CN102069324A - No-clean low-splashing soldering flux for lead-free solder wire and preparation method thereof - Google Patents
No-clean low-splashing soldering flux for lead-free solder wire and preparation method thereof Download PDFInfo
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- CN102069324A CN102069324A CN 201010610839 CN201010610839A CN102069324A CN 102069324 A CN102069324 A CN 102069324A CN 201010610839 CN201010610839 CN 201010610839 CN 201010610839 A CN201010610839 A CN 201010610839A CN 102069324 A CN102069324 A CN 102069324A
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Abstract
The invention discloses a no-clean low-splashing rosin-based soldering flux for a lead-free solder wire and a preparation method thereof. The soldering flux comprises the following components in percentage by mass: 2 to 7 percent of high-boiling point alcohol solvent, 0.5 to 5 percent of organic amine hydrogen halide, 0.5 to 5 percent of organic acid and 80 to 97 percent of rosin. The preparation method comprises the following steps of: mixing and stirring the organic amine hydrogen halide and the high-boiling point alcohol solvent into uniform and transparent liquid; and adding the uniform and transparent liquid into mixed solution of the rosin and the organic acid to prepare uniform and transparent liquid. Therefore, the defect of splashing of the traditional soldering flux for the lead-free solder wire is improved, and the soldering flux has high solderability and electric insulativity.
Description
Technical field
The present invention relates to the scolder field, refer in particular to a kind of low spatter lead-free soldering wire scaling powder and preparation method thereof of exempting to clean.
Background technology
Along with the raising day by day of human environmental requirement, it is unleaded that electronic solder has lead to be converted into from tradition.Because the fusing point of lead-free solder is than having about the high 30-50 of kupper solder ℃, tradition has plumbous solder stick to be used in scaling powder can't satisfy the requirement of welding procedure to braze ability on the lead-free soldering wire.For the braze ability that improves lead-free soldering wire need increase the content of activating agent in the solder flux, but can produce the scaling powder important disadvantages of splashing simultaneously again.Patent 200710022404 has been announced a kind of lead-free soldering wire scaling powder, but this patent solubilizer not, the solubility of organic amine hydrohalide in rosin is very low, easily produces scaling powder during welding and splashes.Patent 200810195090 has been announced a kind of lead-free soldering wire scaling powder, and this patent contains the high boiling ester kind solvent, and is bad to the activating agent dissolubility in the solder flux, also easily produces scaling powder during welding and splashes.
Summary of the invention
Main purpose of the present invention is to provide a kind of the minimizing to splash, and is active high, postwelding insulaion resistance height, no-cleaning leadless solder scaling powder and preparation method thereof that reliability is high.
For realizing above-mentioned purpose, the present invention takes following technical scheme:
A kind ofly exempt to clean the low spatter lead-free soldering wire with scaling powder and preparation method thereof, by mass percentage, comprise 2-7% high-boiling point alcohol kind solvent, 0.5-5% organic amine hydrohalide, 0.5-5% organic acid, 80-97% rosin.
Described high-boiling point alcohol kind solvent be at least glycerine, diethylene glycol (DEG), tetrahydrofurfuryl alcohol, 2-ethyl (1-) hexanol, 2-ethyl (1, the 3-) mixture of one or more in the hexylene glycol.
Described organic amine hydrohalide is at least one or more mixtures in the diphenylguanidine hydrogen bromic acid salt ﹑ hexamethylene amine hydrogen bromic acid salt ﹑ two ethylamine hydrobromide ﹑ dimethylamine hydrochloric acid salt ﹑ diethylamine hydrogen salt hydrochlorates.
Described organic acid is at least 6 carbon atoms above monobasic or binary organic acid, wherein is at least one or more mixtures in suberic acid, decanedioic acid, 12 diacid, dodecoic acid, tetradecylic acid, palmitic acid, the stearic acid.
Preparation method of the present invention mixes the organic amine hydrohalide earlier with the high-boiling point alcohol kind solvent, be stirred to homogeneous transparent liquid with high speed dispersor at normal temperatures; Again rosin is added in the container and to heat with 150 ± 10 ℃ and be stirred to fusing, under 150 ± 10 ℃ of temperature, add organic acid, treat that organic acid is dissolved in the mixing material that adds aforementioned organic amine hydrohalide and alcohols solvent behind the rosin solution again, continue to stir and be dissolved into transparent uniform liquid after 10～30 minutes and get final product.
The invention has the advantages that adding the high-boiling point alcohol kind solvent can well dissolve organic amine hydrohalide, thereby reducing scaling powder splashes, and after adopting the high-boiling point alcohol kind solvent that the organic amine hydrohalide is dissolved earlier with high speed dispersor at normal temperatures, mix with rosin and organic acid heating again, the scaling powder transparency height that is made, substantially do not have during welding and splash, braze ability is good, the insulaion resistance height.
The specific embodiment
Below in conjunction with specific embodiment the present invention is further described.
The present invention is a kind of to exempt to clean the low spatter lead-free soldering wire with scaling powder and preparation method thereof, by mass percentage, comprises 2-7% high-boiling point alcohol kind solvent, 0.5-5% organic amine hydrohalide, 0.5-5% organic acid, 80-97% rosin.Specifically see following embodiment 1-4 for details.
Described high-boiling point alcohol kind solvent be at least Bing San Chun ﹑ Er Gan Chun ﹑ Si hydrogen Kang Chun ﹑ 2-ethyl (1-) Ji Chun ﹑ 2-ethyl (1, the 3-) mixture of one or more in the hexylene glycol.Because the solubility of organic amine hydrohalide in rosin is very low, as the organic amine hydrohalide not being dissolved with solvent, can cause the skewness of organic amine hydrohalogenation in rosin, wherein the place that concentration is big causes scaling powder to splash seriously owing to instant vaporization when welding.The high-boiling point alcohol kind solvent all has excellent dissolubility to organic amine hydrohalide, organic acid and rosin, even organic amine hydrohalide, organic acid are evenly distributed in the rosin, thereby reduce or avoids scaling powder to splash.
Of the present inventionly exempt to clean the low spatter lead-free soldering wire and be lower than the 2%(mass percent with the amount of the high-boiling point alcohol kind solvent that adds in the scaling powder, in the time of down together), the high-boiling point alcohol kind solvent can not improve organic acid, the solubility of organic amine hydrohalide in rosin, thereby splashes and do not have positive effect suppressing scaling powder; When being higher than 7%, the high-boiling point alcohol kind solvent can make splashing of scaling powder more obvious owing to the vaporization of self.Therefore, of the present invention exempt to clean the low spatter lead-free soldering wire must be with the addition of high-boiling point alcohol kind solvent in the scaling powder in 2%～7% scope.More preferably 4%～6% scope.
Described organic acid activator is above monobasic or binary organic acids of at least 6 carbon atoms, wherein is at least: one or more mixtures in Xin Er Suan ﹑ Gui Er Suan ﹑ 12 Er Suan ﹑ Shi Er Suan ﹑ ten Si Suan ﹑ palmitic acids, the stearic acid.Be lower than the following organic acid of 6 carbon atoms because boiling point is low, when welding, easily vaporize, volatilize, cause scaling powder to splash.
Described organic amine hydrohalide is at least one or more mixtures in the diphenylguanidine hydrogen bromic acid salt ﹑ hexamethylene amine hydrogen bromic acid salt ﹑ two ethylamine hydrobromide ﹑ dimethylamine hydrochloric acid salt ﹑ diethylamine hydrogen salt hydrochlorates.This type of material has the ability of stronger removal oxide, but also is the component that has the greatest impact to splashing of scaling powder, therefore controls the scope of its content in scaling powder at 0.5-5%.
Described rosin can be common rosin or modified rosin, any one or two kinds of mixing in preferred superfine rosin, the polymerization Song Xiang ﹑ Qiization Song Xiang ﹑ Foral.Two kinds of mixed rosins are formed residual not easy to crack, postwelding insulaion resistance height, and it is few to splash.
Following each embodiment all adopts following preparation method to carry out: weigh up organic amine hydrohalide and high-boiling point alcohol kind solvent in proportion, it is standby to be stirred to homogeneous transparent liquid with high speed dispersor at normal temperatures in the adding container; Rosin is weighed up in proportion again and put into another container, maintain the temperature at 150 ± 10 ℃ of heating and be stirred to fusing fully, add organic acid activator under 150 ± 10 ℃ of temperature, stirring is dissolved in the rosin organic acid; Add the standby organic amine hydrohalide and the mixture of high-boiling point alcohol kind solvent again, the continuation stirring was dissolved into transparent uniform liquid in 10～30 minutes and is got final product.
Following table is embodiment of the invention 1-4 and comparative example, and is specific as follows:
Following table is embodiment 1-4 and comparative example characteristic test:
Shown in seeing the above table, each component intermiscibility of scaling powder in the comparative example is bad, causes scaling powder outward appearance muddiness, and it is serious to splash, in contrast, according to prescription of the present invention and preparation method, after with the high-boiling point alcohol kind solvent organic amine hydrohalide being dissolved earlier with high speed dispersor at normal temperatures earlier in proportion, mix with rosin and organic acid heating again, the scaling powder transparency height that is made, substantially do not have during welding and splash, braze ability is good, the insulaion resistance height.
The above, it only is preferred embodiment of the present invention, be not that technical scope of the present invention is imposed any restrictions, so every foundation technical spirit of the present invention all still belongs in the scope of technical solution of the present invention any trickle modification, equivalent variations and modification that above embodiment did.
Claims (5)
1. exempt to clean low spatter lead-free soldering wire scaling powder for one kind, it is characterized in that: by mass percentage, comprising:
High-boiling point alcohol kind solvent 2-7%;
Organic amine hydrohalide 0.5-5%;
Organic acid 0.5-5%;
Rosin 80-97%.
2. a kind of low spatter lead-free soldering wire scaling powder of exempting to clean according to claim 1, it is characterized in that: described high-boiling point alcohol kind solvent be at least glycerine, diethylene glycol (DEG), tetrahydrofurfuryl alcohol, 2-ethyl (1-) hexanol, 2-ethyl (1, the 3-) mixture of one or more in the hexylene glycol.
3. a kind of low spatter lead-free soldering wire scaling powder of exempting to clean according to claim 1 is characterized in that: described organic amine hydrohalide is at least one or more mixtures in the diphenylguanidine hydrogen bromic acid salt ﹑ hexamethylene amine hydrogen bromic acid salt ﹑ two ethylamine hydrobromide ﹑ dimethylamine hydrochloric acid salt ﹑ diethylamine hydrogen salt hydrochlorates.
4. a kind of low spatter lead-free soldering wire scaling powder of exempting to clean according to claim 1, it is characterized in that: described organic acid is at least 6 carbon atoms above monobasic or binary organic acid, wherein is at least one or more mixtures in suberic acid, decanedioic acid, 12 diacid, dodecoic acid, tetradecylic acid, palmitic acid, the stearic acid.
5. as claimed in claim 1 exempting from cleaned the preparation method that the low spatter lead-free soldering wire is used scaling powder, it is characterized in that: earlier the organic amine hydrohalide is mixed with the high-boiling point alcohol kind solvent, be stirred to homogeneous transparent liquid with high speed dispersor at normal temperatures; Again rosin is added in the container and to heat with 150 ± 10 ℃ and be stirred to fusing, under 150 ± 10 ℃ of temperature, add organic acid, treat that organic acid is dissolved in the mixing material that adds aforementioned organic amine hydrohalide and alcohols solvent behind the rosin solution again, continue to stir and be dissolved into transparent uniform liquid after 10～30 minutes and get final product.
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| CN2010106108399A CN102069324B (en) | 2010-12-29 | 2010-12-29 | No-clean low-splashing soldering flux for lead-free solder wire and preparation method thereof |
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| CN2010106108399A CN102069324B (en) | 2010-12-29 | 2010-12-29 | No-clean low-splashing soldering flux for lead-free solder wire and preparation method thereof |
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| CN102069324A true CN102069324A (en) | 2011-05-25 |
| CN102069324B CN102069324B (en) | 2012-08-15 |
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Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102689113A (en) * | 2012-06-15 | 2012-09-26 | 东莞市剑鑫电子材料有限公司 | Cleaning-free and residue-free scaling powder and preparation method thereof |
| CN103394824A (en) * | 2013-08-02 | 2013-11-20 | 瑞玛泰（北京）科技有限公司 | Low-splash and halogen-free welding agent for tin wires and preparation method thereof |
| CN104364046A (en) * | 2012-06-11 | 2015-02-18 | 千住金属工业株式会社 | Flux composition, liquid flux, resin flux cored solder, and solder paste |
| CN105234591A (en) * | 2015-10-10 | 2016-01-13 | 广州有色金属研究院 | Halogen-free soldering tin wire activator and preparation method thereof |
| EP3098020A1 (en) * | 2015-05-29 | 2016-11-30 | ELSOLD GmbH & Co. KG | Flux cored solder wire, in particular for soldering of aluminium |
| CN108127292A (en) * | 2018-01-12 | 2018-06-08 | 广东省焊接技术研究所（广东省中乌研究院） | Effective unleaded tin silk medicine core scaling powder of temp sensing controller ripple and preparation method thereof |
| CN110783013A (en) * | 2019-11-06 | 2020-02-11 | 英利能源（中国）有限公司 | Solar cell electrode slurry, cell and preparation method of assembly of cell |
| CN110788522A (en) * | 2019-10-31 | 2020-02-14 | 苏州万山锡业有限公司 | Manufacturing method of low-splashing active solder wire |
| CN111482730A (en) * | 2020-04-24 | 2020-08-04 | 深圳市博士达焊锡制品有限公司 | Solder wire for automatic soldering robot and preparation method thereof |
| CN112621012A (en) * | 2020-12-09 | 2021-04-09 | 东莞市千岛金属锡品有限公司 | Brazing solder wire of antistatic low-splashing solid soldering flux and preparation method thereof |
| CN114012304A (en) * | 2021-12-01 | 2022-02-08 | 东莞市千岛金属锡品有限公司 | High-temperature-resistant high-lead low-tin alloy welding material and preparation method and application thereof |
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Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104364046A (en) * | 2012-06-11 | 2015-02-18 | 千住金属工业株式会社 | Flux composition, liquid flux, resin flux cored solder, and solder paste |
| CN102689113A (en) * | 2012-06-15 | 2012-09-26 | 东莞市剑鑫电子材料有限公司 | Cleaning-free and residue-free scaling powder and preparation method thereof |
| CN103394824A (en) * | 2013-08-02 | 2013-11-20 | 瑞玛泰（北京）科技有限公司 | Low-splash and halogen-free welding agent for tin wires and preparation method thereof |
| CN103394824B (en) * | 2013-08-02 | 2017-04-05 | 北京鹏瑞中联科技有限公司 | A kind of tin silk low spatter Halogen welding agent and preparation method thereof |
| EP3098020A1 (en) * | 2015-05-29 | 2016-11-30 | ELSOLD GmbH & Co. KG | Flux cored solder wire, in particular for soldering of aluminium |
| CN105234591A (en) * | 2015-10-10 | 2016-01-13 | 广州有色金属研究院 | Halogen-free soldering tin wire activator and preparation method thereof |
| CN108127292A (en) * | 2018-01-12 | 2018-06-08 | 广东省焊接技术研究所（广东省中乌研究院） | Effective unleaded tin silk medicine core scaling powder of temp sensing controller ripple and preparation method thereof |
| CN110788522A (en) * | 2019-10-31 | 2020-02-14 | 苏州万山锡业有限公司 | Manufacturing method of low-splashing active solder wire |
| CN110783013A (en) * | 2019-11-06 | 2020-02-11 | 英利能源（中国）有限公司 | Solar cell electrode slurry, cell and preparation method of assembly of cell |
| CN110783013B (en) * | 2019-11-06 | 2021-06-15 | 英利能源（中国）有限公司 | Solar cell electrode slurry, cell and preparation method of assembly of cell |
| CN111482730A (en) * | 2020-04-24 | 2020-08-04 | 深圳市博士达焊锡制品有限公司 | Solder wire for automatic soldering robot and preparation method thereof |
| CN112621012A (en) * | 2020-12-09 | 2021-04-09 | 东莞市千岛金属锡品有限公司 | Brazing solder wire of antistatic low-splashing solid soldering flux and preparation method thereof |
| CN114012304A (en) * | 2021-12-01 | 2022-02-08 | 东莞市千岛金属锡品有限公司 | High-temperature-resistant high-lead low-tin alloy welding material and preparation method and application thereof |
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