GB0201171D0 - Solder alloy - Google Patents

Solder alloy

Info

Publication number
GB0201171D0
GB0201171D0 GBGB0201171.6A GB0201171A GB0201171D0 GB 0201171 D0 GB0201171 D0 GB 0201171D0 GB 0201171 A GB0201171 A GB 0201171A GB 0201171 D0 GB0201171 D0 GB 0201171D0
Authority
GB
United Kingdom
Prior art keywords
solder alloy
solder
alloy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GBGB0201171.6A
Other versions
GB2367834B (en
GB2367834A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Multicore Solders Ltd
Original Assignee
Multicore Solders Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Multicore Solders Ltd filed Critical Multicore Solders Ltd
Publication of GB0201171D0 publication Critical patent/GB0201171D0/en
Publication of GB2367834A publication Critical patent/GB2367834A/en
Application granted granted Critical
Publication of GB2367834B publication Critical patent/GB2367834B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
GB0201171A 1999-07-07 2000-06-29 Solder alloy Expired - Fee Related GB2367834B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GBGB9915954.3A GB9915954D0 (en) 1999-07-07 1999-07-07 Solder alloy
PCT/GB2000/002502 WO2001003878A1 (en) 1999-07-07 2000-06-29 Solder alloy

Publications (3)

Publication Number Publication Date
GB0201171D0 true GB0201171D0 (en) 2002-03-06
GB2367834A GB2367834A (en) 2002-04-17
GB2367834B GB2367834B (en) 2003-07-23

Family

ID=10856849

Family Applications (2)

Application Number Title Priority Date Filing Date
GBGB9915954.3A Ceased GB9915954D0 (en) 1999-07-07 1999-07-07 Solder alloy
GB0201171A Expired - Fee Related GB2367834B (en) 1999-07-07 2000-06-29 Solder alloy

Family Applications Before (1)

Application Number Title Priority Date Filing Date
GBGB9915954.3A Ceased GB9915954D0 (en) 1999-07-07 1999-07-07 Solder alloy

Country Status (3)

Country Link
AU (1) AU5556800A (en)
GB (2) GB9915954D0 (en)
WO (1) WO2001003878A1 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW592872B (en) 2001-06-28 2004-06-21 Senju Metal Industry Co Lead-free solder alloy
CN100464930C (en) * 2002-01-10 2009-03-04 千住金属工业株式会社 Welding method and supply solder alloy
DE10319888A1 (en) * 2003-04-25 2004-11-25 Siemens Ag Solder material based on SnAgCu
CN100509257C (en) * 2003-10-07 2009-07-08 千住金属工业株式会社 Use of lead-free solder ball in producing tin soldering projection and the tin soldering projection thereof
CZ2005659A3 (en) * 2005-10-19 2007-01-10 JenĂ­k@Jan Lead-free solder
JP6011709B1 (en) * 2015-11-30 2016-10-19 千住金属工業株式会社 Solder alloy

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6186091A (en) * 1984-10-03 1986-05-01 Furukawa Electric Co Ltd:The Sn-sb alloy solder
DE3730764C1 (en) * 1987-09-12 1988-07-14 Demetron Use of tin and / or lead alloys as soft solders to apply semiconductors to metallic substrates
GB8807730D0 (en) * 1988-03-31 1988-05-05 Cookson Group Plc Low toxicity soldering compositions
JP3693762B2 (en) * 1996-07-26 2005-09-07 株式会社ニホンゲンマ Lead-free solder
KR19980068127A (en) * 1997-02-15 1998-10-15 김광호 Lead-Free Alloys for Soldering
US6179935B1 (en) * 1997-04-16 2001-01-30 Fuji Electric Co., Ltd. Solder alloys

Also Published As

Publication number Publication date
WO2001003878A1 (en) 2001-01-18
GB2367834B (en) 2003-07-23
AU5556800A (en) 2001-01-30
GB9915954D0 (en) 1999-09-08
GB2367834A (en) 2002-04-17

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20160629