CN109483089A - High temperature solder(ing) paste scaling powder and preparation method thereof - Google Patents
High temperature solder(ing) paste scaling powder and preparation method thereof Download PDFInfo
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- CN109483089A CN109483089A CN201811322551.4A CN201811322551A CN109483089A CN 109483089 A CN109483089 A CN 109483089A CN 201811322551 A CN201811322551 A CN 201811322551A CN 109483089 A CN109483089 A CN 109483089A
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/362—Selection of compositions of fluxes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/40—Making wire or rods for soldering or welding
Abstract
High temperature solder(ing) paste scaling powder and preparation method thereof, the scaling powder include activating agent 5.0%~10.0%, high-temperature antioxidant 0.1%~1.0%, solvent 30.0%~40.0%, thixotropic agent 3.0%~10.0%, surplus be film forming agent；The activating agent is one of three dodecanedioic acids and glutaric acid, adipic acid, azelaic acid, decanedioic acid, stearic acid, 2,3- dibromosuccinic acid or a variety of；The high-temperature antioxidant is PW-9225；The solvent is positive one or both of last of the ten Heavenly stems ether and glycerine, n-octyl ether, and solvent boiling point is higher than 280 DEG C；The thixotropic agent is the mixture of castor oil and 6650R；The film forming agent is the mixture of KE-604 rosin and newtrex.Flux activity of the invention is strong, weldability and stability are good, is not easy to splash, can avoid blacking around oxidation and solder joint, the high temperature series solder(ing) paste product suitable for temperature at 280 DEG C or more.
Description
Technical field
The present invention relates to solder(ing) paste scaling powder and preparation method thereof technical fields, help wlding material as SMT, this helps weldering
Agent is suitable for series alloy powder solder(ing) paste product of the welding temperature at 280 DEG C or more.
Background technique
Solder(ing) paste is mainly used in surface mounting technology (SMT) welding, and with the development of electronic information equipment, SMT is had become
For the mainstream technology of Electronic Assemblies, usage amount increasingly increases.
Solder(ing) paste scaling powder it is many kinds of, component proportion and applicability are different.Currently, being used for semiconductor temperature
The solder welding solder(ing) paste at 280 DEG C or more is spent, due to welding temperature height, scaling powder in the welding process is will lead to and flies
Splash, aoxidize and solder joint around the problems such as blacking.
Summary of the invention
It is an object of the invention to overcome the scaling powder defect of the above prior art, provide a kind of activity strong, weldability and
Stability is good, is not easy to splash, can avoid the scaling powder product to black around oxidation and solder joint and preparation method thereof.
In order to reach the goals above, the present invention takes following technical scheme:
High temperature solder(ing) paste scaling powder, the component and mass content of the scaling powder are as follows: activating agent 5.0%~10.0%,
High-temperature antioxidant 0.1%~1.0%, solvent 30.0%~40.0%, thixotropic agent 3.0%~10.0%, surplus are film forming agent；Institute
State activating agent be three dodecanedioic acids and glutaric acid, adipic acid, azelaic acid, decanedioic acid, stearic acid, in 2,3- dibromosuccinic acid
It is one or more, and the mass ratio of three dodecanedioic acids and other organic acids is 4~5:1~3；The high-temperature antioxidant is PW-
9225；The solvent is positive one or both of last of the ten Heavenly stems ether and glycerine, n-octyl ether, positive last of the ten Heavenly stems ether and glycerine and/or just pungent
The mass ratio of base ether is 1~2:2~3, and solvent boiling point is higher than 280 DEG C；The thixotropic agent is the mixture of castor oil and 6650R,
The mass ratio of castor oil and 6650R are 1~3.5:4~6；The film forming agent is the mixture of KE-604 rosin and newtrex,
The mass ratio of KE-604 rosin and newtrex is 2~3:1~2.
The preparation method of high temperature solder(ing) paste scaling powder of the present invention, is that film forming agent is added in a kettle, in temperature
Be to be melted at 180~200 DEG C, be then added solvent, 170 DEG C~180 DEG C of temperature, stir 8~12 minutes, add activating agent and
High temperature antioxygen retention agent stirs 8~12 minutes, is then cooled to 150 DEG C~160 DEG C, is eventually adding thixotropic agent, stirring 27~33
Minute, room temperature is cooled to up to the scaling powder.
The present invention uses high-temperature antioxidant, high-temperature solvent and three dodecanedioic acid activating agents with high-temperature stability to carry out
Rationally compounding, is prepared suitable for solder(ing) paste scaling powder resistant to high temperature.Firstly, the solvent that the present invention uses is that high temperature is molten
Agent, and by the compounding of high-temperature solvent, reduce the spattering problem in welding process；Secondly, the present invention uses 32 carbon two
The activation temperature of surfactant system based on acid, the activating agent in the system is high, and active retention time is long, to extend work
The activity of property agent at high temperature, improves the weldability of scaling powder at high temperature；At the same time, pass through high-temperature antioxidant PW-
9225 addition can improve the color of film forming matter resin, protection welding under the conditions of high temperature and superhigh temperature (300 DEG C or more)
Solder joint ensure that the weldability of solder(ing) paste at high temperature, also avoid the nigrescence around solder joint in the oxidation of high temperature.In short, logical
The scaling powder being prepared can be made activity is strong at high temperature, weldability and stability are good, are not easy to splash, can avoid by crossing the present invention
Black around oxidation and solder joint.
Specific embodiment
Embodiment 1
Prepare raw material by following mass ratio:
Three dodecanedioic acids 8.0%；
Stearic acid 1.0%；
2,3- dibromosuccinic acids 1.0%；
PW-9225 0.5%；
Positive last of the ten Heavenly stems ether 10.0%；
Glycerine 10%；
N-octyl ether 15.0%；
Castor oil 3.5%；
6650R 6.0%；
Newtrex 140 15.0%；
KE-604 rosin 30.0%.
High temperature solder(ing) paste scaling powder is prepared as follows: KE-604 rosin and newtrex 140 are put into one instead
It answers in kettle, molten rosin at 180 DEG C~200 DEG C；The solvent of positive last of the ten Heavenly stems ether, glycerine and n-octyl ether mixing preparation is slowly added to
In molten rosin, temperature is maintained at 170 DEG C~180 DEG C, stirs 10 minutes, adds three dodecanedioic acids, stearic acid and 2,3-
The activating agent and high-temperature antioxidant PW-9225 of dibromosuccinic acid mixing preparation stir 10 minutes；Then cooled material expects 150
DEG C~160 DEG C, it is eventually adding the thixotropic agent of castor oil and 6650R mixing preparation, stirring poured into glass container after 30 minutes, cooling
To room temperature to get scaling powder product of the invention, the series alloy powder solder(ing) paste suitable for welding temperature at 280 DEG C or more is produced
Product.
Embodiment 2
Prepare raw material by following mass ratio:
Three dodecanedioic acids 5.0%；
Adipic acid 1.0%；
Glutaric acid 2.0%；
PW-9225 1.0%；
Positive last of the ten Heavenly stems ether 20.0%；
Glycerine 20.0%；
Castor oil 3.0%；
6650R 6.0%；
Newtrex 120 10.0%；
Newtrex 140 10.0%；
KE-604 rosin 22.0%.
High temperature solder(ing) paste scaling powder is prepared as follows: by KE-604 rosin and newtrex 120 and newtrex
In 140 one reaction kettle of investment, molten rosin at 180 DEG C~200 DEG C；The solvent of positive last of the ten Heavenly stems ether and glycerine mixing preparation is slow
It is added in molten rosin, temperature is maintained at 170 DEG C~180 DEG C, stirs 12 minutes, adds three dodecanedioic acids, adipic acid, penta
The activating agent and high-temperature antioxidant PW-9225 of diacid mixing preparation stir 8 minutes；Then cooled material expects 150 DEG C~160
DEG C, it is eventually adding the thixotropic agent of castor oil and 6650R mixing preparation, stirring pours into glass container after 33 minutes, is cooled to room temperature,
Up to scaling powder product of the invention, the series alloy powder solder(ing) paste product suitable for welding temperature at 280 DEG C or more.
Embodiment 3
Prepare raw material by following mass ratio:
Three dodecanedioic acids 4.5%；
Azelaic acid 1.0%；
Decanedioic acid 1.0%；
PW-9225 0.1%；
Positive last of the ten Heavenly stems ether 10.0%；
N-octyl ether 20.0%；
Castor oil 2.0%；
6650R 8.0%；
Newtrex 120 18.4%；
KE-604 rosin 35.0%.
High temperature solder(ing) paste scaling powder is prepared as follows: KE-604 rosin and newtrex 120 are put into one instead
It answers in kettle, molten rosin at 180 DEG C~200 DEG C；The solvent of positive last of the ten Heavenly stems ether and n-octyl ether mixing preparation is slowly added to melting pine
In perfume (or spice), temperature is maintained at 170 DEG C~180 DEG C, stirs 8 minutes, adds three dodecanedioic acids, azelaic acid, decanedioic acid mixing tune
The activating agent and high-temperature antioxidant PW-9225 matched stir 8 minutes；Then cooled material expects 150 DEG C~160 DEG C, is eventually adding
The thixotropic agent of castor oil and 6650R mixing preparation, stirring pour into glass container after 27 minutes, are cooled to room temperature to get the present invention
Scaling powder product, the series alloy powder solder(ing) paste product suitable for welding temperature at 280 DEG C or more.
Embodiment 4
Prepare raw material by following mass ratio:
Three dodecanedioic acids 4.0%；
Stearic acid 1.0%；
PW-9225 1.0%；
Positive last of the ten Heavenly stems ether 10.0%；
Glycerine 20%；
N-octyl ether 10.0%；
Castor oil 1.0%；
6650R 2.0%；
Newtrex 140 17.0%；
KE-604 rosin 34.0%.
High temperature solder(ing) paste scaling powder is prepared as follows: KE-604 rosin and newtrex 140 are put into one instead
It answers in kettle, molten rosin at 180 DEG C~200 DEG C；The solvent of positive last of the ten Heavenly stems ether, glycerine and n-octyl ether mixing preparation is slowly added to
In molten rosin, temperature is maintained at 170 DEG C~180 DEG C, stirs 10 minutes, adds three dodecanedioic acids and stearic acid mixing is adjusted
The activating agent and high-temperature antioxidant PW-9225 matched stir 12 minutes；Then cooled material expects 150 DEG C~160 DEG C, finally plus
Enter the thixotropic agent of castor oil and 6650R mixing preparation, stirring pours into glass container after 30 minutes, is cooled to room temperature to get this hair
Bright scaling powder product, the series alloy powder solder(ing) paste product suitable for welding temperature at 280 DEG C or more.
Embodiment 5
Prepare raw material by following mass ratio:
Three dodecanedioic acids 4.5%；
Azelaic acid 1.0%；
2,3- dibromosuccinic acids 1.0%；
PW-9225 1.0%；
Positive last of the ten Heavenly stems ether 15.0%；
N-octyl ether 25.0%；
Castor oil 2.0%；
6650R 5.5%；
Newtrex 120 15.0%；
KE-604 rosin 30.0%.
High temperature solder(ing) paste scaling powder is prepared as follows: KE-604 rosin and newtrex 120 are put into one instead
It answers in kettle, molten rosin at 180 DEG C~200 DEG C；The solvent of positive last of the ten Heavenly stems ether and n-octyl ether mixing preparation is slowly added to melting pine
In perfume (or spice), temperature is maintained at 170 DEG C~180 DEG C, stirs 10 minutes, adds three dodecanedioic acids, azelaic acid, 2,3- dibromo fourth two
The activating agent and high-temperature antioxidant PW-9225 of sour mixing preparation stir 12 minutes；Then cooled material expects 150 DEG C~160
DEG C, it is eventually adding the thixotropic agent of castor oil and 6650R mixing preparation, stirring pours into glass container after 30 minutes, is cooled to room temperature,
Up to scaling powder product of the invention, the series alloy powder solder(ing) paste product suitable for welding temperature at 280 DEG C or more.
Claims (2)
1. high temperature solder(ing) paste scaling powder, characterized in that the component and mass content of the scaling powder are as follows: activating agent 5.0%~
10.0%, high-temperature antioxidant 0.1%~1.0%, solvent 30.0%~40.0%, thixotropic agent 3.0%~10.0%, surplus be at
Film；The activating agent is three dodecanedioic acids and glutaric acid, adipic acid, azelaic acid, decanedioic acid, stearic acid, 2,3- dibromo fourth
One of diacid is a variety of, and the mass ratio of three dodecanedioic acids and other organic acids is 4~5:1~3；The high temperature antioxygen
Agent is PW-9225；The solvent is positive one or both of last of the ten Heavenly stems ether and glycerine, n-octyl ether, positive last of the ten Heavenly stems ether and glycerine and/
Or the mass ratio of n-octyl ether is 1~2:2~3, solvent boiling point is higher than 280 DEG C；The thixotropic agent is the mixed of castor oil and 6650R
The mass ratio of conjunction object, castor oil and 6650R are 1~3.5:4~6；The film forming agent is the mixed of KE-604 rosin and newtrex
The mass ratio of conjunction object, KE604 and newtrex is 2~3:1~2.
2. the preparation method of high temperature solder(ing) paste scaling powder as described in claim 1, characterized in that film forming is added in a kettle
Agent melts at being 180~200 DEG C in temperature, and solvent is then added, 170 DEG C~180 DEG C of temperature, stirs 8~12 minutes, then plus
Enter activating agent and high temperature antioxygen retention agent, stir 8~12 minutes, be then cooled to 150 DEG C~160 DEG C, be eventually adding thixotropic agent,
Stirring 27~33 minutes, is cooled to room temperature up to the scaling powder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201811322551.4A CN109483089B (en) | 2018-11-08 | 2018-11-08 | Soldering flux for high-temperature soldering paste and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811322551.4A CN109483089B (en) | 2018-11-08 | 2018-11-08 | Soldering flux for high-temperature soldering paste and preparation method thereof |
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| CN109483089B CN109483089B (en) | 2021-04-30 |
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| WO2021115287A1 (en) * | 2019-12-09 | 2021-06-17 | 青岛歌尔微电子研究院有限公司 | Solder flux and preparation method thereof, tin paste and preparation method thereof |
| CN113996972A (en) * | 2021-11-24 | 2022-02-01 | 云南锡业锡材有限公司 | Anti-blushing soldering flux for solder wires and preparation method thereof |
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| CN113996972B (en) * | 2021-11-24 | 2022-12-06 | 云南锡业锡材有限公司 | Anti-blushing soldering flux for solder wires and preparation method thereof |
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| CN109483089B (en) | 2021-04-30 |
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Address after: 650501 No.2, Yunjing Road, information industry base, Kunming Economic and Technological Development Zone, Yunnan Province Patentee after: YUNNAN TIN NEW MATERIAL Co.,Ltd. Address before: 650501 No.2, Yunjing Road, information industry base, Kunming Economic and Technological Development Zone, Yunnan Province Patentee before: YUNNAN TIN MATERIAL Co.,Ltd. |