CN105541368A - Brazing method for Al2O3 ceramic and titanium ring adopting AuPd brazing filler metal - Google Patents

Brazing method for Al2O3 ceramic and titanium ring adopting AuPd brazing filler metal Download PDF

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Publication number
CN105541368A
CN105541368A CN201610039479.9A CN201610039479A CN105541368A CN 105541368 A CN105541368 A CN 105541368A CN 201610039479 A CN201610039479 A CN 201610039479A CN 105541368 A CN105541368 A CN 105541368A
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aupd
solder
titanium ring
pottery
brazing
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CN201610039479.9A
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CN105541368B (en
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刘多
牛红伟
宋晓国
周英豪
冯吉才
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Harbin Institute of Technology Weihai
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Harbin Institute of Technology Weihai
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    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B37/00Joining burned ceramic articles with other burned ceramic articles or other articles by heating
    • C04B37/02Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
    • C04B37/023Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used
    • C04B37/026Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used consisting of metals or metal salts
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24Selection of soldering or welding materials proper
    • B23K35/30Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • B23K35/3013Au as the principal constituent
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/02Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
    • C04B2237/12Metallic interlayers
    • C04B2237/125Metallic interlayers based on noble metals, e.g. silver

Abstract

The invention relates to a brazing method for Al2O3 ceramic and a titanium ring adopting AuPd brazing filler metal. The brazing method comprises the following steps: ball-grinding the brazing filler metal prepared from Au powder and Pd powder, cleaning a base material, preparing the brazing filler metal into paste, assembling a to-be-brazed structure of Al2O3 ceramic/AuPd brazing filler metal/titanium ring, starting a vacuum pump to meet the vacuum requirement, powering on the vacuum pump for heating and heat preservation, cooling the material to room temperature in the furnace, and brazing the Al2O3 ceramic and the titanium ring through the AuPd brazing filler metal. The Al2O3 ceramic/AuPd brazing filler metal/titanium ring obtained by brazing is compact in joint tissue and higher in biocompatibility. The brazing method is particularly suitable for connection of Al2O3 ceramic/titanium ring in an artificial retina structure.

Description

A kind of AuPd solder that adopts is to Al2O3 pottery and the method for welding of titanium ring
Technical field
The invention belongs to welding technology field, be specifically related to a kind of AuPd solder that adopts to Al 2o 3the method for welding of pottery and titanium ring.
Background technology
Artificial retina is the retina utilizing electron device to replace losing function, with the optic nerve that galvanism is still intact, helps user to regain basic vision.Al 2o 3pottery is the vitals in artificial retina structure with the syndeton of titanium ring, realizes Al 2o 3pottery is connected promoting that the fast development of artificial retina technology is significant with the reliable of titanium ring.
Al in artificial retina structure 2o 3pottery will meet certain strength of joint and resistance to air loss on the one hand with titanium ring connector, and whole joint will have bio-compatibility on the other hand, and namely linkage interface can not containing harmful constituent element.Vacuum brazing can not only ensure Al 2o 3pottery and titanium ring joint have certain strength of joint, and can not bring outside contamination, can meet the requirement of artificial retina structure.Therefore, adopting the solder with bio-compatibility to carry out vacuum brazing is realize Al 2o 3pottery is connected highly effective method with titanium ring.
Summary of the invention
Technical problem to be solved by this invention is to overcome the deficiencies in the prior art, and provide a kind of technique simple, solder has good bio-compatibility, realizes titanium ring and Al 2o 3the reliable employing AuPd solder connected of pottery is to Al 2o 3the method for welding of pottery and titanium ring.
The present invention solves the problems of the technologies described above adopted technical scheme: a kind of AuPd solder that adopts is to Al 2o 3pottery and the method for welding of titanium ring, is characterized in that: it comprises the following steps:
(1), prepare solder: in planetary ball mill, be 20 ~ 400nm by granularity, massfraction be respectively 77 ~ 99% and 1 ~ 23% Au powder and the mixing of Pd powder, be under the condition of 100 ~ 300 revs/min at rotating speed, ball milling 0.5 ~ 2h, obtains AuPd solder;
(2), by titanium ring to be welded and Al 2o 3acetone ultrasonic cleaning 5 ~ 10min put into by pottery;
(3), by the AuPd solder acetone obtained be mixed into paste, and paste solder is evenly coated in Al 2o 3on to be connected of pottery, then be placed on coat by titanium ring, form assembly parts to be welded, wherein, the thickness of paste solder coat is 50 ~ 100 μm;
(4), the assembly parts to be welded obtained in step 3 are placed in vacuum furnace, when vacuum tightness reaches (1.3 ~ 2.0) × 10 -3during Pa, electrified regulation, to control heat-up rate be 10 DEG C/min ~ 30 DEG C/min, is warming up to 1100 ~ 1450 DEG C, is then incubated 0 ~ 30min, then controlled cooling model speed be 3 DEG C/min ~ 10 DEG C/min, be cooled to 300 DEG C, and then furnace cooling, namely realize Al 2o 3the connection of pottery and titanium ring.
Further, in described AuPd solder, the massfraction of Au powder and Pd powder is respectively 88% and 12%.
Further, in described step (three), the thickness of paste solder coat is 80 μm.
Further, controlling heat-up rate in described step (four) is 20 DEG C/min, and be warming up to 1330 DEG C, be incubated as 15min, speed of cooling is 5 DEG C/min.
The present invention adopts AuPd solder to connect titanium ring and Al 2o 3pottery, by controlling brazing temperature (1100 ~ 1450 DEG C) and soaking time (0 ~ 30min), to ensure that brazed joint obtains good microtexture and performance, successfully achieves titanium ring and Al 2o 3the connection of pottery, and obtain reliable joint.Against existing technologies, the invention has the beneficial effects as follows: the present invention selects AuPd solder, titanium ring and Al can be realized 2o 3the bio-compatibility of pottery connects, and obtains the joint harmless to human non-toxic.Ti in titanium ring by with Al 2o 3au in Al in pottery, O and brazed seam, Pd react, and form compound, and the metallurgy realizing joint interface connects.Be particularly suitable for Al in artificial retina structure 2o 3the connection of pottery/titanium ring.
Embodiment
Technical solution of the present invention is not limited to following cited embodiment, also comprises the arbitrary combination between each embodiment.
Embodiment 1: a kind of AuPd solder that adopts is to Al 2o 3the method for welding of pottery and titanium ring, it comprises the following steps:
(1), prepare solder: in planetary ball mill, be 20 ~ 400nm by granularity, massfraction be respectively 99% and 1% Au powder and the mixing of Pd powder, be under the condition of 100 revs/min at rotating speed, ball milling 0.5 ~ 2h, obtains AuPd solder;
(2), by titanium ring to be welded and Al 2o 3acetone ultrasonic cleaning 5min put into by pottery;
(3), by the AuPd solder acetone obtained be mixed into paste, and paste solder is evenly coated in Al 2o 3on to be connected of pottery, then be placed on coat by titanium ring, form assembly parts to be welded, wherein, the thickness of paste solder coat is 50 μm;
(4), the assembly parts to be welded obtained in step 3 are placed in vacuum furnace, when vacuum tightness reaches (1.3 ~ 2.0) × 10 -3during Pa, electrified regulation, controlling heat-up rate is 10 DEG C/min, be warming up to 1100 DEG C, be then incubated 30min, then controlled cooling model speed is 3 DEG C/min, be cooled to 300 DEG C, and then furnace cooling, namely realizes Al 2o 3the connection of pottery and titanium ring.
Adopt the complete densification of joint that present embodiment obtains, the defects such as flawless, achieve titanium ring and Al 2o 3the reliable connection of pottery, meets the application requiring of artificial retina structure.
Embodiment 2: a kind of AuPd solder that adopts is to Al 2o 3the method for welding of pottery and titanium ring, it comprises the following steps:
(1), prepare solder: in planetary ball mill, be 20 ~ 400nm by granularity, massfraction be respectively 77% and 23% Au powder and the mixing of Pd powder, be under the condition of 300 revs/min at rotating speed, ball milling 0.5 ~ 2h, obtains AuPd solder;
(2), by titanium ring to be welded and Al 2o 3acetone ultrasonic cleaning 10min put into by pottery;
(3), by the AuPd solder acetone obtained be mixed into paste, and paste solder is evenly coated in Al 2o 3on to be connected of pottery, then be placed on coat by titanium ring, form assembly parts to be welded, wherein, the thickness of paste solder coat is 100 μm;
(4), the assembly parts to be welded obtained in step 3 are placed in vacuum furnace, when vacuum tightness reaches (1.3 ~ 2.0) × 10 -3during Pa, electrified regulation, controlling heat-up rate is 30 DEG C/min, be warming up to 1450 DEG C, be then incubated, then controlled cooling model speed is 10 DEG C/min, be cooled to 300 DEG C, and then furnace cooling, namely realizes Al 2o 3the connection of pottery and titanium ring.
Adopt the complete densification of joint that present embodiment obtains, the defects such as flawless, achieve titanium ring and Al 2o 3the reliable connection of pottery, meets the application requiring of artificial retina structure.
Embodiment 3: a kind of AuPd solder that adopts is to Al 2o 3the method for welding of pottery and titanium ring, it comprises the following steps:
(1), prepare solder: in planetary ball mill, be 20 ~ 400nm by granularity, massfraction be respectively 88% and 12% Au powder and the mixing of Pd powder, be under the condition of 100 ~ 300 revs/min at rotating speed, ball milling 0.5 ~ 2h, obtains AuPd solder;
(2), by titanium ring to be welded and Al 2o 3acetone ultrasonic cleaning 8min put into by pottery;
(3), by the AuPd solder acetone obtained be mixed into paste, and paste solder is evenly coated in Al 2o 3on to be connected of pottery, then be placed on coat by titanium ring, form assembly parts to be welded, wherein, the thickness of paste solder coat is 80 μm;
(4), the assembly parts to be welded obtained in step 3 are placed in vacuum furnace, when vacuum tightness reaches (1.3 ~ 2.0) × 10 -3during Pa, electrified regulation, controlling heat-up rate is 20 DEG C/min, be warming up to 1330 DEG C, be then incubated 15min, then controlled cooling model speed is 5 DEG C/min, be cooled to 300 DEG C, and then furnace cooling, namely realizes Al 2o 3the connection of pottery and titanium ring.
Adopt the complete densification of joint that present embodiment obtains, the defects such as flawless, achieve titanium ring and Al 2o 3the reliable connection of pottery.
Embodiment 4: a kind of AuPd solder that adopts is to Al 2o 3pottery and the method for welding of titanium ring, is characterized in that: it comprises the following steps:
(1), prepare solder: in planetary ball mill, be 20 ~ 400nm by granularity, massfraction be respectively 80% and 20% Au powder and the mixing of Pd powder, be under the condition of 100 ~ 300 revs/min at rotating speed, ball milling 0.5 ~ 2h, obtains AuPd solder;
(2), by titanium ring to be welded and Al 2o 3acetone ultrasonic cleaning 8min put into by pottery;
(3), by the AuPd solder acetone obtained be mixed into paste, and paste solder is evenly coated in Al 2o 3on to be connected of pottery, then be placed on coat by titanium ring, form assembly parts to be welded, wherein, the thickness of paste solder coat is 80 μm;
(4), the assembly parts to be welded obtained in step 3 are placed in vacuum furnace, when vacuum tightness reaches (1.3 ~ 2.0) × 10 -3during Pa, electrified regulation, controlling heat-up rate is 20 DEG C/min, be warming up to 1330 DEG C, be then incubated 15min, then controlled cooling model speed is 5 DEG C/min, be cooled to 300 DEG C, and then furnace cooling, namely realizes Al 2o 3the connection of pottery and titanium ring.
Adopt the complete densification of joint that present embodiment obtains, the defects such as flawless, achieve titanium ring and Al 2o 3the reliable connection of pottery.
Embodiment 5: a kind of AuPd solder that adopts is to Al 2o 3pottery and the method for welding of titanium ring, is characterized in that: it comprises the following steps:
(1), prepare solder: in planetary ball mill, be 20 ~ 400nm by granularity, massfraction be respectively 85% and 15% Au powder and the mixing of Pd powder, be under the condition of 100 ~ 300 revs/min at rotating speed, ball milling 0.5 ~ 2h, obtains AuPd solder;
(2), by titanium ring to be welded and Al 2o 3acetone ultrasonic cleaning 8min put into by pottery;
(3), by the AuPd solder acetone obtained be mixed into paste, and paste solder is evenly coated in Al 2o 3on to be connected of pottery, then be placed on coat by titanium ring, form assembly parts to be welded, wherein, the thickness of paste solder coat is 60 μm;
(4), the assembly parts to be welded obtained in step 3 are placed in vacuum furnace, when vacuum tightness reaches (1.3 ~ 2.0) × 10 -3during Pa, electrified regulation, controlling heat-up rate is 15 DEG C/min, be warming up to 1450 DEG C, be then incubated 18min, then controlled cooling model speed is 8 DEG C/min, be cooled to 300 DEG C, and then furnace cooling, namely realizes Al 2o 3the connection of pottery and titanium ring.
Adopt the complete densification of joint that present embodiment obtains, the defects such as flawless, achieve titanium ring and Al 2o 3the reliable connection of pottery, meets the application requiring of artificial retina structure.

Claims (4)

1. one kind adopts AuPd solder to Al 2o 3pottery and the method for welding of titanium ring, is characterized in that: it comprises the following steps:
(1), prepare solder: in planetary ball mill, be 20 ~ 400nm by granularity, massfraction be respectively 77 ~ 99% and 1 ~ 23% Au powder and the mixing of Pd powder, be under the condition of 100 ~ 300 revs/min at rotating speed, ball milling 0.5 ~ 2h, obtains AuPd solder;
(2), by titanium ring to be welded and Al 2o 3acetone ultrasonic cleaning 5 ~ 10min put into by pottery;
(3), by the AuPd solder acetone obtained be mixed into paste, and paste solder is evenly coated in Al 2o 3on to be connected of pottery, then be placed on coat by titanium ring, form assembly parts to be welded, wherein, the thickness of paste solder coat is 50 ~ 100 μm;
(4), the assembly parts to be welded obtained in step 3 are placed in vacuum furnace, when vacuum tightness reaches (1.3 ~ 2.0) × 10 -3during Pa, electrified regulation, to control heat-up rate be 10 DEG C/min ~ 30 DEG C/min, is warming up to 1100 ~ 1450 DEG C, is then incubated 0 ~ 30min, then controlled cooling model speed be 3 DEG C/min ~ 10 DEG C/min, be cooled to 300 DEG C, and then furnace cooling, namely realize Al 2o 3the connection of pottery and titanium ring.
2. employing AuPd solder according to claim 1 is to Al 2o 3pottery and the method for welding of titanium ring, is characterized in that: in described AuPd solder, the massfraction of Au powder and Pd powder is respectively 88% and 12%.
3. employing AuPd solder according to claim 1 is to Al 2o 3pottery and the method for welding of titanium ring, is characterized in that: in described step (three), the thickness of paste solder coat is 80 μm.
4. employing AuPd solder according to claim 1 is to Al 2o 3pottery and the method for welding of titanium ring, is characterized in that: controlling heat-up rate in described step (four) is 20 DEG C/min, and be warming up to 1330 DEG C, be incubated as 15min, speed of cooling is 5 DEG C/min.
CN201610039479.9A 2016-01-21 2016-01-21 One kind is using AuPd solders to Al2O3Ceramics and the method for welding of titanacycle Active CN105541368B (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106365668A (en) * 2016-08-19 2017-02-01 哈尔滨工业大学(威海) Al2O3 ceramic and titanium ring diffusion connection method
CN110014203A (en) * 2019-04-04 2019-07-16 河北躬责科技有限公司 A kind of ceramics feedthrough, solder and welding method
CN110683855A (en) * 2018-07-05 2020-01-14 哈尔滨工业大学 Biocompatible Al2O3Method for diffusion bonding of Ti

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Cited By (3)

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Publication number Priority date Publication date Assignee Title
CN106365668A (en) * 2016-08-19 2017-02-01 哈尔滨工业大学(威海) Al2O3 ceramic and titanium ring diffusion connection method
CN110683855A (en) * 2018-07-05 2020-01-14 哈尔滨工业大学 Biocompatible Al2O3Method for diffusion bonding of Ti
CN110014203A (en) * 2019-04-04 2019-07-16 河北躬责科技有限公司 A kind of ceramics feedthrough, solder and welding method

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