CN103586599A - Lead-free soldering tin wire - Google Patents
Lead-free soldering tin wire Download PDFInfo
- Publication number
- CN103586599A CN103586599A CN201310559374.2A CN201310559374A CN103586599A CN 103586599 A CN103586599 A CN 103586599A CN 201310559374 A CN201310559374 A CN 201310559374A CN 103586599 A CN103586599 A CN 103586599A
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- Prior art keywords
- lead
- free soldering
- solder stick
- copper
- quality
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a lead-free soldering tin wire. The lead-free soldering tin wire is characterized by comprising, by mass, 1.5-8% of Cu, 0.01-2% of Co, 0.01-1% of Ni, and the balance Sn. The liquidus temperature of the lead-free soldering tin wire is 420 DEG C or below 420 DEG C. The lead-free soldering tin wire can further comprise one or more oxidation inhibition elements and/or one or more wetting improvement elements, and a composition of P, Ge and Ga or a composition with 0.05-2% of Ag by mass can be selected and used as the wettability improvement elements. The lead-free soldering tin wire coats the end portion of a copper wire coil. The lead-free soldering tin wire has the advantages that the lead-free soldering tin wire can not be subjected to copper leaching easily when being used in a molten state, the phenomenon of lead poisoning can be reduced, and the lead-free soldering tin wire is practical and convenient to use.
Description
Technical field
The present invention relates to a kind of solder stick, particularly a kind of lead-free soldering wire.
Background technology
In electronic equipment, as used various coils in computer.The welding of end turn is preferably after with solder stick precoating end turn, to guarantee to form satisfied welding point.End turn can be immersed in the solder stick of melting and carry out this precoating.Some in electronic equipment for the manufacture of the copper cash of coil carefully to diameter be 100 microns or less.In the time of in the solder stick that thin like this copper cash end is immersed in to melting, may there is so-called copper and leach.It is a kind of like this phenomenon that copper leaches, and the fine copper wire immersing in melting solder stick dissolves in the solder stick of melting, thereby electric wire is become more carefully or disappear completely.Copper leaches and also may occur in the welding process of end turn, particularly in immersed solder process.Past has taken some countermeasures to prevent that the copper in fine copper wire from leaching.In order to prevent that the copper of fine copper wire in the solder stick of melting from leaching, the most widely used technology is to add copper in solder stick.Owing to can being dissolved in the amount of the copper in the solder stick of melting, be limited, in the time of therefore in copper immersion melting solder stick, the use that is added with the solder stick of copper makes copper cash be difficult to dissolve in melting solder stick.An example of this solder stick is exactly Pb-Sn-Cu alloy.The general composition of this alloy is in Pb-63Sn alloy, to add Cu again, thereby makes wherein have approximately 1.5% to 2% Cu content.With respect to copper cash, Pb-Sn-Cu solder stick has good solderability, so it has been widely used in precoating end turn.Yet due to the toxicity of plumbous (Pb), when processing in landfill yard containing scrap lead, and acid rain dissolves lead from refuse and during polluted underground water, this may cause lead poisoning, therefore need to use a kind of lead-free soldering wire for precoating and welding coil-end.
Summary of the invention
The object of the present invention is to provide a kind of lead-free soldering wire, in order to solve above-mentioned existing issue.
Technical scheme of the present invention is as follows: a kind of lead-free soldering wire, it is characterized in that: lead-free soldering wire includes 1.5-8%(quality) Cu, 0.01 2%(quality) Co, 0.01 1%(quality) Ni, and the Sn of surplus, and its liquidus temperature is 420 ℃ or following.
Lead-free soldering wire can further comprise that the oxidation of at least one suppresses element and/or the wetting element that improves of at least one, and it can be selected from P, and the constituent of Ge and Ga or Ag are 0.05 2%(quality) composition, as wetability, improve element.
This lead-free soldering wire is coated on a kind of end of copper coil.
The invention has the beneficial effects as follows: while using under molten condition, be not easy to be subject to copper and leach, and reduce saturnine phenomenon generation, practical and convenient.
The specific embodiment
A kind of lead-free soldering wire of the present invention, is characterized in that: lead-free soldering wire includes 1.5-8%(quality) Cu, 0.01 2%(quality) Co, 0.01 1%(quality) Ni, and the Sn of surplus, and its liquidus temperature is 420 ℃ or following.Lead-free soldering wire can further comprise that the oxidation of at least one suppresses element and/or the wetting element that improves of at least one, and it can be selected from P, and the constituent of Ge and Ga or Ag are 0.05 2%(quality) composition, as wetability, improve element.This lead-free soldering wire is coated on a kind of end of copper coil.
This lead-free soldering wire according to the present invention is particularly suitable for and uses by having together with the coil of insulating coating, so that heat is removed the insulating coating of end turn, and simultaneously can also be by coil being immersed in melting solder stick, with solder stick precoating coil.This lead-free soldering wire is also applicable to the end of copper coil to be welded on electric terminal.Can weld to carry out such welding by immersed solder or iron.Preferably, end turn to be welded can be used solder stick precoating.In this case, can be only by the solder stick in heating furnace, or with heating tool as electric iron, just may with precoating solder stick, weld in some cases.
For heat, remove the insulating coating of end turn, this coating generally includes interior enamel coating and outer polyurethane coating, end turn need to be heated to near the temperature 400 ℃.Therefore, solder stick should melt at this temperature, to form melting solder stick, thereby can heat remove insulating coating when end turn immerses.But, if the temperature of melting solder stick higher than 470 ℃, the insulating coating immersing on coil carbonization immediately therein, and the carbon obtaining will stick to end turn, thus prevent that solder stick is combined with copper cash.Temperature is also disadvantageous higher than 470 ℃, because copper leaches, can be easy to occur at so high temperature.
Normally in temperature is the scope of 20 ℃ to 50 ℃, with melting solder stick, carry out immersed solder, this temperature is higher than the liquidus temperature of solder stick, and it depends on the thermal capacity of part to be welded.Therefore,, for immersed solder can be carried out in 470 ℃ or following temperature, according to solder stick liquidus temperature of the present invention, should be 420 ℃ or following.
In order to prevent that end turn from while immersing in melting solder stick, copper occurring and leaching, Sn series lead-free soldering tin silk according to the present invention contains 1.5-8%(quality) Cu and 0.01 2%(quality) Co.If the content of Cu is not less than 1.5%(quality), that prevents that the effect that copper leaches from being unconspicuous.The Cu adding surpasses 8%(quality) amount can cause the liquidus temperature of solder stick higher than 420 ℃, thereby cause serious copper to leach, and adversely affect solderability.
To add Co be that the copper that is solder stick to further reduction Sn-Cu in solder stick leaches to Sn-Cu is very effective.If the content of Co is less than 0.01%(quality), this effect is unconspicuous.And be increased to about 2%(quality when Co content) time, copper leaching effect reaches capacity.The interpolation of Co surpasses 2%(quality) be also disadvantageous, because it has also increased solder stick liquidus temperature simultaneously.
The content of Cu is preferably 2-5%(quality), and the content of Co is preferably 0.05 0.5%(quality), 0.05 0.2%(quality more preferably).
According to the present invention, in order further to improve the effect of Cu and Co, to prevent that copper from leaching, and optionally adds nickel in solder stick.If the content of Ni is less than 0.01%(quality) time, this effect is that portion is obvious.In addition, add to surpass 1%(quality) Ni can increase considerably the liquidus temperature of solder stick, higher than 420 ℃, this is inadvisable as mentioned above.Therefore, when adding Ni, the content of Ni is preferably 0.01 1%(quality), 0.1 0.3%(quality more preferably).
By end turn being immersed in melting solder stick, in order to remove the insulating coating of coating copper cash end turn, the temperature of melting solder stick is up to approximately 400 ℃ or above (preferably lower than 470 ℃, as mentioned above).At high like this temperature, the oxidation of solder stick becomes and is showing, and a large amount of oxides can be formed on the surface of melting solder stick.In addition, in order to suppress the oxidation of solder stick, can add the element that one or more can suppress the oxidation of melting solder stick.This element can be P, Ge, and Ga.When adding these elements, the total amount of one or more in these oxidation inhibition elements in solder stick is 0.001 0.5%(quality).If the total amount that these oxidations suppress element is less than 0.001%(quality) time, required effect can not significantly realize.But, if the total amount of these elements surpasses 0.5%(quality), they will adversely affect solderability.Preferably, the total amount of oxidation inhibition element is 0.005 0.1%(quality).
When end turn being immersed in melting solder stick, melting solder stick can fully soak the copper cash immersing, and removes its insulating coating.Lead-free Sn-Cu-Co and Sn-Cu-Co-Ni solder stick may always not have the copper cash that enough wetabilitys are carried out complete moistening immersion.Consequently, the whole part that is immersed in the copper cash in melting solder stick may not have and scribbles in advance solder stick.For fear of the generation of this bad phenomenon, can add a kind of have improve wetability effect element in solder stick.The example that this wetability is improved element is Ag.When adding Ag, it preferably measures the quality into 0.05-2%(), 0.1%(quality more preferably).If the content of Ag is less than 0.05%(quality), its wetability is improved effect and can obviously do not showed.At silver content, be about 2%(quality) time, the wetability of Ag is improved effect and is reached capacity.And Ag is also expensive, the Ag therefore adding had better not surpass 2%(quality).
According to the present invention, lead-free soldering wire Sn-Cu-Co or Sn-Cu-Co-Ni solder stick can be any type of, but are normally applicable to form the form of melting solder stick, as strip solder stick, and prefabricated solder stick or similar type.When by supply solder stick to terminal, make solder stick when precoating coil is welded to electric terminal, it can take bonding wire, flux-cored wire or soldering paste form.
As mentioned above, in the end turn of coating copper cash is immersed to melting solder stick before, can use scaling powder to end turn, thereby after the copper cash from melting solder stick is removed at insulating coating, solder flux can be brought into play its effect on copper cash immediately.Available rosin series solder flux is realized this purpose, although also can use other solder flux, as long as they are up to 400 ℃ or can generation effect at the temperature of above melting solder stick.
According to lead-free soldering wire of the present invention, effectively suppressed the copper under molten condition and leached, the Sn that makes it have easy dissolving Cu is constituent.Therefore, it is particularly suitable for using under molten condition, by end turn being immersed in melting solder stick, to remove insulating coating and precoating end turn, by dipping end turn in the solder stick of melting, thereby reduce or eliminate to greatest extent that showing of wire diameter reduces or wiryly disappear completely, even if coil is to be that 100 microns or less fine copper wire are made by diameter.Consequently, the coil reliability that scribbles in advance solder stick is significantly improved.
example
Copper leaching velocity
Each solder stick in bathing, scolder is heated to 400 ℃, to reach molten condition.Immersion, as the coating copper coil of test material, is coated with interior enamel coating and outer polyurethane coating on it.Saying that rosin flux applies to after end turn along predetermined length, end turn is immersed to melting solder stick 10 seconds at 400 ℃, 20 seconds or 30 seconds.After each immersion phase, the diameter of measuring copper cash with determine by copper, leach the wire diameter that causes reduce speed (micron is per second), using that this leaches copper leaching velocity as copper.
Wetability
The wetability of each solder stick can, by the copper sheet material that is of a size of 10 millimeters * 30 millimeters * 0.3 millimeter is immersed in melting solder stick at 400 ℃, be used wetting balance test can measure its wetability.Can assess wetability by the zero-crossing timing for wetting curve (wetting time) that when test obtains.
According to the lead-free Sn-Cu of this Co of containing of the present invention, be that solder stick shows it and can show to land and suppress copper and leach, this is solder stick with regard to being that its copper leaching velocity is considerably slower than conventional or known Sn-Cu.Therefore, adding a small amount of Co is to leach by very effective inhibition copper in solder stick to Sn-Cu.The shorter Ag that demonstrates interpolation of wetting time has the effect of improving wetability.
Claims (3)
1. a lead-free soldering wire, is characterized in that:
Lead-free soldering wire includes 1.5-8%(quality) Cu, 0.01 2%(quality) Co, 0.01 1%(quality) Ni, and the Sn of surplus, and its liquidus temperature is 420 ℃ or following.
2. lead-free soldering wire according to claim 1, it is characterized in that: lead-free soldering wire can further comprise that the oxidation of at least one suppresses element and/or the wetting element that improves of at least one, it can be selected from P, the constituent of Ge and Ga or Ag are 0.05 2%(quality) composition, as wetability, improve element.
3. lead-free soldering wire according to claim 1, is characterized in that: this lead-free soldering wire is coated on a kind of end of copper coil.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310559374.2A CN103586599A (en) | 2013-11-12 | 2013-11-12 | Lead-free soldering tin wire |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310559374.2A CN103586599A (en) | 2013-11-12 | 2013-11-12 | Lead-free soldering tin wire |
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| Publication Number | Publication Date |
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| CN103586599A true CN103586599A (en) | 2014-02-19 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201310559374.2A Pending CN103586599A (en) | 2013-11-12 | 2013-11-12 | Lead-free soldering tin wire |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107538149A (en) * | 2017-10-25 | 2018-01-05 | 郑州轻工业学院 | A kind of Sn Cu Co Ni lead-free solders and preparation method thereof |
| CN111954585A (en) * | 2018-07-24 | 2020-11-17 | 千住金属工业株式会社 | Solder alloy and solder joint |
Citations (4)
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| CN1496780A (en) * | 2002-10-15 | 2004-05-19 | 千住金属工业株式会社 | Leadless welding flux |
| JP2004154864A (en) * | 2002-10-15 | 2004-06-03 | Senju Metal Ind Co Ltd | Lead-free soldering alloy |
| CN101508062A (en) * | 2001-06-28 | 2009-08-19 | 千住金属工业株式会社 | Lead-free solder alloy |
| CN101733578A (en) * | 2009-12-14 | 2010-06-16 | 郴州金箭焊料有限公司 | Lead-free solder for high-temperature soldering |
-
2013
- 2013-11-12 CN CN201310559374.2A patent/CN103586599A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101508062A (en) * | 2001-06-28 | 2009-08-19 | 千住金属工业株式会社 | Lead-free solder alloy |
| CN1496780A (en) * | 2002-10-15 | 2004-05-19 | 千住金属工业株式会社 | Leadless welding flux |
| JP2004154864A (en) * | 2002-10-15 | 2004-06-03 | Senju Metal Ind Co Ltd | Lead-free soldering alloy |
| US20040115088A1 (en) * | 2002-10-15 | 2004-06-17 | Tsukasa Ohnishi | Lead-free solder |
| CN101733578A (en) * | 2009-12-14 | 2010-06-16 | 郴州金箭焊料有限公司 | Lead-free solder for high-temperature soldering |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107538149A (en) * | 2017-10-25 | 2018-01-05 | 郑州轻工业学院 | A kind of Sn Cu Co Ni lead-free solders and preparation method thereof |
| CN107538149B (en) * | 2017-10-25 | 2019-09-24 | 郑州轻工业学院 | A kind of Sn-Cu-Co-Ni lead-free solder and preparation method thereof |
| CN111954585A (en) * | 2018-07-24 | 2020-11-17 | 千住金属工业株式会社 | Solder alloy and solder joint |
| CN111954585B (en) * | 2018-07-24 | 2021-09-28 | 千住金属工业株式会社 | Solder alloy and solder joint |
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Application publication date: 20140219 |