GB2367834A - Solder alloy - Google Patents

Solder alloy

Info

Publication number
GB2367834A
GB2367834A GB0201171A GB0201171A GB2367834A GB 2367834 A GB2367834 A GB 2367834A GB 0201171 A GB0201171 A GB 0201171A GB 0201171 A GB0201171 A GB 0201171A GB 2367834 A GB2367834 A GB 2367834A
Authority
GB
United Kingdom
Prior art keywords
amount
flux
solder alloy
voc
tin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GB0201171A
Other versions
GB0201171D0 (en
GB2367834B (en
Inventor
Hector Andrew Hamilton Steen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Multicore Solders Ltd
Original Assignee
Multicore Solders Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Multicore Solders Ltd filed Critical Multicore Solders Ltd
Publication of GB0201171D0 publication Critical patent/GB0201171D0/en
Publication of GB2367834A publication Critical patent/GB2367834A/en
Application granted granted Critical
Publication of GB2367834B publication Critical patent/GB2367834B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

A lead-free solder alloy suitable for use in wave soldering and, in particular with water base VOC-free flux, low-VOC (water base) flux and low solids (solvent base flux consists of tin to which is/are added one or more of Ag in an amount of up to 10 %. Cu in an amount of up to 5 %. Sb in an amount of up to 10 % and Bi in an amount of up to 10 %, which alloy additionally contains phosphorus in an amount of up to 0.01 %. all percentages being on weight basis related to the amount of tin.
GB0201171A 1999-07-07 2000-06-29 Solder alloy Expired - Fee Related GB2367834B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GBGB9915954.3A GB9915954D0 (en) 1999-07-07 1999-07-07 Solder alloy
PCT/GB2000/002502 WO2001003878A1 (en) 1999-07-07 2000-06-29 Solder alloy

Publications (3)

Publication Number Publication Date
GB0201171D0 GB0201171D0 (en) 2002-03-06
GB2367834A true GB2367834A (en) 2002-04-17
GB2367834B GB2367834B (en) 2003-07-23

Family

ID=10856849

Family Applications (2)

Application Number Title Priority Date Filing Date
GBGB9915954.3A Ceased GB9915954D0 (en) 1999-07-07 1999-07-07 Solder alloy
GB0201171A Expired - Fee Related GB2367834B (en) 1999-07-07 2000-06-29 Solder alloy

Family Applications Before (1)

Application Number Title Priority Date Filing Date
GBGB9915954.3A Ceased GB9915954D0 (en) 1999-07-07 1999-07-07 Solder alloy

Country Status (3)

Country Link
AU (1) AU5556800A (en)
GB (2) GB9915954D0 (en)
WO (1) WO2001003878A1 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW592872B (en) 2001-06-28 2004-06-21 Senju Metal Industry Co Lead-free solder alloy
ATE500018T1 (en) 2002-01-10 2011-03-15 Senju Metal Industry Co SOLDERING PROCESS WITH ADDITIONAL SUPPLY OF SOLDER CONTAINING ANTI-OXIDATION
DE10319888A1 (en) 2003-04-25 2004-11-25 Siemens Ag Solder material based on SnAgCu
ATE555871T1 (en) 2003-10-07 2012-05-15 Senju Metal Industry Co LEAD-FREE SOLDER BALL
CZ2005659A3 (en) * 2005-10-19 2007-01-10 JenĂ­k@Jan Lead-free solder
JP6011709B1 (en) * 2015-11-30 2016-10-19 千住金属工業株式会社 Solder alloy

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6186091A (en) * 1984-10-03 1986-05-01 Furukawa Electric Co Ltd:The Sn-sb alloy solder
DE3730764C1 (en) * 1987-09-12 1988-07-14 Demetron Use of tin and / or lead alloys as soft solders to apply semiconductors to metallic substrates
EP0336575A1 (en) * 1988-03-31 1989-10-11 COOKSON GROUP plc Low toxicity alloy compositions for joining and sealing
JPH1034376A (en) * 1996-07-26 1998-02-10 Nippon Genma:Kk Lead-free solder
JPH10225790A (en) * 1997-02-15 1998-08-25 Samsung Electron Co Ltd Lead-free alloy for soldering
DE19816671A1 (en) * 1997-04-16 1998-10-22 Fuji Electric Co Ltd Lead-free tin-antimony-silver solder alloy

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6186091A (en) * 1984-10-03 1986-05-01 Furukawa Electric Co Ltd:The Sn-sb alloy solder
DE3730764C1 (en) * 1987-09-12 1988-07-14 Demetron Use of tin and / or lead alloys as soft solders to apply semiconductors to metallic substrates
EP0336575A1 (en) * 1988-03-31 1989-10-11 COOKSON GROUP plc Low toxicity alloy compositions for joining and sealing
JPH1034376A (en) * 1996-07-26 1998-02-10 Nippon Genma:Kk Lead-free solder
JPH10225790A (en) * 1997-02-15 1998-08-25 Samsung Electron Co Ltd Lead-free alloy for soldering
DE19816671A1 (en) * 1997-04-16 1998-10-22 Fuji Electric Co Ltd Lead-free tin-antimony-silver solder alloy

Also Published As

Publication number Publication date
GB9915954D0 (en) 1999-09-08
GB0201171D0 (en) 2002-03-06
WO2001003878A1 (en) 2001-01-18
GB2367834B (en) 2003-07-23
AU5556800A (en) 2001-01-30

Similar Documents

Publication Publication Date Title
TW411731B (en) Solder alloy
TW363334B (en) Lead-free, tin based solder composition
MY136743A (en) Lead-free solder alloy
EP1614500A4 (en) Solder paste and printed board
DE50010623D1 (en) Cadmium-free brazing alloys
HK1031844A1 (en) Lead-free solder.
EP1705258A3 (en) Composition, methods and devices for high temperature lead-free solder
TW360578B (en) Lead-free solder used for connecting electronic parts on organic substrate
EP1088615A3 (en) Sn-Ag-Cu solder and surface treatment and parts mounting methods using the same
JPS5690942A (en) High-tensile electrically conductive copper alloy
EP1166938A3 (en) PB-free soldering alloy
SG46442A1 (en) Use of silver alloys as cadmium-free brazing solder
GB2367834A (en) Solder alloy
WO2003026828A3 (en) Improved compositions, methods and devices for high temperature lead-free solder
MY127928A (en) Solder paste for chip components
GB1442970A (en) Solder alloy composition
MY105936A (en) Manufacture of printed circuit board assemblies.
JPS57187195A (en) Silver solder material
JPS6447894A (en) Double-ply plated steel sheet for soldering
ES8501276A1 (en) Solder alloys for brazing contact materials.
JPS5326223A (en) Work hardening copper alloy
JPS52128825A (en) Copper alloy for lead material
JPS57160594A (en) Soldering alloy for preventing silver-disolving
WO2003004713A3 (en) Lead-free solder alloy
HUP0104903A2 (en) Lead-free solder alloy

Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20160629