CN104942480B - A kind of Solid flux for stainless steel soft soldering - Google Patents
A kind of Solid flux for stainless steel soft soldering Download PDFInfo
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- CN104942480B CN104942480B CN201510375209.0A CN201510375209A CN104942480B CN 104942480 B CN104942480 B CN 104942480B CN 201510375209 A CN201510375209 A CN 201510375209A CN 104942480 B CN104942480 B CN 104942480B
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- Prior art keywords
- stainless steel
- solid
- solid flux
- soft soldering
- solder
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- 239000007787 solid Substances 0.000 title claims abstract description 49
- 230000004907 flux Effects 0.000 title claims abstract description 42
- 238000005476 soldering Methods 0.000 title claims abstract description 39
- 229910001220 stainless steel Inorganic materials 0.000 title claims abstract description 38
- 239000010935 stainless steel Substances 0.000 title claims abstract description 37
- 239000000203 mixture Substances 0.000 claims abstract description 23
- 239000000843 powder Substances 0.000 claims abstract description 22
- 239000002253 acid Substances 0.000 claims abstract description 19
- 230000007797 corrosion Effects 0.000 claims abstract description 15
- 238000005260 corrosion Methods 0.000 claims abstract description 15
- 239000007788 liquid Substances 0.000 claims description 16
- 238000000034 method Methods 0.000 claims description 16
- 238000003756 stirring Methods 0.000 claims description 15
- 238000006243 chemical reaction Methods 0.000 claims description 12
- YGSDEFSMJLZEOE-UHFFFAOYSA-N salicylic acid Chemical compound OC(=O)C1=CC=CC=C1O YGSDEFSMJLZEOE-UHFFFAOYSA-N 0.000 claims description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 7
- 239000002994 raw material Substances 0.000 claims description 6
- RPNUMPOLZDHAAY-UHFFFAOYSA-N Diethylenetriamine Chemical compound NCCNCCN RPNUMPOLZDHAAY-UHFFFAOYSA-N 0.000 claims description 4
- QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 claims description 4
- FJKROLUGYXJWQN-UHFFFAOYSA-N papa-hydroxy-benzoic acid Natural products OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 claims description 4
- 229920002401 polyacrylamide Polymers 0.000 claims description 4
- 229960004889 salicylic acid Drugs 0.000 claims description 4
- 238000005303 weighing Methods 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 abstract description 40
- 229910052751 metal Inorganic materials 0.000 abstract description 21
- 239000002184 metal Substances 0.000 abstract description 21
- 239000013543 active substance Substances 0.000 abstract description 15
- 239000006184 cosolvent Substances 0.000 abstract description 12
- 150000007513 acids Chemical class 0.000 abstract description 11
- 239000003795 chemical substances by application Substances 0.000 abstract description 11
- 230000003213 activating effect Effects 0.000 abstract description 10
- 238000002360 preparation method Methods 0.000 abstract description 9
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 35
- 238000003466 welding Methods 0.000 description 21
- 229910000831 Steel Inorganic materials 0.000 description 10
- 238000005219 brazing Methods 0.000 description 10
- 239000010959 steel Substances 0.000 description 10
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 8
- -1 hydroxyethyl diamines Chemical class 0.000 description 7
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 6
- 238000002425 crystallisation Methods 0.000 description 6
- 230000008025 crystallization Effects 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 230000008569 process Effects 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- BHHYHSUAOQUXJK-UHFFFAOYSA-L zinc fluoride Chemical compound F[Zn]F BHHYHSUAOQUXJK-UHFFFAOYSA-L 0.000 description 6
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 5
- 239000002202 Polyethylene glycol Substances 0.000 description 5
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 5
- 229920001223 polyethylene glycol Polymers 0.000 description 5
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 5
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 description 4
- FGUUSXIOTUKUDN-IBGZPJMESA-N C1(=CC=CC=C1)N1C2=C(NC([C@H](C1)NC=1OC(=NN=1)C1=CC=CC=C1)=O)C=CC=C2 Chemical compound C1(=CC=CC=C1)N1C2=C(NC([C@H](C1)NC=1OC(=NN=1)C1=CC=CC=C1)=O)C=CC=C2 FGUUSXIOTUKUDN-IBGZPJMESA-N 0.000 description 4
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 4
- 239000011324 bead Substances 0.000 description 4
- JVTAAEKCZFNVCJ-UHFFFAOYSA-N lactic acid Chemical compound CC(O)C(O)=O JVTAAEKCZFNVCJ-UHFFFAOYSA-N 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- 239000011787 zinc oxide Substances 0.000 description 4
- TXUICONDJPYNPY-UHFFFAOYSA-N (1,10,13-trimethyl-3-oxo-4,5,6,7,8,9,11,12,14,15,16,17-dodecahydrocyclopenta[a]phenanthren-17-yl) heptanoate Chemical compound C1CC2CC(=O)C=C(C)C2(C)C2C1C1CCC(OC(=O)CCCCCC)C1(C)CC2 TXUICONDJPYNPY-UHFFFAOYSA-N 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- AVXURJPOCDRRFD-UHFFFAOYSA-N Hydroxylamine Chemical compound ON AVXURJPOCDRRFD-UHFFFAOYSA-N 0.000 description 3
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 3
- 229910021626 Tin(II) chloride Inorganic materials 0.000 description 3
- MKUWVMRNQOOSAT-UHFFFAOYSA-N but-3-en-2-ol Chemical group CC(O)C=C MKUWVMRNQOOSAT-UHFFFAOYSA-N 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 238000006073 displacement reaction Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 3
- 239000011976 maleic acid Substances 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- UDGSVBYJWHOHNN-UHFFFAOYSA-N n',n'-diethylethane-1,2-diamine Chemical compound CCN(CC)CCN UDGSVBYJWHOHNN-UHFFFAOYSA-N 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 235000011150 stannous chloride Nutrition 0.000 description 3
- 239000001119 stannous chloride Substances 0.000 description 3
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 3
- 150000003852 triazoles Chemical class 0.000 description 3
- BJEPYKJPYRNKOW-REOHCLBHSA-N (S)-malic acid Chemical compound OC(=O)[C@@H](O)CC(O)=O BJEPYKJPYRNKOW-REOHCLBHSA-N 0.000 description 2
- WBYWAXJHAXSJNI-VOTSOKGWSA-M .beta-Phenylacrylic acid Natural products [O-]C(=O)\C=C\C1=CC=CC=C1 WBYWAXJHAXSJNI-VOTSOKGWSA-M 0.000 description 2
- QFGCFKJIPBRJGM-UHFFFAOYSA-N 12-[(2-methylpropan-2-yl)oxy]-12-oxododecanoic acid Chemical compound CC(C)(C)OC(=O)CCCCCCCCCCC(O)=O QFGCFKJIPBRJGM-UHFFFAOYSA-N 0.000 description 2
- GNFTZDOKVXKIBK-UHFFFAOYSA-N 3-(2-methoxyethoxy)benzohydrazide Chemical compound COCCOC1=CC=CC(C(=O)NN)=C1 GNFTZDOKVXKIBK-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- WBYWAXJHAXSJNI-SREVYHEPSA-N Cinnamic acid Chemical compound OC(=O)\C=C/C1=CC=CC=C1 WBYWAXJHAXSJNI-SREVYHEPSA-N 0.000 description 2
- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 description 2
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- WUGQZFFCHPXWKQ-UHFFFAOYSA-N Propanolamine Chemical compound NCCCO WUGQZFFCHPXWKQ-UHFFFAOYSA-N 0.000 description 2
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 2
- FEWJPZIEWOKRBE-UHFFFAOYSA-N Tartaric acid Natural products [H+].[H+].[O-]C(=O)C(O)C(O)C([O-])=O FEWJPZIEWOKRBE-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 2
- 239000001089 [(2R)-oxolan-2-yl]methanol Substances 0.000 description 2
- ISKQADXMHQSTHK-UHFFFAOYSA-N [4-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=C(CN)C=C1 ISKQADXMHQSTHK-UHFFFAOYSA-N 0.000 description 2
- BJEPYKJPYRNKOW-UHFFFAOYSA-N alpha-hydroxysuccinic acid Natural products OC(=O)C(O)CC(O)=O BJEPYKJPYRNKOW-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- 229930016911 cinnamic acid Natural products 0.000 description 2
- 235000013985 cinnamic acid Nutrition 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 150000001991 dicarboxylic acids Chemical class 0.000 description 2
- HPNMFZURTQLUMO-UHFFFAOYSA-N diethylamine Chemical compound CCNCC HPNMFZURTQLUMO-UHFFFAOYSA-N 0.000 description 2
- 150000002462 imidazolines Chemical class 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 235000014655 lactic acid Nutrition 0.000 description 2
- 235000011090 malic acid Nutrition 0.000 description 2
- 239000001630 malic acid Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- LGRLWUINFJPLSH-UHFFFAOYSA-N methanide Chemical compound [CH3-] LGRLWUINFJPLSH-UHFFFAOYSA-N 0.000 description 2
- WBYWAXJHAXSJNI-UHFFFAOYSA-N methyl p-hydroxycinnamate Natural products OC(=O)C=CC1=CC=CC=C1 WBYWAXJHAXSJNI-UHFFFAOYSA-N 0.000 description 2
- 150000002762 monocarboxylic acid derivatives Chemical class 0.000 description 2
- IJFHXXRIQVMNDB-UHFFFAOYSA-N n-ethyl-n-[2-(ethylamino)ethyl]hydroxylamine Chemical compound CCNCCN(O)CC IJFHXXRIQVMNDB-UHFFFAOYSA-N 0.000 description 2
- 229910000480 nickel oxide Inorganic materials 0.000 description 2
- DBJLJFTWODWSOF-UHFFFAOYSA-L nickel(ii) fluoride Chemical compound F[Ni]F DBJLJFTWODWSOF-UHFFFAOYSA-L 0.000 description 2
- GNRSAWUEBMWBQH-UHFFFAOYSA-N oxonickel Chemical compound [Ni]=O GNRSAWUEBMWBQH-UHFFFAOYSA-N 0.000 description 2
- 229920001083 polybutene Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 238000003892 spreading Methods 0.000 description 2
- 230000007480 spreading Effects 0.000 description 2
- ANOBYBYXJXCGBS-UHFFFAOYSA-L stannous fluoride Chemical compound F[Sn]F ANOBYBYXJXCGBS-UHFFFAOYSA-L 0.000 description 2
- 229960002799 stannous fluoride Drugs 0.000 description 2
- 239000001384 succinic acid Substances 0.000 description 2
- 239000011975 tartaric acid Substances 0.000 description 2
- 235000002906 tartaric acid Nutrition 0.000 description 2
- BSYVTEYKTMYBMK-UHFFFAOYSA-N tetrahydrofurfuryl alcohol Chemical compound OCC1CCCO1 BSYVTEYKTMYBMK-UHFFFAOYSA-N 0.000 description 2
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 2
- NWONKYPBYAMBJT-UHFFFAOYSA-L zinc sulfate Chemical compound [Zn+2].[O-]S([O-])(=O)=O NWONKYPBYAMBJT-UHFFFAOYSA-L 0.000 description 2
- 229960001763 zinc sulfate Drugs 0.000 description 2
- 229910000368 zinc sulfate Inorganic materials 0.000 description 2
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 229920002594 Polyethylene Glycol 8000 Polymers 0.000 description 1
- 241001487808 Protobothrops mucrosquamatus Species 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 125000005605 benzo group Chemical group 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 229910000416 bismuth oxide Inorganic materials 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000005574 cross-species transmission Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 229960000935 dehydrated alcohol Drugs 0.000 description 1
- TYIXMATWDRGMPF-UHFFFAOYSA-N dibismuth;oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Bi+3].[Bi+3] TYIXMATWDRGMPF-UHFFFAOYSA-N 0.000 description 1
- NJLLQSBAHIKGKF-UHFFFAOYSA-N dipotassium dioxido(oxo)titanium Chemical compound [K+].[K+].[O-][Ti]([O-])=O NJLLQSBAHIKGKF-UHFFFAOYSA-N 0.000 description 1
- 229960004756 ethanol Drugs 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- MTNDZQHUAFNZQY-UHFFFAOYSA-N imidazoline Chemical compound C1CN=CN1 MTNDZQHUAFNZQY-UHFFFAOYSA-N 0.000 description 1
- 230000005764 inhibitory process Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 150000002736 metal compounds Chemical class 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 239000002362 mulch Substances 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 235000014593 oils and fats Nutrition 0.000 description 1
- 239000005416 organic matter Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 238000010926 purge Methods 0.000 description 1
- 229910001404 rare earth metal oxide Inorganic materials 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 230000035807 sensation Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
- 238000005491 wire drawing Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/362—Selection of compositions of fluxes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/40—Making wire or rods for soldering or welding
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a kind of Solid flux for stainless steel soft soldering and preparation method；Wherein, Solid flux includes: organic cosolvent 0 68.5%, metal active agent 0 19.8%；Acids activating agent 0 39.8%, corrosion inhibiter 0.1 0.8%, surplus is organic carrier；Preparation method includes step a, with mass ratio range, by organic cosolvent and metal active agent mix and blend；Step b, will add acids activating agent in the solution that configures of step a, and the step such as stand 24 hours；Present invention can apply to scaling powder field, the application present invention can effectively solve the problem that the problem helping weldering unstable properties, it is possible to effectively solves solder and sprawls the problem that situation is poor, the rate of spread is low.
Description
Technical field
The present invention relates to scaling powder field, a kind of Solid flux for stainless steel soft soldering and preparation method.
Background technology
American Welding Society (AWS) (AWS) regulation solder liquidus temperature is solder brazing higher than 450 DEG C of solderings carried out, and is solder less than 450 DEG C of solderings carried out.Solder relies primarily on the solder moistening to mother metal to form joint.Solder is soldered technique, and it has the following characteristics that (1) solder can carry out soldering with the common thermal source such as flatiron, blowtorch compared with solder brazing, it is easy to operation；(2) heating-up temperature is low, and the structure property change of base metals is little, and welded part can be made to weld by any way, and its contingent expansion, Strength Changes and deformation are the least；(3) soldering productivity ratio is high, performance tens to thousand of weld seams of welding, it is easy to accomplish automated production；(4) the brazing filler metal melts temperature owing to using is low, and the selectable scope of flux compounds that during soldering, scaling powder is difficult to be burnt and be suitable for is wide, and performance is more excellent.
The wire having most of resistor and capacitor in the market uses stainless steel material as pin, the novel resistance to bending of stainless steel wire pin, and toughness is strong, resistance to torsion；Its resistance to vibration is 3-6 times of ordinary steel wire pin, and electronic devices and components solder is more reliable after connecing, and product is longer for service life, and cost is lower；Meanwhile, along with various electronic installations are good at appearance looks elegant, surface tactile sensation and the pursuit of the aspect of performance such as high intensity, electronic product more use various surface, intensity to process after Stainless Steel Shell.
But, there is many difficult points and defect because welding temperature is too high in stainless steel soft soldering tech of the prior art；Rustless steel complicated component simultaneously, there is the oxide of Multiple components and structure on surface, and soft solder is poor with the moistening of stainless steel material, and stainless steel soft soldering tech to be realized needs to prepare the fluxes for soft soldering of excellent performance.Meanwhile, rustless steel welding material disclosed in prior art and technology are concentrated mainly on solder brazing, typically with Ore, potassium titanate, titanium dioxide, crome metal compound, bismuth oxide, rare earth oxide or fluoride, and carbon, silicon, manganese, phosphorus etc. become subassembly melting to form the stainless steel electrode for solder brazing, welding wire, welding powder etc., these products in use welding temperature is high, need to use the equipments such as arc welding, so in terms of the welding of electronic devices and components and casting of electronic device and inapplicable, electronic product requirement solder joint cannot be met little, reliability is high, surfacing, the characteristics such as solder joint light.
Summary of the invention
Present invention solves the technical problem that and be to provide a kind of Solid flux for stainless steel soft soldering and preparation method, can effectively solve the problem that the problem that the welding activity of 320-420 DEG C of solder can not meet actual production demand, can effectively solve the problem that the problem helping weldering unstable properties, it is possible to effectively solve solder and sprawl the problem that situation is poor, the rate of spread is low.
For solving above-mentioned technical problem, the invention provides a kind of Solid flux for stainless steel soft soldering, it is characterised in that calculated in weight percent, this Solid flux includes:
Organic cosolvent 0-68.5%, metal active agent 0-19.8%；Acids activating agent 0-39.8%, corrosion inhibiter 0.1-0.8%, surplus is organic carrier；Wherein,
Described organic cosolvent is one or more in glycerol, diethylene glycol, ethanolamine, ethylenediamine, triethanolamine, butanediolamine, fatty amine, diethylamine, diethylenetriamine, 3-Propanolamine, polymine, azanol, α-hydroxyethylethylene diamine, hydroxyl diethyl ethylenediamine, four hydroxyethyl diamines, succinic acid amine, N, N-diethyl ethylene diamine, tetrahydrofurfuryl alcohol；
Described metal active agent is one or more in dibutyltin diacetate, stannous methide, stannous chloride, stannous fluoride, tin fluoborate, titanium oxide, zinc sulfate, zinc oxide, zinc fluoride, nickel oxide, Nickel difluoride, Nickel dichloride.；
Described acids activating agent is one or more in monocarboxylic acid, dicarboxylic acids, 2 hydroxy propanoic acid, malic acid, maleic acid, fluoboric acid, Fluohydric acid., tartaric acid, cinnamic acid, 11 carbon diacid, dodecanedioic acid, l-amino acid, salicylic acid；
Described corrosion inhibiter is the one in BTA, triazole type, imidazolines Organic substance；
Described organic carrier is one or more in hydrogenated rosin, water-soluble rosin resin, Polyethylene Glycol, polyethylene glycol oxide, polypropylene, polyacrylamide, polybutene.
The above-mentioned Solid flux for stainless steel soft soldering also can have following features, and described Solid flux includes:
The above-mentioned Solid flux for stainless steel soft soldering also can have following features, and described Solid flux includes:
The above-mentioned Solid flux for stainless steel soft soldering also can have following features, and described Solid flux includes:
The above-mentioned Solid flux for stainless steel soft soldering also can have following features, and described Solid flux includes:
It addition, present invention also offers the preparation method of a kind of Solid flux as previously mentioned, it is characterised in that comprise the steps:
Step a, with mass ratio range, by organic cosolvent and metal active agent mix and blend；
Step b, added acids activating agent in solution step a configured, and stands 24 hours；
Step c, is heated to 140-145 DEG C by the solution that step b configures and removes the moisture brought into or produce in course of reaction, and then be cooled to room temperature, and obtain solid state crystallization thing；
Step d, solid state crystallization thing step c obtained is placed in reactor, heats and keeps temperature to be 105-120 DEG C, and stirs to melting for liquid；
Step e, joins corrosion inhibiter in melted liquid, continuously stirred 5-30min；
Step f, is cooled to temperature 90-95 DEG C by the liquid of step e, adds organic carrier and stirs 10-20min；
Step g, is cooled to room temperature by the mixture of step f, obtains the Solid flux for stainless steel soft soldering.
Scaling powder prepared by the present invention is reacted completely by organic cosolvent, metal active agent and acids activating agent three to prepare and has the solid state crystallization thing removing rustless steel surface oxides performance；This solid state crystallization thing occurs mushy stage to change between 70-80 DEG C, have no irritating odor, it it is neutral substance under room temperature, the effect of rustless steel surface oxides and oils and fats can be decomposed and can effectively remove when welding is heated, the metal ion simultaneously wherein added can occur rapidly displacement reaction with the metal simple-substance on top layer, at the metal bonding layer that its Surface mulch one layer is good with soft solder wettability.
The metal active agent added in scaling powder of the present invention is dissolved in organic cosolvent with acids active agent response product or is uniformly distributed, in solder termination process, metal active agent presents with positive and negative ion state, the simple substance atom effect exposed with top layer, there is displacement reaction and at the new dissimilar metal layer of rustless steel Surface Realize, this new metal level and stainless steel-based physical ability reach metallurgical binding, and it is good with melted soft solder moistening, soft solder sprawling at matrix skin can be promoted, promote welding spot reliability, solder joint service life is effectively ensured.
The corrosion inhibiter of scaling powder of the present invention can be formed stable non-corrosiveness product with the material such as corrosive ion of residual, reduce residue butt welding point joint and the corrosion of electronic devices and components, improve components and parts and the service life of equipment after welding completes.
The carrier of scaling powder of the present invention is water solublity, volatile noresidue organic solvent, organic cosolvent, metal active agent and the state of inhibition agent composition can be adjusted, ensure the solid-state at normal temperatures in high intensity, and fast setting during lead-free soldering wire drawing process, flux-free spillover.
Scaling powder of the present invention, it is adaptable to the flame spray welding the etc. when machine automatization in the range of 320-420 DEG C welds, manual flatiron welds and is applied to bigger electronic device, can realize the rustless steel electronic device of Multiple components is carried out solder.
Relative to prior art, technique scheme of the present invention has the advantages that
1, the present invention use organic cosolvent, metal active agent and acids activating agent product as scaling powder removes film component and active component, at normal temperatures in high intensity solid-state, low-hygroscopicity, butt welding point joint and Trimeresurus mucrosquamatus (Cantor). non-corrosiveness, help weldering stable performance；Especially can give full play to welding activity under the soldering temperature of 320-420 DEG C, effectively remove the surface oxides of rustless steel device, solder is sprawled in order, and the rate of spread is high.
2, scaling powder of the present invention adds metal active agent, welding process plays simultaneously and removes oxide film dissolving and form the effect on new metal simple-substance top layer, the lead-free brazing wetting and spreading on device top layer can be effectively facilitated, improve soft solder and the wettability of substrate and Joint Strength.
3, the organic carrier that the present invention uses is water solublity and volatile organic matter, and postwelding residue is few, can wash by water.
Other features and advantages of the present invention will illustrate in the following description, and, partly become apparent from description, or understand by implementing the present invention.The purpose of the present invention and other advantages can be realized by structure specifically noted in description, claims and be obtained.
Detailed description of the invention
For making the object, technical solutions and advantages of the present invention clearer, hereinafter embodiments of the present invention will be explained in detail.It should be noted that in the case of not conflicting, the embodiment in the application and the feature in embodiment can mutual combination in any.
The invention provides a kind of Solid flux for stainless steel soft soldering, calculated in weight percent, this Solid flux includes:
Organic cosolvent 0-68.5%, metal active agent 0-19.8%；Acids activating agent 0-39.8%, corrosion inhibiter 0.1-0.8%, surplus is organic carrier；Wherein,
Described organic cosolvent is one or more in glycerol, diethylene glycol, ethanolamine, ethylenediamine, triethanolamine, butanediolamine, fatty amine, diethylamine, diethylenetriamine, 3-Propanolamine, polymine, azanol, α-hydroxyethylethylene diamine, hydroxyl diethyl ethylenediamine, four hydroxyethyl diamines, succinic acid amine, N, N-diethyl ethylene diamine, tetrahydrofurfuryl alcohol；
Described metal active agent is one or more in dibutyltin diacetate, stannous methide, stannous chloride, stannous fluoride, tin fluoborate, titanium oxide, zinc sulfate, zinc oxide, zinc fluoride, nickel oxide, Nickel difluoride, Nickel dichloride.；
Described acids activating agent is one or more in monocarboxylic acid, dicarboxylic acids, 2 hydroxy propanoic acid, malic acid, maleic acid, fluoboric acid, Fluohydric acid., tartaric acid, cinnamic acid, 11 carbon diacid, dodecanedioic acid, l-amino acid, salicylic acid；
Described corrosion inhibiter is the one in BTA, triazole type, imidazolines Organic substance；
Described organic carrier is one or more in hydrogenated rosin, water-soluble rosin resin, Polyethylene Glycol, polyethylene glycol oxide, polypropylene, polyacrylamide, polybutene.
Accordingly, present invention also offers the preparation method of a kind of Solid flux as previously mentioned, it is characterised in that comprise the steps:
Step a, with mass ratio range, by organic cosolvent and metal active agent mix and blend；
Step b, added acids activating agent in solution step a configured, and stands 24 hours；
Step c, is heated to 140-145 DEG C by the solution that step b configures and removes the moisture brought into or produce in course of reaction, and then be cooled to room temperature, and obtain solid state crystallization thing；
Step d, solid state crystallization thing step c obtained is placed in reactor, heats and keeps temperature to be 105-120 DEG C, and stirs to melting for liquid；
Step e, joins corrosion inhibiter in melted liquid, continuously stirred 5-30min；
Step f, is cooled to temperature 90-95 DEG C by the liquid of step e, adds organic carrier and stirs 10-20min；
Step g, is cooled to room temperature by the mixture of step f, obtains the Solid flux for stainless steel soft soldering.
Accordingly, the invention provides following multiple specific embodiment (it should be understood that following example constituent content is the most by weight percentage)；
Embodiment 1
A kind of Solid flux for stainless steel soft soldering, composition of raw materials component is as follows:
Collocation method: N, N-diethyl ethylene diamine, zinc fluoride are weighed by said ratio and stirred in corrosion-resistant reactor, is slowly added dropwise to reactor by the fluoboric acid of the 40%wt concentration of weighing, places 24 hours to reaction completely；Above-mentioned reaction solution is heated to 145 DEG C fully removed by moisture, the active mixture obtaining solid-state to be cooled；Again above-mentioned solid mixt is heated to 110 DEG C in a kettle., add BTA in above-mentioned liquid object, continue stirring 20min, polyethylene glycol oxide 100000 carrier of said ratio is added when liquid scaling powder temperature is down to 90 DEG C, continue stirring until mix homogeneously, it is cooled to room temperature, i.e. obtains a kind of Solid flux for stainless steel soft soldering.
Embodiment 2
A kind of Solid flux for stainless steel soft soldering, composition of raw materials component is as follows:
Collocation method: azanol, four hydroxyethyl diamines, zinc oxide are weighed by said ratio and stirred in corrosion-resistant reactor, is slowly added dropwise to reactor by the Fluohydric acid. of 40% concentration weighed, places 24 hours to reaction completely；Above-mentioned reaction solution is heated to 140 DEG C fully removed by moisture, the active mixture obtaining solid-state to be cooled；Again above-mentioned solid mixt is heated to 105 DEG C in a kettle., add triazole type corrosion inhibiter in above-mentioned liquid object, continue to stir 15min, the PEG 8000 carrier of said ratio is added when liquid scaling powder temperature is down to 90 DEG C, continue stirring until mix homogeneously, it is cooled to room temperature, i.e. obtains a kind of Solid flux for stainless steel soft soldering.
Embodiment 3
A kind of Solid flux for stainless steel soft soldering, composition of raw materials component is as follows:
Collocation method: α-hydroxyethylethylene diamine, zinc oxide, stannous chloride are weighed by said ratio and stirred in corrosion-resistant reactor, adds the maleic acid weighed to reactor, and places 24 hours to reaction completely；Above-mentioned reaction solution is heated to 145 DEG C fully removed by moisture, the active mixture obtaining solid-state to be cooled；Again above-mentioned solid mixt is heated to 105 DEG C in a kettle., add imidazoline in above-mentioned liquid object, continue to stir 10min, the water-soluble rosin resin carrier of said ratio is added when liquid scaling powder temperature is down to 90 DEG C, continue stirring until mix homogeneously, it is cooled to room temperature, i.e. obtains a kind of Solid flux for stainless steel soft soldering.
Embodiment 4
A kind of Solid flux for stainless steel soft soldering, composition of raw materials component is as follows:
Collocation method: diethylenetriamine, Nickel dichloride. are weighed by said ratio and stirred in corrosion-resistant reactor, the salicylic acid of weighing and the Fluohydric acid. of 40% concentration is slowly added dropwise to reactor, places 24 hours to reaction completely；Above-mentioned reaction solution is heated to 145 DEG C fully removed by moisture, the active mixture obtaining solid-state to be cooled；Again above-mentioned solid mixt is heated to 120 DEG C in a kettle., add benzo three nitrogen and file in above-mentioned liquid object, continue stirring 12min, the Polyacrylamide gel of said ratio is added when liquid scaling powder temperature is down to 90 DEG C, continue stirring until mix homogeneously, it is cooled to room temperature, i.e. obtains a kind of Solid flux for stainless steel soft soldering.
In order to the implementation result of effective above-described embodiment that the checking present invention provides, present invention also offers the following method of inspection:
Above case study on implementation makes a kind of Solid flux for stainless steel soft soldering, lead-free brazing rate of spread measuring method with reference to described in GB GB9491, to spread lead-free brazing as the diameter of a ball and the rate of spread characteristic manner being used for solder of extension rear center height.
Concrete operations technique is as described below:
1, specification is the stainless steel substrates 5 of 50 × 50 × 0.3mm, uses ethanol purge dry for standby.
2, Sn-0.7Cu solder is coiled into the solder ring that quality is 0.3 ± 0.005g.
3, take stainless steel substrates, place a solder ring in central authorities, and add, in ring central authorities, the above-mentioned scaling powder that the present invention provides.
After 4, this test piece is placed on the heated at constant temperature platform of test temperature holding 20s, air cooling is to room temperature, wipes flux residue with dehydrated alcohol, uses micrometer to record each solder joint height (Hi).
5, using the arithmetic mean of instantaneous value (Hav) of the solder joint height (Hi) in five pieces of test pieces as the height of described scaling powder postwelding Lead-Free Solder Joint, occur that the sample of obvious deviation should be left out.
6, respectively 5 solder rings are placed in evaporating dish heating so that it is fusing point is a bead.Put it into after cooling and the density bottle of 25 DEG C measure its displacement (m) in water, obtain molten bulb diameter according to below equation,
V=m/5
V=4 π (D/2)3/3
E=(D-Hav)/D × 100
Described scaling powder rate of spread E (%) of lead-free brazing after experimental temperature extends is obtained according to E=(D-Hav)/D × 100.
In formula: average rate of spread % of E-sample
M-bead discharges the quality of water in water
The volume cm of V-bead3
The diameter cm of D-bead
Hav-average solder joint height cm
This scaling powder rate of spread measures each case rate of spread of lead-free brazing when 320 DEG C and 380 DEG C welding respectively, and testing result is as shown in table 1.
The performance test results of table 1 embodiment of the present invention 1 to 4
Meanwhile, through retrieval, applicant finds that described in Application No. 201410752119.4 " a kind of No clean Solid flux for aluminum low temperature solder and preparation method " belongs to scaling powder technical field with this patent；Applicant through carefully consulting discovery this case main distinction compared with the present invention is:
Rustless steel fluxes for soft soldering of the present invention use be highly applicable to the active component of stainless steel soft soldering processes and film former and dilute solution, preparation technology need not be configured easier；It is applicable to high-temperature soldering, especially at the stainless steel soft Welding of 320-420 DEG C.
The No clean Solid flux of the aluminum low temperature solder described in documents, complicated process of preparation；It is applicable to middle soldered, is especially adapted for use in manual low temperature flatiron weldering and flame spray welding etc..
Therefore, in terms of raw material and proportioning thereof and applicable solder range of application and soldering temperature, documents and the present invention all have the difference of essence；Meanwhile, according to above-mentioned experimental result: the above-mentioned scaling powder that the present invention provides has good spreading property in the case of a high temperature.
A kind of Solid flux for stainless steel soft soldering of the present invention all can realize the large area of solder on stainless steel substrate and sprawl when 320 DEG C of solders carried out above, there is high activity feature, be suitable for applying in each components and parts of electronics, electrical equipment and communication equipment field and the rustless steel pin of product, the solder of housing.
Those skilled in the art should be understood that, although as above, but described content only readily appreciates the present invention and the embodiment that uses to the embodiment that disclosed herein, is not limited to the present invention.Technical staff in any art of the present invention; on the premise of without departing from the spirit and scope that disclosed herein; any amendment and change can be carried out in the form implemented and details, but the scope of patent protection of the present invention, still must be defined in the range of standard with appending claims.
Claims (1)
1. the Solid flux for stainless steel soft soldering, it is characterised in that by weight percentage
Calculating, the composition of raw materials component of this Solid flux is as follows:
This Solid flux collocation method is: by diethylenetriamine, Nickel dichloride. by said ratio weigh and
Corrosion-resistant reactor stirs, the salicylic acid of weighing and the Fluohydric acid. of 40% concentration are the most dropwise added
Enter to reactor, place 24 hours to reaction completely；Above-mentioned reaction solution is heated to 145 DEG C by water
Divide and fully remove, the active mixture obtaining solid-state to be cooled；Again by above-mentioned solid mixt in a kettle.
It is heated to 120 DEG C, adds BTA in above-mentioned liquid object, continue stirring 12min, in liquid
Scaling powder temperature is down to add when 90 DEG C the Polyacrylamide gel of said ratio, continues stirring until mixing all
Even, it is cooled to room temperature, i.e. obtains the Solid flux for stainless steel soft soldering.
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| TWI607822B (en) * | 2016-03-17 | 2017-12-11 | 國立屏東科技大學 | Silicon dioxide-based ignition flux for arc stud welding |
| CN106271222A (en) * | 2016-09-12 | 2017-01-04 | 东莞市千岛金属锡品有限公司 | A kind of Solid flux for automatic tin soldering solder and preparation method thereof |
| CN106695154A (en) * | 2017-01-16 | 2017-05-24 | 佛山通宝华通控制器有限公司 | Soft soldering structure of corrugated pipe, capillary pipe and bottom plate for pressure type thermostat |
| CN107962317B (en) * | 2017-10-31 | 2020-07-24 | 浙江双渔科技有限公司 | Water-based cleaning-free soldering flux |
| CN108637521B (en) * | 2018-07-17 | 2020-09-29 | 烟台艾邦电子材料有限公司 | Tin wire capable of welding stainless steel material at low temperature and preparation method thereof |
| CN113084394A (en) * | 2021-04-16 | 2021-07-09 | 湖南东安县特种焊材有限公司 | Non-corrosive soldering flux and preparation method thereof |
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Denomination of invention: A Solid Flux for Stainless Steel Soft Brazing Granted publication date: 20160824 Pledgee: China Co. truction Bank Corp Dongguan branch Pledgor: DONGGUAN CITY THOUSAND ISLAND METAL FOIL CO.,LTD. Registration number: Y2024980015348 |