GB2367834B - Solder alloy - Google Patents

Solder alloy

Info

Publication number
GB2367834B
GB2367834B GB0201171A GB0201171A GB2367834B GB 2367834 B GB2367834 B GB 2367834B GB 0201171 A GB0201171 A GB 0201171A GB 0201171 A GB0201171 A GB 0201171A GB 2367834 B GB2367834 B GB 2367834B
Authority
GB
United Kingdom
Prior art keywords
solder alloy
solder
alloy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB0201171A
Other versions
GB2367834A (en
GB0201171D0 (en
Inventor
Hector Andrew Hamilton Steen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Multicore Solders Ltd
Original Assignee
Multicore Solders Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Multicore Solders Ltd filed Critical Multicore Solders Ltd
Publication of GB0201171D0 publication Critical patent/GB0201171D0/en
Publication of GB2367834A publication Critical patent/GB2367834A/en
Application granted granted Critical
Publication of GB2367834B publication Critical patent/GB2367834B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
GB0201171A 1999-07-07 2000-06-29 Solder alloy Expired - Fee Related GB2367834B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GBGB9915954.3A GB9915954D0 (en) 1999-07-07 1999-07-07 Solder alloy
PCT/GB2000/002502 WO2001003878A1 (en) 1999-07-07 2000-06-29 Solder alloy

Publications (3)

Publication Number Publication Date
GB0201171D0 GB0201171D0 (en) 2002-03-06
GB2367834A GB2367834A (en) 2002-04-17
GB2367834B true GB2367834B (en) 2003-07-23

Family

ID=10856849

Family Applications (2)

Application Number Title Priority Date Filing Date
GBGB9915954.3A Ceased GB9915954D0 (en) 1999-07-07 1999-07-07 Solder alloy
GB0201171A Expired - Fee Related GB2367834B (en) 1999-07-07 2000-06-29 Solder alloy

Family Applications Before (1)

Application Number Title Priority Date Filing Date
GBGB9915954.3A Ceased GB9915954D0 (en) 1999-07-07 1999-07-07 Solder alloy

Country Status (3)

Country Link
AU (1) AU5556800A (en)
GB (2) GB9915954D0 (en)
WO (1) WO2001003878A1 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW592872B (en) 2001-06-28 2004-06-21 Senju Metal Industry Co Lead-free solder alloy
CN100464930C (en) 2002-01-10 2009-03-04 千住金属工业株式会社 Welding method and supply solder alloy
DE10319888A1 (en) 2003-04-25 2004-11-25 Siemens Ag Solder material based on SnAgCu
PT1679149E (en) 2003-10-07 2012-07-02 Senju Metal Industry Co Lead-free solder ball
CZ297596B6 (en) * 2005-10-19 2007-01-10 JenĂ­k@Jan Lead-free solder
JP6011709B1 (en) * 2015-11-30 2016-10-19 千住金属工業株式会社 Solder alloy

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6186091A (en) * 1984-10-03 1986-05-01 Furukawa Electric Co Ltd:The Sn-sb alloy solder
DE3730764C1 (en) * 1987-09-12 1988-07-14 Demetron Use of tin and / or lead alloys as soft solders to apply semiconductors to metallic substrates
EP0336575A1 (en) * 1988-03-31 1989-10-11 COOKSON GROUP plc Low toxicity alloy compositions for joining and sealing
JPH1034376A (en) * 1996-07-26 1998-02-10 Nippon Genma:Kk Lead-free solder
JPH10225790A (en) * 1997-02-15 1998-08-25 Samsung Electron Co Ltd Lead-free alloy for soldering
DE19816671A1 (en) * 1997-04-16 1998-10-22 Fuji Electric Co Ltd Lead-free tin-antimony-silver solder alloy

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6186091A (en) * 1984-10-03 1986-05-01 Furukawa Electric Co Ltd:The Sn-sb alloy solder
DE3730764C1 (en) * 1987-09-12 1988-07-14 Demetron Use of tin and / or lead alloys as soft solders to apply semiconductors to metallic substrates
EP0336575A1 (en) * 1988-03-31 1989-10-11 COOKSON GROUP plc Low toxicity alloy compositions for joining and sealing
JPH1034376A (en) * 1996-07-26 1998-02-10 Nippon Genma:Kk Lead-free solder
JPH10225790A (en) * 1997-02-15 1998-08-25 Samsung Electron Co Ltd Lead-free alloy for soldering
DE19816671A1 (en) * 1997-04-16 1998-10-22 Fuji Electric Co Ltd Lead-free tin-antimony-silver solder alloy
US6179935B1 (en) * 1997-04-16 2001-01-30 Fuji Electric Co., Ltd. Solder alloys

Also Published As

Publication number Publication date
AU5556800A (en) 2001-01-30
WO2001003878A1 (en) 2001-01-18
GB2367834A (en) 2002-04-17
GB9915954D0 (en) 1999-09-08
GB0201171D0 (en) 2002-03-06

Similar Documents

Publication Publication Date Title
EP1080824A4 (en) Leadless solder
KR20010012869A (en) Lead-free Solder Alloy
GB2319039B (en) Solder alloy
EP1165849A4 (en) Alloy materials
IL128067A0 (en) Iron-cobalt alloy
AU4247100A (en) Soldering alloy
PL353734A1 (en) Copper alloy
SG111021A1 (en) Pb-free soldering alloy
HK1040066A1 (en) Cobalt-chromium-palladium-base brazing alloys
SG98429A1 (en) Lead-free solders
GB9911743D0 (en) Robo-nurse/solder
HK1045718A1 (en) Iron-nickel alloy
GB2367834B (en) Solder alloy
GB9926675D0 (en) Aluminium alloy
HUP0104903A3 (en) Lead-free solder alloy
GB9914192D0 (en) Soldering flux
GB9923965D0 (en) Metal casting
GB0017057D0 (en) High-temperature alloy
GB2351503B (en) Alloy plating
PL333444A1 (en) Novel copper alloy
SG87016A1 (en) Metal casting
GB9826627D0 (en) Alloy
PL333446A1 (en) Novel cu-sb alloy
SG53105A1 (en) Solder alloy
GB9912397D0 (en) Soldering procedures

Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20160629