CN1792539A - Leadless brazing filler metal containing cerium - Google Patents
Leadless brazing filler metal containing cerium Download PDFInfo
- Publication number
- CN1792539A CN1792539A CNA2005100225631A CN200510022563A CN1792539A CN 1792539 A CN1792539 A CN 1792539A CN A2005100225631 A CNA2005100225631 A CN A2005100225631A CN 200510022563 A CN200510022563 A CN 200510022563A CN 1792539 A CN1792539 A CN 1792539A
- Authority
- CN
- China
- Prior art keywords
- lead
- cerium
- tin
- nickel
- wetability
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910052684 Cerium Inorganic materials 0.000 title claims description 63
- GWXLDORMOJMVQZ-UHFFFAOYSA-N cerium Chemical compound [Ce] GWXLDORMOJMVQZ-UHFFFAOYSA-N 0.000 title claims description 63
- 238000005219 brazing Methods 0.000 title claims description 61
- 229910052751 metal Inorganic materials 0.000 title description 6
- 239000002184 metal Substances 0.000 title description 6
- 239000000945 filler Substances 0.000 title 1
- 229910052802 copper Inorganic materials 0.000 claims abstract description 25
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 25
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 75
- 239000010949 copper Substances 0.000 claims description 47
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 28
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 26
- 229910000679 solder Inorganic materials 0.000 abstract description 12
- 238000005266 casting Methods 0.000 abstract description 3
- 238000003723 Smelting Methods 0.000 abstract 1
- 238000002156 mixing Methods 0.000 abstract 1
- 239000000203 mixture Substances 0.000 description 23
- 239000000758 substrate Substances 0.000 description 23
- 229910001369 Brass Inorganic materials 0.000 description 22
- 239000010951 brass Substances 0.000 description 22
- 229910000906 Bronze Inorganic materials 0.000 description 21
- 239000010974 bronze Substances 0.000 description 21
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 21
- 230000004907 flux Effects 0.000 description 21
- 239000000843 powder Substances 0.000 description 21
- 238000003892 spreading Methods 0.000 description 21
- 229910045601 alloy Inorganic materials 0.000 description 6
- 239000000956 alloy Substances 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- 229910017944 Ag—Cu Inorganic materials 0.000 description 3
- 241001062472 Stokellia anisodon Species 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 229910020816 Sn Pb Inorganic materials 0.000 description 2
- 229910020888 Sn-Cu Inorganic materials 0.000 description 2
- 229910020922 Sn-Pb Inorganic materials 0.000 description 2
- 229910019204 Sn—Cu Inorganic materials 0.000 description 2
- 229910008783 Sn—Pb Inorganic materials 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 229910018471 Cu6Sn5 Inorganic materials 0.000 description 1
- 229910020882 Sn-Cu-Ni Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229910000765 intermetallic Inorganic materials 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000005272 metallurgy Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 231100000614 poison Toxicity 0.000 description 1
- 230000007096 poisonous effect Effects 0.000 description 1
- 229910052761 rare earth metal Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- GOLXNESZZPUPJE-UHFFFAOYSA-N spiromesifen Chemical compound CC1=CC(C)=CC(C)=C1C(C(O1)=O)=C(OC(=O)CC(C)(C)C)C11CCCC1 GOLXNESZZPUPJE-UHFFFAOYSA-N 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
A Ce contained Pb-free solder in the form of wire contains Cu (0.08-3.0 mass%), Ni (0.01-1.6), Pb (0.005-0.2), Ce (0.001-0.1) and Sn (rest). It is prepared from electrolytic Cu, Ni, Sn ingot, Pb ingot and Ce through proportional mixing, smelting, casting, extruding and drawing.
Description
One, technical field
The present invention relates to a kind of lead-free brazing that contains cerium, belong to the brazing material of class of metal materials and field of metallurgy.
Two, background technology
According to the WEEE and the RoHS instruction of European Union's promulgation, clearly propose will or forbid in restriction on July 1st, 2006 in household electrical appliance, using plumbous and other several poisonous and harmful substances, force Research of Lead-free Solders to enter practical stage.The Sn-Ag-Cu alloy has excellent wetting capacity energy and mechanical property, is considered to the substitute of the most potential Sn-Pb solder.It is on the high side that but Sn-Ag-Cu is an alloy, therefore uses and limited to.The Sn-Cu-Ni solder is owing to have better comprehensive performance, and moderate cost has a good application prospect.This invention " lead-free brazing that contains cerium " is promptly finished under this technical background, and solders such as its combination property and Sn-Pb, Sn-Cu, Sn-Ag-Cu are close.
Three, summary of the invention
The task of this invention provides a kind of wetability, the lead-free brazing of the wave-soldering that can be used for electron trade, reflow welding and other welding method of spreadability and brazed seam good mechanical properties.
This invention has mainly solved following two key technical problems: the melting range of the lead-free brazing of 1) developing is at 225 ℃～260 ℃; By optimizing the chemical composition of " lead-free brazing that contains cerium ", obtained mother metal (and PCB substrate) wetability, good, the good lead-free brazing of brazed seam mechanical property (σ b, τ) of spreadability; 2) in containing the lead-free brazing of cerium, add an amount of lead (Pb) to reduce the fusing point of principal component alloy (Sn-Cu alloy), improve the wetability of lead-free brazing on red copper, brass and PCB substrate that contains cerium; Add an amount of nickel, suppress the formation of Cu6Sn5 intermetallic compound, add rare-earth element cerium (Ce) simultaneously, improve the plasticity and the comprehensive mechanical property of the lead-free brazing that contains cerium with the neoteric crystal grain that contains the lead-free brazing of cerium of refinement.
The technical scheme that addresses the above problem is 1), use commercially available cathode copper, metallic nickel, tin slab, lead pig, metallic cerium, proportioning on demand adopts that conventional manufacturing process is smelted, casting, can obtain bar.By extruding, drawing, promptly obtain needed solder wire material.2), according to producing needs, metallic nickel, cathode copper, metallic cerium can be smelted into alloy in advance, add then in tin-copper-metal smelt, casting, can obtain bar.By extruding, drawing, promptly obtain needed solder wire material.
" lead-free brazing that contains cerium " that this is bright, chemical composition (mass percent) is: 0.08%～3.0% copper (Cu), 0.01%～1.6% nickel (Ni), 0.005%～0.2% lead (Pb), 0.001%～0.10% cerium (Pb), all the other are tin (Sn).Use commercially available cathode copper, metallic nickel, tin slab, lead pig, metallic cerium, proportioning adopts conventional manufacturing process to smelt, cast on demand, can obtain bar.By extruding, drawing, promptly obtain needed solder wire material.According to producing needs, metallic nickel, cathode copper, metallic cerium can be smelted into alloy in advance, add then in tin-copper-metal and smelt, cast, can obtain bar.By extruding, drawing, promptly obtain needed solder wire material.
Technical characterstic of the present invention is also to contain the lead element of trace in " lead-free brazing that contains cerium ".Though lead is harmful element, its adding can significantly improve wetability, the spreadability of tin-based solder to mother metal, and very little to other performance impact of solder.Therefore, contained harmful element lead can be adjusted according to the relevant regulations of countries such as the WEEE of European Union's promulgation and RoHS instruction and Japan, China, the U.S. in the neoteric lead-free brazing that contains cerium, to meet the requirement of various criterion and regulation.Simultaneously, still in solder, keep the lead of an amount of (trace), to improve wetability, the spreadability of lead-free brazing to mother metal.
Four, explanation accompanying drawing-nothing
Five, the specific embodiment is narrated the specific embodiment of the present invention according to the quality recipe ratio of " lead-free brazing that contains cerium " of the present invention.
The specific embodiment one:
Press the mass percent proportioning, its composition is: 0.08% bronze medal (Cu), and 1.6% nickel (Ni), 0.2% lead (Pb), 0.10% cerium (Ce), all the other are tin (Sn).
" lead-free brazing that contains cerium " solidus temperature that the mentioned component proportioning obtains about 230 ℃, liquidus temperature (considered experimental error) about 245 ℃, cooperate commercially available brazing flux (scaling powder), wetability, spreading property on red copper, brass and PCB substrate are good.
The specific embodiment two:
Press the mass percent proportioning, its composition is: 3.0% bronze medal (Cu), and 0.01% nickel (Ni), 0.2% lead (Pb), 0.10% cerium (Ce), all the other are tin (Sn).
" lead-free brazing that contains cerium " solidus temperature that the mentioned component proportioning obtains about 225 ℃, liquidus temperature (considered experimental error) about 240 ℃, cooperate commercially available brazing flux (scaling powder), wetability, spreading property on red copper, brass and PCB substrate are good.
The specific embodiment three:
Press the mass percent proportioning, its composition is: 0.7% bronze medal (Cu), and 0.01% nickel (Ni), 0.005% lead (Pb), 0.001% cerium (Ce), all the other are tin (Sn).
" lead-free brazing that contains cerium " solidus temperature that the mentioned component proportioning obtains about 227 ℃, liquidus temperature (considered experimental error) about 240 ℃, cooperate commercially available brazing flux (scaling powder), wetability, spreading property on red copper, brass and PCB substrate are good.
The specific embodiment four:
Press the mass percent proportioning, its composition is: 0.7% bronze medal (Cu), and 0.1% nickel (Ni), 0.02% lead (Pb), 0.03% cerium (Ce), all the other are tin (Sn).
" lead-free brazing that contains cerium " solidus temperature that the mentioned component proportioning obtains about 227 ℃, liquidus temperature (considered experimental error) about 240 ℃, cooperate commercially available brazing flux (scaling powder), wetability, spreading property on red copper, brass and PCB substrate are good.
The specific embodiment five:
Press the mass percent proportioning, its composition is: 0.2% bronze medal (Cu), and 0.5% nickel (Ni), 0.05% lead (Pb), 0.03% cerium (Ce), all the other are tin (Sn).
" lead-free brazing that contains cerium " solidus temperature that the mentioned component proportioning obtains about 230 ℃, liquidus temperature (considered experimental error) about 245 ℃, cooperate commercially available brazing flux (scaling powder), wetability, spreading property on red copper, brass and PCB substrate are good.
The specific embodiment six:
Press the mass percent proportioning, its composition is: 1.0% bronze medal (Cu), and 1.0% nickel (Ni), 0.1% lead (Pb), 0.05% cerium (Ce), all the other are tin (Sn).
" lead-free brazing that contains cerium " solidus temperature that the mentioned component proportioning obtains about 230 ℃, liquidus temperature (considered experimental error) about 245 ℃, cooperate commercially available brazing flux (scaling powder), wetability, spreading property on red copper, brass and PCB substrate are good.
The specific embodiment seven:
Press the mass percent proportioning, its composition is: 0.12% bronze medal (Cu), and 0.01% nickel (Ni), 0.02% lead (Pb), 0.10% cerium (Ce), all the other are tin (Sn).
" lead-free brazing that contains cerium " solidus temperature that the mentioned component proportioning obtains about 227 ℃, liquidus temperature (considered experimental error) about 235 ℃, cooperate commercially available brazing flux (scaling powder), wetability, spreading property on red copper, brass and PCB substrate are good.
The specific embodiment eight:
Press the mass percent proportioning, its composition is: 2.5% bronze medal (Cu), and 1.0% nickel (Ni), 0.02% lead (Pb), 0.03% cerium (Ce), all the other are tin (Sn).
" lead-free brazing that contains cerium " solidus temperature that the mentioned component proportioning obtains about 235 ℃, liquidus temperature (considered experimental error) about 250 ℃, cooperate commercially available brazing flux (scaling powder), wetability, spreading property on red copper, brass and PCB substrate are good.
The specific embodiment nine:
Press the mass percent proportioning, its composition is: 2.0% bronze medal (Cu), and 1.6% nickel (Ni), 0.02% lead (Pb), 0.03% cerium (Ce), all the other are tin (Sn).
" lead-free brazing that contains cerium " solidus temperature that the mentioned component proportioning obtains about 235 ℃, liquidus temperature (considered experimental error) about 260 ℃, cooperate commercially available brazing flux (scaling powder), wetability, spreading property on red copper, brass and PCB substrate are good.
The specific embodiment ten:
Press the mass percent proportioning, its composition is: 3.0% bronze medal (Cu), and 1.6% nickel (Ni), 0.02% lead (Pb), 0.01% cerium (Ce), all the other are tin (Sn).
" lead-free brazing that contains cerium " solidus temperature that the mentioned component proportioning obtains about 240 ℃, liquidus temperature (considered experimental error) about 260 ℃, cooperate commercially available brazing flux (scaling powder), wetability, spreading property on red copper, brass and PCB substrate are good.
The specific embodiment 11:
Press the mass percent proportioning, its composition is: 3.0% bronze medal (Cu), and 1.6% nickel (Ni), 0.2% lead (Pb), 0.001% cerium (Ce), all the other are tin (Sn).
" lead-free brazing that contains cerium " solidus temperature that the mentioned component proportioning obtains about 235 ℃, liquidus temperature (considered experimental error) about 255 ℃, cooperate commercially available brazing flux (scaling powder), wetability, spreading property on red copper, brass and PCB substrate are good.
The specific embodiment 12:
Press the mass percent proportioning, its composition is: 3.0% bronze medal (Cu), and 1.6% nickel (Ni), 0.1% lead (Pb), 0.01% cerium (Ce), all the other are tin (Sn).
" lead-free brazing that contains cerium " solidus temperature that the mentioned component proportioning obtains about 240 ℃, liquidus temperature (considered experimental error) about 260 ℃, cooperate commercially available brazing flux (scaling powder), wetability, spreading property on red copper, brass and PCB substrate are good.
The specific embodiment 13:
Press the mass percent proportioning, its composition is: 0.9% bronze medal (Cu), and 0.03% nickel (Ni), 0.02% lead (Pb), 0.02% cerium (Ce), all the other are tin (Sn).
" lead-free brazing that contains cerium " solidus temperature that the mentioned component proportioning obtains about 235 ℃, liquidus temperature (considered experimental error) about 245 ℃, cooperate commercially available brazing flux (scaling powder), wetability, spreading property on red copper, brass and PCB substrate are good.
The specific embodiment 14:
Press the mass percent proportioning, its composition is: 0.4% bronze medal (Cu), and 0.02% nickel (Ni), 0.05% lead (Pb), 0.05% cerium (Ce), all the other are tin (Sn).
" lead-free brazing that contains cerium " solidus temperature that the mentioned component proportioning obtains about 230 ℃, liquidus temperature (considered experimental error) about 245 ℃, cooperate commercially available brazing flux (scaling powder), wetability, spreading property on red copper, brass and PCB substrate are good.
The specific embodiment 15:
Press the mass percent proportioning, its composition is: 0.8% bronze medal (Cu), and 0.02% nickel (Ni), 0.03% lead (Pb), 0.02% cerium (Ce), all the other are tin (Sn).
" lead-free brazing that contains cerium " solidus temperature that the mentioned component proportioning obtains about 235 ℃, liquidus temperature (considered experimental error) about 245 ℃, cooperate commercially available brazing flux (scaling powder), wetability, spreading property on red copper, brass and PCB substrate are good.
The specific embodiment 16:
Press the mass percent proportioning, its composition is: 1.4% bronze medal (Cu), and 0.02% nickel (Ni), 0.10% lead (Pb), 0.08% cerium (Ce), all the other are tin (Sn).
" lead-free brazing that contains cerium " solidus temperature that the mentioned component proportioning obtains about 230 ℃, liquidus temperature (considered experimental error) about 245 ℃, cooperate commercially available brazing flux (scaling powder), wetability, spreading property on red copper, brass and PCB substrate are good.
The specific embodiment 17:
Press the mass percent proportioning, its composition is: 1.8% bronze medal (Cu), and 0.6% nickel (Ni), 0.12% lead (Pb), 0.08% cerium (Ce), all the other are tin (Sn).
" lead-free brazing that contains cerium " solidus temperature that the mentioned component proportioning obtains about 240C, liquidus temperature (considered experimental error) about 255C, cooperate commercially available brazing flux (scaling powder), wetability, spreading property on red copper, brass and PCB substrate are good.
The specific embodiment 18:
Press the mass percent proportioning, its composition is: 1.8% bronze medal (Cu), and 0.6% nickel (Ni), 0.10% lead (Pb), 0.08% cerium (Ce), all the other are tin (Sn).
" lead-free brazing that contains cerium " solidus temperature that the mentioned component proportioning obtains about 240 ℃, liquidus temperature (considered experimental error) about 255 ℃, cooperate commercially available brazing flux (scaling powder), wetability, spreading property on red copper, brass and PCB substrate are good.
The specific embodiment 19:
Press the mass percent proportioning, its composition is: 0.6% bronze medal (Cu), and 0.1% nickel (Ni), 0.02% lead (Pb), 0.03% cerium (Ce), all the other are tin (Sn).
" lead-free brazing that contains cerium " solidus temperature that the mentioned component proportioning obtains about 230 ℃, liquidus temperature (considered experimental error) about 235 ℃, cooperate commercially available brazing flux (scaling powder), wetability, spreading property on red copper, brass and PCB substrate are good.
The specific embodiment 20:
Press the mass percent proportioning, its composition is: 0.5% bronze medal (Cu), and 0.2% nickel (Ni), 0.02% lead (Pb), 0.03% cerium (Ce), all the other are tin (Sn).
" lead-free brazing that contains cerium " solidus temperature that the mentioned component proportioning obtains about 230 ℃, liquidus temperature (considered experimental error) about 235C, cooperate commercially available brazing flux (scaling powder), wetability, spreading property on red copper, brass and PCB substrate are good.
The specific embodiment 21:
Press the mass percent proportioning, its composition is: 0.7% bronze medal (Cu), and 0.1% nickel (Ni), 0.02% lead (Pb), 0.03% cerium (Ce), all the other are tin (Sn).
" lead-free brazing that contains cerium " solidus temperature that the mentioned component proportioning obtains about 230 ℃, liquidus temperature (considered experimental error) about 235 ℃, cooperate commercially available brazing flux (scaling powder), wetability, spreading property on red copper, brass and PCB substrate are good.
Claims (1)
1. a lead-free brazing that contains cerium is characterized in that, by the mass percent proportioning is: 0.08%～3.0% copper (Cu), 0.01%～1.6% nickel (Ni), 0.005%～0.2% lead (Pb), 0.001%～0.10% cerium (Ce), all the other are tin (Sn).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100225631A CN100366376C (en) | 2005-12-23 | 2005-12-23 | Leadless brazing filler metal containing cerium |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100225631A CN100366376C (en) | 2005-12-23 | 2005-12-23 | Leadless brazing filler metal containing cerium |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1792539A true CN1792539A (en) | 2006-06-28 |
| CN100366376C CN100366376C (en) | 2008-02-06 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2005100225631A Active CN100366376C (en) | 2005-12-23 | 2005-12-23 | Leadless brazing filler metal containing cerium |
Country Status (1)
| Country | Link |
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| CN (1) | CN100366376C (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101862921A (en) * | 2010-06-25 | 2010-10-20 | 南京航空航天大学 | Sn-Cu-Ni lead-free solder containing Pr, Sr and Ga |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101564803B (en) * | 2008-07-15 | 2011-11-23 | 广州冶炼厂 | Leadless solder of silverless Sn-Bi-Cu system and preparation method thereof |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB671079A (en) * | 1949-11-16 | 1952-04-30 | Richard Chadwick | Improvements in or relating to solders |
| JPS57160594A (en) * | 1981-03-30 | 1982-10-02 | Nippon Genma:Kk | Soldering alloy for preventing silver-disolving |
| CN85108518A (en) * | 1985-10-19 | 1987-04-22 | 郴州电光源焊料厂 | Rare earth-tin-lead solder and preparation method |
| JP2003211283A (en) * | 2002-01-22 | 2003-07-29 | Japan Science & Technology Corp | Lead-free solder material |
| NL1022976C1 (en) * | 2003-03-20 | 2004-09-21 | Mat Tech B V | Solder alloy, comprises zinc or bismuth, zinc, titanium, gallium, nickel, manganese, chromium, cerium and tin |
| CN1235718C (en) * | 2003-07-25 | 2006-01-11 | 南昌大学 | Tin-zinc base plumbum-free solder alloy and its preparing technology |
| CN1265934C (en) * | 2003-12-26 | 2006-07-26 | 杨嘉骥 | Anti-oxidation lead-free solder and its preparing method |
-
2005
- 2005-12-23 CN CNB2005100225631A patent/CN100366376C/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101862921A (en) * | 2010-06-25 | 2010-10-20 | 南京航空航天大学 | Sn-Cu-Ni lead-free solder containing Pr, Sr and Ga |
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| Publication number | Publication date |
|---|---|
| CN100366376C (en) | 2008-02-06 |
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Application publication date: 20060628 Assignee: Huayin Welding Material Co., Ltd., Changshu City Assignor: Nanjing University of Aeronautics and Astronautics Contract record no.: 2010320000278 Denomination of invention: Sn-Cu-Ni solder containing cerium Granted publication date: 20080206 License type: Exclusive License Record date: 20100323 |