CN114700651A - Heat-resistant environment-friendly superfine solder wire applied to intelligent manipulator welding and preparation method thereof - Google Patents
Heat-resistant environment-friendly superfine solder wire applied to intelligent manipulator welding and preparation method thereof Download PDFInfo
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- CN114700651A CN114700651A CN202210338613.0A CN202210338613A CN114700651A CN 114700651 A CN114700651 A CN 114700651A CN 202210338613 A CN202210338613 A CN 202210338613A CN 114700651 A CN114700651 A CN 114700651A
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- 229910000679 solder Inorganic materials 0.000 title claims abstract description 69
- 238000003466 welding Methods 0.000 title claims abstract description 41
- 238000002360 preparation method Methods 0.000 title claims abstract description 18
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 74
- 229910052718 tin Inorganic materials 0.000 claims abstract description 74
- 229910001128 Sn alloy Inorganic materials 0.000 claims abstract description 52
- 230000004907 flux Effects 0.000 claims abstract description 48
- 238000005476 soldering Methods 0.000 claims abstract description 48
- 238000002844 melting Methods 0.000 claims abstract description 41
- 230000008018 melting Effects 0.000 claims abstract description 41
- 239000010949 copper Substances 0.000 claims abstract description 22
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 19
- 229910052802 copper Inorganic materials 0.000 claims abstract description 19
- 229910052684 Cerium Inorganic materials 0.000 claims abstract description 17
- GWXLDORMOJMVQZ-UHFFFAOYSA-N cerium Chemical compound [Ce] GWXLDORMOJMVQZ-UHFFFAOYSA-N 0.000 claims abstract description 17
- 229910052720 vanadium Inorganic materials 0.000 claims abstract description 16
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 claims abstract description 16
- 229910052727 yttrium Inorganic materials 0.000 claims abstract description 16
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 claims abstract description 16
- 229910052738 indium Inorganic materials 0.000 claims abstract description 12
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims abstract description 12
- 229910052709 silver Inorganic materials 0.000 claims abstract description 12
- 239000004332 silver Substances 0.000 claims abstract description 12
- 230000003647 oxidation Effects 0.000 claims abstract description 7
- 238000007254 oxidation reaction Methods 0.000 claims abstract description 7
- 238000003756 stirring Methods 0.000 claims description 36
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 claims description 35
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 claims description 35
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 claims description 35
- 229920005989 resin Polymers 0.000 claims description 23
- 239000011347 resin Substances 0.000 claims description 23
- 229920001187 thermosetting polymer Polymers 0.000 claims description 17
- 239000002904 solvent Substances 0.000 claims description 16
- 239000013008 thixotropic agent Substances 0.000 claims description 16
- 239000012190 activator Substances 0.000 claims description 15
- 230000003064 anti-oxidating effect Effects 0.000 claims description 14
- 238000001816 cooling Methods 0.000 claims description 14
- 239000003822 epoxy resin Substances 0.000 claims description 14
- 229920000647 polyepoxide Polymers 0.000 claims description 14
- 238000010438 heat treatment Methods 0.000 claims description 12
- 239000004094 surface-active agent Substances 0.000 claims description 12
- 150000001412 amines Chemical class 0.000 claims description 11
- 150000007524 organic acids Chemical class 0.000 claims description 10
- XLJMAIOERFSOGZ-UHFFFAOYSA-M cyanate Chemical compound [O-]C#N XLJMAIOERFSOGZ-UHFFFAOYSA-M 0.000 claims description 8
- 238000004806 packaging method and process Methods 0.000 claims description 8
- 238000004804 winding Methods 0.000 claims description 8
- 238000006243 chemical reaction Methods 0.000 claims description 7
- 238000007599 discharging Methods 0.000 claims description 7
- 238000001035 drying Methods 0.000 claims description 7
- 238000001125 extrusion Methods 0.000 claims description 7
- -1 polysiloxane Polymers 0.000 claims description 7
- 229920001296 polysiloxane Polymers 0.000 claims description 7
- 238000005096 rolling process Methods 0.000 claims description 7
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical group C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 6
- 239000004643 cyanate ester Substances 0.000 claims description 6
- LYRFLYHAGKPMFH-UHFFFAOYSA-N octadecanamide Chemical compound CCCCCCCCCCCCCCCCCC(N)=O LYRFLYHAGKPMFH-UHFFFAOYSA-N 0.000 claims description 6
- 238000005303 weighing Methods 0.000 claims description 6
- 238000013329 compounding Methods 0.000 claims description 5
- 230000007613 environmental effect Effects 0.000 claims description 5
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 claims description 4
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 claims description 4
- TYFQFVWCELRYAO-UHFFFAOYSA-N suberic acid Chemical compound OC(=O)CCCCCCC(O)=O TYFQFVWCELRYAO-UHFFFAOYSA-N 0.000 claims description 4
- 239000004952 Polyamide Substances 0.000 claims description 3
- 239000004359 castor oil Substances 0.000 claims description 3
- 235000019438 castor oil Nutrition 0.000 claims description 3
- ZEMPKEQAKRGZGQ-XOQCFJPHSA-N glycerol triricinoleate Natural products CCCCCC[C@@H](O)CC=CCCCCCCCC(=O)OC[C@@H](COC(=O)CCCCCCCC=CC[C@@H](O)CCCCCC)OC(=O)CCCCCCCC=CC[C@H](O)CCCCCC ZEMPKEQAKRGZGQ-XOQCFJPHSA-N 0.000 claims description 3
- 239000000203 mixture Substances 0.000 claims description 3
- 229920002647 polyamide Polymers 0.000 claims description 3
- 229940037312 stearamide Drugs 0.000 claims description 3
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 claims description 2
- PVFQHGDIOXNKIC-UHFFFAOYSA-N 4-[2-[3-[2-(4-hydroxyphenyl)propan-2-yl]phenyl]propan-2-yl]phenol Chemical compound C=1C=CC(C(C)(C)C=2C=CC(O)=CC=2)=CC=1C(C)(C)C1=CC=C(O)C=C1 PVFQHGDIOXNKIC-UHFFFAOYSA-N 0.000 claims description 2
- RPNUMPOLZDHAAY-UHFFFAOYSA-N Diethylenetriamine Chemical compound NCCNCCN RPNUMPOLZDHAAY-UHFFFAOYSA-N 0.000 claims description 2
- 235000021355 Stearic acid Nutrition 0.000 claims description 2
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 claims description 2
- SLINHMUFWFWBMU-UHFFFAOYSA-N Triisopropanolamine Chemical compound CC(O)CN(CC(C)O)CC(C)O SLINHMUFWFWBMU-UHFFFAOYSA-N 0.000 claims description 2
- 239000001089 [(2R)-oxolan-2-yl]methanol Substances 0.000 claims description 2
- 235000011037 adipic acid Nutrition 0.000 claims description 2
- 239000001361 adipic acid Substances 0.000 claims description 2
- 125000002723 alicyclic group Chemical group 0.000 claims description 2
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 claims description 2
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 claims description 2
- AFEQENGXSMURHA-UHFFFAOYSA-N oxiran-2-ylmethanamine Chemical compound NCC1CO1 AFEQENGXSMURHA-UHFFFAOYSA-N 0.000 claims description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 2
- 229940068918 polyethylene glycol 400 Drugs 0.000 claims description 2
- 239000008117 stearic acid Substances 0.000 claims description 2
- BSYVTEYKTMYBMK-UHFFFAOYSA-N tetrahydrofurfuryl alcohol Chemical compound OCC1CCCO1 BSYVTEYKTMYBMK-UHFFFAOYSA-N 0.000 claims description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 2
- 230000002265 prevention Effects 0.000 claims 1
- 239000011135 tin Substances 0.000 abstract description 68
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 abstract description 11
- 238000011161 development Methods 0.000 abstract description 7
- 229910052751 metal Inorganic materials 0.000 abstract description 6
- 239000002184 metal Substances 0.000 abstract description 6
- 238000004880 explosion Methods 0.000 abstract description 4
- 238000005299 abrasion Methods 0.000 abstract description 3
- 230000008859 change Effects 0.000 abstract description 3
- 239000011573 trace mineral Substances 0.000 abstract description 3
- 235000013619 trace mineral Nutrition 0.000 abstract description 3
- 239000013078 crystal Substances 0.000 abstract description 2
- 238000007670 refining Methods 0.000 abstract description 2
- 150000002739 metals Chemical class 0.000 abstract 1
- 230000000052 comparative effect Effects 0.000 description 14
- 239000002893 slag Substances 0.000 description 10
- 238000005260 corrosion Methods 0.000 description 6
- 230000007797 corrosion Effects 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 239000000243 solution Substances 0.000 description 6
- 238000005282 brightening Methods 0.000 description 5
- 238000005266 casting Methods 0.000 description 5
- 239000003795 chemical substances by application Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 238000011068 loading method Methods 0.000 description 5
- 230000003213 activating effect Effects 0.000 description 4
- 239000000696 magnetic material Substances 0.000 description 4
- 239000011159 matrix material Substances 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- 229910052779 Neodymium Inorganic materials 0.000 description 3
- 229910052797 bismuth Inorganic materials 0.000 description 3
- 238000007334 copolymerization reaction Methods 0.000 description 3
- 229910052742 iron Inorganic materials 0.000 description 3
- 229910052745 lead Inorganic materials 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 230000002285 radioactive effect Effects 0.000 description 3
- 229910052761 rare earth metal Inorganic materials 0.000 description 3
- 239000006104 solid solution Substances 0.000 description 3
- 238000007711 solidification Methods 0.000 description 3
- 230000008023 solidification Effects 0.000 description 3
- 238000002425 crystallisation Methods 0.000 description 2
- 230000008025 crystallization Effects 0.000 description 2
- 229910052736 halogen Inorganic materials 0.000 description 2
- 150000002367 halogens Chemical class 0.000 description 2
- 238000006386 neutralization reaction Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000009736 wetting Methods 0.000 description 2
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 1
- AHZMUXQJTGRNHT-UHFFFAOYSA-N [4-[2-(4-cyanatophenyl)propan-2-yl]phenyl] cyanate Chemical compound C=1C=C(OC#N)C=CC=1C(C)(C)C1=CC=C(OC#N)C=C1 AHZMUXQJTGRNHT-UHFFFAOYSA-N 0.000 description 1
- WTSZEAJEVDVRML-UHFFFAOYSA-N [O--].[O--].[O--].[O--].[V+5].[Y+3] Chemical compound [O--].[O--].[O--].[O--].[V+5].[Y+3] WTSZEAJEVDVRML-UHFFFAOYSA-N 0.000 description 1
- 230000005262 alpha decay Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3613—Polymers, e.g. resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/40—Making wire or rods for soldering or welding
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a heat-resistant environment-friendly superfine solder wire applied to intelligent manipulator welding and a preparation method thereof, wherein the heat-resistant environment-friendly superfine solder wire comprises 96.1-98.0% of tin alloy and 2.0-3.9% of soldering flux, wherein the tin alloy consists of tin, silver, copper, indium, cerium, vanadium and yttrium, and trace elements added in the tin alloy with the melting point of 1890 +/-10 ℃, belongs to high-melting-point rare metals, can enhance the heat resistance of the tin alloy, and simultaneously improve the abrasion resistance and the explosion resistance of the solder wire, the yttrium addition can obviously improve the strength, the hardness and the heat resistance of the tin alloy, improve the melting point of the solder wire, simultaneously enhance the oxidation resistance and the ductility of the tin alloy, and the addition of cerium can change the tissue structure of solder, thereby refining crystal grains, reducing connecting bridges, changing the surface wettability of the tin alloy, improving the creep property and the tensile property The high-strength lead-free high-strength welding wire has excellent tensile strength, is lead-free and environment-friendly, and can be used for high-solderability and lead-free environment-friendly development of products in high-end application fields such as intelligent manipulator welding.
Description
The application is a divisional application, the application number of the original application is 2020105288487, the application date is 6/11/2020, and the name of the invention is 'high-melting-point environment-friendly superfine solder wire applied to automatic welding and a preparation method thereof'.
Technical Field
The invention belongs to the technical field of welding materials, and particularly relates to a heat-resistant environment-friendly superfine solder wire applied to intelligent manipulator welding and a preparation method thereof.
Background
With the development of electronic products and the technical development thereof, products gradually develop towards high power consumption and high power, the requirement on superfine solder wires is higher and higher, the microelectronic interconnection material industry gradually grows along with the development of the domestic electronic industry product industry, common solder wire products are not inferior to foreign products, but the melting point of the superfine solder wires is about 210 ℃, and the product still has a considerable difference with foreign products in high-end application fields such as high power of electronic elements, automatic welding and the like, because the electronic elements have high power, high power consumption and high heat, the temperature of the electronic elements can melt the superfine solder wires with low melting point, and the electronic elements can be detached from soldering, false soldering and element detachment. In addition, radioactive isotope elements such as Bi, Pb, Co and the like are added into the tin alloy, alpha decay easily occurs in the tin alloy, alpha particles can be continuously released in a semiconductor device, and then the semiconductor device is caused to generate a single event effect, so that the signal integrity is affected by loss, and data loss, function interruption and the like of electronic equipment are damaged; on the other hand, magnetic materials such as Fe, Co, Ni and Nd are added into tin alloy components, and the magnetic permeability of the magnetic materials changes nonlinearly along with the change of a magnetic field, so that hysteresis characteristics occur, and finally, two or more signals generate strong interference signals, so that a communication system is greatly influenced; furthermore, the activators added to the flux are halogen, amine and amino compounds, which are prone to cause excessive corrosion after soldering, form corrosive residues on the circuit board, have a great influence on the substrate, and usually need to be cleaned to reduce the corrosion.
Therefore, there is a need in the art to develop a high melting point environment-friendly ultrafine solder wire for use in the field of automatic soldering for soldering electronic components of high-power electronic circuits.
Disclosure of Invention
The invention provides a heat-resistant environment-friendly superfine solder wire applied to intelligent manipulator welding, aiming at solving the technical problem of the melting point of the existing superfine solder wire.
The invention also aims to provide a preparation method of the heat-resistant environment-friendly superfine solder wire applied to intelligent manipulator welding.
The invention relates to a heat-resistant environment-friendly superfine solder wire applied to welding of an intelligent manipulator, which consists of 96.1-98.0 wt% of tin alloy and 2.0-3.9 wt% of soldering flux;
the tin alloy comprises the following components in percentage by weight: 1.2 to 1.8 percent of copper, 2.9 to 4.2 percent of silver, 3.1 to 3.9 percent of indium, 0.14 to 0.25 percent of cerium, 0.09 to 0.15 percent of vanadium, 0.08 to 0.19 percent of yttrium and the balance of tin;
the soldering flux comprises the following components in percentage by weight: 7.1 to 11.8 percent of activator, 0.5 to 1.5 percent of surface active agent, 3 to 7 percent of solvent, 1.1 to 2.2 percent of thixotropic agent, 18.1 to 23.3 percent of thermosetting resin and the balance of rosin.
The application relates to a heat-resistant environment-friendly superfine tin wire applied to welding of an intelligent manipulator, which comprises 96.1-98.0% of tin alloy and 2.0-3.9% of soldering flux, wherein the tin alloy consists of tin, silver, copper, indium, cerium, vanadium and yttrium, the melting point of vanadium is 1890 +/-10 ℃, the tin wire belongs to high-melting-point rare metal, the heat resistance of the tin alloy can be enhanced, the abrasion resistance and the explosion resistance of the tin wire are improved, the strength, the hardness and the heat resistance of the tin alloy can be obviously improved by adding the yttrium, the melting point of the tin wire is improved, the oxidation resistance and the ductility of the tin alloy are enhanced, the organizational structure of solder can be changed by adding the cerium, thereby grains are refined, welding point bridges are reduced, the surface wettability of the tin alloy is changed, the creep property and the tensile property are improved, the bridging shape of the increase of the viscosity of the solder is avoided by adding the copper, the solidified Cu exists in a copper plate matrix in a solid solution form and can be well combined with the copper plate, the solidification and crystallization state of the solder can be improved by adding trace rare earth elements into the tin alloy, the melting point of the solder wire is increased, and the tensile strength and the toughness of the solder are improved, wherein the tin alloy is not added with radioactive isotope elements such as Bi, Pb, Co and the like, so as to reduce signal interference caused by decay, and magnetic materials such as Fe, Co, Ni, Nd and the like are not added, the flux comprises rosin, thermosetting resin, thixotropic agent, activator, surfactant and solvent, adopts copolymerization of the rosin and the thermosetting resin as a main body, can improve the tin wetting capacity of the metal surface, can improve the extension toughness of solder wire simultaneously, the solder wire melting point of this application is high, tensile strength is excellent and leadless environmental protection, high weldable and the development of leadless environmental protection of product when being applied to high-end application fields such as intelligent mechanical arm welding.
Preferably, the thermosetting resin is cyanate ester resin and epoxy resin in a weight ratio of 2-3: 1-2 compounding. Cyanate is a high-performance resin matrix, a triazine network formed after curing has excellent mechanical properties and a high glass transition temperature (Tg ═ 260C), and the melting point of the system is improved by adding a cyanate/epoxy resin system into the soldering flux, carrying out copolymerization modification on the cyanate resin through the epoxy resin, and modifying.
Preferably, the cyanate ester resin is one or more of bisphenol A cyanate ester, bisphenol F cyanate ester, bisphenol M cyanate ester and phenolic cyanate ester; the epoxy resin is one or a combination of more of alicyclic epoxy resin, bisphenol A type epoxy resin, phenol-aralkyl epoxy resin and glycidyl amine type epoxy resin.
Preferably, the activating agent is compounded by organic amine and organic acid according to the weight ratio of 1:3-4, the organic acid is one or a combination of a plurality of adipic acid, suberic acid and stearic acid, and the organic amine is one or a combination of a plurality of triethanolamine, diethylenetriamine and triisopropanolamine. The organic acid is used as an activating agent, so that the phenomenon that substances such as halogen, amine and amino compounds are easy to cause excessive corrosion after welding and have great influence on a substrate is avoided, the corrosion degree is reduced by using the organic acid, and the organic amine contains amino, NH: has activity, and the organic amine is added to promote the welding effect. The organic acid and the organic amine are mixed to generate neutralization reaction, and a neutralization product is generated. The neutralized product is unstable and can be quickly decomposed at the welding temperature to regenerate the organic acid and the organic amine, so that the original activity of the organic acid can be ensured, and after the welding is finished, the residual organic acid can be neutralized by the organic amine, so that the acidity of the residue is reduced, and the corrosion is reduced.
Preferably, the thixotropic agent is formed by compounding stearamide and polyamide modified hydrogenated castor oil according to the weight ratio of 1-2: 2-3. The viscosity and the printing performance of the soldering flux are mainly adjusted, the soldering tin wire is endowed with certain thixotropy, and the thixotropic agent is prepared by compounding stearamide and polyamide modified hydrogenated castor oil, and has a better effect than a single thixotropic agent.
Preferably, the rosin is any one of water white rosin, perhydrogenated rosin and disproportionated rosin. For improving the wettability of the product.
Preferably, the surfactant is a halogen-free activator ST-200 and polyethylene glycol 400 which are compounded according to the weight ratio of 1: 1-3. Is a halogen-free activator, and reduces the surface tension of the soldering flux.
Preferably, the solvent is prepared from tetrahydrofurfuryl alcohol and butyl cellosolve according to the weight ratio of 2-3: 1. The solvent is a high-boiling-point solvent, has high volatility, reduces the residue after welding, and simultaneously has the functions of preventing collapse and controlling viscosity.
A preparation method of heat-resistant environment-friendly superfine solder wires applied to intelligent manipulator welding is characterized by comprising the following steps:
s1, weighing the components according to the weight percentage for later use;
s2, adding rosin into a reaction kettle, heating to the temperature of 130-150 ℃, after dissolving, adding a solvent and thermosetting resin, stirring for 20-30min, adding a thixotropic agent, stirring until completely dissolving, cooling to the temperature of 70-90 ℃, adding an activator and a surfactant, stirring for 40-60 min, and cooling to obtain the soldering flux;
s3, melting tin, adding the molten tin into a melting furnace, melting the molten tin to 350-;
s4, putting the cylindrical bar blank into an extruder with a wire outlet caliber of phi 9mm, adding soldering flux into a rosin barrel according to the weight proportion of 2.0-3.9%, controlling the temperature of the rosin barrel at 120 ℃, the temperature of the bar blank at 110 ℃ and the extrusion force at 150kg/cm2Extruding the cylindrical bar blank into thick tin wires with the inner core of phi 9mm and the weight ratio of 2.0-3.9% of soldering flux at the wire-discharging speed of 1.5 m/min;
and S5, rolling and drawing the coarse tin wire to obtain a tin wire with the diameter of 0.12mm, performing online lightening and anti-oxidation treatment, drying in the shade, winding and packaging to obtain the tin wire.
Preferably, the oxidation preventing process in step S5 includes: the solder wire is passed through the polysiloxane solution at a speed of 10-40m/min to form an oxidation resistant film with a film thickness of 0.001nm-0.01mm on the surface of the solder wire.
Compared with the prior art, the invention has the following advantages:
the application relates to a heat-resistant environment-friendly superfine solder wire applied to welding of an intelligent manipulator, which comprises 96.1-98.0% of tin alloy and 2.0-3.9% of soldering flux, wherein the tin alloy comprises tin, silver, copper, indium, cerium, vanadium and yttrium, the melting point is 242-247 ℃, the melting point of the added trace element vanadium is 1890 +/-10 ℃, the added trace element vanadium belongs to high-melting-point rare metal, the heat resistance of the tin alloy can be enhanced, the abrasion resistance and the explosion resistance of the solder wire are improved, the yttrium addition can obviously improve the strength, the hardness and the heat resistance of the tin alloy, the melting point of the solder wire is improved, the oxidation resistance and the ductility of the tin alloy are enhanced, the addition of cerium can change the texture structure of solder, thereby refining crystal grains, reducing welding spot connecting bridges, changing the surface wettability of the tin alloy, improving the creep property and the tensile property, and avoiding the shape of the bridge formed by the increase of the viscosity of the solder, cu exists in a matrix in a solid solution form after solidification and can be well combined with a copper plate, the solidification crystallization state of a solder can be improved by adding trace rare earth elements into tin alloy, the melting point of a solder wire is increased, and the tensile strength and the toughness of the solder are improved. The high-solderability and lead-free environment-friendly development of products is realized when the method is applied to high-end application fields such as intelligent manipulator welding.
According to the preparation method of the heat-resistant environment-friendly superfine solder wire applied to intelligent manipulator welding, the traditional solder wire preparation method needs to be subjected to processes of multi-pass drawing (large drawing, middle drawing, small drawing and micro drawing), winding, packaging and the like, and wire breakage is easily caused by drawing.
Detailed Description
The following is a detailed description of the present invention:
the specific technical scheme of the invention is described by combining specific examples 1-5 and comparative examples 1-5:
example 1:
the heat-resistant environment-friendly superfine tin wire applied to intelligent manipulator welding comprises 96.5 percent of tin alloy and 3.50 percent of soldering flux by weight, wherein the component proportion of the tin alloy is shown in a table 2, the component proportion of the soldering flux is shown in a table 3, and the preparation method comprises the following steps:
weighing the components according to the weight percentages in the tables 2 and 3 for later use; adding rosin into a reaction kettle, heating to 140 ℃, adding a solvent and thermosetting resin after dissolving, stirring for 30min, adding a thixotropic agent, stirring until completely dissolving, cooling to 70 ℃, adding an activating agent and a surfactant, stirring for 60 min,cooling to obtain the soldering flux; melting tin, adding the melted tin into a melting furnace, melting to 360 ℃, keeping the temperature, stirring for 20min, taking out tin slag, adding silver, copper and indium, stirring for 20min, then heating to 430 ℃, sequentially adding cerium, vanadium and yttrium, keeping the temperature, stirring for 30min, standing, removing slag, and casting a cylindrical bar blank; loading the cylindrical bar blank into an extruder with a wire outlet diameter of phi 9mm, adding the soldering flux into a rosin barrel in proportion, controlling the temperature of the rosin barrel at 120 ℃, the temperature of the bar blank at 110 ℃ and the extrusion force at 150kg/cm2Extruding the cylindrical bar blank into thick tin wires with phi 9mm and inner cores containing specified soldering flux at a wire discharging speed of 1.5 m/min; rolling and drawing the coarse tin wire to prepare a tin wire with the diameter of 0.12mm, and then carrying out online brightening and anti-oxidation treatment, wherein the anti-oxidation treatment comprises the steps of passing the tin wire through polysiloxane solution at the speed of 30m/min, drying in the shade, winding and packaging to obtain the tin wire.
Example 2:
the heat-resistant environment-friendly superfine tin wire applied to intelligent manipulator welding comprises the following components, by weight, 97.60% of tin alloy and 2.40% of soldering flux, wherein the component proportion of the tin alloy is shown in Table 2, the component proportion of the soldering flux is shown in Table 3, and the preparation method comprises the following steps:
weighing the components according to the weight percentages in the tables 2 and 3 for later use; adding rosin into a reaction kettle, heating to 140 ℃, adding a solvent and thermosetting resin after dissolving, stirring for 30min, adding a thixotropic agent, stirring until completely dissolving, cooling to 70 ℃, adding an activator and a surfactant, stirring for 60 min, and cooling to obtain a soldering flux; melting tin, adding the melted tin into a melting furnace, melting to 360 ℃, keeping the temperature, stirring for 20min, taking out tin slag, adding silver, copper and indium, stirring for 20min, then heating to 430 ℃, sequentially adding cerium, vanadium and yttrium, keeping the temperature, stirring for 30min, standing, removing slag, and casting a cylindrical bar blank; loading the cylindrical bar blank into an extruder with a wire outlet diameter of phi 9mm, adding the soldering flux into a rosin barrel in proportion, controlling the temperature of the rosin barrel at 120 ℃, the temperature of the bar blank at 110 ℃ and the extrusion force at 150kg/cm2Extruding the cylindrical bar blank into thick tin wires with phi 9mm and inner cores containing specified soldering flux at a wire discharging speed of 1.5 m/min; rolling and drawing the coarse tin wire into the size of phi 0.12mmAnd (3) carrying out online brightening and anti-oxidation treatment on the solder wire, wherein the anti-oxidation treatment process comprises the steps of passing the solder wire through polysiloxane solution at the speed of 30m/min, drying in the shade, winding and packaging to obtain the solder wire.
Example 3:
the heat-resistant environment-friendly superfine tin wire applied to intelligent manipulator welding comprises 96.1 wt% of tin alloy and 3.9 wt% of soldering flux, wherein the component proportion of the tin alloy is shown in a table 2, the component proportion of the soldering flux is shown in a table 3, and the preparation method comprises the following steps:
weighing the components according to the weight percentages in the tables 2 and 3 for later use; adding rosin into a reaction kettle, heating to 140 ℃, adding a solvent and thermosetting resin after dissolving, stirring for 30min, adding a thixotropic agent, stirring until completely dissolving, cooling to 80 ℃, adding an activator and a surfactant, stirring for 50 min, and cooling to obtain a soldering flux; melting tin, adding the melted tin into a melting furnace, melting to 360 ℃, keeping the temperature and stirring for 10min, then fishing out tin slag, adding silver, copper and indium, stirring for 20min, then heating to 430 ℃, sequentially adding cerium, vanadium and yttrium, keeping the temperature and stirring for 30min, standing, removing slag, and casting a cylindrical bar blank; loading the cylindrical bar blank into an extruder with a wire outlet diameter of phi 9mm, adding the soldering flux into a rosin barrel in proportion, controlling the temperature of the rosin barrel at 120 ℃, the temperature of the bar blank at 110 ℃ and the extrusion force at 150kg/cm2Extruding the cylindrical bar blank into thick tin wires with phi 9mm and inner cores containing specified soldering flux at a wire discharging speed of 1.5 m/min; rolling and drawing the coarse tin wire to prepare a tin wire with the diameter of 0.12mm, and then carrying out online brightening and anti-oxidation treatment, wherein the anti-oxidation treatment comprises the steps of passing the tin wire through polysiloxane solution at the speed of 20m/min, drying in the shade, winding and packaging to obtain the tin wire.
Example 4:
the heat-resistant environment-friendly superfine tin wire applied to intelligent manipulator welding comprises 96.8 wt% of tin alloy and 3.2 wt% of soldering flux, wherein the component proportion of the tin alloy is shown in a table 2, the component proportion of the soldering flux is shown in a table 3, and the preparation method comprises the following steps:
weight as given in tables 2 and 3Weighing the components according to the weight percentage for later use; adding rosin into a reaction kettle, heating to 145 ℃, adding a solvent and thermosetting resin after dissolving, stirring for 20min, adding a thixotropic agent, stirring until the solvent and thermosetting resin are completely dissolved, cooling to 80 ℃, adding an activating agent and a surfactant, stirring for 60 min, and cooling to obtain a soldering flux; melting tin, adding the melted tin into a melting furnace, melting to 360 ℃, preserving heat, stirring for 20min, fishing out tin slag, adding silver, copper and indium, stirring for 20min, then heating to 430 ℃, sequentially adding cerium, vanadium and yttrium, preserving heat, stirring for 30min, standing, removing slag, and casting a cylindrical bar blank; loading the cylindrical bar blank into an extruder with a wire outlet diameter of phi 9mm, adding the soldering flux into a rosin barrel in proportion, controlling the temperature of the rosin barrel at 120 ℃, the temperature of the bar blank at 110 ℃ and the extrusion force at 150kg/cm2Extruding the cylindrical bar blank into thick tin wires with phi 9mm and inner cores containing specified soldering flux at a wire discharging speed of 1.5 m/min; rolling and drawing the coarse tin wire to prepare a tin wire with the diameter of 0.12mm, and then carrying out online brightening and anti-oxidation treatment, wherein the anti-oxidation treatment comprises the steps of passing the tin wire through polysiloxane solution at the speed of 10m/min, drying in the shade, winding and packaging to obtain the tin wire.
Example 5:
the heat-resistant environment-friendly ultrafine solder wire applied to intelligent manipulator welding comprises the following components in parts by weight, 98.00 wt% of tin alloy and 2.00 wt% of soldering flux, wherein the component proportion of the tin alloy is shown in Table 2, the component proportion of the soldering flux is shown in Table 3, and the preparation method comprises the following steps:
weighing the components according to the weight percentages in the tables 2 and 3 for later use; adding rosin into a reaction kettle, heating to 130 ℃, adding a solvent and thermosetting resin after dissolving, stirring for 20min, adding a thixotropic agent, stirring until completely dissolving, cooling to 80 ℃, adding an activator and a surfactant, stirring for 40 min, and cooling to obtain a soldering flux; melting tin, adding the melted tin into a melting furnace, melting to 350 ℃, keeping the temperature, stirring for 10min, taking out tin slag, adding silver, copper and indium, stirring for 20min, then heating to 420 ℃, sequentially adding cerium, vanadium and yttrium, keeping the temperature, stirring for 30min, standing, removing slag, and casting a cylindrical bar blank; loading the cylindrical bar blank into an extruder with a wire outlet diameter of phi 9mm, and proportionally weldingAdding the agent into a rosin barrel, controlling the temperature of the rosin barrel at 120 ℃, the temperature of a rod blank at 110 ℃ and the extrusion force at 150kg/cm2Extruding the cylindrical bar blank into thick tin wires with phi 9mm and inner cores containing specified soldering flux at a wire discharging speed of 1.5 m/min; rolling and drawing the coarse tin wire to prepare a tin wire with the diameter of 0.12mm, and then carrying out online brightening and anti-oxidation treatment, wherein the anti-oxidation treatment comprises the steps of passing the tin wire through polysiloxane solution at the speed of 40m/min, drying in the shade, winding and packaging to obtain the tin wire.
Comparative example 1: is a commercial lead-free solder wire with the diameter of 0.12 mm.
Comparative example 2 the preparation was the same as in example 2, the flux components were the same, but the tin alloy contained no cerium.
Comparative example 3 the preparation method was the same as in example 3, the flux components were the same, but the tin alloy contained no vanadium.
Comparative example 4 the same procedure was used as in example 4, with the same flux composition, but the tin alloy did not contain yttrium.
Comparative example 5 the same procedure was followed as in example 5, with the same tin alloy composition, but without the thermosetting resin in the flux.
Table 1: the solder wire of the embodiment 1-5 comprises the following components in parts by weight:
table 2: the tin alloy of examples 1-5 and comparative examples 2-4 comprises the following components in parts by weight:
| components | Tin (Sn) | Silver (Ag) | Copper (Cu) | Indium (In) | Cerium (Ce) | Vanadium oxide | Yttrium salt |
| Example 1 | 90.84％ | 3.80％ | 1.20％ | 3.70％ | 0.19％ | 0.13％ | 0.14％ |
| Example 2 | 90.94％ | 4.20％ | 1.30％ | 3.10％ | 0.16％ | 0.11％ | 0.19％ |
| Example 3 | 91.08％ | 3.40％ | 1.80％ | 3.30％ | 0.22％ | 0.10％ | 0.10％ |
| Example 4 | 90.99％ | 3.20％ | 1.60％ | 3.90％ | 0.14％ | 0.09％ | 0.08％ |
| Example 5 | 91.54％ | 2.90％ | 1.50％ | 3.50％ | 0.25％ | 0.15％ | 0.16％ |
| Comparative example 2 | 91.10％ | 4.20％ | 1.30％ | 3.10％ | 0.00％ | 0.11％ | 0.19％ |
| Comparative example 3 | 91.18％ | 3.40％ | 1.80％ | 3.30％ | 0.22％ | 0.00％ | 0.10％ |
| Comparative example 4 | 91.07％ | 3.20％ | 1.60％ | 3.90％ | 0.14％ | 0.09％ | 0.00％ |
Table 3: the scaling powder of the embodiment 1-5 and the comparative example 5 comprises the following components in parts by weight:
the highly weldable environment-friendly ultrafine solder wires prepared in the examples 1 to 6, the lead-free solder wire sold in the comparative example 1 and the comparative examples 2 to 5 are subjected to performance tests, and the test results are shown in the table 4:
table 4: test results of examples 1 to 6 and comparative example
As shown by test data in Table 4, compared with a commercially available solderless tin wire, the melting point of the tin wire reaches 242-247 ℃, the expansion rate is low, and the copper mirror test, the corrosion resistance and the wettability meet the requirements, the heat-resistant environment-friendly superfine tin wire applied to the welding of the intelligent manipulator comprises 96.1-98.0% of tin alloy and 2.0-3.9% of soldering flux, wherein the tin alloy comprises tin, silver, copper, indium, cerium, vanadium and yttrium, the melting point of vanadium is 1890 +/-10 ℃, the heat-resistant superfine tin wire belongs to high-melting-point rare metal, the heat resistance of the tin alloy can be enhanced, the anti-wear and anti-explosion properties of the tin wire are improved, the strength, the hardness and the heat resistance of the tin alloy can be obviously improved by adding yttrium, the melting point of the tin wire can be improved, the anti-oxidation and ductility of the tin alloy can be enhanced, the texture structure of the solder can be changed by adding cerium, so that grains are refined, the solder bridges are reduced, and the surface wettability of the tin alloy is changed, the creep property and the tensile property are improved, the addition of copper avoids the bridging shape of the increase of the viscosity of the solder, the solidified Cu exists in a matrix in a solid solution form and can be well combined with a copper plate, the solidified crystalline state of the solder can be improved by adding trace rare earth elements into tin alloy, the melting point of a solder wire is increased, the tensile strength and the toughness of the solder are improved, radioactive isotope elements such as Bi, Pb, Co and the like are not added into the tin alloy, so that the signal interference caused by decay is reduced, magnetic materials such as Fe, Co, Ni, Nd and the like are not added, the signal interference caused by the nonlinearity of the materials can be reduced, the soldering flux comprises rosin, thermosetting resin, a thixotropic agent, an activator, a surface activator and a solvent, the copolymerization of the rosin and the thermosetting resin is adopted as a main body, the metal surface tin wetting capacity can be improved, and the extension toughness of the solder wire can be improved at the same time, the solder wire has the advantages of high melting point, excellent tensile strength, no lead and environmental protection, and the high weldability and the no lead environmental protection development of products when the solder wire is applied to high-end application fields such as intelligent manipulator welding.
Claims (10)
1. The utility model provides a be applied to superfine solder wire of heat-resisting environmental protection of intelligent mechanical hand welded which characterized in that: the solder wire consists of 96.1 to 98.0 weight percent of tin alloy and 2.0 to 3.9 weight percent of soldering flux;
the tin alloy comprises the following components in percentage by weight: 1.2 to 1.8 percent of copper, 2.9 to 4.2 percent of silver, 3.1 to 3.9 percent of indium, 0.14 to 0.25 percent of cerium, 0.09 to 0.15 percent of vanadium, 0.08 to 0.19 percent of yttrium and the balance of tin;
the soldering flux comprises the following components in percentage by weight: 7.1 to 11.8 percent of activator, 3 to 7 percent of solvent, 0.5 to 1.5 percent of surfactant, 1.1 to 2.2 percent of thixotropic agent, 18.1 to 23.3 percent of thermosetting resin and the balance of rosin.
2. The heat-resistant environment-friendly superfine solder wire applied to intelligent manipulator welding of claim 1 is characterized in that: the surface of the solder wire is provided with an anti-oxidation film with the film thickness of 0.001nm-0.01 mm.
3. The heat-resistant environment-friendly superfine solder wire applied to intelligent manipulator welding of claim 1 is characterized in that: the thermosetting resin is cyanate ester resin and epoxy resin according to the weight ratio of 2-3: 1-2 compounding;
the cyanate resin is one or a plurality of compositions of bisphenol A cyanate, bisphenol F cyanate, bisphenol M cyanate and phenolic cyanate;
the epoxy resin is one or a combination of more of alicyclic epoxy resin, bisphenol A type epoxy resin, phenol-aralkyl epoxy resin and glycidylamine type epoxy resin.
4. The heat-resistant environment-friendly superfine solder wire applied to intelligent manipulator welding of claim 1 is characterized in that: the activator is compounded by organic amine and organic acid according to the weight ratio of 1:3-4, the organic acid is one or a plurality of combinations of adipic acid, suberic acid and stearic acid, and the organic amine is one or a plurality of combinations of triethanolamine, diethylenetriamine and triisopropanolamine.
5. The heat-resistant environment-friendly superfine solder wire applied to intelligent manipulator welding of claim 1 is characterized in that: the thixotropic agent is formed by compounding stearamide and polyamide modified hydrogenated castor oil according to the weight ratio of 1-2: 2-3.
6. The heat-resistant environment-friendly superfine solder wire applied to intelligent manipulator welding of claim 1 is characterized in that: the rosin is any one of water white rosin, perhydrogenated rosin and disproportionated rosin.
7. The heat-resistant environment-friendly superfine solder wire applied to intelligent manipulator welding of claim 1 is characterized in that: the surfactant is a halogen-free activator ST-200 and polyethylene glycol 400 which are compounded according to the weight ratio of 1: 1-3.
8. The heat-resistant environment-friendly superfine solder wire applied to intelligent manipulator welding of claim 1 is characterized in that: the solvent is prepared from tetrahydrofurfuryl alcohol and butyl cellosolve according to the weight ratio of 2-3: 1.
9. The preparation method of the heat-resistant environment-friendly superfine solder wire applied to intelligent manipulator welding according to any one of claims 1 to 8 is characterized by comprising the following steps of:
s1, weighing the components according to the weight percentage for later use;
s2, adding rosin into a reaction kettle, heating to 130-150 ℃, adding a solvent and thermosetting resin after dissolving, stirring for 20-30min, adding a thixotropic agent, stirring until the thixotropic agent is completely dissolved, cooling to 70-90 ℃, adding an activator and a surfactant, stirring for 40-60 min, and cooling to obtain the soldering flux;
s3, melting tin, adding the tin into a melting furnace, melting to 350-;
s4, putting the cylindrical bar blank into an extruder with a wire outlet caliber of phi 9mm, adding soldering flux into a rosin barrel according to the weight proportion of 2.0-3.9%, controlling the temperature of the rosin barrel at 120 ℃, the temperature of the bar blank at 110 ℃ and the extrusion force at 150kg/cm2Extruding the cylindrical bar blank into thick tin wires with phi 9mm and the inner core of which contains 2.0-3.9% of soldering flux by weight at a wire-discharging speed of 1.5 m/min;
and S5, rolling and drawing the coarse tin wire to obtain a tin wire with the diameter of 0.12mm, performing online lightening and anti-oxidation treatment, drying in the shade, winding and packaging to obtain the tin wire.
10. The preparation method of the heat-resistant environment-friendly superfine solder wire applied to intelligent manipulator welding according to claim 9, is characterized in that: the oxidation prevention processing step in step S5 includes: the solder wire is passed through the polysiloxane solution at a speed of 10-40m/min to form an oxidation resistant film with a film thickness of 0.001nm-0.01mm on the surface of the solder wire.
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| CN118028655A (en) * | 2024-01-29 | 2024-05-14 | 东莞市高海亮金属材料科技有限公司 | Tin alloy material resistant to extreme temperature and preparation method and application thereof |
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| CN113118662B (en) * | 2021-04-23 | 2022-04-08 | 宏桥金属制品(昆山)有限公司 | High-collapse-resistance solder wire and preparation method thereof |
| CN114367761B (en) * | 2022-02-21 | 2023-08-18 | 中山翰华锡业有限公司 | Low-residue halogen-free lead-free soldering paste after welding and preparation method thereof |
| CN114669909B (en) * | 2022-04-01 | 2023-08-18 | 中山翰华锡业有限公司 | Oxidation-resistant preformed soldering lug and preparation method thereof |
| CN114669908B (en) * | 2022-04-01 | 2023-08-18 | 中山翰华锡业有限公司 | High-reliability preformed soldering lug and preparation method thereof |
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Denomination of invention: A heat-resistant and environmentally friendly ultrafine solder wire applied to intelligent robotic arm welding and its preparation method Granted publication date: 20240405 Pledgee: Zhongshan Branch of Bank of Communications Co.,Ltd. Pledgor: ZHONGSHAN TIN-KING Co.,Ltd. Registration number: Y2024980026094 |