CN109483081A - Metal targets bind solder and preparation method thereof - Google Patents
Metal targets bind solder and preparation method thereof Download PDFInfo
- Publication number
- CN109483081A CN109483081A CN201811462525.1A CN201811462525A CN109483081A CN 109483081 A CN109483081 A CN 109483081A CN 201811462525 A CN201811462525 A CN 201811462525A CN 109483081 A CN109483081 A CN 109483081A
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- Prior art keywords
- vaccum sensitive
- stove
- solder
- preparation
- heating
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
Abstract
The present invention relates to a kind of metal targets binding solders and preparation method thereof, the preparation method includes the following steps: S1, ingredient: by weight tin: silver: copper=94 ~ 95%:4.99 ~ 5.99%:0.01 ~ 0.05% ingredient, it is uniformly mixed, is put into a vaccum sensitive stove；S2, it vacuumizes: vaccum sensitive stove is evacuated to vacuum degree less than 3 × 10‑3Pa closes vacuum pump, is passed through protective gas to normal pressure to vaccum sensitive stove, vaccum sensitive stove is evacuated to vacuum degree less than 3 × 10 again‑2Pa closes vacuum pump, is then passed through protective gas to 10 ~ 50Pa to vaccum sensitive stove；S3, first segment heating: opening induction heating, and vaccum sensitive stove is warming up to 235 ~ 275 DEG C with the first heating rate, keeps the temperature the T1 time；S4, second segment heating: and then vaccum sensitive stove is warming up to 300-450 DEG C with the second heating rate, keeps the temperature the T2 time；S5, it comes out of the stove: stopping heating, when temperature drops to 30 DEG C hereinafter, come out of the stove, obtain solder.This solder raw material is simple and easy to get, and preparation flow is short, and the binding welded rate of target is all larger than 95%, and wellability is higher than indium.
Description
Technical field
The present invention relates to target preparation fields more particularly to a kind of metal targets binding solder and preparation method thereof.
Background technique
Target is typically all to pass through solder to be bundled in backboard or penstock, in order to guarantee that target does not take off in sputtering process
It falls, it is general that binding welded rate is required to be greater than 95%.
During target binding, usually first one layer of solder is smeared in the binding face of target, is made with ultrasonic coating apparatus
Solder sufficiently, uniformly penetrates into inside target, is conducive to the adhesive effect of target binding in this way.
Currently used solder is indium, but for metal targets, such as nickel platinum, tungsten titanium target material, infiltration of the indium to its surface
The effect is relatively poor, and after ultrasound coating, the bound target binding welded rate come out is not achieved 95%.
In order to solve the above technical problems, the present invention proposes that a kind of metal targets bind solder and preparation method thereof, make metal
The binding welded rate of target is greater than 95%.
Summary of the invention
It is an object of the invention to propose a kind of metal targets binding solder and preparation method thereof of the welded rate greater than 95%.
To realize foregoing purpose, the present invention adopts the following technical scheme: a kind of preparation method of metal targets binding solder,
It includes the following steps:
S1, ingredient: by weight tin: silver: copper=94 ~ 95%:4.99 ~ 5.99%:0.01 ~ 0.05% ingredient are uniformly mixed, are put into one
In vaccum sensitive stove；
S2, it vacuumizes: vaccum sensitive stove is evacuated to vacuum degree less than 3 × 10-3Pa closes vacuum pump, to vaccum sensitive stove
Protective gas is passed through to normal pressure, vaccum sensitive stove is evacuated to vacuum degree less than 3 × 10 again-2Pa closes vacuum pump, then to true
Empty induction furnace is passed through protective gas to 10 ~ 50Pa；
S3, first segment heating: opening induction heating, and vaccum sensitive stove is warming up to 235 ~ 275 DEG C with the first heating rate, keeps the temperature T1
Time；
S4, second segment heating: and then vaccum sensitive stove is warming up to 300-450 DEG C with the second heating rate, keeps the temperature the T2 time；
S5, it comes out of the stove: stopping heating, when temperature drops to 30 DEG C hereinafter, come out of the stove, obtain solder.
As a further improvement of the present invention, the protective gas is 5N or the above nitrogen, inert gas.
As a further improvement of the present invention, the first heating rate is 20 ~ 30 DEG C/min.
As a further improvement of the present invention, the first heating rate is 35 ~ 50 DEG C/min.
As a further improvement of the present invention, the T1 time is 2 ~ 3h.
As a further improvement of the present invention, the T2 time is 2 ~ 5h.
The present invention proposes a kind of metal targets binding solder simultaneously, and the raw material weight of the solder is than tin: silver: copper=94 ~
95%:4.99 ~ 5.99%:0.01 ~ 0.05%.
Compared with the prior art, the raw material of this metal targets binding solder only includes three kinds of tin, silver, copper metals, raw material letter
It is singly easy to get, and the process of preparation method is short, and is applied to nickel platinum, on tungsten titanium target, the binding of metal targets
Welded rate is all larger than 95%, and wellability is higher than indium.
Specific embodiment
Technical solution is clearly and completely described below in conjunction with the embodiment of the present invention, it is clear that described implementation
Example is only a part of the embodiment of the present invention, instead of all the embodiments.Based on the embodiments of the present invention, this field is common
Technical staff's every other embodiment obtained without making creative work belongs to the model that the present invention protects
It encloses.
The present invention proposes a kind of metal targets binding solder, and the raw material weight of the solder is than tin: silver: copper=94 ~ 95%:
4.99 ~ 5.99%:0.01 ~ 0.05%.
The present invention proposes a kind of preparation method of metal targets binding solder simultaneously comprising following steps.
S1, ingredient: by weight tin: silver: copper=94 ~ 95%:4.99 ~ 5.99%:0.01 ~ 0.05% ingredient are uniformly mixed, put
Enter in a vaccum sensitive stove.
S2, it vacuumizes: vaccum sensitive stove is evacuated to vacuum degree less than 3 × 10-3Pa closes vacuum pump, to vacuum sense
Furnace is answered to be passed through protective gas to normal pressure, vaccum sensitive stove is evacuated to vacuum degree less than 3 × 10 again-2Pa closes vacuum pump, then
Protective gas is passed through to 10 ~ 50Pa to vaccum sensitive stove.
S3, first segment heating: opening induction heating, and vaccum sensitive stove is warming up to 235 ~ 275 DEG C with the first heating rate, protects
The warm T1 time.
S4, second segment heating: and then vaccum sensitive stove is warming up to 300-450 DEG C with the second heating rate, keeps the temperature the T2 time.
S5, it comes out of the stove: stopping heating, when temperature drops to 30 DEG C hereinafter, come out of the stove, obtain solder.
In certain embodiments of the present invention, protective gas is 5N or the above nitrogen, inert gas.
In certain embodiments of the present invention, the first heating rate is 20 ~ 30 DEG C/min.
In certain embodiments of the present invention, the first heating rate is 35 ~ 50 DEG C/min.
In certain embodiments of the present invention, the T1 time is 2 ~ 3h.
In certain embodiments of the present invention, the T2 time is 2 ~ 5h.
This preparation method prepares tin-silver-copper solder using vacuum induction melting method, and heats fusing tin by first segment, leads to
It crosses second segment and heats tin and silver, copper fully reacting so that melting, obtain the uniform solder of tin, silver, copper.
Embodiment 1.
A kind of preparation method of metal targets binding solder comprising following steps: ingredient: by weight tin: silver: copper=
95%:4.99%:0.01% ingredient is uniformly mixed, is put into a vaccum sensitive stove；Heating prepares: vaccum sensitive stove is evacuated to
Vacuum degree is less than 3 × 10-3Pa closes vacuum pump, and the pressure being passed through in argon gas to vaccum sensitive stove is normal pressure, then is evacuated to true
Reciprocal of duty cycle is less than 3 × 10-2Pa closes vacuum pump, and the pressure then passed in argon gas to vaccum sensitive stove is 30Pa；First segment adds
Heat: opening induction heating, is warming up to 235 DEG C with the heating rate of 30 DEG C/min, keeps the temperature 3h；Second segment heating: and then with 50 DEG C/
The heating rate of min is warming up to 450 DEG C, keeps the temperature 2h；It comes out of the stove: stopping heating, reduce the temperature to 30 DEG C hereinafter, come out of the stove, closed
The tin-silver-copper solder of lattice.Test: the tin-silver-copper solder prepared is coated on nickel platinum target by ultrasound, is then bundled in copper
In penstock, measuring binding welded rate with c-scan is 98.5%.
Embodiment 2.
A kind of preparation method of metal targets binding solder comprising following steps: ingredient: by weight tin: silver: copper=
94.46%:5.5%:0.04% ingredient is uniformly mixed, is put into a vaccum sensitive stove；Heating prepares: vaccum sensitive stove is evacuated to
Vacuum degree is less than 3 × 10-3Pa closes vacuum pump, and the pressure being passed through in argon gas to vaccum sensitive stove is normal pressure, then is evacuated to true
Reciprocal of duty cycle is less than 3 × 10-2Pa closes vacuum pump, and the pressure then passed in argon gas to vaccum sensitive stove is 10Pa；First segment adds
Heat: opening induction heating, is warming up to 265 DEG C with the heating rate of 20 DEG C/min, keeps the temperature 2.5h；Second segment heating: and then with 35
DEG C/heating rate of min is warming up to 400 DEG C, keep the temperature 4h；It comes out of the stove: stopping heating, when temperature drops to 30 DEG C hereinafter, come out of the stove, obtain
Qualified tin-silver-copper solder.Binding test: the tin-silver-copper solder prepared is coated on nickel platinum target by ultrasound, is then tied up
It is scheduled in copper penstock, measuring binding welded rate with c-scan is 98.9%.
Embodiment 3.
A kind of preparation method of metal targets binding solder comprising following steps: ingredient: by weight tin: silver: copper=
94%:5.99%:0.01% ingredient is uniformly mixed, is put into a vaccum sensitive stove；Heating prepares: vacuum induction stove evacuation is directly true
Reciprocal of duty cycle is less than 3 × 10-3Pa closes vacuum pump, and the pressure being passed through in argon gas to vaccum sensitive stove is normal pressure, then is evacuated to vacuum
Degree is less than 3 × 10-2Pa closes vacuum pump, and the pressure then passed in argon gas to vaccum sensitive stove is 50Pa；First segment heating:
Induction heating is opened, 250 DEG C is warming up to the heating rate of 25 DEG C/min, keeps the temperature 3h；Second segment heating: and then with 40 DEG C/min
Heating rate be warming up to 350 DEG C, keep the temperature 5h；It comes out of the stove: stopping heating, when temperature drops to 30 DEG C hereinafter, come out of the stove, it is qualified to obtain
Tin-silver-copper solder.Binding test: the tin-silver-copper solder prepared is coated on tungsten titanium target material by ultrasound, is then bundled in titanium
In penstock, measuring binding welded rate with c-scan is 97.8%.
From above embodiments it is found that the tin-silver-copper solder prepared is coated on nickel platinum, tungsten titanium target by ultrasound
On, it is then bundled in copper or titanium penstock, measures binding welded rate with c-scan and be all larger than 95%.
Compared with the prior art, the raw material of this metal targets binding solder only includes three kinds of tin, silver, copper metals, raw material letter
It is singly easy to get, and the process of preparation method is short, and is applied to nickel platinum, on tungsten titanium target, the binding of metal targets
Welded rate is all larger than 95%, and wellability is higher than indium.
Although for illustrative purposes, the preferred embodiment of the present invention is had been disclosed, but the ordinary skill people of this field
Member will realize without departing from the scope and spirit of the invention as disclosed by the appended claims, various to change
Into, increase and replace be possible.
Claims (7)
1. a kind of preparation method of metal targets binding solder, it is characterised in that: it includes the following steps:
S1, ingredient: by weight tin: silver: copper=94 ~ 95%:4.99 ~ 5.99%:0.01 ~ 0.05% ingredient are uniformly mixed, are put into one
In vaccum sensitive stove；
S2, it vacuumizes: vaccum sensitive stove is evacuated to vacuum degree less than 3 × 10-3Pa closes vacuum pump, to vaccum sensitive stove
Protective gas is passed through to normal pressure, vaccum sensitive stove is evacuated to vacuum degree less than 3 × 10 again-2Pa closes vacuum pump, then to true
Empty induction furnace is passed through protective gas to 10 ~ 50Pa；
S3, first segment heating: opening induction heating, and vaccum sensitive stove is warming up to 235 ~ 275 DEG C with the first heating rate, keeps the temperature T1
Time；
S4, second segment heating: and then vaccum sensitive stove is warming up to 300-450 DEG C with the second heating rate, keeps the temperature the T2 time；
S5, it comes out of the stove: stopping heating, when temperature drops to 30 DEG C hereinafter, come out of the stove, obtain solder.
2. the preparation method of metal targets binding solder according to claim 1, it is characterised in that: the protective gas
For 5N or the above nitrogen, inert gas.
3. the preparation method of metal targets binding solder according to claim 1, it is characterised in that: the first heating rate
For 20 ~ 30 DEG C/min.
4. the preparation method of metal targets binding solder according to claim 1, it is characterised in that: the first heating rate
For 35 ~ 50 DEG C/min.
5. the preparation method of metal targets binding solder according to claim 1, it is characterised in that: the T1 time is 2 ~ 3h.
6. the preparation method of metal targets binding solder according to claim 1, it is characterised in that: the T2 time is 2 ~ 5h.
7. a kind of metal targets bind solder, it is characterised in that: the raw material weight of the solder is than tin: silver: copper=94 ~ 95%:
4.99 ~ 5.99%:0.01 ~ 0.05%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811462525.1A CN109483081A (en) | 2018-12-03 | 2018-12-03 | Metal targets bind solder and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811462525.1A CN109483081A (en) | 2018-12-03 | 2018-12-03 | Metal targets bind solder and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109483081A true CN109483081A (en) | 2019-03-19 |
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ID=65698221
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811462525.1A Pending CN109483081A (en) | 2018-12-03 | 2018-12-03 | Metal targets bind solder and preparation method thereof |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114752899A (en) * | 2022-03-13 | 2022-07-15 | 先导薄膜材料（广东）有限公司 | Binding method of tungsten-titanium target material |
| CN115287497A (en) * | 2022-07-29 | 2022-11-04 | 先导薄膜材料（广东）有限公司 | Tin-silver-copper target material and preparation method thereof |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114752899A (en) * | 2022-03-13 | 2022-07-15 | 先导薄膜材料（广东）有限公司 | Binding method of tungsten-titanium target material |
| CN115287497A (en) * | 2022-07-29 | 2022-11-04 | 先导薄膜材料（广东）有限公司 | Tin-silver-copper target material and preparation method thereof |
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Application publication date: 20190319 |
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