CN106695154A - Soft soldering structure of corrugated pipe, capillary pipe and bottom plate for pressure type thermostat - Google Patents
Soft soldering structure of corrugated pipe, capillary pipe and bottom plate for pressure type thermostat Download PDFInfo
- Publication number
- CN106695154A CN106695154A CN201710027992.0A CN201710027992A CN106695154A CN 106695154 A CN106695154 A CN 106695154A CN 201710027992 A CN201710027992 A CN 201710027992A CN 106695154 A CN106695154 A CN 106695154A
- Authority
- CN
- China
- Prior art keywords
- capillary
- soldering
- bellows
- opening
- pipe
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 title abstract description 23
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical group [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 18
- 230000004907 flux Effects 0.000 claims abstract description 16
- 239000007787 solid Substances 0.000 claims abstract description 8
- 229910000679 solder Inorganic materials 0.000 claims description 11
- 239000007788 liquid Substances 0.000 abstract description 10
- 238000000034 method Methods 0.000 abstract description 8
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 238000003466 welding Methods 0.000 abstract description 6
- 239000000463 material Substances 0.000 abstract description 2
- 229910001128 Sn alloy Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 239000000843 powder Substances 0.000 description 5
- 238000001816 cooling Methods 0.000 description 3
- 239000000155 melt Substances 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 238000001291 vacuum drying Methods 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 238000005219 brazing Methods 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 238000009835 boiling Methods 0.000 description 1
- 239000003599 detergent Substances 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 150000007522 mineralic acids Chemical class 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 239000005416 organic matter Substances 0.000 description 1
- 238000005057 refrigeration Methods 0.000 description 1
- 210000005239 tubule Anatomy 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K33/00—Specially-profiled edge portions of workpieces for making soldering or welding connections; Filling the seams formed thereby
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Control Of Temperature (AREA)
Abstract
The invention discloses a soft soldering structure of a corrugated pipe, a capillary pipe and a bottom plate for a pressure type thermostat. A concave tray and a center hole are arranged on the bottom plate. The inner end of the capillary pipe penetrates the center hole from bottom to top and is fixed to the center hole in a riveted manner. The portion, around the capillary pipe, in the concave tray is provided with an opening tin ring with a solid soldering flux core. The corrugated pipe is arranged on the concave tray. An opening portion of the corrugated pipe is in contact connection with the inner wall of the concave tray in a matched manner. The width of the opening of the tin ring ranges from 0.5 mm to 1.5 mm. By the adoption of the soft soldering joint structure, the soldering welding quality of the soft soldering joint structure can be facilitated, the airtightness of the post-soldered soft soldering joint structure is guaranteed, no liquid soldering flux needs to be added in the soldering process, a lot of manpower and material resources can be saved, the technological process is reduced, the production cost is lowered, and the production efficiency is improved.
Description
Technical field
The present invention relates to soldering interface structure technical field between temperature controller part, more particularly to a kind of compression-type temperature controller
Bellows and capillary, the solder structure of base plate.
Background technology
The temperature module is that the bellows of metal is entered with base plate and capillary in the compression-type temperature controller of refrigeration control
Row solder is connected, thereafter insufflation gas working medium and to extracapillary end seals, using its internal gas working medium pressure with
Variation of ambient temperature and the characteristic that changes makes bellows produce telescopic displacement to carry out temperature control, thus, above-mentioned soldering is connected
The requirement for connecing is with air-tightness.
A kind of current way is that capillary one end is fixed on base plate, bellows opening portion cover capillary and base plate it
Between connecting portion and be placed with scolding tin on the base plate of institute cap position, then, instill liquid soldering flux, added by bottom base plate
Heat.In heating process, the position covered by bellows will be flowed through compared with the low-melting liquid soldering flux of scolding tin, to the bottom for matching
The metal surface of plate, capillary and bellows carries out oxide clean and prevents it from reoxidizing, when guiding tin liquor after melts soldering tin
Outwards reach the crest of bellows, inwardly cover the connecting portion for being deposited in capillary and base plate, sealing is formed after cooling
Solder structure component.The aforesaid liquid scaling powder generally main component that uses is G ＆ W, active component be inorganic acid with
Inorganic salts.
Above-mentioned way has the following disadvantages：1）Because the liquid soldering flux of the outside residual of soldering mouthful has corrosivity, need
The mode to be washed with water is removed, and also needs to add alkalinous metal detergent in water.2）Due to the liquid to soldering mouthful internal residual
Scaling powder cannot be cleaned, it is necessary to using vacuum drying with water（Heat and vacuumize）Method removal.Above-mentioned measure consume compared with
Many human resources, reduce production efficiency, and cause the production cost to increase.Additionally, 3）Liquid soldering flux is waved in welding process
Hair is serious, and certain pollution is caused to atmospheric environment.
The content of the invention
It is an object of the invention to provide a kind of bellows of compression-type temperature controller and capillary, the solder knot of base plate
Structure, the structure can improve its Welding quality and ensure the air-tightness after its soldering, and liquid soldering flux is used while being avoided that,
Postwelding cleaning and Vacuum Drying Step are saved, and reduces the pollution in welding process to atmospheric environment.
Technical solution proposed by the invention is such：
A kind of bellows of compression-type temperature controller and capillary, the solder structure of base plate, be provided with base plate recessed pallet and in
Heart hole, capillary inner end rivets fixation through centre bore and with the centre bore from bottom to top, around institute in the recessed pallet
State capillary and be placed with the opening tin ring with Solid flux core, bellows, the bellows are placed with the recessed pallet
Opening portion is connected with the recessed pallet inwall matching contact.
Further, the width of the opening of the tin ring is 0.5mm~1.5mm.
Compared with prior art, the present invention has following remarkable result：
（1）Because base plate is provided with recessed pallet and centre bore, bottom center hole uses riveting structure with capillary, and bellows is opened
The crest of oral area contacts attachment structure, the bellows and capillary of this compression-type temperature controller with recessed pallet inwall using matching
Solder interface structure between pipe, base plate is conducive to improving its Welding quality and ensuring the air-tightness after its soldering.
（2）Tin ring as a result of band opening is simultaneously placed in recessed pallet around capillary, and solid-state is provided with the tin ring
Scaling powder core, the main component of the Solid flux core is polymeric organic acid, and active component is organic salt, at normal temperatures
Aobvious solid-state, its fusing point is lower than the fusing point of tin alloy.Because tin is equipped with opening, when being heated to bottom base plate, with plus
Hot temperature gradually rises, and the Solid flux core in tin ring first melts and flowed out to from opening in recessed pallet, to bellows, hair
The metal surface of connecting portion carries out oxide clean and prevents it from reoxidizing between tubule and the recessed pallet of base plate, works as heating-up temperature
Continue to be increased to make tin alloy melt after, guiding tin liquor outwards reach at the crest of bellows opening portion, inwardly covering pile up product
Caulking part between capillary and recessed tray center hole, is formed the braze-welded structure component of sealing, whole brazing process after cooling
It is not required to add liquid soldering flux.
（3）Because Solid flux bellows at normal temperatures to metal, capillary and the base plate for using are substantially without corruption
Erosion is acted on, and its residue saves a large amount of human and material resources without cleaning or vacuum drying removal, reduces technological process,
Production cost is reduced, production efficiency is improve.
（4）As a result of Solid flux, its boiling point is higher than liquid soldering flux, so can be sent out very in brazing process
It is few, so that, reduce the volatilizable organic matter to air（VOC）Pollution.
Brief description of the drawings
Fig. 1 is bellows and capillary, the solder of base plate of a kind of compression-type temperature controller of one embodiment of the invention
Structural representation.
Fig. 2 is the schematic top plan view of tin ring shown in Fig. 14.
Fig. 3 is the structural representation after Welding between bellows shown in Fig. 1, capillary and recessed pallet.
Specific embodiment
The present invention is further elaborated by example below.
Referring to shown in Fig. 1 to Fig. 3, a kind of bellows of compression-type temperature controller and capillary, the solder structure of base plate,
Base plate 1 is provided with recessed pallet 1-1 and centre bore 1-2, and the inner end of capillary 2 passes through centre bore 1-2 Bing Yugai centers from bottom to top
1-2 rivetings in hole are fixed, and the opening 4- with Solid flux core 4-1 is placed with around the capillary 2 in the recessed pallet 1-1
2 tin rings 4, are placed with bellows 3, the opening portion of the bellows 3 and the recessed pallet 1-1 inwalls on the recessed pallet 1-1
Connected with contact.The width of the opening 4-2 of the tin ring 4 is 0.5mm~1.5mm.
After being assembled by said structure, bottom base plate is heated, as temperature is raised, scaling powder core 4-1 first melts cocurrent
Go out the recessed pallet 1-1 to base plate 1, associated metal oxide on surface is cleaned and is prevented from reoxidizing, when heating-up temperature continues
It is increased to after melting tin alloy, guiding tin liquor is outwards reached at the crest of bellows opening portion, inwardly covering is deposited in capillary
Caulking part between pipe and recessed tray center hole, is formed tin alloy weld bond 5, and then constitute the braze-welded structure of sealing after cooling
Component.If the opening 4-2 of tin ring 4 is too small, the outflow of scaling powder can be hindered；If 4-2 is too big for opening, easily cause local
Tin alloy lacks, it is difficult to sprawl the periphery for covering whole recessed pallet 1-1.
Claims (2)
1. a kind of bellows of compression-type temperature controller and capillary, the solder structure of base plate, it is characterised in that：In base plate（1）
It is provided with recessed pallet（1-1）And centre bore（1-2）, capillary（2）Inner end passes through centre bore from bottom to top（1-2）And with this in
Heart hole（1-2）Riveting is fixed, in the recessed pallet（1-1）It is interior around the capillary（2）It is placed with band Solid flux core（4-
1）Opening（4-2）Tin ring（4）, in the recessed pallet（1-1）On be placed with bellows（3）, the bellows（3）Opening portion with
The recessed pallet（1-1）Inwall matching contact connection.
2. the bellows of compression-type temperature controller according to claim 1 and capillary, the solder structure of base plate, its feature
It is：The tin ring（4）Opening（4-2）Width be 0.5mm~1.5mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710027992.0A CN106695154A (en) | 2017-01-16 | 2017-01-16 | Soft soldering structure of corrugated pipe, capillary pipe and bottom plate for pressure type thermostat |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710027992.0A CN106695154A (en) | 2017-01-16 | 2017-01-16 | Soft soldering structure of corrugated pipe, capillary pipe and bottom plate for pressure type thermostat |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106695154A true CN106695154A (en) | 2017-05-24 |
Family
ID=58907570
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710027992.0A Pending CN106695154A (en) | 2017-01-16 | 2017-01-16 | Soft soldering structure of corrugated pipe, capillary pipe and bottom plate for pressure type thermostat |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106695154A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107999993A (en) * | 2017-12-05 | 2018-05-08 | 广东省焊接技术研究所（广东省中乌研究院） | A kind of lead-free solder for temperature controller bellows iron bottom plate solder and preparation method thereof |
| CN110142477A (en) * | 2019-05-15 | 2019-08-20 | 常州汇商电器有限公司 | A kind of pressure type temperature controller bellows-welding technique |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6264062B1 (en) * | 1999-06-09 | 2001-07-24 | Craig D. Lack | Solder preforms with predisposed flux for plumbing applications |
| CN101489713A (en) * | 2006-05-25 | 2009-07-22 | 贝尔曼-梅尔科发展有限责任公司 | Filler metal with flux for brazing and soldering and method of making and using same |
| CN102728967A (en) * | 2012-07-19 | 2012-10-17 | 华南理工大学 | Scaling powder for nickel-plating alloy soft soldering tin wire core and preparation method of scaling powder |
| CN204480960U (en) * | 2015-03-25 | 2015-07-15 | 九江恒通自动控制器有限公司 | A kind of thermostat base |
| CN104942480A (en) * | 2015-06-29 | 2015-09-30 | 东莞市千岛金属锡品有限公司 | Solid state scaling powder for stainless steel soldering and preparing method |
| CN105118733A (en) * | 2015-09-01 | 2015-12-02 | 常州汇商电器有限公司 | Temperature controller pedestal and manufacturing technique |
| CN206509648U (en) * | 2017-01-16 | 2017-09-22 | 佛山通宝华通控制器有限公司 | The bellows of compression-type temperature controller and capillary, the solder structure of bottom plate |
-
2017
- 2017-01-16 CN CN201710027992.0A patent/CN106695154A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6264062B1 (en) * | 1999-06-09 | 2001-07-24 | Craig D. Lack | Solder preforms with predisposed flux for plumbing applications |
| CN101489713A (en) * | 2006-05-25 | 2009-07-22 | 贝尔曼-梅尔科发展有限责任公司 | Filler metal with flux for brazing and soldering and method of making and using same |
| CN102728967A (en) * | 2012-07-19 | 2012-10-17 | 华南理工大学 | Scaling powder for nickel-plating alloy soft soldering tin wire core and preparation method of scaling powder |
| CN204480960U (en) * | 2015-03-25 | 2015-07-15 | 九江恒通自动控制器有限公司 | A kind of thermostat base |
| CN104942480A (en) * | 2015-06-29 | 2015-09-30 | 东莞市千岛金属锡品有限公司 | Solid state scaling powder for stainless steel soldering and preparing method |
| CN105118733A (en) * | 2015-09-01 | 2015-12-02 | 常州汇商电器有限公司 | Temperature controller pedestal and manufacturing technique |
| CN206509648U (en) * | 2017-01-16 | 2017-09-22 | 佛山通宝华通控制器有限公司 | The bellows of compression-type temperature controller and capillary, the solder structure of bottom plate |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107999993A (en) * | 2017-12-05 | 2018-05-08 | 广东省焊接技术研究所（广东省中乌研究院） | A kind of lead-free solder for temperature controller bellows iron bottom plate solder and preparation method thereof |
| CN110142477A (en) * | 2019-05-15 | 2019-08-20 | 常州汇商电器有限公司 | A kind of pressure type temperature controller bellows-welding technique |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20170524 |