CN105921840B - A kind of soldering processes - Google Patents
A kind of soldering processes Download PDFInfo
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- CN105921840B CN105921840B CN201610389992.0A CN201610389992A CN105921840B CN 105921840 B CN105921840 B CN 105921840B CN 201610389992 A CN201610389992 A CN 201610389992A CN 105921840 B CN105921840 B CN 105921840B
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- soldered elements
- warm area
- temperature
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- brazing material
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
- B23K1/206—Cleaning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/365—Selection of non-metallic compositions of coating materials either alone or conjoint with selection of soldering or welding materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/40—Making wire or rods for soldering or welding
Abstract
A kind of soldering processes, include the following steps：(1) the first soldered elements and the second soldered elements and brazing material to be welded are provided；(2) pre-treatment is carried out to soldered elements；(3) brazing material is injected to the welding position of the first soldered elements and the second soldered elements；(4) the first soldered elements and the second soldered elements for keeping having been injected into brazing material are fixed, and it is made to be heated and be cooled down by heating device, and wherein heating temperature is no more than 180 DEG C；(5) soldered elements are post-processed.Soldering processes provided by the invention can realize the low temperature brazing of such as metal aluminum alloy composite material, ceramics and glass material；The solder used has higher thermal coefficient, simple operation, simple for process, of low cost, effectively raises the product qualification rate of soldering and reduces production cost.
Description
Technical field
The invention belongs to welding technology fields, and in particular to a kind of soldering processes between inorganic non-metallic material.
Background technology
In the prior art, the assembly technology between the light source assembly and lamp housing of LEDbulb lamp is generally viscose glue, sealing and card
A series of assembly techniques such as button.Traditional, lampshade is bonded by glue and pedestal, resistance to although at low cost, simple for process
Warm nature is poor, and being susceptible to cracking after lamps and lanterns are using fever a period of time falls off.And for high-temperature fusion sealing technology,
Outer electrode is fixed by bonding way in this hot environment, also easily causes dead lamp with pedestal disengaging.
Soldering processes are typically considered to that the technological deficiency of the technology types such as viscose glue, sealing, buckle can be made up, thus one
As often applied in industrial production.But existing soldering processes are largely only applicable to metal material, also gradually appear in recent years
A part of inorganic non-metallic material uses the technique of Welding, but all has comparable technology difficulty and higher cost.
Especially, some soldering processes are in hot environment during crossing fluid welding, when welding is related to the shell dress of lamps and lanterns
When with technique, since enclosure interior has encapsulated LED light source block, hot environment damages LED light source, therefore at this
High temperature brazing technique is not applicable under kind technique.
Invention content
In order to overcome the deficiencies of existing technologies, the purpose of the present invention is to provide a kind of assembly technologies of LEDbulb lamp, lead to
Soldering tech is crossed to assemble LEDbulb lamp.Soldering processes provided by the invention can be realized such as metal aluminum alloy composite wood
The low temperature brazing of the materials such as material/ceramic/glass is assembled；The solder used has higher thermal coefficient, simple operation, technique letter
It is single, of low cost, it effectively raises the product qualification rate of soldering assembly and reduces production cost.
The invention is realized in this way a kind of soldering processes, include the following steps：
(1) the first soldered elements and the second soldered elements and brazing material to be welded are provided；
(2) surface preparation is carried out to the first soldered elements and the second soldered elements；
(3) brazing material is injected to the welding position of the first soldered elements and the second soldered elements；
(4) the first soldered elements and the second soldered elements for keeping having been injected into brazing material are fixed, and make it by heating
Device is heated and is cooled down, and heating temperature is no more than 180 DEG C；
(5) to after welding the first soldered elements and the second soldered elements post-process.
The brazing material includes materials described below：
Metal alloy powder 80-90 parts by weight and weld-aiding cream 10-20 parts by weight；
The wherein described metal alloy powder includes materials described below：
Bi is 1-20 parts by weight, and Ag is 0.1-1 parts by weight and Sn is 79-99 parts by weight；
The weld-aiding cream is by rosin and its derivative, polyorganosiloxane resin, tetraethoxysilane, surfactant, antioxygen
One or more compositions in agent and inorganic filler；.
Preferably, the rosin and its derivative are one kind in natural gum rosin, newtrex and part-polymerised rosin
Or it is a variety of；The polyorganosiloxane resin is the one or two of dimethyl silicone polymer and phenyl methyl siloxane homopolymer.
Preferably, the surfactant is one or more in polyoxyethylene carboxylate and triethanolamine.
Preferably, the antioxidant is one or more in benzotriazole and phytic acid.
Preferably, the inorganic filler is SiO2And Al2O3In it is one or more.
Preferably, first soldered elements are Al alloy composite or inorganic non-metallic material, second welding
Element is Al alloy composite or inorganic non-metallic material.
Preferably, the inorganic non-metallic material is ceramics or glass.
Preferably, the heating device in the step (4) is Muffle furnace, baking oven or sintering/soldering/metallization one atmosphere
Meshbeltfurnace.
Preferably, sintering/soldering in the step (4)/metallization one atmosphere meshbeltfurnace include set gradually it is more
A temperature control area and 1 natural cooling area, first soldered elements for having been injected into brazing material and the second soldered elements pass through institute
It is cooled to room temperature again by the natural cooling area after stating multiple temperature control areas.
Preferably, the multiple temperature control area includes the 1st warm area, the 2nd warm area, the 3rd warm area, the 4th warm area, the 5th warm area, the 6th
Warm area, the 7th warm area and the 8th warm area；
By guipure rate control at every 5 minutes by a temperature control area, the 1st warm area temperature is set as 60 DEG C, the 2nd
Warm area set temperature is 90 DEG C, and the 3rd warm area set temperature is 120 DEG C, and the 4th warm area set temperature is 150 DEG C, the 5th temperature
Area's set temperature is 180 DEG C, and the 6th warm area set temperature is 150 DEG C, and the 7th warm area set temperature is 120 DEG C, the 8th warm area
Set temperature is 80 DEG C.
Compared with prior art, the invention has the advantages that：
(1) melting temperature for the solder that soldering processes of the present invention use is relatively low, is 160-180 DEG C, hence it is evident that less than routine
The melting temperature (217 DEG C) of Sn-Pb solders, suitable for metal aluminum alloy composite material, ceramics, especially easily sends out at high temperature
The welding of the materials such as the glass of green material damage so that LEDbulb lamp is assembled at low temperature by soldering；
(2) since the thermal coefficient of solder is up to 30-40W/MK, higher heat conduction is also possessed while assembly connection
Performance, and can be so that being seamlessly connected between the object being brazed, to which the effective heat dissipation of formation is logical by being brazed assembly
Road can allow extra heat in LED light source effectively to conduct so that the service life of LEDbulb lamp and product qualification rate obtain
To promotion.
Description of the drawings
Fig. 1 is that temperature controls process schematic in soldering processes of the present invention.
Specific implementation mode
It below will a kind of soldering processes the present invention will now be described by way of example.Generally, this soldering processes is implemented on metallic aluminium
Between the materials such as alloy composite materials, glass and ceramics.This soldering processes includes the following steps：
(1) the first soldered elements and the second soldered elements and brazing material to be welded are provided；
(2) surface preparation is carried out to the first soldered elements and the second soldered elements；
(3) brazing material is injected to the welding position of the first soldered elements and the second soldered elements；
(4) the first soldered elements and the second soldered elements for keeping having been injected into brazing material are fixed, and make it by heating
Device is heated and is cooled down, and heating temperature is no more than 180 DEG C；
(5) to after welding the first soldered elements and the second soldered elements post-process.
For the brazing material used in above-mentioned soldering processes, the present invention provides following two embodiments.It is appreciated that
It is that this two embodiments are only used for understanding the ingredient of brazing material and manufacturing process, is not used in the limitation present invention.
Brazing material embodiment 1
Embodiment 1
Brazing material includes materials described below：
The weld-aiding cream of the metal alloy powder and 20 parts by weight of 80 parts by weight；
Wherein metal alloy powder is made of materials described below：The bismuth metal Bi, the metallic silver Ag of 1 parts by weight and 98 of 1 parts by weight
The metallic tin Sn of parts by weight；
The purity of above-mentioned bismuth metal is 99.99%；
The purity of above-mentioned metallic silver is 99.99%；
The purity of above-mentioned metallic tin is 99.99%；
Each material weight part is in weld-aiding cream, 4.8 parts by weight of newtrex, 4.8 parts by weight of dimethyl silicone polymer, tetrem
9.6 parts by weight of oxysilane, 0.95 parts by weight of triethanolamine, 0.48 parts by weight of phytic acid, SiO24.37 parts by weight.
The method for preparing brazing material：
Step 1: preparing Sn-Bi alloy intermediates
By Sn and Bi by weight 2：1 weighs 2 parts by weight Sn and 1 parts by weight Bi, is then placed in intermediate-frequency heating furnace and heats
To 455 DEG C, 2.1h is kept the temperature, Sn-Bi alloy intermediates are obtained after being sufficiently stirred, it is spare；
Step 2: preparing Sn-Ag alloy intermediates
By Sn and Ag by weight 5：1 weighs 5 parts by weight Sn and 1 parts by weight Ag, is then placed in heating furnace and is heated to 805
DEG C, 3.1h is kept the temperature, Sn-Ag alloy intermediates are obtained after being sufficiently stirred, it is spare；
Step 3: preparing metal alloy powder
Take 3 parts by weight of Sn-Bi alloys intermediate (wherein Sn accounts for 2 parts by weight, and Bi accounts for 1 parts by weight) and the step in step 1
6 parts by weight of Sn-Ag alloys intermediate (wherein Sn accounts for 5 parts by weight, and Ag accounts for 1 parts by weight) in two, separately take 91 parts by weight Sn, are put into
Melting in stainless-steel pan, is heated to 502 DEG C, keeps the temperature 2.2h, obtains metal alloy, using centrifugal atomization apparatus by metal alloy system
At metal alloy powder.
Step 4: preparing brazing material
Take 4.8 parts by weight of newtrex, 4.8 parts by weight of dimethyl silicone polymer, 9.6 parts by weight of tetraethoxy-silicane, three second
0.95 parts by weight of hydramine, 0.48 parts by weight of phytic acid, SiO24.37 parts by weight sequentially add container heating, temperature control
At 81 DEG C, stirring high speed dispersion 23 minutes to after dissolving are cooled to room temperature.Metal alloy powder and ball milling, ball milling speed control is added
System obtains brazing material at 200-400 revs/min.
The brazing material performance parameter obtained is as shown in table 1：
Table 1
| Performance indicator | Parameter |
| Density (g/cm3) | 8.17-8.20 |
| Fusing point (DEG C) | 170-180 |
| Thermal coefficient (W/MK) | 56-60 |
| Tensile strength (MPa) | 27 |
The brazing material embodiment 2 that the present invention uses
Brazing material includes materials described below：
90 parts by weight of metal alloy powder, 10 parts by weight of weld-aiding cream；
Wherein metal alloy powder is made of materials described below：The Bi of 20 parts by weight, the Ag of 0.1 parts by weight and parts by weight
Sn79.9；
The purity of above-mentioned bismuth metal is 99.99%；
The purity of above-mentioned metallic silver is 99.99%；
The purity of above-mentioned metallic tin is 99.99%；
Each material weight part is in weld-aiding cream, 3.85 parts by weight of newtrex, 3.85 weight of phenyl methyl siloxane homopolymer
Measure part, 0.38 parts by weight of triethanolamine, Al2O31.92 parts by weight.
The method for preparing brazing material：
Step 1: preparing Sn-Bi alloy intermediates
By Sn and Bi by weight 1.5：1 weighs 30 parts by weight Sn and 20 parts by weight Bi, is then placed in intermediate-frequency heating furnace
455 DEG C are heated to, 2.1h is kept the temperature, Sn-Bi alloy intermediates is obtained after being sufficiently stirred, it is spare；
Step 2: preparing Sn-Ag alloy intermediates
By Sn and Ag by weight 4：1 weighs 0.4 parts by weight Sn and 0.1 parts by weight Ag, is then placed in heating furnace and heats
To 805 DEG C, 3.1h is kept the temperature, Sn-Ag alloy intermediates are obtained after being sufficiently stirred, it is spare；
Step 3: preparing brazing material
Take 50 parts by weight of Sn-Bi alloys intermediate (wherein Sn accounts for 30 parts by weight, and Bi accounts for 20 parts by weight) in step 1 and
0.5 parts by weight of Sn-Ag alloys intermediate (wherein Sn accounts for 0.4 parts by weight, and Ag accounts for 0.1 parts by weight) in step 2, separately take 49.5
Parts by weight Sn is put into melting in stainless-steel pan, is heated to 502 DEG C, keeps the temperature 2.2h, obtains metal alloy, is filled using centrifugal atomizing
It sets and metal alloy powder is made in alloy.
Step 4: preparing brazing material
Take 3.85 parts by weight of newtrex, 3.85 parts by weight of phenyl methyl siloxane homopolymer, 0.38 weight of triethanolamine
Part, Al2O31.92 parts by weight sequentially add container heating, and temperature is controlled at 80 DEG C, stirring high speed dispersion 20 minutes to after dissolving,
It is cooled to room temperature.Metal alloy powder and ball milling is added, ball milling speed is controlled at 200-400 revs/min, obtains brazing material.
The brazing material performance parameter obtained is as shown in table 2：
Table 2
| Performance indicator | Parameter |
| Density (g/cm3) | 8.08-8.10 |
| Fusing point (DEG C) | 164-170 |
| Thermal coefficient (W/MK) | 40-47 |
| Tensile strength (MPa) | 27 |
The brazing material melts temperature of the present invention is relatively low so that and LEDbulb lamp can be assembled by soldering, meanwhile, by
It is good in the brazing material thermal conductivity of the present invention, while realizing assembly connection, also possess higher heat conductivility, passes through soldering
Assembly can make to be seamlessly connected between the object being brazed, and to form effective heat dissipation channel, can allow in LED light source and dissipate
The heat of hair effectively conducts, and improves the qualification rate in the service life and production product of bulb lamp.
It is brazed using the brazing material of the present invention, can be applied to ceramic/glass soldering, ceramics/Ceramic brazing, glass
The inorganic non-metallic materials solderings such as glass/glass soldering, can also be applied to metal aluminum alloy composite material/ceramics, metal aluminum alloy
The soldering of the materials such as composite material/glass, metal aluminum alloy composite material/metal aluminum alloy composite material.
Soldering assembly embodiment
The brazing material of the present invention is applied to LEDbulb lamp, LED filament lamp be brazed when assembling, specific implementation step
Suddenly it is：
(1) prepare LEDbulb lamp or LED filament lamp and above-mentioned brazing material；
(2) pretreatment before welding：Welding assembly is cleaned, by the ceramic component of LED light (such as ceramic heat-dissipating
Device) it is put into ceramic cleaning agent, the impurity and greasy dirt on surface are removed within 1-2 minutes by ultrasonic cleaning, then rushed with a large amount of water
It is dried after washing；
(3) ceramic heat sink and glass lamp shade are fixed on rigging position with fixture or other setting tools；
(4) solder is injected into the welding position between ceramic heat sink and glass lamp shade, welding position can be reserved
Brazing material storage tank (such as annular groove etc. around lampshade neck)；
(5) ceramic heat sink and glass lamp shade are put into and are made it through heating device after solder injection, heating device can
For Muffle furnace, baking oven or sintering/soldering/metallization one atmosphere guipure with multiple heating zones and a natural cooling area
Stove.It may be other devices with heating function, can realize and melting is heated and reached to brazing material to be brazed
；
As shown in Figure 1, for temperature controlled processes in preferred soldering processes, wherein abscissa is the time, and ordinate is temperature
Degree.
When being brazed using meshbeltfurnace, preferably 8 temperature control areas and 1 natural cooling area also may be selected to be less than 8 temperature controls
Cooling degree delays, because some inorganic non-metallic materials are such as long as can rise to the melting temperature of brazing material and can delay to rise in area
Glass can have the danger of fragmentation when rising sharply rapid drawdown temperature.
As shown in Figure 1, by guipure rate control at every 5 minutes by a warm area, the 1st warm area temperature is set as 60 DEG C,
2nd warm area set temperature is 90 DEG C, and the 3rd warm area set temperature is 120 DEG C, and the 4th warm area set temperature is 150 DEG C, the 5th
A warm area set temperature is 180 DEG C, and the 6th warm area set temperature is 150 DEG C, and the 7th warm area set temperature is 120 DEG C, the 8th
Warm area set temperature is 80 DEG C.By being cooled to room temperature again by natural cooling area after temperature control area；
(6) it post-processes：To complete assemble welding after ceramic heat sink and glass lamp shade welding position nearby overflow weldering
Material is purged.Alcohol may be used and non-dust cloth removes the solder overflowed, other organic solvents and wiping work can also be used
Tool removes solder.
Soldering processes by above-mentioned brazing material for the present invention, can realize the nonmetallic materials such as composite ceramics/glass
Connection；The melting temperature of above-mentioned brazing material is 160-180 DEG C, is brazed than existing Sn-Pb as a kind of unleaded brazing material
Material melting point is low (fusing point of existing brazing material is generally greater than 217 DEG C), solves this kind of material while reducing brazing temperature
It is difficult to the technological difficulties connected since itself chemical property is stable.
The brazing material melts temperature that the present invention uses is relatively low so that LEDbulb lamp, LED filament lamp etc. can pass through soldering
It is assembled, simultaneously as the brazing material thermal coefficient of the present invention is 30-40W/MK, thermal conductivity is good, is realizing assembly company
While connecing, also possess higher heat conductivility, can make to be seamlessly connected between the object being brazed by being brazed assembly, from
And effective heat dissipation channel is formed, the heat distributed can be allowed effectively to conduct in LED light source, improve the service life of bulb lamp
With the qualification rate of production product.
Finally it should be noted that：Above-described embodiments are merely to illustrate the technical scheme, rather than to it
Limitation；Although the present invention is described in detail referring to the foregoing embodiments, it will be understood by those of ordinary skill in the art that：
It can still modify to the technical solution recorded in previous embodiment, or to which part or all technical features into
Row equivalent replacement；And these modifications or substitutions, it does not separate the essence of the corresponding technical solution various embodiments of the present invention technical side
The range of case.
Claims (9)
1. a kind of soldering processes, include the following steps：
(1) the first soldered elements and the second soldered elements and brazing material to be welded are provided；First soldered elements are
Al alloy composite or inorganic non-metallic material, second soldered elements are Al alloy composite or inorganic non-metallic material
Material；
(2) the first soldered elements and the second soldered elements are cleaned；
(3) the first soldered elements and the second soldered elements are fixed on rigging position with setting tool；
(4) brazing material is injected to the welding position of the first soldered elements and the second soldered elements, the welding position is reserved with
Brazing material storage tank；
(5) the first soldered elements and the second soldered elements for keeping having been injected into brazing material are fixed, and it is made to pass through heating device
It is heated and is cooled down, the heating device, which can rise to the melting temperature of brazing material and can delay to rise, delays cooling degree；
(6) solder overflowed to the welding position of the first soldered elements and the second soldered elements after welding is purged；It is special
Sign is：Heating temperature is no more than 180 DEG C；
The brazing material includes materials described below：
Metal alloy powder 80-90 parts by weight and weld-aiding cream 10-20 parts by weight；
The wherein described metal alloy powder includes materials described below：
Bi is 1-20 parts by weight, and Ag is 0.1-1 parts by weight and Sn is 79-99 parts by weight；
The weld-aiding cream is by rosin and its derivative, polyorganosiloxane resin, tetraethoxysilane, surfactant, antioxidant
With one or more compositions in inorganic filler.
2. soldering processes according to claim 1, it is characterised in that：The rosin and its derivative be natural gum rosin,
It is one or more in newtrex and part-polymerised rosin；The polyorganosiloxane resin is dimethyl silicone polymer and phenyl first
The one or two of radical siloxane homopolymer.
3. soldering processes according to claim 1, it is characterised in that：The surfactant is polyoxyethylene carboxylate
With it is one or more in triethanolamine.
4. soldering processes according to claim 1, it is characterised in that：The antioxidant is benzotriazole and phytic acid
In it is one or more.
5. soldering processes according to claim 1, it is characterised in that：The inorganic filler is SiO2And Al2O3In one kind
Or it is a variety of.
6. soldering processes according to claim 1, it is characterised in that：The inorganic non-metallic material is ceramics or glass.
7. soldering processes according to claim 1, it is characterised in that：Heating device in the step (5) be Muffle furnace,
Baking oven or sintering/soldering/metallization one atmosphere meshbeltfurnace.
8. soldering processes according to claim 7, it is characterised in that：Sintering/soldering/metallization in the step (5)
Integrated atmosphere meshbeltfurnace includes the multiple temperature control areas set gradually and 1 natural cooling area, described to have been injected into the of brazing material
One soldered elements and the second soldered elements by the natural cooling area by being cooled to room temperature again after the multiple temperature control area.
9. soldering processes according to claim 8, it is characterised in that：The multiple temperature control area includes the 1st warm area, the 2nd temperature
Area, the 3rd warm area, the 4th warm area, the 5th warm area, the 6th warm area, the 7th warm area and the 8th warm area；Guipure rate control was led at every 5 minutes
A temperature control area is crossed, the 1st warm area temperature is set as 60 DEG C, and the 2nd warm area set temperature is 90 DEG C, the 3rd warm area setting
Temperature is 120 DEG C, and the 4th warm area set temperature is 150 DEG C, and the 5th warm area set temperature is 180 DEG C, the 6th warm area setting temperature
Degree is 150 DEG C, and the 7th warm area set temperature is 120 DEG C, and the 8th warm area set temperature is 80 DEG C.
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| CN113084290B (en) * | 2021-03-15 | 2023-04-28 | 武汉华工激光工程有限责任公司 | Laser soldering system and method |
| CN114799475A (en) * | 2022-04-14 | 2022-07-29 | 哈尔滨工业大学 | Method for low-temperature direct brazing of nonmetal and metal by using commercial inactive brazing filler metal |
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| CN101491866A (en) * | 2008-01-25 | 2009-07-29 | 深圳市亿铖达工业有限公司 | Low-temperature leadless cored solder alloy and produced solder paste |
| CN104668818A (en) * | 2015-01-16 | 2015-06-03 | 北京鹏瑞中联科技有限公司 | Low-voidage soldering paste for packaging semiconductor chip and preparation method of low-voidage soldering paste |
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