429 polyethylene glycol 6000 Drugs 0.000 claims description 2
- 239000000126 substance Substances 0.000 claims description 2
- 239000004615 ingredient Substances 0.000 claims 1
- 238000003466 welding Methods 0.000 abstract description 12
- 229910045601 alloy Inorganic materials 0.000 abstract description 10
- 239000000956 alloy Substances 0.000 abstract description 10
- 229910052736 halogen Inorganic materials 0.000 abstract description 10
- 150000002367 halogens Chemical class 0.000 abstract description 10
- 229910007637 SnAg Inorganic materials 0.000 abstract description 7
- 230000003647 oxidation Effects 0.000 abstract description 7
- 238000007254 oxidation reaction Methods 0.000 abstract description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 4
- 229910052802 copper Inorganic materials 0.000 abstract description 4
- 239000010949 copper Substances 0.000 abstract description 4
- 230000004913 activation Effects 0.000 abstract description 3
- 150000001875 compounds Chemical class 0.000 abstract description 2
- RWSOTUBLDIXVET-UHFFFAOYSA-N Dihydrogen sulfide Chemical compound S RWSOTUBLDIXVET-UHFFFAOYSA-N 0.000 abstract 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 abstract 2
- 229910000037 hydrogen sulfide Inorganic materials 0.000 abstract 2
- 125000002252 acyl group Chemical group 0.000 abstract 1
- 150000001336 alkenes Chemical class 0.000 abstract 1
- 150000001412 amines Chemical class 0.000 abstract 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 abstract 1
- 239000006071 cream Substances 0.000 abstract 1
- 229930007927 cymene Natural products 0.000 abstract 1
- 235000019581 fat taste sensations Nutrition 0.000 abstract 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 abstract 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 abstract 1
- HFPZCAJZSCWRBC-UHFFFAOYSA-N p-cymene Chemical compound CC(C)C1=CC=C(C)C=C1 HFPZCAJZSCWRBC-UHFFFAOYSA-N 0.000 abstract 1
- 238000002360 preparation method Methods 0.000 description 13
- 239000002994 raw material Substances 0.000 description 10
- 238000000034 method Methods 0.000 description 7
- 238000007639 printing Methods 0.000 description 7
- 230000007797 corrosion Effects 0.000 description 6
- 238000005260 corrosion Methods 0.000 description 6
- 150000002500 ions Chemical class 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 230000008569 process Effects 0.000 description 6
- 229910007116 SnPb Inorganic materials 0.000 description 5
- 238000002844 melting Methods 0.000 description 5
- 230000008018 melting Effects 0.000 description 5
- RTBFRGCFXZNCOE-UHFFFAOYSA-N 1-methylsulfonylpiperidin-4-one Chemical compound CS(=O)(=O)N1CCC(=O)CC1 RTBFRGCFXZNCOE-UHFFFAOYSA-N 0.000 description 4
- JFCQEDHGNNZCLN-UHFFFAOYSA-N anhydrous glutaric acid Natural products OC(=O)CCCC(O)=O JFCQEDHGNNZCLN-UHFFFAOYSA-N 0.000 description 4
- 238000005219 brazing Methods 0.000 description 4
- 238000011156 evaluation Methods 0.000 description 4
- 239000003960 organic solvent Substances 0.000 description 4
- 238000003756 stirring Methods 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- 229910005728 SnZn Inorganic materials 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000006023 eutectic alloy Substances 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 230000000087 stabilizing effect Effects 0.000 description 3
- 239000001384 succinic acid Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- DHMQDGOQFOQNFH-UHFFFAOYSA-N Glycine Chemical compound NCC(O)=O DHMQDGOQFOQNFH-UHFFFAOYSA-N 0.000 description 2
- 239000004480 active ingredient Substances 0.000 description 2
- 230000032683 aging Effects 0.000 description 2
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000002708 enhancing effect Effects 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- WRIDQFICGBMAFQ-UHFFFAOYSA-N (E)-8-Octadecenoic acid Natural products CCCCCCCCCC=CCCCCCCC(O)=O WRIDQFICGBMAFQ-UHFFFAOYSA-N 0.000 description 1
- BJEPYKJPYRNKOW-REOHCLBHSA-N (S)-malic acid Chemical compound OC(=O)[C@@H](O)CC(O)=O BJEPYKJPYRNKOW-REOHCLBHSA-N 0.000 description 1
- LQJBNNIYVWPHFW-UHFFFAOYSA-N 20:1omega9c fatty acid Natural products CCCCCCCCCCC=CCCCCCCCC(O)=O LQJBNNIYVWPHFW-UHFFFAOYSA-N 0.000 description 1
- BTXXTMOWISPQSJ-UHFFFAOYSA-N 4,4,4-trifluorobutan-2-one Chemical compound CC(=O)CC(F)(F)F BTXXTMOWISPQSJ-UHFFFAOYSA-N 0.000 description 1
- QSBYPNXLFMSGKH-UHFFFAOYSA-N 9-Heptadecensaeure Natural products CCCCCCCC=CCCCCCCCC(O)=O QSBYPNXLFMSGKH-UHFFFAOYSA-N 0.000 description 1
- BQACOLQNOUYJCE-FYZZASKESA-N Abietic acid Natural products CC(C)C1=CC2=CC[C@]3(C)[C@](C)(CCC[C@@]3(C)C(=O)O)[C@H]2CC1 BQACOLQNOUYJCE-FYZZASKESA-N 0.000 description 1
- 239000005711 Benzoic acid Substances 0.000 description 1
- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 description 1
- WHUUTDBJXJRKMK-UHFFFAOYSA-N Glutamic acid Natural products OC(=O)C(N)CCC(O)=O WHUUTDBJXJRKMK-UHFFFAOYSA-N 0.000 description 1
- 239000004471 Glycine Substances 0.000 description 1
- 108010003272 Hyaluronate lyase Proteins 0.000 description 1
- WHUUTDBJXJRKMK-VKHMYHEASA-N L-glutamic acid Chemical compound OC(=O)[C@@H](N)CCC(O)=O WHUUTDBJXJRKMK-VKHMYHEASA-N 0.000 description 1
- 206010027439 Metal poisoning Diseases 0.000 description 1
- 239000005642 Oleic acid Substances 0.000 description 1
- ZQPPMHVWECSIRJ-UHFFFAOYSA-N Oleic acid Natural products CCCCCCCCC=CCCCCCCCC(O)=O ZQPPMHVWECSIRJ-UHFFFAOYSA-N 0.000 description 1
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 1
- 229910020816 Sn Pb Inorganic materials 0.000 description 1
- 229910020922 Sn-Pb Inorganic materials 0.000 description 1
- 229910008433 SnCU Inorganic materials 0.000 description 1
- 229910008783 Sn—Pb Inorganic materials 0.000 description 1
- FEWJPZIEWOKRBE-UHFFFAOYSA-N Tartaric acid Natural products [H+].[H+].[O-]C(=O)C(O)C(O)C([O-])=O FEWJPZIEWOKRBE-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- RSWGJHLUYNHPMX-ONCXSQPRSA-N abietic acid Chemical compound C([C@@H]12)CC(C(C)C)=CC1=CC[C@@H]1[C@]2(C)CCC[C@@]1(C)C(O)=O RSWGJHLUYNHPMX-ONCXSQPRSA-N 0.000 description 1
- 238000003916 acid precipitation Methods 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- BJEPYKJPYRNKOW-UHFFFAOYSA-N alpha-hydroxysuccinic acid Natural products OC(=O)C(O)CC(O)=O BJEPYKJPYRNKOW-UHFFFAOYSA-N 0.000 description 1
- 235000001014 amino acid Nutrition 0.000 description 1
- 150000001413 amino acids Chemical class 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 235000010233 benzoic acid Nutrition 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 235000015165 citric acid Nutrition 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 210000003298 dental enamel Anatomy 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 239000004220 glutamic acid Substances 0.000 description 1
- 235000013922 glutamic acid Nutrition 0.000 description 1
- 239000003673 groundwater Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- QXJSBBXBKPUZAA-UHFFFAOYSA-N isooleic acid Natural products CCCCCCCC=CCCCCCCCCC(O)=O QXJSBBXBKPUZAA-UHFFFAOYSA-N 0.000 description 1
- 208000008127 lead poisoning Diseases 0.000 description 1
- 239000001630 malic acid Substances 0.000 description 1
- 235000011090 malic acid Nutrition 0.000 description 1
- RKISUIUJZGSLEV-UHFFFAOYSA-N n-[2-(octadecanoylamino)ethyl]octadecanamide Chemical compound CCCCCCCCCCCCCCCCCC(=O)NCCNC(=O)CCCCCCCCCCCCCCCCC RKISUIUJZGSLEV-UHFFFAOYSA-N 0.000 description 1
- ZQPPMHVWECSIRJ-KTKRTIGZSA-N oleic acid Chemical compound CCCCCCCC\C=C/CCCCCCCC(O)=O ZQPPMHVWECSIRJ-KTKRTIGZSA-N 0.000 description 1
- 235000021313 oleic acid Nutrition 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 230000002028 premature Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 230000001502 supplementing effect Effects 0.000 description 1
- 235000002906 tartaric acid Nutrition 0.000 description 1
- 239000011975 tartaric acid Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
- 229940045860 white wax Drugs 0.000 description 1
Abstract
The invention relates to a scaling powder, especially applying to the alloy's department such as SnAgCu, SnAgCuRE and SnAg and so on. The quality percent of the present invention is the activation dosage of the organic acid which consists of the duality acid, the three-member acid, the hydroxyl acid, the balminess acid in the fattiness race 4-30wt%,the changed capable colophony which is one or more mixed of the converged colophony, the hydrogen sulfide colophony and the divergent colophony 29-67wt%, the becoming electuary which is one or more mixed of the assembled glycol2000,the assembled glycol4000 and the assembled glycol6000 1-20wt%,the olefin as the tranquilization dosage 0.5-8wt%,the touched and altered dosage which one or more mixed of the hydrogen sulfide castor oil and the compound of the acyl and amine 1-8wt% and the remain is the impregnant of the high boiling point which is one or more mixed of the butyl dissolved fine dosage, the calorie certain alcohol of the cymene and the calorie certain alcohol of the second radicle. The invention doesn't contain the halogen and penetrate the copper mirror after welding. It has high insulated resistances, the excellent function of the assisting burning. Also it solves the problem of oxidation in the high temperature and the appropriate viscosity of the welding cream.
Description
Technical Field
The invention relates to a soldering flux, in particular to a rosin-type halogen-free soldering flux for preparing lead-free soldering paste of alloy systems such as SnAgCu, SnAgCuRE, SnAg and the like.
Background
The Sn-Pb alloy solder has mature technology, has incomparable advantages compared with other solders, and is widely applied to electric and electronic products. But whenWhen the waste electronic and electric appliances are buried, Pb in the solder meets acid rain or underground water to form Pb2+Dissolved in groundwater and entering the water supply chain of people and thus entering the human body, leading to lead poisoning.
The European Union (EU) passed the electrical and electronic equipment disposal act (WEEE) for environmental protection, and clearly announced that electrical and electronic products need to be lead-free since 7/1/2006.
The best substitute of SnPb solder is solder alloy such as SnCu, SnAg, SnZn, SnAgCu, SnAgCuRE, etc. For the soldering paste for surface assembly, the current solder alloys such as SnAgCu, SnAgCuRE, SnAg and the like are the best substitutes, and the melting point of the SnPb eutectic solder is 187 ℃, and the melting point of the SnAgCu near eutectic alloy is 217-220 ℃, so that the welding temperature is integrally increased by about 30 ℃, the problem of serious high-temperature oxidation in the welding process is brought, the more rigorous requirement is provided for the soldering flux for the lead-free soldering paste, and the traditional soldering flux is not adapted to the soldering flux any more. Based on the urgent need of lead-free electronic and electrical products, the development and research of the soldering flux for lead-free soldering paste is urgent.
The existence of halogen enhances the corrosion of the flux residue on the welding spot, and the corrosion mechanism is as follows:
in view of the patents of the rosin-type soldering flux for solder paste appearing at home and abroad, few patent researches on the rosin-type halogen-free soldering flux applicable to lead-free solder paste are found. For example, a flux for solder paste disclosed in patent 95117301.4 (U.S. patent of chinese application) mainly solves the problem of hardening or solidification of SnPb near eutectic alloy solder paste with time, but does not solve the problem of severe high-temperature oxidation of near eutectic alloy lead-free solder paste such as SnAgCu; flux for solder paste disclosed in patent 99810452.3 (japanese patent application in china) and patent 01117345.9 (japanese patent application in china) and 01800016.9 (japanese patent application in china), which mainly aim at SnZn or SnPb solder, and solve the problem of aging and aging of SnZn solder paste, but the flux contains halogen, so that the corrosion problem of residues after soldering is generated; the flux for solder paste disclosed in patent 00137388.9 (japanese patent application No. chinese) mainly solves the problem of reliability degradation caused by dew or dust adhesion, but mainly aims at SnPb solder, and also causes corrosion of post-soldering residue due to halogen; the rosin type flux disclosed in patent 89105911.3 is mainly applied to wave soldering, is not used for preparing soldering paste, and simultaneously, because a low-boiling-point solvent is adopted, the problem that lead-free solder is seriously oxidized at high temperature in the soldering process cannot be solved; the soldering flux disclosed in patent 200410026717.X is suitable for lead-free solder,but it is also mainly used for wave soldering and is not suitable for preparing lead-free solder paste. Patent 200410022403.2 discloses a flux for making lead-free solder paste, but contains halogen and is not a no-clean flux.
The invention is to meet the requirement of lead-free solder paste preparation of alloy systems such as SnAgCu, SnAgCuRE, SnAg and the like, and develop rosin type halogen-free cleaning-free soldering flux.
Disclosure of Invention
The invention aims to provide a halogen-free rosin type soldering flux for lead-free soldering paste, which takes a high-boiling point solvent as a solvent carrier and does not contain halogen, aiming at the problems of serious high-temperature oxidation of a welding spot caused by the trend of lead-free soldering and corrosion of the welding spot caused by the existence of halogen. The soldering flux for the lead-free soldering paste can overcome the defects of the prior art, has good soldering flux performance, and better meets the requirement of environmental protection when in use. The lead-free solder paste is suitable for the preparation of the lead-free solder paste of alloy systems such as SnAgCu, SnAgCuRE, SnAg and the like.
The rosin type halogen-free soldering flux for the lead-free soldering paste comprises the following components in percentage by weight: 4-30 wt% of organic acid activator; 29-67 wt% of modified rosin; 1-20 wt% of finished paste; 0.5-8 wt% of stabilizer; 1-8 wt% of thixotropic agent; 0.5-10 wt% of surfactant and the balance of high boiling point solvent.
The organic acid activator is aliphatic monobasic acid, dibasic acid, tribasic acid, hydroxy acid, aromatic acid, olefine acid, amino acid, especially acetic acid, succinic acid, mucic acid, fatty acid, oxalic acid, salicylic acid, benzoic acid, lactic acid,tartaric acid, citric acid, malic acid, oleic acid, glutamic acid, glycine, and optionally one or more of the above-mentioned materials. The activator has enough fluxing activity, and particularly has the best fluxing performance by using mixed acid of two organic acids with the mass mixing ratio of 1: 1. The action mechanism of the active ingredients in the soldering flux in the soldering process is that firstly, above an activation point, the active ingredients ionize in a solvent to form free H + ions, and the free H + ions react with oxides on the surfaces of a base material and a solder. The reaction equation is as follows:
thus, the oxide film on the surface of the base material and the solder is removed, and the metal portion of the base material is exposed. And secondly, the metal part of the base material is exposed, so that the base material and the solder can be spread at the brazing temperature, and the purpose of good brazing is achieved.
The activating agent can be decomposed, sublimated or volatilized at the brazing temperature, so that organic acid residues of a Printed Circuit Board (PCB) after being welded are low, and the PCB is free of corrosion.
The modified rosin is one or a mixture of polymerized rosin, hydrogenated rosin and disproportionated rosin. The flux for rosin-type solder paste is substantially a lyophobic sol. A certain amount of rosin is dissolved in an organic solvent, and the sol can be prepared by an over-saturation method. The sol does not affect the fluxing properties of the solder paste because it is a thermodynamically unstable system, above its activation temperature, the sol becomes a solution and the abietic acid in the solution ionizes to give H+And (4) removing an oxide film by ions, and performing a soldering assisting effect.
The modified rosin is solid at normal temperature and is not ionized, a transparent organic film with good air tightness is formed after brazing, a soldering tin point can be wrapped, the metal is isolated from being contacted with the atmosphere and other corrosive media, the modified rosin has good protective performance, and the contradiction between the activity and the corrosivity of the soldering flux is well solved.
The ointment is selected from one or more of polyethylene glycol 2000, polyethylene glycol 4000 and polyethylene glycol 6000. The paste forming function is to enhance the ability of the rosin sol to form a viscous paste, and the recommended amount is 1-20 wt% of the soldering flux content.
The stabilizer is paraffin. The stabilizer is used for enhancing the viscous stability of the rosin sol. The paraffin has strong stabilizing effect, but the dosage is little, and the dosage is too much, so a large amount of white wax can be separated out, and the stabilizing effect cannot be achieved; too little dosage can not play a stabilizing role. The dosage of the soldering flux is 0.5-8 wt% of the content of the soldering flux.
The thixotropic agent is hydrogenated castor oil and an amide compound, and one or two of the compounds can be selected to be mixed. The thixotropic agent has the functions of enhancing the shear thinning behavior of the soldering paste fluid, improving the printing performance of the soldering paste, enabling the soldering paste to be easy to demould and avoiding collapse. The dosage of the flux is 1-Swt% of the content of the soldering flux.
The solvent is a high boiling point solvent. The organic solvent has the function of providing an ionization environment, so that the rosin acid and the organic acid are ionized to obtain free H in the organic solvent+Ions. At the same time, the solvent also acts as a carrier, carrying free H during the welding process+The oxide film is removed by ions, and other components of the soldering flux are carried to play a role in assisting the welding.
Since the melting point of the lead-free solder alloy such as SnAgCu is about 35 ℃ higher than that of the conventional lead-containing solder, the problem of severe high-temperature oxidation of the solder due to the increase of the soldering temperature arises. Thus, the choice of solvent is critical. If the boiling point of the solvent is too low, the solvent is volatilized too early in the welding process, and H+Premature loss of the ionization environment by the ions; if the boiling point of the solvent is too high, the post-weld residue increases. The selected high boiling point solvent is one or two mixtures of butyl cellosolve, methyl carbitol, ethyl carbitol, butyl carbitol or diethylene glycol diethyl ether, and the boiling points are all very high and are all lower than the welding temperature, so that the problem is solved well.
The rosin-type halogen-free soldering flux for the lead-free soldering paste is also added with a certain amount of surfactant. The addition of a suitable amount of surfactant reduces the interfacial tension between the PCB surface and the molten solder alloy, enhances wetting, thereby improving the fluxing properties of the flux, and thereby reducing the formation of solder balls and solder bridges. The surfactant is not easy to volatilize, the dosage of the surfactant is generally 0.5 to 10 weight percent, and the surfactant is one or a mixture of more of octyl phenol polyoxyethylene ether, nonyl phenol polyoxyethylene ether, FSN and FSO.
The above various additive mixtures determine an important parameter of the solder paste, namely viscosity. The high-viscosity soldering paste can form a good printing shape, the phenomenon of collapse is reduced, but the soldering paste is not easy to pass through a template, the phenomenon of hole plugging or wire dragging is easy to occur, and hidden dangers are left for defects such as insufficient soldering, erection and the like generated in the later soldering. The solder paste with low viscosity is easy to print, but is easy to collapse, and after soldering, bad defects such as solder balls and short circuits are generated. In high precision Surface Mount Technology (SMT), solder paste is required to print good shapes and to pass through small opening stencils. In addition, the viscosity of the soldering paste can be kept stable for a long time (4-8 hr) before and after printing, otherwise, the reliability of repeated printing cannot be guaranteed, the one-time passing rate is reduced, and the SMT cost is increased. Especially for the printing of fine-pitch components, the printing quality can be ensured only by ensuring that the viscosity value of the soldering paste is not less than 800kPa · s after the soldering paste is fully centrifugally stirred.
The viscosity of the rosin-type halogen-free soldering flux for the lead-free soldering paste is 10-155 Pa.S, the prepared soldering paste can form a good printing shape, has little 'collapse' phenomenon, is easy to demould, does not have the phenomena of hole plugging or wire dragging, and has no hidden troubles of insufficient soldering, erection, solder balls, short circuit and the like.
The rosin-type halogen-free soldering flux for the lead-free soldering paste is suitable for the preparation of the lead-free soldering paste of alloy systems such as SnAgCu, SnAgCuRE, SnAg and the like, has scientific design, reasonable preparation, no halogen and good soldering aiding property, solves the problem of serious high-temperature oxidation caused by the increase of the melting point of the lead-free soldering paste, and ensures that a copper mirror has no penetration after welding; the prepared lead-free soldering paste has good fluidity, easy operability, stable quality and excellent fluxing property. The soldering flux is adopted to carry out inspection according to national standard GB/T9491-2002 and electronic industry standard SJ/T11186-1998, and all indexes reach the standard. Can completely meet the requirements of the reflow soldering process of the mainboards of communication equipment, computers, high-grade sound equipment and the like.
Detailed Description
The specific formulation of the rosin-type halogen-free flux for the lead-free solder paste of the present invention is given in detail in the following examples. It should be understood, however, that the description specifically presents particular embodiments of the invention, but these examples are presented primarily for purposes of illustration, and the invention is to be construed in its broader aspects and is not limited to these examples.
Example 1: the rosin-type halogen-free soldering flux for the lead-free soldering paste without the surfactant comprises the following raw materials in percentage by mass:
polymerized rosin: 67
Glutaric acid 4
Polyethylene glycol 20001
Diethylene glycol ethyl ether 26.5
Hydrogenated castor oil 1
0.5 Paraffin wax
The preparation method comprises the following steps: the preparation method is a conventional method, namely, adding an organic solvent into a clean enamel kettle with a stirrer, then adding polymerized rosin into the solvent, heating, stirring, dissolving and clarifying, then sequentially adding other raw materials, continuously stirring until solid substances are completely dissolved, uniformly mixing, stopping stirring, supplementing the amount of the solvent reduced due to volatilization through calculation, uniformly mixing, standing, and cooling with water to obtain the rosin-type halogen-free soldering flux for the lead-free soldering paste; then mixing the soldering flux and the lead-free soldering powder in a ratio of 12: 88, and uniformly stirring to obtain the halogen-free lead-free soldering paste.
Example 2: the rosin-type halogen-free soldering flux for the lead-free soldering paste containing the surfactant and the bi-component organic acid comprises the following raw materials in percentage by mass:
polymerized rosin: 19
Hydrogenated rosin 10
Succinic acid 15
Glutaric acid 15
Nonylphenol polyoxyethylene ether 0.5
Polyethylene glycol 60002
Diethylene glycol butyl ether 22.5
Hydrogenated castor oil 8
Paraffin 8
The preparation method is the same as that of example 1.
Example 3: the rosin-type halogen-free soldering flux is another rosin-type halogen-free soldering flux for lead-free soldering paste containing a surfactant and single-component organic acid, and the mass percentages of the raw materials are as follows:
polymerized rosin: 25
Disproportionated rosin 15
Salicylic acid 4
Octylphenol polyoxyethylene ether 10
Polyethylene glycol 400011
Butyl Cellosolve 25
Hydrogenated castor oil 5
Paraffin 5
The preparation method is the same as that of example 1.
Example 4: the rosin-type halogen-free soldering flux for the lead-free soldering paste containing the single-component organic acid comprises the following raw materials in percentage by mass:
polymerized rosin 25
Hydrogenated rosin 15
Disproportionated rosin 12
Succinic acid 4
Nonylphenol polyoxyethylene ether 0.5
Polyethylene glycol 200010
Diethylene glycol Ether 20
Hydrogenated castor oil 8
Paraffin wax 3.5
The preparation method is the same as that of example 1.
Example 5: the rosin-type halogen-free soldering flux for the lead-free soldering paste containing the single-component organic acid comprises the following raw materials in percentage by mass:
polymerized rosin 39
Salicylic acid 30
Octylphenol polyoxyethylene 2
Polyethylene glycol 20002
Diethylene glycol methyl ether 23.5
Hydrogenated castor oil 3
0.5 Paraffin wax
The preparation method is the same as that of example 1.
Example 6: the rosin-type halogen-free soldering flux for the lead-free soldering paste containing the single-component organic acid comprises the following raw materials in percentage by mass:
hydrogenated rosin 44.5
Citric acid 9.5
Nonylphenol polyoxyethylene ether 5
Polyethylene glycol 20008
Diethylene glycol Ether 20
Hydrogenated castor oil 5
Paraffin 8
The preparation method is the same as that of example 1.
Example 7: the rosin-type halogen-free soldering flux for the lead-free soldering paste containing the double-component organic acid comprises the following raw materials in percentage by mass:
polymerized rosin: 33
Disproportionated rosin 20
Succinic acid 2
Glutaric acid 2
Octyl phenol polyoxyethylene ether 5
Polyethylene glycol 40005
Butyl Cellosolve 26
Hydrogenated castor oil 5
Paraffin 2
The preparation method is the same as that of example 1.
Example 8: the rosin-type halogen-free soldering flux for the lead-free soldering paste containing the three-component organic acid comprises the following raw materials in percentage by mass:
hydrogenated rosin 11
Polymerized rosin 25
Salicylic acid 10
Lactic acid 10
Glutaric acid 10
Nonylphenol polyoxyethylene ether 4
Polyethylene glycol 20004.5
Diethylene glycol diethyl ether 20
Hydrogenated castor oil 4
Paraffin wax 1.5
The preparation method is the same as that of example 1.
Example 9: the rosin-type halogen-free soldering flux for the lead-free soldering paste containing the single-component organic acid comprises the following raw materials in percentage by mass:
polymerized rosin 20
Hydrogenated rosin 20
Disproportionated rosin 10
Lactic acid 10
Polyethylene glycol 400020
Paraffin 5
N, N-ethylene bis stearamide 5
Octylphenol polyoxyethylene ether 10
Evaluation of rosin-type halogen-free flux for lead-free solder paste: the evaluation standard is measured and evaluated according to national standard GB/T9491-2002 and electronic standards SJ/T11273-. The evaluation results of examples 1 to 9 are shown in table 1.
TABLE 1
Evaluation results of the fluxes for lead-free solder pastes of examples 1 to 9
| Soldering flux | Halogen content | Spreading factor | Corrosiveness of copper mirror | Insulation resistance | Flux viscosity (20 ℃ C.) |
| Example 1 | Is free of | 80％ | Does not penetrate through | 1.1×1012Ω | 121.9Pa·S |
| Example 2 | Is free of | 82％ | Does not penetrate through | 1.2×1012Ω | 115.5Pa·S |
| Example 3 | Is free of | 81％ | Does not penetrate through | 1.3×1012Ω | 119.6Pa·S |
| Example 4 | Is free of | 80.5％ | Does not penetrate through | 1.5×1012Ω | 118.3Pa·S |
| Practice ofExample 5 | Is free of | 82％ | Does not penetrate through | 1.4×1012Ω | 108.4Pa·S |
| Example 6 | Is free of | 80.8％ | Does not penetrate through | 1.2×1012Ω | 116.8Pa·S |
| Example 7 | Is free of | 81.5％ | Does not penetrate through | 1.1×1012Ω | 117.5Pa·S |
| Example 8 | Is free of | 82％ | Does not penetrate through | 1.2×1012Ω | 109.7Pa·S |
| Example 9 | Is free of | 80.9％ | Does not penetrate through | 1.4×1012Ω | 114.6Pa·S |
As can be seen from table 1, the flux shown in examples 1 to 9 does not contain halogen, the copper mirror does not penetrate after soldering, the insulation resistance is high, and the flux has good fluxing property, so that the problem of severe high-temperature oxidation of the lead-free solder paste caused by the increase of the melting point is solved, and the flux has a certain viscosity, so that the prepared lead-free solder paste has proper viscosity, good fluidity and easy operability.
While this invention has been particularly shown and described with references to embodiments thereof, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the scope of the invention encompassed by the appended claims.
Claims (4)
1. A rosin-type halogen-free soldering flux for lead-free soldering paste is characterized by comprising the following substances in parts by weight: 4-30 wt% of organic acid activator, 29-67 wt% of modified rosin, 1-20 wt% of paste, 0.5-8 wt% of stabilizer paraffin, 1-8 wt% of thixotropic agent and the balance of high-boiling-point solvent; the organic acid activator is aliphatic dibasic acid, tribasic acid, hydroxy acid or aromatic acid; the modified rosin is one or a mixture of polymerized rosin, hydrogenated rosin and disproportionated rosin; the ointment is one or more of polyethylene glycol 2000, polyethylene glycol 4000 and polyethylene glycol 6000; the thixotropic agent is one or a mixture of hydrogenated castor oil and amide compound; the high boiling point solvent is one or two of butyl cellosolve, methyl carbitol, ethyl carbitol, butyl carbitol and diethylene glycol diethyl ether.
2. The rosin-type halogen-free flux for a lead-free solder paste according to claim 1, wherein: the organic acid activator is one or a mixture of succinic acid, mucic acid, salicylic acid, lactic acid and citric acid.
3. The rosin-type halogen-free flux for a lead-free solder paste according to claim 1, wherein: the organic acid activator is a mixture of two organic acids with the mixing ratio of 1: 1.
4. The rosin-type halogen-free flux for a lead-free solder paste according to claim 1, wherein: the ingredients contain 0.5-10 wt% of surfactant; the surfactant is one or a mixture of more of octyl phenol polyoxyethylene ether, nonyl phenol polyoxyethylene ether, FSN and FSO.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100902590A CN100336626C (en) | 2005-08-12 | 2005-08-12 | Rosin halogen-free scaling powder for lead-free soldering paste |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100902590A CN100336626C (en) | 2005-08-12 | 2005-08-12 | Rosin halogen-free scaling powder for lead-free soldering paste |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1709638A true CN1709638A (en) | 2005-12-21 |
| CN100336626C CN100336626C (en) | 2007-09-12 |
Family
ID=35705964
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2005100902590A Expired - Fee Related CN100336626C (en) | 2005-08-12 | 2005-08-12 | Rosin halogen-free scaling powder for lead-free soldering paste |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100336626C (en) |
Cited By (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100408257C (en) * | 2006-04-21 | 2008-08-06 | 北京工业大学 | Water-soluble soldering flux dedicated for lead-free solder |
| CN100425385C (en) * | 2006-10-27 | 2008-10-15 | 烟台德邦科技有限公司 | Leadless solder paste and its preparation method |
| CN100450700C (en) * | 2006-04-30 | 2009-01-14 | 北京市航天焊接材料厂 | Lead-free halogen-free tinol and preparation process |
| CN101352789B (en) * | 2008-09-12 | 2011-01-12 | 上海华实纳米材料有限公司 | Non-halogen scaling powder for leadless solder |
| CN101966632A (en) * | 2010-09-29 | 2011-02-09 | 广州瀚源电子科技有限公司 | Wash-free soldering flux for leadless low-temperature soldering paste and preparation method thereof |
| CN102039497A (en) * | 2010-12-27 | 2011-05-04 | 东莞市阿比亚能源科技有限公司 | Lead-free paste flux |
| CN102069324A (en) * | 2010-12-29 | 2011-05-25 | 东莞永安科技有限公司 | No-clean low-splashing soldering flux for lead-free solder wire and preparation method thereof |
| CN102126094A (en) * | 2011-01-15 | 2011-07-20 | 广州市铠特电子材料有限公司 | Halogen-free soldering flux for lead-free solder paste |
| CN101197230B (en) * | 2006-12-05 | 2011-11-16 | 比亚迪股份有限公司 | Low-melting point alloy wire and temperature fuse adopting the same |
| CN101197224B (en) * | 2006-12-08 | 2011-11-16 | 比亚迪股份有限公司 | Fusing agent and temperature fuse containing the same |
| CN102303199A (en) * | 2011-08-12 | 2012-01-04 | 广州化学试剂厂 | Soldering flux composition containing cyclohexane citrate |
| CN102369083A (en) * | 2009-03-30 | 2012-03-07 | 荒川化学工业株式会社 | Flux composition for lead-free solder, and lead-free solder composition |
| CN101733573B (en) * | 2009-11-04 | 2012-09-19 | 昆山成利焊锡制造有限公司 | Lead-free and halogen-free environmental soldering paste for electronic industry |
| CN102756220A (en) * | 2011-04-26 | 2012-10-31 | 荒川化学工业株式会社 | Flux for dip soldering |
| CN102990242A (en) * | 2011-09-13 | 2013-03-27 | 郴州金箭焊料有限公司 | Low-temperature halogen-free lead-free solder paste |
| CN103561903A (en) * | 2011-03-23 | 2014-02-05 | 千住金属工业株式会社 | Lead-free solder alloy |
| CN104191108A (en) * | 2014-08-28 | 2014-12-10 | 华南理工大学 | Halogen-free high-activity low-splatter solder wire soldering flux and preparing method thereof |
| CN105728982A (en) * | 2015-11-05 | 2016-07-06 | 广东轻工职业技术学院 | Efficient scaling powder |
| CN105855750A (en) * | 2016-06-15 | 2016-08-17 | 傅兴琴 | Anti-oxidation flux and preparation method thereof |
| CN107186388A (en) * | 2017-08-02 | 2017-09-22 | 合肥东恒锐电子科技有限公司 | A kind of surface-mounted integrated circuit paster scaling powder and preparation method thereof |
| CN107891232A (en) * | 2017-12-06 | 2018-04-10 | 江苏广昇新材料有限公司 | A kind of lead-free and halogen-free weld-aiding cream and preparation method thereof |
| JP2020157310A (en) * | 2019-03-25 | 2020-10-01 | 株式会社タムラ製作所 | Flux and solder paste |
| CN112867583A (en) * | 2018-10-25 | 2021-05-28 | 千住金属工业株式会社 | Flux and solder paste |
| CN112912205A (en) * | 2018-11-06 | 2021-06-04 | 千住金属工业株式会社 | Flux, method for applying flux, and method for mounting solder ball |
| CN115446500A (en) * | 2021-06-09 | 2022-12-09 | 千住金属工业株式会社 | Flux and solder paste |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101569966B (en) * | 2009-06-10 | 2015-11-25 | 上海华庆焊材技术有限公司 | A kind of lead-free tin cream |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1042809C (en) * | 1994-04-06 | 1999-04-07 | 化学工业部晨光化工研究院成都分院 | Non-halogen non-rosin type low solid content non-cleaning scaling powder |
| US6402013B2 (en) * | 1999-12-03 | 2002-06-11 | Senju Metal Industry Co., Ltd | Thermosetting soldering flux and soldering process |
| JP2003264367A (en) * | 2002-03-11 | 2003-09-19 | Tamura Kaken Co Ltd | Reflow soldering solder paste composition and circuit substrate |
| JP3797990B2 (en) * | 2003-08-08 | 2006-07-19 | 株式会社東芝 | Thermosetting flux and solder paste |
| CN1307024C (en) * | 2004-05-09 | 2007-03-28 | 邓和升 | High adhesion leadless soldering tin grease |
-
2005
- 2005-08-12 CN CNB2005100902590A patent/CN100336626C/en not_active Expired - Fee Related
Cited By (39)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100408257C (en) * | 2006-04-21 | 2008-08-06 | 北京工业大学 | Water-soluble soldering flux dedicated for lead-free solder |
| CN100450700C (en) * | 2006-04-30 | 2009-01-14 | 北京市航天焊接材料厂 | Lead-free halogen-free tinol and preparation process |
| CN100425385C (en) * | 2006-10-27 | 2008-10-15 | 烟台德邦科技有限公司 | Leadless solder paste and its preparation method |
| CN101197230B (en) * | 2006-12-05 | 2011-11-16 | 比亚迪股份有限公司 | Low-melting point alloy wire and temperature fuse adopting the same |
| CN101197224B (en) * | 2006-12-08 | 2011-11-16 | 比亚迪股份有限公司 | Fusing agent and temperature fuse containing the same |
| CN101352789B (en) * | 2008-09-12 | 2011-01-12 | 上海华实纳米材料有限公司 | Non-halogen scaling powder for leadless solder |
| TWI481466B (en) * | 2009-03-30 | 2015-04-21 | Arakawa Chem Ind | Lead-free solder flux composition and lead-free solder composition |
| CN102369083B (en) * | 2009-03-30 | 2014-08-20 | 荒川化学工业株式会社 | Flux composition for lead-free solder, and lead-free solder composition |
| CN102369083A (en) * | 2009-03-30 | 2012-03-07 | 荒川化学工业株式会社 | Flux composition for lead-free solder, and lead-free solder composition |
| CN101733573B (en) * | 2009-11-04 | 2012-09-19 | 昆山成利焊锡制造有限公司 | Lead-free and halogen-free environmental soldering paste for electronic industry |
| CN101966632A (en) * | 2010-09-29 | 2011-02-09 | 广州瀚源电子科技有限公司 | Wash-free soldering flux for leadless low-temperature soldering paste and preparation method thereof |
| CN101966632B (en) * | 2010-09-29 | 2013-07-17 | 广州瀚源电子科技有限公司 | Wash-free soldering flux for leadless low-temperature soldering paste and preparation method thereof |
| CN102039497B (en) * | 2010-12-27 | 2014-01-22 | 东莞市阿比亚能源科技有限公司 | Lead-free paste flux |
| CN102039497A (en) * | 2010-12-27 | 2011-05-04 | 东莞市阿比亚能源科技有限公司 | Lead-free paste flux |
| CN102069324A (en) * | 2010-12-29 | 2011-05-25 | 东莞永安科技有限公司 | No-clean low-splashing soldering flux for lead-free solder wire and preparation method thereof |
| CN102069324B (en) * | 2010-12-29 | 2012-08-15 | 东莞永安科技有限公司 | No-clean low-splashing soldering flux for lead-free solder wire and preparation method thereof |
| CN102126094A (en) * | 2011-01-15 | 2011-07-20 | 广州市铠特电子材料有限公司 | Halogen-free soldering flux for lead-free solder paste |
| US9844837B2 (en) | 2011-03-23 | 2017-12-19 | Senju Metal Industry Co., Ltd. | Lead-free solder alloy |
| CN103561903B (en) * | 2011-03-23 | 2017-03-22 | 千住金属工业株式会社 | Lead-free solder alloy |
| CN103561903A (en) * | 2011-03-23 | 2014-02-05 | 千住金属工业株式会社 | Lead-free solder alloy |
| CN102756220B (en) * | 2011-04-26 | 2016-08-24 | 荒川化学工业株式会社 | Flux for dip soldering |
| CN102756220A (en) * | 2011-04-26 | 2012-10-31 | 荒川化学工业株式会社 | Flux for dip soldering |
| CN102303199A (en) * | 2011-08-12 | 2012-01-04 | 广州化学试剂厂 | Soldering flux composition containing cyclohexane citrate |
| CN102303199B (en) * | 2011-08-12 | 2012-08-01 | 广州化学试剂厂 | Soldering flux composition containing cyclohexane citrate |
| CN102990242A (en) * | 2011-09-13 | 2013-03-27 | 郴州金箭焊料有限公司 | Low-temperature halogen-free lead-free solder paste |
| CN104191108A (en) * | 2014-08-28 | 2014-12-10 | 华南理工大学 | Halogen-free high-activity low-splatter solder wire soldering flux and preparing method thereof |
| CN105728982B (en) * | 2015-11-05 | 2017-11-24 | 广东轻工职业技术学院 | A kind of efficient scaling powder |
| CN105728982A (en) * | 2015-11-05 | 2016-07-06 | 广东轻工职业技术学院 | Efficient scaling powder |
| CN105855750A (en) * | 2016-06-15 | 2016-08-17 | 傅兴琴 | Anti-oxidation flux and preparation method thereof |
| CN107186388A (en) * | 2017-08-02 | 2017-09-22 | 合肥东恒锐电子科技有限公司 | A kind of surface-mounted integrated circuit paster scaling powder and preparation method thereof |
| CN107891232B (en) * | 2017-12-06 | 2020-03-17 | 江苏广昇新材料有限公司 | Lead-free halogen-free soldering paste and preparation method thereof |
| CN107891232A (en) * | 2017-12-06 | 2018-04-10 | 江苏广昇新材料有限公司 | A kind of lead-free and halogen-free weld-aiding cream and preparation method thereof |
| CN112867583A (en) * | 2018-10-25 | 2021-05-28 | 千住金属工业株式会社 | Flux and solder paste |
| CN112867583B (en) * | 2018-10-25 | 2022-03-04 | 千住金属工业株式会社 | Flux and solder paste |
| CN112912205A (en) * | 2018-11-06 | 2021-06-04 | 千住金属工业株式会社 | Flux, method for applying flux, and method for mounting solder ball |
| CN112912205B (en) * | 2018-11-06 | 2022-04-01 | 千住金属工业株式会社 | Flux, method for applying flux, and method for mounting solder ball |
| JP2020157310A (en) * | 2019-03-25 | 2020-10-01 | 株式会社タムラ製作所 | Flux and solder paste |
| JP7324024B2 (en) | 2019-03-25 | 2023-08-09 | 株式会社タムラ製作所 | flux and solder paste |
| CN115446500A (en) * | 2021-06-09 | 2022-12-09 | 千住金属工业株式会社 | Flux and solder paste |
Also Published As
| Publication number | Publication date |
|---|---|
| CN100336626C (en) | 2007-09-12 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN1709638A (en) | Rosin halogen-free scaling powder for lead-free soldering paste | |
| JP6138464B2 (en) | Solder composition for laser soldering and mounting method using the same | |
| CN101073862A (en) | Low-rosin and cleaning-free welding accessory without halogen for lead-free welding grease | |
| JP6402213B2 (en) | Solder composition and electronic substrate | |
| JP5887330B2 (en) | Solder composition and printed wiring board using the same | |
| JP6674982B2 (en) | Solder composition and electronic substrate | |
| JP5916674B2 (en) | Solder composition for jet dispenser | |
| JP6310893B2 (en) | Flux composition, solder composition, and method for manufacturing electronic substrate | |
| JP6138846B2 (en) | Solder composition and method for producing electronic substrate using the same | |
| JP6895213B2 (en) | Method for manufacturing solder composition and electronic board | |
| JP6653686B2 (en) | Solder composition and electronic substrate | |
| JP6469623B2 (en) | Solder composition for jet dispenser | |
| JP6402148B2 (en) | Solder composition and electronic substrate | |
| JP6136851B2 (en) | Solder flux and solder paste | |
| JP7312798B2 (en) | solder composition | |
| JP4213642B2 (en) | Soldering flux, soldering method and printed circuit board | |
| JP2019130566A (en) | Flux composition, solder composition and electronic substrate | |
| JP2015208779A (en) | Soldering flux and soldering paste | |
| EP3834982A1 (en) | Flux and solder paste | |
| JP7066798B2 (en) | Solder composition | |
| JP2019212577A (en) | Bonding agent | |
| JP7133579B2 (en) | Solder composition and electronic substrate | |
| CN109719422B (en) | Solder composition and electronic substrate | |
| JP7361481B2 (en) | Solder composition and electronic board manufacturing method | |
| JP6259795B2 (en) | Solder composition and method for producing electronic substrate |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20070912 Termination date: 20100812 |