CN105541368B - One kind is using AuPd solders to Al2O3Ceramics and the method for welding of titanacycle - Google Patents
One kind is using AuPd solders to Al2O3Ceramics and the method for welding of titanacycle Download PDFInfo
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- CN105541368B CN105541368B CN201610039479.9A CN201610039479A CN105541368B CN 105541368 B CN105541368 B CN 105541368B CN 201610039479 A CN201610039479 A CN 201610039479A CN 105541368 B CN105541368 B CN 105541368B
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- titanacycle
- ceramics
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- solders
- powder
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
- C04B37/02—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
- C04B37/023—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used
- C04B37/026—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used consisting of metals or metal salts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/3013—Au as the principal constituent
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
- C04B2237/12—Metallic interlayers
- C04B2237/125—Metallic interlayers based on noble metals, e.g. silver
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Materials Engineering (AREA)
- Structural Engineering (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Ceramic Products (AREA)
- Materials For Medical Uses (AREA)
- Prostheses (AREA)
Abstract
The present invention relates to one kind using AuPd solders to Al2O3Ceramics and the method for welding of titanacycle, comprise the following steps：The solder that ball milling is made of Au powder and Pd powder, cleans mother metal, solder is made paste and is assembled into Al2O3Ceramics/AuPd solders/titanacycle treats welding structure, starts vacuum pump and reaches electrified regulation after vacuum level requirements and keep the temperature, then cools to room temperature with the furnace, complete AuPd solders to Al2O3Ceramics and the soldering connection of titanacycle.The Al of gained after soldering2O3Ceramics/AuPd solders/titanacycle joint microstructure is fine and close, and bio-compatibility is preferable.Particularly suitable for Al in artificial retina structure2O3The connection of ceramics/titanacycle.
Description
Technical field
The invention belongs to welding technology field, and in particular to one kind is using AuPd solders to Al2O3Ceramics and the soldering of titanacycle
Method.
Background technology
Artificial retina is to replace losing the retina of function using electronic device, is stimulated with electric current and still intact regards god
Through helping user to regain basic vision.Al2O3Ceramics and the connection structure of titanacycle are in artificial retina structure
Important component, realizes Al2O3Ceramics have important meaning with being reliably connected for titanacycle to the fast development for promoting artificial retina technology
Justice.
Al in artificial retina structure2O3On the one hand ceramics will meet that certain bonding strength is gentle with titanacycle connector
Close property, on the other hand entirely connector will have bio-compatibility, i.e. linkage interface can not contain harmful constituent element.Vacuum
Soldering not only can guarantee that Al2O3Ceramics have certain bonding strength with titanacycle connector, and will not bring outside contamination, can expire
The requirement of sufficient artificial retina structure.Therefore, it is to realize Al to carry out vacuum brazing using the solder with bio-compatibility2O3Pottery
Porcelain is connected highly effective method with titanacycle.
The content of the invention
The technical problems to be solved by the invention are for simple, the pricker that overcomes the deficiencies of the prior art and provide a kind of technique
Material has good bio-compatibility, realizes titanacycle and Al2O3What ceramics were reliably connected uses AuPd solders to Al2O3Ceramics with
The method for welding of titanacycle.
Technical solution is used by the present invention solves above-mentioned technical problem：One kind is using AuPd solders to Al2O3Ceramics with
The method for welding of titanacycle, it is characterised in that：It comprises the following steps：
（One）, prepare solder：In planetary ball mill, by granularity for 20 ~ 400nm, mass fraction be respectively 77 ~
99% and 1 ~ 23% Au powder and Pd powder mixing, rotating speed be 100 ~ 300 revs/min under conditions of, 0.5 ~ 2h of ball milling, obtains AuPd prickers
Material；
（Two）, by titanacycle and Al to be welded2O3Ceramics are put into 5 ~ 10min of ultrasonic cleaning in acetone；
（Three）, obtained AuPd solders are mixed into paste with acetone, and paste solder is coated uniformly on Al2O3Ceramics
Treat on joint face, then titanacycle is placed on coat, forms assembly parts to be welded, wherein, the thickness of paste solder coat is
50~100μm；
（Four）, the assembly parts to be welded obtained in step 3 are placed in vacuum furnace, when vacuum reaches (1.3 ~
2.0)×10-3During Pa, electrified regulation, it is 10 DEG C/min ~ 30 DEG C/min to control programming rate, is warming up to 1100 ~ 1450 DEG C, then
0 ~ 30min is kept the temperature, then it is 3 DEG C/min ~ 10 DEG C/min to control cooling velocity, is cooled to 300 DEG C, then furnace cooling again, i.e., it is real
Existing Al2O3Ceramics and the connection of titanacycle.
Further, the mass fraction of Au powder and Pd powder is respectively 88% and 12% in the AuPd solders.
Further, the step（Three）The thickness of middle paste solder coat is 80 μm.
Further, the step（Four）Middle to control programming rate be 20 DEG C/min, is warming up to 1330 DEG C, is kept the temperature as 15min,
Cooling velocity is 5 DEG C/min.
The present invention is using AuPd solders connection titanacycle and Al2O3Ceramics, by control brazing temperature (1100 ~ 1450 DEG C) and
Soaking time (0 ~ 30min), to ensure that soldered fitting obtains preferable microstructure and performance, is successfully realized titanacycle and Al2O3
The connection of ceramics, and obtain reliable connector.Against existing technologies, the beneficial effects of the invention are as follows：The present invention selects AuPd
Solder, can realize titanacycle and Al2O3The bio-compatibility connection of ceramics, obtains the connector nontoxic to human body.In titanacycle
Ti by with Al2O3Au in Al in ceramics, O and brazed seam, Pd reaction, form compound, realize joint interface it is metallurgical even
Connect.Particularly suitable for Al in artificial retina structure2O3The connection of ceramics/titanacycle.
Embodiment
Technical solution of the present invention is not limited to the embodiment of act set forth below, further include each embodiment it
Between any combination.
Embodiment 1：One kind is using AuPd solders to Al2O3Ceramics and the method for welding of titanacycle, it comprises the following steps：
（One）, prepare solder：For 20 ~ 400nm, mass fraction it is respectively 99% and by granularity in planetary ball mill
1% Au powder and Pd powder mixing, under conditions of rotating speed is 100 revs/min, 0.5 ~ 2h of ball milling, obtains AuPd solders；
（Two）, by titanacycle and Al to be welded2O3Ceramics, which are put into acetone, is cleaned by ultrasonic 5min；
（Three）, obtained AuPd solders are mixed into paste with acetone, and paste solder is coated uniformly on Al2O3Ceramics
Treat on joint face, then titanacycle is placed on coat, forms assembly parts to be welded, wherein, the thickness of paste solder coat is
50μm；
（Four）, the assembly parts to be welded obtained in step 3 are placed in vacuum furnace, when vacuum reaches (1.3 ~
2.0)×10-3During Pa, electrified regulation, it is 10 DEG C/min to control programming rate, is warming up to 1100 DEG C, then keeps the temperature 30min, then control
Cooling velocity processed is 3 DEG C/min, is cooled to 300 DEG C, then furnace cooling again, that is, realize Al2O3Ceramics and the connection of titanacycle.
The defects of connector obtained using present embodiment is completely fine and close, flawless, realizes titanacycle and Al2O3Ceramics
It is reliably connected, meets the application requirement of artificial retina structure.
Embodiment 2：One kind is using AuPd solders to Al2O3Ceramics and the method for welding of titanacycle, it comprises the following steps：
（One）, prepare solder：For 20 ~ 400nm, mass fraction it is respectively 77% and by granularity in planetary ball mill
23% Au powder and Pd powder mixing, under conditions of rotating speed is 300 revs/min, 0.5 ~ 2h of ball milling, obtains AuPd solders；
（Two）, by titanacycle and Al to be welded2O3Ceramics, which are put into acetone, is cleaned by ultrasonic 10min；
（Three）, obtained AuPd solders are mixed into paste with acetone, and paste solder is coated uniformly on Al2O3Ceramics
Treat on joint face, then titanacycle is placed on coat, forms assembly parts to be welded, wherein, the thickness of paste solder coat is
100μm；
（Four）, the assembly parts to be welded obtained in step 3 are placed in vacuum furnace, when vacuum reaches (1.3 ~
2.0)×10-3During Pa, electrified regulation, it is 30 DEG C/min to control programming rate, is warming up to 1450 DEG C, then keeps the temperature, then controls cold
But speed is 10 DEG C/min, is cooled to 300 DEG C, then furnace cooling again, that is, realize Al2O3Ceramics and the connection of titanacycle.
The defects of connector obtained using present embodiment is completely fine and close, flawless, realizes titanacycle and Al2O3Ceramics
It is reliably connected, meets the application requirement of artificial retina structure.
Embodiment 3：One kind is using AuPd solders to Al2O3Ceramics and the method for welding of titanacycle, it comprises the following steps：
（One）, prepare solder：For 20 ~ 400nm, mass fraction it is respectively 88% and by granularity in planetary ball mill
12% Au powder and Pd powder mixing, under conditions of rotating speed is 100 ~ 300 revs/min, 0.5 ~ 2h of ball milling, obtains AuPd solders；
（Two）, by titanacycle and Al to be welded2O3Ceramics, which are put into acetone, is cleaned by ultrasonic 8min；
（Three）, obtained AuPd solders are mixed into paste with acetone, and paste solder is coated uniformly on Al2O3Ceramics
Treat on joint face, then titanacycle is placed on coat, forms assembly parts to be welded, wherein, the thickness of paste solder coat is
80μm；
（Four）, the assembly parts to be welded obtained in step 3 are placed in vacuum furnace, when vacuum reaches (1.3 ~
2.0)×10-3During Pa, electrified regulation, it is 20 DEG C/min to control programming rate, is warming up to 1330 DEG C, then keeps the temperature 15min, then control
Cooling velocity processed is 5 DEG C/min, is cooled to 300 DEG C, then furnace cooling again, that is, realize Al2O3Ceramics and the connection of titanacycle.
The defects of connector obtained using present embodiment is completely fine and close, flawless, realizes titanacycle and Al2O3Ceramics
It is reliably connected.
Embodiment 4：One kind is using AuPd solders to Al2O3Ceramics and the method for welding of titanacycle, it is characterised in that：It includes
Following steps：
（One）, prepare solder：For 20 ~ 400nm, mass fraction it is respectively 80% and by granularity in planetary ball mill
20% Au powder and Pd powder mixing, under conditions of rotating speed is 100 ~ 300 revs/min, 0.5 ~ 2h of ball milling, obtains AuPd solders；
（Two）, by titanacycle and Al to be welded2O3Ceramics, which are put into acetone, is cleaned by ultrasonic 8min；
（Three）, obtained AuPd solders are mixed into paste with acetone, and paste solder is coated uniformly on Al2O3Ceramics
Treat on joint face, then titanacycle is placed on coat, forms assembly parts to be welded, wherein, the thickness of paste solder coat is
80μm；
（Four）, the assembly parts to be welded obtained in step 3 are placed in vacuum furnace, when vacuum reaches (1.3 ~
2.0)×10-3During Pa, electrified regulation, it is 20 DEG C/min to control programming rate, is warming up to 1330 DEG C, then keeps the temperature 15min, then control
Cooling velocity processed is 5 DEG C/min, is cooled to 300 DEG C, then furnace cooling again, that is, realize Al2O3Ceramics and the connection of titanacycle.
The defects of connector obtained using present embodiment is completely fine and close, flawless, realizes titanacycle and Al2O3Ceramics
It is reliably connected.
Embodiment 5：One kind is using AuPd solders to Al2O3Ceramics and the method for welding of titanacycle, it is characterised in that：It includes
Following steps：
（One）, prepare solder：For 20 ~ 400nm, mass fraction it is respectively 85% and by granularity in planetary ball mill
15% Au powder and Pd powder mixing, under conditions of rotating speed is 100 ~ 300 revs/min, 0.5 ~ 2h of ball milling, obtains AuPd solders；
（Two）, by titanacycle and Al to be welded2O3Ceramics, which are put into acetone, is cleaned by ultrasonic 8min；
（Three）, obtained AuPd solders are mixed into paste with acetone, and paste solder is coated uniformly on Al2O3Ceramics
Treat on joint face, then titanacycle is placed on coat, forms assembly parts to be welded, wherein, the thickness of paste solder coat is
60μm；
（Four）, the assembly parts to be welded obtained in step 3 are placed in vacuum furnace, when vacuum reaches (1.3 ~
2.0)×10-3During Pa, electrified regulation, it is 15 DEG C/min to control programming rate, is warming up to 1450 DEG C, then keeps the temperature 18min, then control
Cooling velocity processed is 8 DEG C/min, is cooled to 300 DEG C, then furnace cooling again, that is, realize Al2O3Ceramics and the connection of titanacycle.
The defects of connector obtained using present embodiment is completely fine and close, flawless, realizes titanacycle and Al2O3Ceramics
It is reliably connected, meets the application requirement of artificial retina structure.
Claims (3)
1. one kind is using AuPd solders to Al2 O3 Ceramics and the method for welding of titanacycle, it is characterised in that：It comprises the following steps：
（One）, prepare solder：For 20 ~ 400nm, mass fraction it is respectively 77 ~ 99% and 1 ~ 23% by granularity in planetary ball mill
Au powder and Pd powder mixing, rotating speed be 100 ~ 300 revs/min under conditions of, 0.5 ~ 2h of ball milling, obtains AuPd solders；
（Two）, titanacycle to be welded and Al2O3 ceramics are put into acetone to 5 ~ 10min of ultrasonic cleaning；
（Three）, obtained AuPd solders and acetone be mixed into paste, and paste solder is coated uniformly on Al2O3Ceramics are treated
On joint face, then titanacycle is placed on coat, forms assembly parts to be welded, wherein, the thickness of paste solder coat is 80 μm；
（Four）, the assembly parts to be welded obtained in step 3 are placed in vacuum furnace, when vacuum reach (1.3 ~ 2.0) ×
10-3During Pa, electrified regulation, it is 20 DEG C/min to control programming rate, is warming up to 1330 ~ 1450 DEG C, then keeps the temperature 0 ~ 30min, then
It is 5 DEG C/min to control cooling velocity, is cooled to 300 DEG C, then furnace cooling again, that is, realizes Al in artificial retina2O3Ceramics with
The connection of titanacycle.
2. according to claim 1 use AuPd solders to Al2O3Ceramics and the method for welding of titanacycle, it is characterised in that：Institute
It is respectively 88% and 12% to state the mass fraction of Au powder and Pd powder in AuPd solders.
3. according to claim 1 use AuPd solders to Al2O3Ceramics and the method for welding of titanacycle, it is characterised in that：Institute
State step（Four）Middle to control programming rate be 20 DEG C/min, is warming up to 1330 DEG C, is kept the temperature as 15min, cooling velocity for 5 DEG C/
min。
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|---|---|---|---|
| CN201610039479.9A CN105541368B (en) | 2016-01-21 | 2016-01-21 | One kind is using AuPd solders to Al2O3Ceramics and the method for welding of titanacycle |
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| CN105541368B true CN105541368B (en) | 2018-05-08 |
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| CN106365668A (en) * | 2016-08-19 | 2017-02-01 | 哈尔滨工业大学（威海） | Al2O3 ceramic and titanium ring diffusion connection method |
| CN110683855A (en) * | 2018-07-05 | 2020-01-14 | 哈尔滨工业大学 | Biocompatible Al2O3Method for diffusion bonding of Ti |
| CN110014203A (en) * | 2019-04-04 | 2019-07-16 | 河北躬责科技有限公司 | A kind of ceramics feedthrough, solder and welding method |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1805821A (en) * | 2003-06-17 | 2006-07-19 | 钴碳化钨硬质合金公司 | Coated cutting tool with brazed-in superhard blank |
| CN101890590A (en) * | 2010-07-01 | 2010-11-24 | 哈尔滨工业大学 | Composite soldering material for soldering titanium alloy and ceramic or ceramic matrix composition material and method for soldering by using same |
-
2016
- 2016-01-21 CN CN201610039479.9A patent/CN105541368B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1805821A (en) * | 2003-06-17 | 2006-07-19 | 钴碳化钨硬质合金公司 | Coated cutting tool with brazed-in superhard blank |
| CN101890590A (en) * | 2010-07-01 | 2010-11-24 | 哈尔滨工业大学 | Composite soldering material for soldering titanium alloy and ceramic or ceramic matrix composition material and method for soldering by using same |
Non-Patent Citations (1)
| Title |
|---|
| 氧化铝陶瓷与金属活性钎焊研究进展;王颖等;《第十三次全国焊接学术会议论文 焊接》;20091231(第2期);第56-71页 * |
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