CN101491866A - Low-temperature leadless cored solder alloy and produced solder paste - Google Patents
Low-temperature leadless cored solder alloy and produced solder paste Download PDFInfo
- Publication number
- CN101491866A CN101491866A CN 200810065651 CN200810065651A CN101491866A CN 101491866 A CN101491866 A CN 101491866A CN 200810065651 CN200810065651 CN 200810065651 CN 200810065651 A CN200810065651 A CN 200810065651A CN 101491866 A CN101491866 A CN 101491866A
- Authority
- CN
- China
- Prior art keywords
- solder
- low
- alloy
- solder alloy
- ing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Abstract
The invention discloses a low-temperature lead-free brazing solder alloy and soldering paste made of thereof. As an SMT solder, the low-temperature lead-free brazing solder alloy is improved by adding 0.2 to 6 weight percent of Ag or 0.1 to 3 weight percent of Cu into a system which takes Sn-58Bi as a main component. The solder alloy after the improvement improves wetting property and welding spot strength. The soldering paste of solder alloy powder containing the Ag and the Cu can provide good wettability and reliability, meet the requirements of a solder alloy and soldering paste needed by SMT, and is particularly applicable to occasions where the low-temperature application is needed.
Description
Technical field
The present invention relates to a kind of low temperature lead-free solder alloy, relate in particular to a kind of solder(ing) paste made from this solder alloy composition.
Background technology
Along with the enhancing of people's environmental consciousness, the Sn-Pb soft soldering alloy that tradition is adopted in the electronics industry begins to be replaced by no-lead soft soldering gradually.
In presently used no-lead soft soldering, composition is mainly Sn-Cu, Sn-Ag and Sn-Ag-Cu system.Based on these systems, can improve the performance of solder alloy by the interpolation alloying element.For example on Sn-Ag (3.5-6.0%) basis, add micro-Ni to suppress the diffusion of Cu in soldering alloy.Japan Nihon proposes the leadless solder be made up of Sn-(0.3-0.7) Cu-(0.04-0.1) Ni on the basis of SnCu eutectic composition in U.S. Pat 6180055, element Ni can suppress the dissolving of Cu in fusion welding, reduces the dissolution velocity of Cu in molten solder and the possibility of bridging generation.
The fusing point of these solder compositions between 217-227 ℃, is higher than the Sn-37Pb scolder fusing point (183 ℃) that tradition is used far away respectively.In use, this just needs the wave-soldering tin-soldering temperature is 250-265 ℃, and peak temperature is 240-245 ℃ in the reflow process.Particularly in the SMT reflow process, used solder(ing) paste, solder(ing) paste contains and the mixed uniformly solder powder of scaling powder, particularly the solder powder that mixes with rosin flux homogeneous.Usually, in reflow soldering, by printing or dispersion, solder(ing) paste is provided on the printed circuit board (PCB), utilizes the adhesive attraction of solder(ing) paste, the electronic component of chip type is adsorbed temporarily and is connected on the printed circuit board (PCB).Therefore, in reflow soldering, electronic components mounted to be exposed under the welding temperature equally.So high welding temperature all is huge tests to the even heating efficiency of welding equipment and the temperature capacity of components and parts.
Given this, it is US6503338 that the patent No. has been declared by Japanese Senju company, and composition is the leadless welding alloy of Sn-8Zn-3Bi, and fusing point is 192-197 ℃, approaches the fusing point of Sn-37Pb scolder.Yet, up to now, still have components and parts still can not bear so high welding temperature, need to use the lower solder alloy of fusing point.Therefore the Sn-Bi brazing filler metal alloy just becomes a kind of selection, and the fusing point of Sn-58Bi eutectic solder is 138 ℃, can satisfy the requirement of welding temperature.But Bi is a kind of alloying element of easy oxidation, the scaling powder of Sn-Bi solder alloy is had relatively high expectations, and fusion welding is relatively poor along the climbing ability of components and parts pin and the wettability on pad in the welding process the corresponding intensity that also reduces solder joint.
As countermeasure,, can wherein add other alloying element in the past and improve its performance in order to improve these bad shortcomings of Sn-Bi solder alloy.
Summary of the invention
The object of the present invention is to provide a kind of low-temperature lead-free soft soldering alloy and based on a kind of lead-free tin cream preparation method of this solder alloy composition.
A kind of low-temperature lead-free cored solder alloy of the present invention and the solder(ing) paste of making thereof, solder(ing) paste includes this low-temperature lead-free cored solder alloy and as the solder paste of solder flux, this low-temperature lead-free cored solder alloy is to add alloying element Ag and Cu in existing Sn-Bi solder system, the percentage by weight component of wherein middle Sn, Bi, Ag is respectively: Sn accounts for 35-65%, Bi accounts for 35-65%, Ag accounts for 0.2-6%, also contain Cu in the brazing filler metal alloy powder of this low-temperature lead-free cored solder alloy, its percentage by weight component is 0.1-3.0%.
The brazing filler metal alloy powder of above-mentioned low-temperature lead-free cored solder alloy contains Sn, Bi, Ag and the Cu in its amount of powder, and the percentage by weight component that this Sn, Bi, Ag and Cu are is 88-91%.
Above-mentioned Sn-58Bi is the brazing filler metal alloy powder, and with Sn-3.5Ag brazing filler metal alloy powder and Sn-3.8Ag-0.7Cu brazing filler metal alloy powder being 65-90% according to the Sn-58Bi percentage by weight, the Sn-3.5Ag percentage by weight is 8-20%, and the ratio of Sn-3.8Ag-0.7Cu percentage by weight 4-10% is evenly mixed
Leadless solder involved in the present invention does not use the lead of hypertoxicity in the basic composition as solder, belong to feature of environmental protection leadless solder.
Leadless solder involved in the present invention, fusing point weld needed temperature between 170-195 ℃ between 138-155 ℃, well below the Welding Problems of traditional Sn-37Pb and Sn-Cu, Sn-Ag, Sn-Ag-Cu no-lead soft soldering.Requirement to welding equipment heating efficiency and components and parts heat resisting temperature reduces greatly.
Describe effect and the optimum content thereof that respectively adds element in the present embodiment below in detail.
Add Bi and can form binary low melting point eutectic scolder at 58wt.%Bi, 138 ℃ the time with Sn.Bismuth element is to form the basic of solder alloy with tin element.The preferable range of bi content is 40-60wt.%, and preferred content range is 45-60wt.%.
Add Ag and can improve the wetability of solder alloy, the intensity of solder joint, under the condition that 0.2-6.0wt.%Ag exists, also change the fusing point of Sn-Bi solder alloy indistinctively, thereby do not influence the low melting point or the low-temperature characteristics of the leadless solder of being invented.The preferable range of silver content is 0.5-4wt.%, and preferred content range is 0.5-3wt.%.
Add Cu and can further improve the intensity of solder alloy and the intensity of the solder joint that forms.The preferable range of copper content is 0.1-2.0wt.%, and preferred content range is 0.1-1.0wt.%.
Lead-free brazing of the present invention with above-mentioned composition can be smelted by conventional method, and promptly Sn, Bi, Ag, Cu heat in crucible and stirring with the raw metal supply, and casting can obtain brazing filler metal alloy.Brazing filler metal alloy of the present invention can be processed to form the form of soldering tin bar, scolding tin rod, solder stick, solder ball and solder(ing) paste etc. by traditional handicraft, thereby can satisfy needed brazing filler metal alloys such as PCB assembling, SMT microelectronics surface encapsulation and surface mount, particularly need the occasion of cryogenic applications.
The solder(ing) paste that uses in SMT is by mixing the manufacturings of solder powder and weld-aiding cream.The typical system of weld-aiding cream is the abietyl weld-aiding cream, this abietyl weld-aiding cream be by with rosin as key component, for example thixotropic agent, activator are dissolved in solvent and form with other additive.Weld-aiding cream requires to have insulating properties and corrosion resistance highly reliably.The solder powder of leadless solder of the present invention with above-mentioned composition is except as stated above directly by pure Sn, Bi, Ag, dust after the Cu metal molten is smelted make outside, provide a kind of preparation method of the solder(ing) paste based on this solder alloy composition below: Sn-3.5Ag or other Sn Ag composition and Sn-58Bi or other Sn-Bi composition, or Sn-Ag-Cu and Sn-58Bi or other Sn-Bi composition, or Sn-3.5Ag or other Sn-Ag composition, Sn-0.7Cu or other Sn-Cu composition mix in proportion with the solder powder of Sn-58Bi or other Sn-Bi composition, thereby obtain having the Sn-Ag-Bi or the Sn-Ag-Cu-Bi solder powder of above-mentioned composition respectively.In this inventive method, the relatively easy patent composition of making and can not invade others of Sn-3.5Ag or other Sn-Ag composition, Sn-0.7Cu or other Sn-Cu composition, Sn-Ag-Cu, Sn-58Bi or other Sn-Bi composition, on market, purchase easily, thereby can make the solder(ing) paste of leadless solder of the present invention easily with above-mentioned composition.
Description of drawings
Fig. 1 by embodiment 1, embodiment 2 and Comparative Examples 1 the wettability equilibrium curve of description soft soldering alloy under 180 ℃;
Fig. 2 is a low temperature reflux welding temperature curve;
Fig. 3 is a high temperature reflux welding temperature curve;
Fig. 4 is a QFP pin pull-off strength test method.
The specific embodiment
According to present embodiment in detail the present invention is described in detail, but the scope of the invention is not the embodiment that is limited to here to be proposed.In the following description, the percentage all about alloying component all is percetage by weight.
Embodiment 1, and leadless solder is by 58%Bi, 1%Ag, and remainder is that 41%Sn forms.
Embodiment 3, spherical powder with 75%, 15% thoroughly mixes to prepare solder(ing) paste with 10% weld-aiding cream based on rosin based on the spherical powder of Sn-3.5Ag leadless welding alloy based on the Sn-58Bi leadless welding alloy, described solder(ing) paste has 48.33%Bi, 0.583%Ag, remainder is the soldering alloy composition that 51.087%Sn forms, and solder powder proportion in solder(ing) paste is 90%.Described weld-aiding cream is based on following composition, belong to typical abietyl system: 45% Foral, 45% propylene glycol monomethyl ether, 2% diphenylguanidine HBr, 5% modified hydrogenated castor oil, 1% malonic acid, 2% dibromo butene glycol, dissolve making fully through heating and obtain, weld-aiding cream proportion in solder(ing) paste is 10%.
Comparative Examples 1, leadless solder are by 58%Bi, and remainder is 42%Sn.
Comparative Examples 2, the spherical powder based on the Sn-58Bi leadless welding alloy with 90% mixes with the preparation solder(ing) paste with 10% the weld-aiding cream based on rosin is thorough.Described weld-aiding cream is based on following composition, belong to typical abietyl system: 45% Foral, 45% propylene glycol monomethyl ether, 2% diphenylguanidine HBr, 5% modified hydrogenated castor oil, 1% malonic acid, 2% dibromo butene glycol, dissolve making fully through heating and obtain.
(1) wetting test
According to the 4th part among the JIS Z3198 of Japanese Industrial Standards " lead-free solder test method " " based on the wettability test method of wettability equilibrium method and contact horn cupping " to embodiment 1 and 2 and the leadless solder that obtains of Comparative Examples 1 adopt the wettability equilibrium instrument to carry out the wetability test.Testing substrates is the Cu plate, adopts active abietyl scaling powder, and test result is seen Fig. 1.
The time that intersects of curve and abscissa is represented the wetting time of soft soldering alloy in the wettability equilibrium curve, the maximum wetting power of it and curve characterizes out the wettability of soft soldering alloy jointly, wetting time is short more, wetting power is big more, shows that the wetability of soft soldering alloy is good more.The wetting time and the wetting power of embodiment 1 described solder alloy are respectively 0.751s and 3.53mN, and the wetting time and the wetting power of embodiment 2 described solder alloys are respectively 0.673s and 3.47mN.The wetting time and the wetting power of Comparative Examples 1 described solder alloy are respectively 0.797s and 2.73mN.Embodiment 1 and 2 has shorter wetting time and the wetting power of Geng Gao than Comparative Examples 1, has reflected that the more traditional Sn-58Bi solder alloy of solder alloy described in the invention has better wetability.
(2) Reflow Soldering temperature curve
With embodiment 3 and 4 and the solder(ing) pastes that obtain of Comparative Examples 2 and 3 by serigraphy on pcb board, the last corresponding pad of PCB is that 208 pins, spacing are the standard QFP pad of 0.4mm, stick the QFP components and parts then, cross reflow soldering and weld also slowdown monitoring circuit plate surface Reflow Soldering temperature curve, realize that the temperature curve of good welding is seen Fig. 2 and Fig. 3.The Sn-Bi base solder(ing) paste that embodiment 3, embodiment 4 and Comparative Examples 2 obtain is under the temperature described in Fig. 2, and solder alloy melts, and has realized the good welding between QFP components and parts and pcb board pad.And the Sn-Ag-Cu base leadless soldering tin paste that Comparative Examples 3 obtains need could be realized molten solder under temperature curve that Fig. 3 describes.The peak temperature that Fig. 2 and Fig. 3 describe the Reflow Soldering temperature curve is respectively 180-190 ℃ and 245 ℃.Illustrate that soft soldering alloy described in the invention is a kind of solder alloy, its welding peak temperature is less than 200 ℃, and the welding temperature of more conventional Sn-Ag-Cu leadless welding alloy is hanged down about 50 ℃.Therefore, adopt solder alloy described in the invention that the heating efficiency of welding equipment and the heat-resisting requirement of components and parts are reduced greatly.
(3) pull-off strength of solder joint that solder alloy forms
According to the 6th part among the JISZ3198 of Japanese Industrial Standards " lead-free solder test method " " the miter angle pull-off test method of QFP lead solder-joint " to embodiment 3 and 4 and the no-lead soft soldering solder(ing) paste that obtains of Comparative Examples 2 after above-mentioned reflow soldering, the printed circuit board (PCB) level QFP assembly that obtains is fixed on the particular jig, then stretch to measure the intensity of solder joint, as Fig. 4 along the miter angle method.
Table 1 provided embodiment 3 and 4 and the no-lead soft soldering solder(ing) paste that obtains of Comparative Examples 2 through 45 degree tensile strength test results of QFP pin after the reflow soldering.As can be seen, reaching based on the Sn-Ag-Bi leadless solder that the present invention describes has higher pull-off strength based on the formed QFP solder joint of the more traditional Sn-58Bi leadless solder of the formed QFP solder joint of Sn-Ag-Cu-Bi leadless solder.
The pull-off strength result of table 1 solder alloy
Claims (5)
1, a kind of low-temperature lead-free cored solder alloy and the solder(ing) paste made thereof, solder(ing) paste includes this low-temperature lead-free cored solder alloy and as the solder paste of solder flux, it is characterized in that described low-temperature lead-free cored solder alloy is to add alloying element Ag and Cu in existing Sn-Bi solder system.
2, low-temperature lead-free cored solder alloy according to claim 1 and the solder(ing) paste made thereof, it is characterized in that, the percentage by weight component of Sn, Bi, Ag is respectively in the brazing filler metal alloy powder of this low-temperature lead-free cored solder alloy: Sn accounts for 35-65%, and Bi accounts for 35-65%, and Ag accounts for 0.2-6%.
3, low-temperature lead-free cored solder alloy according to claim 1 and the solder(ing) paste made thereof is characterized in that also contain Cu in the brazing filler metal alloy powder of this low-temperature lead-free cored solder alloy, its percentage by weight component is 0.1-3.0%.
4, low-temperature lead-free cored solder alloy according to claim 1 and the solder(ing) paste made thereof, it is characterized in that, the brazing filler metal alloy powder of described low-temperature lead-free cored solder alloy contains Sn, Bi, Ag and the Cu in its amount of powder, and the percentage by weight component that this Sn, Bi, Ag and Cu are is 88-91%.
5, low-temperature lead-free cored solder alloy according to claim 1 and the solder(ing) paste made thereof, it is characterized in that, above-mentioned Sn-58Bi is the brazing filler metal alloy powder, and with Sn-3.5Ag brazing filler metal alloy powder and Sn-3.8Ag-0.7Cu brazing filler metal alloy powder being 65-90% according to the Sn-58Bi percentage by weight, the Sn-3.5Ag percentage by weight is 8-20%, and the ratio of Sn-3.8Ag-0.7Cu percentage by weight 4-10% is evenly mixed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200810065651.3A CN101491866B (en) | 2008-01-25 | 2008-01-25 | Low-temperature leadless cored solder alloy and produced solder paste |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200810065651.3A CN101491866B (en) | 2008-01-25 | 2008-01-25 | Low-temperature leadless cored solder alloy and produced solder paste |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101491866A true CN101491866A (en) | 2009-07-29 |
| CN101491866B CN101491866B (en) | 2014-06-04 |
Family
ID=40922751
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200810065651.3A Active CN101491866B (en) | 2008-01-25 | 2008-01-25 | Low-temperature leadless cored solder alloy and produced solder paste |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101491866B (en) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102909362A (en) * | 2012-10-15 | 2013-02-06 | 江苏博迁光伏材料有限公司 | Sub-micron solder alloy powder and preparation method thereof |
| CN104043911A (en) * | 2014-06-27 | 2014-09-17 | 深圳市汉尔信电子科技有限公司 | Lead-free solder capable of achieving evenly organized soldering spots and soldering method thereof |
| CN104956779A (en) * | 2013-01-28 | 2015-09-30 | 凸版印刷株式会社 | Wiring substrate and method for manufacturing same |
| CN104942461A (en) * | 2015-04-14 | 2015-09-30 | 中山市智牛电子有限公司 | Tin paste preparation method |
| CN105880872A (en) * | 2016-06-03 | 2016-08-24 | 广东昭信照明科技有限公司 | Brazing material and preparing method thereof |
| CN105921840A (en) * | 2016-06-03 | 2016-09-07 | 广东昭信照明科技有限公司 | Brazing technique |
| CN106180939A (en) * | 2016-08-05 | 2016-12-07 | 苏州锡友微连电子科技有限公司 | The soldering paste of laser reflow weldering |
| CN106271217A (en) * | 2016-09-23 | 2017-01-04 | 工业和信息化部电子第五研究所华东分所 | A kind of disposable halogen-free scaling powder and low temperature solder stick |
| CN107088716A (en) * | 2017-07-03 | 2017-08-25 | 中山翰华锡业有限公司 | A kind of environment-friendly low-temperature noresidue tin cream and preparation method thereof |
| JP2018202472A (en) * | 2017-06-08 | 2018-12-27 | 株式会社タムラ製作所 | Lead-free solder alloy |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3622462B2 (en) * | 1997-12-16 | 2005-02-23 | 株式会社日立製作所 | Semiconductor device |
| JP2002001573A (en) * | 2000-06-16 | 2002-01-08 | Nippon Handa Kk | Leadless cream solder and bonding method using the same |
-
2008
- 2008-01-25 CN CN200810065651.3A patent/CN101491866B/en active Active
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102909362A (en) * | 2012-10-15 | 2013-02-06 | 江苏博迁光伏材料有限公司 | Sub-micron solder alloy powder and preparation method thereof |
| CN102909362B (en) * | 2012-10-15 | 2015-11-18 | 江苏博迁新材料有限公司 | Sub-micron solder alloy powder and preparation method thereof |
| CN104956779A (en) * | 2013-01-28 | 2015-09-30 | 凸版印刷株式会社 | Wiring substrate and method for manufacturing same |
| CN104956779B (en) * | 2013-01-28 | 2018-02-13 | 凸版印刷株式会社 | Circuit board and its manufacture method |
| CN104043911A (en) * | 2014-06-27 | 2014-09-17 | 深圳市汉尔信电子科技有限公司 | Lead-free solder capable of achieving evenly organized soldering spots and soldering method thereof |
| CN104942461A (en) * | 2015-04-14 | 2015-09-30 | 中山市智牛电子有限公司 | Tin paste preparation method |
| CN105921840A (en) * | 2016-06-03 | 2016-09-07 | 广东昭信照明科技有限公司 | Brazing technique |
| CN105880872A (en) * | 2016-06-03 | 2016-08-24 | 广东昭信照明科技有限公司 | Brazing material and preparing method thereof |
| CN105921840B (en) * | 2016-06-03 | 2018-08-14 | 广东昭信照明科技有限公司 | A kind of soldering processes |
| CN106180939A (en) * | 2016-08-05 | 2016-12-07 | 苏州锡友微连电子科技有限公司 | The soldering paste of laser reflow weldering |
| CN106271217A (en) * | 2016-09-23 | 2017-01-04 | 工业和信息化部电子第五研究所华东分所 | A kind of disposable halogen-free scaling powder and low temperature solder stick |
| JP2018202472A (en) * | 2017-06-08 | 2018-12-27 | 株式会社タムラ製作所 | Lead-free solder alloy |
| CN107088716A (en) * | 2017-07-03 | 2017-08-25 | 中山翰华锡业有限公司 | A kind of environment-friendly low-temperature noresidue tin cream and preparation method thereof |
| CN107088716B (en) * | 2017-07-03 | 2020-01-24 | 中山翰华锡业有限公司 | Environment-friendly low-temperature residue-free solder paste and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101491866B (en) | 2014-06-04 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101491866B (en) | Low-temperature leadless cored solder alloy and produced solder paste | |
| JP5553181B2 (en) | No-clean lead-free solder paste | |
| JP4613823B2 (en) | Solder paste and printed circuit board | |
| JP3622788B2 (en) | Lead-free solder alloy | |
| EP2017031B1 (en) | Solder paste | |
| JP5238088B1 (en) | Solder alloy, solder paste and electronic circuit board | |
| JP3753168B2 (en) | Solder paste for joining microchip components | |
| CN101653876B (en) | Low-silver halogen free soldering paste | |
| KR101738841B1 (en) | HIGH-TEMPERATURE SOLDER JOINT COMPRISING Bi-Sn-BASED HIGH-TEMPERATURE SOLDER ALLOY | |
| CN101462209A (en) | Common resin type soldering flux without halogen suitable for low-silver leadless solder paste | |
| JP2012106280A (en) | Low silver solder alloy and solder paste composition | |
| CN101348875A (en) | Tin, bismuth and copper type low temperature lead-free solder alloy | |
| CN103341699A (en) | Unleaded Sn-In-Ag brazing filler metal replacing tin-lead brazing filler metal | |
| KR20230153507A (en) | Lead-free solder compositions | |
| JP3312618B2 (en) | How to supply additional solder to the solder bath | |
| JP2010029868A (en) | Lead-free solder paste, electronic circuit board using the same, and method for manufacturing the same | |
| CN101569966A (en) | Method for preparing lead-free tin cream and soldering flux thereof | |
| US7282174B2 (en) | Lead-free solder and soldered article | |
| TW201943861A (en) | Solder paste | |
| WO1999004048A1 (en) | Tin-bismuth based lead-free solders | |
| CN111230355B (en) | Lead-free solder alloy | |
| JP4396162B2 (en) | Lead-free solder paste | |
| JP6619387B2 (en) | Lead-free solder alloy | |
| CN1442272A (en) | Leadless soft brazing alloy for wave crest soldering | |
| JP2019155465A (en) | Solder paste for chip component joining |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C57 | Notification of unclear or unknown address | ||
| DD01 | Delivery of document by public notice |
Addressee: Ye Hui Document name: Notification of Passing Preliminary Examination of the Application for Invention |
|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |