CN102974954B - Tin-copper-nickel (Sn-Cu-Ni) lead-free solder containing ferrum (Fe) and praseodymium (Pr) - Google Patents
Tin-copper-nickel (Sn-Cu-Ni) lead-free solder containing ferrum (Fe) and praseodymium (Pr) Download PDFInfo
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- CN102974954B CN102974954B CN201210544430.0A CN201210544430A CN102974954B CN 102974954 B CN102974954 B CN 102974954B CN 201210544430 A CN201210544430 A CN 201210544430A CN 102974954 B CN102974954 B CN 102974954B
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- 229910020882 Sn-Cu-Ni Inorganic materials 0.000 title claims abstract description 47
- 229910052777 Praseodymium Inorganic materials 0.000 title claims abstract description 41
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 title abstract description 67
- 229910000679 solder Inorganic materials 0.000 title abstract description 39
- PUDIUYLPXJFUGB-UHFFFAOYSA-N praseodymium atom Chemical compound [Pr] PUDIUYLPXJFUGB-UHFFFAOYSA-N 0.000 title abstract description 6
- VRUVRQYVUDCDMT-UHFFFAOYSA-N [Sn].[Ni].[Cu] Chemical compound [Sn].[Ni].[Cu] VRUVRQYVUDCDMT-UHFFFAOYSA-N 0.000 title abstract 2
- 238000005219 brazing Methods 0.000 claims abstract description 62
- 229910052742 iron Inorganic materials 0.000 claims abstract description 43
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 10
- 239000000203 mixture Substances 0.000 claims description 8
- 229910052751 metal Inorganic materials 0.000 abstract description 27
- 239000002184 metal Substances 0.000 abstract description 27
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 abstract description 19
- 229910052802 copper Inorganic materials 0.000 abstract description 6
- 238000000034 method Methods 0.000 abstract description 5
- 238000005476 soldering Methods 0.000 abstract description 5
- 239000000463 material Substances 0.000 abstract description 4
- 238000003466 welding Methods 0.000 abstract description 4
- 239000000126 substance Substances 0.000 abstract description 3
- 239000007769 metal material Substances 0.000 abstract description 2
- 238000005272 metallurgy Methods 0.000 abstract description 2
- 150000001875 compounds Chemical class 0.000 description 20
- 229910000765 intermetallic Inorganic materials 0.000 description 12
- 239000010949 copper Substances 0.000 description 11
- 238000011160 research Methods 0.000 description 10
- 229910052761 rare earth metal Inorganic materials 0.000 description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
- 230000032683 aging Effects 0.000 description 7
- 238000012360 testing method Methods 0.000 description 7
- 230000000694 effects Effects 0.000 description 6
- 229910020888 Sn-Cu Inorganic materials 0.000 description 5
- 229910019204 Sn—Cu Inorganic materials 0.000 description 5
- 230000004907 flux Effects 0.000 description 5
- 229910045601 alloy Inorganic materials 0.000 description 4
- 239000000956 alloy Substances 0.000 description 4
- 238000002474 experimental method Methods 0.000 description 4
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 description 4
- 230000002401 inhibitory effect Effects 0.000 description 3
- 230000000977 initiatory effect Effects 0.000 description 3
- 238000012876 topography Methods 0.000 description 3
- 238000003723 Smelting Methods 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 150000002910 rare earth metals Chemical class 0.000 description 2
- 230000008719 thickening Effects 0.000 description 2
- 238000012795 verification Methods 0.000 description 2
- 229910017944 Ag—Cu Inorganic materials 0.000 description 1
- 229910052684 Cerium Inorganic materials 0.000 description 1
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 1
- 229910052779 Neodymium Inorganic materials 0.000 description 1
- 229910020816 Sn Pb Inorganic materials 0.000 description 1
- 229910020922 Sn-Pb Inorganic materials 0.000 description 1
- 229910020994 Sn-Zn Inorganic materials 0.000 description 1
- 229910008783 Sn—Pb Inorganic materials 0.000 description 1
- 229910009069 Sn—Zn Inorganic materials 0.000 description 1
- CJXCSUVPCHPYPL-UHFFFAOYSA-N [Pb].[Cu].[Cu].[Sn] Chemical compound [Pb].[Cu].[Cu].[Sn] CJXCSUVPCHPYPL-UHFFFAOYSA-N 0.000 description 1
- 229910000905 alloy phase Inorganic materials 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- ZMIGMASIKSOYAM-UHFFFAOYSA-N cerium Chemical compound [Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce] ZMIGMASIKSOYAM-UHFFFAOYSA-N 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 229910001325 element alloy Inorganic materials 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000000383 hazardous chemical Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 150000002736 metal compounds Chemical class 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 238000012216 screening Methods 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
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Abstract
The invention provides tin-copper-nickel (Sn-Cu-Ni) lead-free solder containing ferrum (Fe) and praseodymium (Pr), and the solder belongs to a braze welding material in the fields of metal materials and metallurgy. Chemical components (in mass percentage) are as follows: 0.3 percent to 1.5 percent of Cu, 0.05 percent to 2.5 percent of Ni, 0.002 percent to 0.1 percent of Fe, and 0.01 percent to 0.2 percent of Pr, and the rest is Sn. The solder has good moistening performance, can effectively suppress the growth of the thickness of chemicals among brazing seam interface metal, so that the 'reliability' of a braze welding connector is greatly improved, and the solder can be used for wave soldering, reflow soldering and other soldering methods in the electronic industry.
Description
Technical field
The present invention relates to a kind of Sn-Cu-Ni lead-free brazing containing Fe and Pr, belong to the brazing material of class of metal materials and field of metallurgy.Being mainly used in assembling and the encapsulation of electron trade components and parts, is that a kind of brazing property (as wettability) is good, the novel green of solder joint (brazed seam) good mechanical performance, environment-friendly type lead-free solder.
Background technology
Along with RoHS(The Restriction of the Use of certain Hazardous Substance in Electrical and Electronic Equipment) the coming into force of instruction, research and development lead-free brazing is the focus of electron trade technical staff research with the problem of alternative tin-lead solder always.Lead-free brazing representative at present has the alloy systems such as Sn-Ag-Cu, Sn-Zn, Sn-Cu, Sn-Cu-Ni, has his own strong points, but compares with tin-lead solder, still has a certain distance in solder cost, solder fusing point etc.Sn-Cu-Ni brazing filler metal is owing to having good combination property, moderate, has a good application prospect, and wave-soldering has started application.But in use find, along with the prolongation of time, between the brazed seam interface metal of Sn-Cu-Ni solder, the thickness of compound has the trend progressively increasing, thicken, and thus may reduce " reliability " of soldered fitting.Therefore, this problem that Sn-Cu-Ni solder exists, still needs Improvement.
The basis of the external Sn-Cu-Ni solder of recent year have developed " lead-free brazing containing cerium " (Chinese invention patent, CN1792539), " a kind of anti-molten copper tin copper lead free brazing material alloy " (Chinese invention patent, CN102554490A), " a kind of SAC cobalt lead-free brazing " (Chinese invention patent, CN102091882A) and " containing V, the Sn-Cu-Ni lead-free brazing of Nd and Ge " (Chinese invention patent, the Sn-Cu of multiple " multi-element alloy system " such as CN101885119A), Sn-Cu-Ni solder, the Sn-Cu of they and binary or ternary, Sn-Cu-Ni alloy phase makes moderate progress than in some performance, but the grown in thickness of compound between brazed seam interface metal, the research aspect thickened not yet relates to, therefore, for Sn-Cu, " reliability " problem of Sn-Cu-Ni solder brazing joint, still need further research, improve.This invention " the Sn-Cu-Ni lead-free brazing containing Fe and Pr ", namely completes under this technical background.
Summary of the invention
The object of this invention is to provide and a kind of there is good wettability, effectively can suppress the growth of compound thickness between brazed seam interface metal, thus improve " reliability " of soldered fitting widely and be applicable to the Sn-Cu-Ni series leadless solder of the welding methods such as electron trade wave-soldering and reflow welding.
To achieve the object of the present invention, the Sn-Cu-Ni lead-free brazing containing Fe and Pr of the present invention, the chemical composition determined after optimizing by mass percent proportioning is: the Cu of 0.3 ~ 1.5%, the Ni of 0.05 ~ 2.5%, the Fe of 0.002 ~ 0.1%, the Pr of 0.01 ~ 0.2%, surplus is Sn; Wherein the addition mass ratio of Ni and Fe meets Ni ︰ Fe=24 ~ 26 ︰ 1.
Conventional method is adopted to prepare solder; namely commercially available tin slab, metal praseodymium, cathode copper, iron-nickel alloy is used; various raw metal proportioning on demand, adds commercially available " coverture " determined through optimal screening or adopts " inert gas " protection to carry out smelting, casting, can obtain bar during smelting.By extruding, drawing, namely obtain a material (also scaling powder can be added, make " flux-cored wire ").Pb element is as " impurity element " in the raw material such as tin slab, cathode copper, overall control, within the scope of the wt.% of Pb≤0.1, meets the regulation (specifying Pb≤0.1wt.% in standard) of National Standard of the People's Republic of China GB/T 20422-2006 " lead-free brazing " to meet.
Consider that metal praseodymium fusing point is high and be very easily oxidized, also metal praseodymium can be smelted into intermediate alloy in advance according to need of production, add with the form of Sn-Pr, to ensure the accuracy of metal praseodymium composition in solder.
Solder even tissue of the present invention, is easy to be processed into various shape, as strip, bar-shaped, thread, soldered ball, to adapt to the needs of different working condition.
Accompanying drawing explanation
Fig. 1 does not add the Sn-Cu-Ni brazed seam interface topography of Fe and Pr;
Fig. 2 adds the Sn-Cu-Ni brazed seam interface topography of Pr;
Fig. 3 adds the Sn-Cu-Ni brazed seam interface topography of Fe;
The Sn-Pr intermetallic compound formed when the addition of Fig. 4 Pr is 0.25%;
The relation curve (in figure, ordinate " IMC " is the english abbreviation of general " intermetallic compound " in the industry, lower same) of Fig. 5 Sn-0.3 Cu-2.5Ni and Sn-0.3 Cu-2.5Ni-0.1 Fe-0.2Pr timeliness 1200 hours rear interface intermetallic compound gross thickness and aging time;
The relation curve of Fig. 6 Sn-1.5 Cu-0.05Ni and Sn-1.5 Cu-0.05Ni-0.002 Fe-0.01Pr timeliness 1200 hours rear interface intermetallic compound gross thickness and aging time;
The relation curve of Fig. 7 Sn-0.8 Cu-0.5Ni and Sn-0.8Cu-0.5Ni-0.02 Fe-0.02Pr timeliness 1200 hours rear interface intermetallic compound gross thickness and aging time;
The relation curve of Fig. 8 Sn-1.0 Cu-0.2Ni and Sn-1.0Cu-0.2Ni-0.008 Fe-0.05Pr timeliness 1200 hours rear interface intermetallic compound gross thickness and aging time;
The relation curve of Fig. 9 Sn-1.1Cu-0.25Ni and Sn-1.1Cu-0.25Ni-0.01 Fe-0.12Pr timeliness 1200 hours rear interface intermetallic compound gross thickness and aging time.
Specific embodiments
Compared with studying, creativeness of the present invention was in the past:
1) found effectively to suppress the Fe element that between brazed seam interface metal, compound thickness increases.
In process of the test of the present invention, research finds, Fe joins in Sn-Cu-Ni lead-free brazing, effectively can suppress the growth rate of compound thickness between Sn-Cu-Ni lead-free brazing brazed seam interface metal.Further research finds, if add Fe and Pr element simultaneously, the inhibitory action of Fe to " growth rate of brazed seam interface metal compound thickness " of Sn-Cu-Ni lead-free brazing is more remarkable.
Research in the past is unanimously thought, adding of Fe element, will the wettability of " deterioration " Sn-Pb solder and lead-free brazing significantly.Therefore, be no matter GB/T 3131-2001 " tin-lead solder " or GB/T 20422-2006 " lead-free brazing ", all using Fe element as " impurity element ", require to control its content within 0.02%.
In the present invention, research finds, when Fe joins in Sn-Cu-Ni lead-free brazing, although the wettability of solder can be worsened, and, " counteracting " its negative effect can be carried out by adding rare earth element Pr simultaneously.Even if when the addition of Fe reaches 0.1% (having exceeded GB/T 3131-2001 " tin-lead solder ", GB/T 20422-2006 " lead-free brazing " standard gauge definite value 5 times), still there is good wettability containing the Sn-Cu-Ni lead-free brazing of Fe and Pr.But adding the Fe of 0.002 ~ 0.1%, to the inhibitory action that compound thickness between brazed seam interface metal increases, is but very significant (see accompanying drawing 5 ~ Fig. 9).As can be seen from figure Fig. 5 ~ Fig. 9, with the addition of the Sn-Cu-Ni lead-free brazing of Fe and Pr element, between brazed seam interface metal, the prolongation of compound gross thickness and aging time is (in test, generally acknowledge in the industry and carry out analog component service time with aging time) although be all the relation of " grow up, thickening ", but compound gross thickness is all less than the gross thickness of the Sn-Cu-Ni lead-free brazing not adding Fe and Pr element between the Sn-Cu-Ni lead-free brazing brazed seam interface metal that with the addition of Fe and Pr element.Illustrate and add Fe and Pr element, really have and suppress the effect that between brazed seam interface metal, compound thickness increases, thus the risk causing crack initiation because of growing up of intermetallic compound, grow up, finally make solder joint (brazed seam) ftracture can be reduced, improve the reliability of solder joint (brazed seam).
Because existing research is unanimously generally acknowledged, along with the prolongation of solder joint working time (as: components and parts service time), between brazed seam interface metal, compound thickness constantly can increase (thickening), intermetallic compound can constantly be grown up, thus Joint Strength can be made to decline gradually, finally cause solder joint to destroy or lost efficacy.Therefore, Chinese scholars is found by large quantity research, Ni or Co element is added in Sn-Cu lead-free brazing, have and suppress the effect that between brazed seam interface metal, compound thickness increases, thus the risk causing crack initiation because of growing up of intermetallic compound, grow up, finally make solder joint (brazed seam) ftracture can be reduced, improve the reliability of solder joint (brazed seam).
Present inventor studies discovery, and Fe and Ni or Co element belong to the VIIIth race's element in " periodic table of elements " together, chemically analyze in theory, and Fe should tool and the same or analogous effect of Ni or Co element.Therefore, found by lot of experiments, the addition (mass percent) of Fe, 0.002 ~ 0.1% time, really has and suppresses the effect that between brazed seam interface metal, compound thickness increases.
2) verification experimental verification the interpolation scope of preferred Ni and Fe and proportionate relationship
Find that Fe joins to suppressing the affecting laws that between brazed seam interface metal, compound thickness increases in Sn-Cu-Ni lead-free brazing by " Sequential designed experiment " method, and tentatively determined interpolation scope and the proportionate relationship of Ni and Fe.Namely in the addition (mass percent) of Fe in the scope of 0.002 ~ 0.1%, when the addition mass ratio of Ni and Fe meets Ni ︰ Fe=25 ︰ 1, neoteric lead-free brazing has good solder joint (or brazed seam) " reliability ".Effectively can suppress the growth of compound thickness between brazed seam interface metal, thus the risk causing crack initiation because of growing up of intermetallic compound, grow up, finally make solder joint (brazed seam) ftracture can be reduced, improve the reliability of solder joint (brazed seam).
Size due to weld thickness is little, and (intermetallic compound thickness is at micron order, general between several micron to tens microns), measure error is large, therefore, existing research means can't assess exactly Ni ︰ Fe actual ratio (such as, during Ni ︰ Fe=24 ︰ 1 or Ni ︰ Fe=26 ︰ 1, whether Fe will significantly die down to the inhibitory action that in Sn-Cu-Ni lead-free brazing, between brazed seam interface metal, compound thickness increases), therefore, " optimization " proportion that the present invention provides proposes according to the experiment interpolation scope of " Sequential designed experiment " method.
3) the interpolation scope of rare earth element Pr is optimized
Compared with the lead-free brazing of existing interpolation rare earth element, in the alloy system that the present invention relates to, " favourable " interpolation scope of rare earth element Pr is very narrow, only in 0.01 ~ 0.2% scope.Other many lead-free brazing containing rare earth element unlike, can 0.001% be low to moderate, up to 1%.Primary Study shows, adding of iron, due effect is not had when making rare earth element Pr be less than 0.01%, and after the addition of Pr is greater than 0.2%, the appearance of " rare-earth phase ", under the existence condition of Fe, can have a negative impact (see accompanying drawing 4 to neoteric solder wetting performance, after the addition of Pr reaches 0.25%, " rare-earth phase " that occur in Sn-0.3Cu-2.5Ni-0.1 Fe-0.25Pr lead-free brazing).
According to the quality proportioning of " the Sn-Cu-Ni lead-free brazing containing Fe and Pr " of the present invention, describe the specific embodiment of the present invention as follows.
embodiment one
Containing a Sn-Cu-Ni lead-free brazing of Fe and Pr, by mass percent proportioning, its composition is: the Cu of 0.3%, the Ni of 2.5%, the Fe of 0.1%, the Pr of 0.2%, and surplus is Sn.
" the Sn-Cu-Ni lead-free brazing containing Fe and Pr " solidus temperature that mentioned component proportioning obtains is at about 228 DEG C, and liquidus temperature is about 246 DEG C (all considering test error).Coordinate commercially available RMA brazing flux on copper plate, have excellent wettability, brazed seam tensile strength reaches 40MPa ± 10MPa.
Fig. 5 shows, and timeliness is after 1200 hours, and the Sn-Cu-Ni lead-free brazing that with the addition of Fe and Pr is less by about 30% than compound gross thickness between the lead-free brazing brazed seam interface metal of not adding Fe and Pr, illustrates that the reliability of solder joint (brazed seam) is significantly improved.
embodiment two
Containing a Sn-Cu-Ni lead-free brazing of Fe and Pr, by mass percent proportioning, its composition is: the Cu of 1.5%, the Ni of 0.05%, the Fe of 0.002%, the Pr of 0.01%, and surplus is Sn.
" the Sn-Cu-Ni lead-free brazing containing Fe and Pr " solidus temperature that mentioned component proportioning obtains is at about 228 DEG C, and liquidus temperature is about 240 DEG C (all considering test error).Coordinate commercially available RMA brazing flux on copper plate, have excellent wettability, brazed seam tensile strength reaches 40MPa ± 10MPa.
Fig. 6 shows, and timeliness is after 1200 hours, and the Sn-Cu-Ni lead-free brazing that with the addition of Fe and Pr is less by about 30% than compound gross thickness between the lead-free brazing brazed seam interface metal of not adding Fe and Pr, illustrates that the reliability of solder joint (brazed seam) is significantly improved.
embodiment three
Containing a Sn-Cu-Ni lead-free brazing of Fe and Pr, by mass percent proportioning, its composition is: the Cu of 0.8%, the Ni of 0.5%, the Fe of 0.02%, the Pr of 0.02%, and surplus is Sn.
" the Sn-Cu-Ni lead-free brazing containing Fe and Pr " solidus temperature that mentioned component proportioning obtains is at about 228 DEG C, and liquidus temperature is about 240 DEG C (all considering test error).Coordinate commercially available RMA brazing flux on copper plate, have excellent wettability, brazed seam tensile strength reaches 40MPa ± 10MPa.
Fig. 7 shows, and timeliness is after 1200 hours, and the Sn-Cu-Ni lead-free brazing that with the addition of Fe and Pr is less by about 30% than compound gross thickness between the lead-free brazing brazed seam interface metal of not adding Fe and Pr, illustrates that the reliability of solder joint (brazed seam) is significantly improved.
embodiment four
Containing a Sn-Cu-Ni lead-free brazing of Fe and Pr, by mass percent proportioning, its composition is: the Cu of 1.0%, the Ni of 0.2%, the Fe of 0.008%, the Pr of 0.05%, and surplus is Sn.
" the Sn-Cu-Ni lead-free brazing containing Fe and Pr " solidus temperature that mentioned component proportioning obtains is at about 226 DEG C, and liquidus temperature is about 245 DEG C (all considering test error).Coordinate commercially available RMA brazing flux on copper plate, have excellent wettability, brazed seam tensile strength reaches 40MPa ± 10MPa.
Fig. 8 shows, and timeliness is after 1200 hours, and the Sn-Cu-Ni lead-free brazing that with the addition of Fe and Pr is less by about 30% than compound gross thickness between the lead-free brazing brazed seam interface metal of not adding Fe and Pr, illustrates that the reliability of solder joint (brazed seam) is significantly improved.
embodiment five
Containing a Sn-Cu-Ni lead-free brazing of Fe and Pr, by mass percent proportioning, its composition is: the Cu of 1.1%, the Ni of 0.25%, the Fe of 0.01%, the Pr of 0.12%, and surplus is Sn.
" the Sn-Cu-Ni lead-free brazing containing Fe and Pr " solidus temperature that mentioned component proportioning obtains is at about 230 DEG C, and liquidus temperature is about 248 DEG C (all considering test error).Coordinate commercially available RMA brazing flux on copper plate, have excellent wettability, brazed seam tensile strength reaches 40MPa ± 10MPa.
Fig. 9 shows, and timeliness is after 1200 hours, and the Sn-Cu-Ni lead-free brazing that with the addition of Fe and Pr is less by about 30% than compound gross thickness between the lead-free brazing brazed seam interface metal of not adding Fe and Pr, illustrates that the reliability of solder joint (brazed seam) is significantly improved.
Claims (2)
1., containing a Sn-Cu-Ni lead-free brazing of Fe and Pr, it is characterized in that: composition by mass percent proportioning is: the Cu of 0.3 ~ 1.5%, the Ni of 0.05 ~ 2.5%, the Fe of 0.002 ~ 0.1%, the Pr of 0.01 ~ 0.2%, surplus is Sn; Wherein the addition mass ratio of Ni and Fe meets Ni ︰ Fe=24 ~ 26 ︰ 1.
2. the Sn-Cu-Ni lead-free brazing containing Fe and Pr according to claim 1, is characterized in that: the optimum addition mass ratio of Ni and Fe meets Ni ︰ Fe=25 ︰ 1.
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|---|---|---|---|
| CN201210544430.0A CN102974954B (en) | 2012-12-17 | 2012-12-17 | Tin-copper-nickel (Sn-Cu-Ni) lead-free solder containing ferrum (Fe) and praseodymium (Pr) |
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| CN201210544430.0A CN102974954B (en) | 2012-12-17 | 2012-12-17 | Tin-copper-nickel (Sn-Cu-Ni) lead-free solder containing ferrum (Fe) and praseodymium (Pr) |
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| CN102974954B true CN102974954B (en) | 2015-03-11 |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001096394A (en) * | 1999-09-29 | 2001-04-10 | Nec Toyama Ltd | Solder and method for surface treatment for printed wiring board using the solder and method for mounting electronic components on the board using the solder |
| JP2006021205A (en) * | 2004-07-06 | 2006-01-26 | Seiko Epson Corp | Lead-free solder alloy |
| CN101862921A (en) * | 2010-06-25 | 2010-10-20 | 南京航空航天大学 | Sn-Cu-Ni lead-free solder containing Pr, Sr and Ga |
| CN101885119A (en) * | 2010-06-25 | 2010-11-17 | 常熟市华银焊料有限公司 | Sn-Cu-Ni lead-free solder containing V, Nd and Ge |
-
2012
- 2012-12-17 CN CN201210544430.0A patent/CN102974954B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001096394A (en) * | 1999-09-29 | 2001-04-10 | Nec Toyama Ltd | Solder and method for surface treatment for printed wiring board using the solder and method for mounting electronic components on the board using the solder |
| JP2006021205A (en) * | 2004-07-06 | 2006-01-26 | Seiko Epson Corp | Lead-free solder alloy |
| CN101862921A (en) * | 2010-06-25 | 2010-10-20 | 南京航空航天大学 | Sn-Cu-Ni lead-free solder containing Pr, Sr and Ga |
| CN101885119A (en) * | 2010-06-25 | 2010-11-17 | 常熟市华银焊料有限公司 | Sn-Cu-Ni lead-free solder containing V, Nd and Ge |
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