JPS57160594A - Soldering alloy for preventing silver-disolving - Google Patents

Soldering alloy for preventing silver-disolving

Info

Publication number
JPS57160594A
JPS57160594A JP4811381A JP4811381A JPS57160594A JP S57160594 A JPS57160594 A JP S57160594A JP 4811381 A JP4811381 A JP 4811381A JP 4811381 A JP4811381 A JP 4811381A JP S57160594 A JPS57160594 A JP S57160594A
Authority
JP
Japan
Prior art keywords
silver
disolving
soldering
rare earth
earth element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4811381A
Other languages
Japanese (ja)
Inventor
Ikuo Sasaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NIPPON GENMA KK
Nihon Genma KK
Original Assignee
NIPPON GENMA KK
Nihon Genma KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NIPPON GENMA KK, Nihon Genma KK filed Critical NIPPON GENMA KK
Priority to JP4811381A priority Critical patent/JPS57160594A/en
Publication of JPS57160594A publication Critical patent/JPS57160594A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PURPOSE:To prevent a silver-disolving of soldering of a silver-plated part, by adding a specific quantity of a rare earth element which is comparative inexpensive innoxious for the health, to an Sn-Pb or Sn-Pb-Ag alloy soldering base materials. CONSTITUTION:In case when soldering has been performed to silver-plated electronic parts by adding 0.1-1.0wt% rare earth element to Sn-Pb or Sn-Pb-Ag alloy solders, it is prevented that soldering strength drops due to a silver-disolving phenomenon. As for this rare earth element, a cerium mishmash metal consisting of about 48,05wt% Ce, about 31.94% La, about 4.55% Pr, about 15.08% Nd and about 0.34% Sm is used preferably from the viewpoint of its cost. Said rare earth element preventes generation of a silver disolving phenomenon, instead of expensive Ag, or Cr which is noxious for the health.
JP4811381A 1981-03-30 1981-03-30 Soldering alloy for preventing silver-disolving Pending JPS57160594A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4811381A JPS57160594A (en) 1981-03-30 1981-03-30 Soldering alloy for preventing silver-disolving

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4811381A JPS57160594A (en) 1981-03-30 1981-03-30 Soldering alloy for preventing silver-disolving

Publications (1)

Publication Number Publication Date
JPS57160594A true JPS57160594A (en) 1982-10-02

Family

ID=12794255

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4811381A Pending JPS57160594A (en) 1981-03-30 1981-03-30 Soldering alloy for preventing silver-disolving

Country Status (1)

Country Link
JP (1) JPS57160594A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001034860A1 (en) * 1999-11-08 2001-05-17 Euromat Gesellschaft Für Werkstofftechnologie Und Transfer Mbh Soldering alloy
EP1647352A1 (en) * 2004-10-16 2006-04-19 Stannol GmbH Solder material
CN100366376C (en) * 2005-12-23 2008-02-06 南京航空航天大学 Leadless brazing filler metal containing cerium
WO2008084603A1 (en) * 2007-01-11 2008-07-17 Topy Kogyo Kabushiki Kaisha Manual soldering lead-free solder alloy
JP2008188672A (en) * 2007-01-11 2008-08-21 Topy Ind Ltd Manual soldering lead-free solder alloy

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001034860A1 (en) * 1999-11-08 2001-05-17 Euromat Gesellschaft Für Werkstofftechnologie Und Transfer Mbh Soldering alloy
EP1647352A1 (en) * 2004-10-16 2006-04-19 Stannol GmbH Solder material
CN100366376C (en) * 2005-12-23 2008-02-06 南京航空航天大学 Leadless brazing filler metal containing cerium
WO2008084603A1 (en) * 2007-01-11 2008-07-17 Topy Kogyo Kabushiki Kaisha Manual soldering lead-free solder alloy
JP2008188672A (en) * 2007-01-11 2008-08-21 Topy Ind Ltd Manual soldering lead-free solder alloy

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