CN106736005A - Lead-free low-temperature through hole special environment protection tin cream - Google Patents
Lead-free low-temperature through hole special environment protection tin cream Download PDFInfo
- Publication number
- CN106736005A CN106736005A CN201710021702.1A CN201710021702A CN106736005A CN 106736005 A CN106736005 A CN 106736005A CN 201710021702 A CN201710021702 A CN 201710021702A CN 106736005 A CN106736005 A CN 106736005A
- Authority
- CN
- China
- Prior art keywords
- cream
- weld
- tin
- temperature
- tin cream
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3613—Polymers, e.g. resins
Abstract
A kind of lead-free low-temperature through hole special environment protection tin cream, is made up of Sn42Bi58 alloys glass putty and weld-aiding cream, is containing mass ratio in the weld-aiding cream：The phenolic antioxidant of the resin KE 604,2 3% of 1 6% thixotropic agent 6650,35 58%, 1 2% nonionic halogen compounds, 35 55% diethylene glycol hexyl ether, the activating agent of 1.5 7% mass；The weight ratio of the Sn42Bi58 alloys glass putty and weld-aiding cream is 89:11.The phenomenon that drops of tin cream, keeps the stability of lotion when the present invention efficiently solves the element inserting in THT techniques；Postwelding residual less and transparent, good insulation preformance, No clean, there is extremely strong postwelding reliability；Postwelding tin cream unit volume is relatively stable, is not in the phenomenon of many tin or few tin.
Description
Technical field
The present invention relates to a kind of electronic printing circuit board assembling welding material, more particularly to a kind of lead-free low-temperature through hole
Special environment protection tin cream.
Background technology
With developing rapidly for electronics manufacturing, the production of mains charger also gets over modernization, but, due to product sheet
The two-sided limitation for loading in mixture of body list, the assembling of mains charger must be by surface mount（SMT）And through-hole mounting（THT）Twice are different
Technique composition, due to electronics processing constantly develop towards miniature and highly integrated direction, the electronics used by mains charger
Element is also less and less, the packing density more and more higher of electronic component, and particularly in THT techniques, tin cream is easy when element is inserted
Drop, cause the phenomenon of rosin joint more serious, so as to the requirement to tin cream also more and more higher, particularly to the postwelding reliability of tin cream
Property require more strict, mains charger requirement element non-refractory, in lead-free solder, first-selected alloying component is exactly
Sn42Bi58, weld-aiding cream is typically by the resin of 35-58% mass（KE-604）, the thixotropic agent of 1-6% mass（Such as thixotropic agent 6650）,
The solvent of 35-55% mass（Such as diethylene glycol hexyl ether）, the activating agent of 1.5-7% mass（Such as succinic acid, 24 acid etc.）Composition, it is existing
Such tin cream is difficult to meet above-mentioned requirements, and following deficiency is primarily present in mains charger welding：
1st, inserting element tin cream in operation is inserted easily drops and causes rosin joint；
2nd, there is more tin sweat(ing) using after 2-3 hours in tin cream in postwelding residue, especially between the less pad of spacing,
The phenomenon of short circuit occurs；
3rd, after using 2-3 hours, tin cream is dried tin cream, causes the few tin of lower tin, the few tin of solder joint to cause dry joint.
The content of the invention
In place of in view of the shortcomings of the prior art, it is an object of the invention to provide a kind of lead-free low-temperature through hole special environment protection tin
Cream.
To achieve the above object, the technical solution adopted in the present invention is：
A kind of lead-free low-temperature through hole special environment protection tin cream, is made up of Sn42Bi58 alloys glass putty and weld-aiding cream,
It is containing mass ratio in the weld-aiding cream：
The thixotropic agent 6650 of 1-6%
The resin KE-604 of 35-58%
The phenolic antioxidant of 2-3%
The nonionic halogen compounds of 1-2%
The diethylene glycol hexyl ether of 35-55%
The activating agent of 1.5-7% mass；
The weight ratio of the Sn42Bi58 alloys glass putty and weld-aiding cream is 89:11.
Compared with prior art, the beneficial effects of the invention are as follows：
1st, the phenomenon that drops of tin cream when element is inserted in THT techniques is efficiently solved, the stability of lotion is kept；
2nd, postwelding residual less and transparent, good insulation preformance, No clean, there is extremely strong postwelding reliability；
3rd, postwelding tin cream unit volume is relatively stable, is not in the phenomenon of many tin or few tin.
Specific embodiment
Embodiment 1：A kind of lead-free low-temperature through hole special environment protection tin cream, is made up of Sn42Bi58 alloys glass putty and weld-aiding cream,
Sn42Bi58 alloy glass puttys proportion is 89%, and weld-aiding cream is consisted of, the thixotropic agent 6650 of 1-6%, the resin of 35-58%
The phenolic antioxidant of KE-604,2-3%, the nonionic halogen compounds of 1-2%, the diethylene glycol hexyl ether of 35-55%, 1.5-7%
The activating agent of quality（Such as succinic acid, 24 acid etc.）.
Weld-aiding cream manufacture craft：
Rosin and solvent heating for dissolving and are stirred continuously at a temperature of 150 degree, to transparent homogeneous liquid is dissolved into, are stopped
Heating；100 degree are cooled to by thixotropic agent, antioxidant is added, quick stirring and dissolving is into transparent liquid；Cool to 80 degree of additions non-
Ionic halogen compounds, the quick stirring and dissolving of activating agent continues to cool down and do not stop to be stirred to 20 degree into transparent and homogeneous liquid, will
Lotion sealing preserve is 24 hours under 5-15 degree low temperature environments.Normal temperature is returned to, three-roller is used（Roll shaft spacing 0.1mm）Grinding 4
Time, obtain a kind of uniform weld-aiding cream.Lotion is preserved at room temperature, can be used after 48 hours.
Lead-free low-temperature through hole special environment protection tin cream preparation method：
Sn42Bi58 alloys glass putty is coordinated in 89% ratio and above-mentioned weld-aiding cream ratio, 20 points are stirred in solder paste stirrer
Clock, and vacuumized when rear end is stirred, extract the bubble in tin cream out, a kind of uniform solder(ing) paste is obtained, this product is in sealing 0-
Can be preserved 6 months under 10 degree of low temperature.When needing to use, taken out from low temperature environment, can just made after being thawed 4 hours under normal temperature
With.
Embodiment 2：A kind of lead-free low-temperature through hole special environment protection tin cream, is made up of Sn42Bi58 alloys glass putty and weld-aiding cream,
Sn42Bi58 alloy glass puttys proportion is 89%, and weld-aiding cream is consisted of, the thixotropic agent 6650 of 2-5%, the resin of 30-60%
The phenolic antioxidant of KE-604,1-2%, the nonionic halogen compounds of 1-4%, the diethylene glycol hexyl ether of 30-57%, 1.5-6%
The activating agent of quality（Such as succinic acid, 24 acid etc.）.
Weld-aiding cream manufacture craft is with embodiment 1.
Lead-free low-temperature through hole special environment protection tin cream preparation method is with embodiment 1.
Embodiment 3：A kind of lead-free low-temperature through hole special environment protection tin cream, is made up of Sn42Bi58 alloys glass putty and weld-aiding cream,
Sn42Bi58 alloy glass puttys proportion is 89%, and weld-aiding cream is consisted of, the thixotropic agent 6650 of 1.5-5.5%, 20-60%'s
The phenolic antioxidant of resin KE-604,3-5%, the nonionic halogen compounds of 2.3-4.8%, the diethylene glycol of 30-62% oneself
Ether, the activating agent of 1.8-5.6% mass（Such as succinic acid, 24 acid etc.）.
Weld-aiding cream manufacture craft is with embodiment 1.
Lead-free low-temperature through hole special environment protection tin cream preparation method is with embodiment 1.
Embodiment 4：A kind of lead-free low-temperature through hole special environment protection tin cream, is made up of Sn42Bi58 alloys glass putty and weld-aiding cream,
Sn42Bi58 alloy glass puttys proportion is 89%, and weld-aiding cream is consisted of, the thixotropic agent 6650 of 1.8-6%, the tree of 28-63%
The phenolic antioxidant of fat KE-604,3.2-5.6%, the nonionic halogen compounds of 2.6-4.6%, the diethylene glycol of 35-64% oneself
Ether, the activating agent of 2.1-5.8% mass（Such as succinic acid, 24 acid etc.）.
Weld-aiding cream manufacture craft is with embodiment 1.
Lead-free low-temperature through hole special environment protection tin cream preparation method is with embodiment 1.
Claims (1)
1. a kind of lead-free low-temperature through hole special environment protection tin cream, it is characterised in that be made up of Sn42Bi58 alloys glass putty and weld-aiding cream,
It is containing mass ratio in the weld-aiding cream：
The thixotropic agent 6650 of 1-6%
The resin KE-604 of 35-58%
The phenolic antioxidant of 2-3%
The nonionic halogen compounds of 1-2%
The diethylene glycol hexyl ether of 35-55%
The activating agent of 1.5-7% mass；
The weight ratio of the Sn42Bi58 alloys glass putty and weld-aiding cream is 89:11.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710021702.1A CN106736005A (en) | 2017-01-12 | 2017-01-12 | Lead-free low-temperature through hole special environment protection tin cream |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710021702.1A CN106736005A (en) | 2017-01-12 | 2017-01-12 | Lead-free low-temperature through hole special environment protection tin cream |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106736005A true CN106736005A (en) | 2017-05-31 |
Family
ID=58947301
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710021702.1A Pending CN106736005A (en) | 2017-01-12 | 2017-01-12 | Lead-free low-temperature through hole special environment protection tin cream |
Country Status (1)
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| CN (1) | CN106736005A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109483089A (en) * | 2018-11-08 | 2019-03-19 | 云南锡业锡材有限公司 | High temperature solder(ing) paste scaling powder and preparation method thereof |
| CN114833452A (en) * | 2022-03-18 | 2022-08-02 | 浙江隆基乐叶光伏科技有限公司 | Solder paste and production method thereof, and production method of photovoltaic module |
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| CN101157168A (en) * | 2007-11-16 | 2008-04-09 | 北京工业大学 | Lead-free solder thread-use colophony type non-halide cleaning-free scaling powder |
| CN101347875A (en) * | 2008-08-19 | 2009-01-21 | 深圳悍豹科技有限公司 | Middle-temperature energy-saving leadless solder paste special for tuners |
| CN101347874A (en) * | 2008-08-19 | 2009-01-21 | 深圳悍豹科技有限公司 | Low-temperature energy-saving leadless solder paste special for tuners |
| CN102357748A (en) * | 2011-10-18 | 2012-02-22 | 苏州之侨新材料科技有限公司 | Halogen-and-rosin-free antibacterial no-clean soldering flux for lead-free solder |
| CN104308395A (en) * | 2014-10-24 | 2015-01-28 | 云南锡业锡材有限公司 | Halogen-free soldering flux applicable to SnBi series soldering paste and preparation method |
| CN104889596A (en) * | 2015-06-16 | 2015-09-09 | 广西南宁迈点装饰工程有限公司 | Low-temperature lead-free tin paste and production technique for paste flux thereof |
| JP2015205293A (en) * | 2014-04-18 | 2015-11-19 | 株式会社デンソー | Solder paste, method for manufacturing electronic device, and electronic device |
| JP2016026882A (en) * | 2014-06-26 | 2016-02-18 | 荒川化学工業株式会社 | Flux for lead-free solder for clearance resist, and lead-free solder paste for clearance resist |
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2017
- 2017-01-12 CN CN201710021702.1A patent/CN106736005A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101157168A (en) * | 2007-11-16 | 2008-04-09 | 北京工业大学 | Lead-free solder thread-use colophony type non-halide cleaning-free scaling powder |
| CN101347875A (en) * | 2008-08-19 | 2009-01-21 | 深圳悍豹科技有限公司 | Middle-temperature energy-saving leadless solder paste special for tuners |
| CN101347874A (en) * | 2008-08-19 | 2009-01-21 | 深圳悍豹科技有限公司 | Low-temperature energy-saving leadless solder paste special for tuners |
| CN102357748A (en) * | 2011-10-18 | 2012-02-22 | 苏州之侨新材料科技有限公司 | Halogen-and-rosin-free antibacterial no-clean soldering flux for lead-free solder |
| JP2015205293A (en) * | 2014-04-18 | 2015-11-19 | 株式会社デンソー | Solder paste, method for manufacturing electronic device, and electronic device |
| JP2016026882A (en) * | 2014-06-26 | 2016-02-18 | 荒川化学工業株式会社 | Flux for lead-free solder for clearance resist, and lead-free solder paste for clearance resist |
| CN104308395A (en) * | 2014-10-24 | 2015-01-28 | 云南锡业锡材有限公司 | Halogen-free soldering flux applicable to SnBi series soldering paste and preparation method |
| CN104889596A (en) * | 2015-06-16 | 2015-09-09 | 广西南宁迈点装饰工程有限公司 | Low-temperature lead-free tin paste and production technique for paste flux thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109483089A (en) * | 2018-11-08 | 2019-03-19 | 云南锡业锡材有限公司 | High temperature solder(ing) paste scaling powder and preparation method thereof |
| CN109483089B (en) * | 2018-11-08 | 2021-04-30 | 云南锡业锡材有限公司 | Soldering flux for high-temperature soldering paste and preparation method thereof |
| CN114833452A (en) * | 2022-03-18 | 2022-08-02 | 浙江隆基乐叶光伏科技有限公司 | Solder paste and production method thereof, and production method of photovoltaic module |
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Application publication date: 20170531 |
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| RJ01 | Rejection of invention patent application after publication |