JP5724088B2 - Metal filler and lead-free solder containing the same - Google Patents
Metal filler and lead-free solder containing the same Download PDFInfo
- Publication number
- JP5724088B2 JP5724088B2 JP2010279115A JP2010279115A JP5724088B2 JP 5724088 B2 JP5724088 B2 JP 5724088B2 JP 2010279115 A JP2010279115 A JP 2010279115A JP 2010279115 A JP2010279115 A JP 2010279115A JP 5724088 B2 JP5724088 B2 JP 5724088B2
- Authority
- JP
- Japan
- Prior art keywords
- based alloy
- alloy particles
- particles
- mass
- metal filler
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 229910000679 solder Inorganic materials 0.000 title claims description 100
- 229910052751 metal Inorganic materials 0.000 title claims description 97
- 239000002184 metal Substances 0.000 title claims description 95
- 239000000945 filler Substances 0.000 title claims description 79
- 239000002245 particle Substances 0.000 claims description 320
- 229910045601 alloy Inorganic materials 0.000 claims description 218
- 239000000956 alloy Substances 0.000 claims description 218
- 239000010949 copper Substances 0.000 claims description 91
- 238000010438 heat treatment Methods 0.000 claims description 51
- 239000000853 adhesive Substances 0.000 claims description 27
- 230000001070 adhesive effect Effects 0.000 claims description 27
- 239000002131 composite material Substances 0.000 claims description 26
- 239000000203 mixture Substances 0.000 claims description 21
- 229910052718 tin Inorganic materials 0.000 claims description 17
- 229910052802 copper Inorganic materials 0.000 claims description 16
- 229910052738 indium Inorganic materials 0.000 claims description 16
- 229910052709 silver Inorganic materials 0.000 claims description 14
- 229910052797 bismuth Inorganic materials 0.000 claims description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 5
- 239000004332 silver Substances 0.000 claims description 5
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 4
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims description 4
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 4
- 239000000758 substrate Substances 0.000 description 26
- 238000002844 melting Methods 0.000 description 25
- 230000008018 melting Effects 0.000 description 25
- 238000000034 method Methods 0.000 description 23
- 230000004907 flux Effects 0.000 description 21
- 229910000905 alloy phase Inorganic materials 0.000 description 13
- 230000005496 eutectics Effects 0.000 description 12
- 239000000463 material Substances 0.000 description 11
- 239000007789 gas Substances 0.000 description 10
- 230000008569 process Effects 0.000 description 10
- 239000000155 melt Substances 0.000 description 8
- 229910001152 Bi alloy Inorganic materials 0.000 description 7
- 229910020830 Sn-Bi Inorganic materials 0.000 description 7
- 229910018728 Sn—Bi Inorganic materials 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 7
- 238000009826 distribution Methods 0.000 description 7
- 238000005275 alloying Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000007639 printing Methods 0.000 description 6
- 238000005507 spraying Methods 0.000 description 6
- 230000004927 fusion Effects 0.000 description 5
- 239000001307 helium Substances 0.000 description 5
- 229910052734 helium Inorganic materials 0.000 description 5
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 5
- 239000012535 impurity Substances 0.000 description 5
- 238000005304 joining Methods 0.000 description 5
- 150000002739 metals Chemical class 0.000 description 5
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 4
- 238000001816 cooling Methods 0.000 description 4
- 238000009792 diffusion process Methods 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- 239000007921 spray Substances 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 230000009257 reactivity Effects 0.000 description 3
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 2
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 241000723353 Chrysanthemum Species 0.000 description 2
- 235000005633 Chrysanthemum balsamita Nutrition 0.000 description 2
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 2
- 239000012298 atmosphere Substances 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 230000033228 biological regulation Effects 0.000 description 2
- 229910002092 carbon dioxide Inorganic materials 0.000 description 2
- 239000001569 carbon dioxide Substances 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 239000010419 fine particle Substances 0.000 description 2
- 230000001771 impaired effect Effects 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000002923 metal particle Substances 0.000 description 2
- 239000011812 mixed powder Substances 0.000 description 2
- 239000012299 nitrogen atmosphere Substances 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 238000007712 rapid solidification Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 239000007790 solid phase Substances 0.000 description 2
- 230000003685 thermal hair damage Effects 0.000 description 2
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 2
- 239000012855 volatile organic compound Substances 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- 229910001128 Sn alloy Inorganic materials 0.000 description 1
- 239000012190 activator Substances 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000002803 fossil fuel Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 231100001261 hazardous Toxicity 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 238000009616 inductively coupled plasma Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000002075 main ingredient Substances 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000002250 progressing effect Effects 0.000 description 1
- 238000006722 reduction reaction Methods 0.000 description 1
- 238000010405 reoxidation reaction Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000000550 scanning electron microscopy energy dispersive X-ray spectroscopy Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000005204 segregation Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 239000013008 thixotropic agent Substances 0.000 description 1
- 238000010792 warming Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Powder Metallurgy (AREA)
Description
本発明は、各種電子部品の接続及びビア充填等に使用される金属フィラー、及び該金属フィラーを含む鉛フリーはんだ、特に低温〜中温接続用の鉛フリーはんだに関する。また、本発明の金属フィラーは、原理上導電性接着剤等にも使用されることができる。また、本発明は、本発明の鉛フリーはんだを用いて得られる接続構造体、並びに基板及び該基板上に搭載された該接続構造体を含む部品搭載基板に関する。 The present invention relates to a metal filler used for connecting various electronic components, filling vias, and the like, and a lead-free solder containing the metal filler, particularly a lead-free solder for low to medium temperature connection. Further, the metal filler of the present invention can be used for a conductive adhesive or the like in principle. The present invention also relates to a connection structure obtained by using the lead-free solder of the present invention, a substrate, and a component mounting substrate including the connection structure mounted on the substrate.
従来、リフロー熱処理において使用されるはんだ材料として、一般的に１８３℃の融点を有するスズ（Ｓｎ）−３７鉛（Ｐｂ）共晶はんだが用いられてきた。また、高耐熱性が要求される電子部品の内部等で使用される高温はんだとしては、２７０℃の固相線温度及び３０５℃の液相線温度を有するＳｎ−９０Ｐｂ高温はんだが広く用いられてきた。 Conventionally, tin (Sn) -37 lead (Pb) eutectic solder having a melting point of 183 ° C. has generally been used as a solder material used in reflow heat treatment. In addition, Sn-90Pb high-temperature solder having a solidus temperature of 270 ° C. and a liquidus temperature of 305 ° C. has been widely used as a high-temperature solder used inside electronic components that require high heat resistance. It was.
しかしながら、近年、ＷＥＥＥ（Ｗａｓｔｅ Ｅｌｅｃｔｒｉｃａｌ ａｎｄ Ｅｌｅｃｔｒｏｎｉｃ Ｅｑｕｉｐｍｅｎ）指令、ＲｏＨＳ（Ｒｅｓｔｒｉｃｔｉｏｎ ｏｆ Ｈａｚａｒｄｏｕｓ Ｓｕｂｓｔａｎｃｅｓ）指令等のＥＵの環境規制が示すように、鉛（Ｐｂ）の有害性が問題となっている。よって、環境汚染を防止する観点から、はんだの鉛フリー化（すなわち、実質的に鉛を含まないはんだの形成）が急速に進んでいる。このような状況の中で、現在、Ｓｎ−３７Ｐｂ共晶はんだの代替物としては、約２２０℃の融点を有するＳｎ−３．０銀（Ａｇ）−０．５銅（Ｃｕ）から成る鉛フリーはんだが代表的である。該鉛フリーはんだのリフロー熱処理条件としては、ピーク温度が約２４０℃〜２６０℃である温度範囲が一般的となりつつある。 However, in recent years, the harmfulness of lead (Pb) has become a problem as shown by EU environmental regulations such as the WEEE (Waste Electrical and Electronic Equipment) command and the RoHS (Restriction of Hazardous Substitutes) command. Therefore, from the viewpoint of preventing environmental pollution, lead-free solder (that is, formation of solder that does not substantially contain lead) is rapidly progressing. Under such circumstances, as a substitute for Sn-37Pb eutectic solder at present, lead-free consisting of Sn-3.0 silver (Ag) -0.5 copper (Cu) having a melting point of about 220 ° C. Solder is typical. As a reflow heat treatment condition for the lead-free solder, a temperature range in which a peak temperature is about 240 ° C. to 260 ° C. is becoming common.
上記Ｓｎ−３．０Ａｇ−０．５Ｃｕから成る鉛フリーはんだは、Ｓｎ−３７Ｐｂ共晶はんだに比べ、合金の融点が高いことから、そのリフロー熱処理条件もより高温になる。昨今、化石燃料の枯渇、地球温暖化等の問題が危惧されているので、リフロー熱処理温度を低温化することによって、省エネルギープロセス、及び低二酸化炭素排出プロセスを確立することが切望されている。また、このようなリフロー熱処理温度の低温化は、電気・電子機器及び基板材料の熱損傷を抑制することを可能にし、そして使用できる基板材料の選択の幅を広げるので期待されている。現在、低温で溶融接合できるＰｂフリーはんだ材料の代表的な例としては、Ｓｎ−５８ビスマス（Ｂｉ）共晶はんだ（融点１３８℃）、インジウム（Ｉｎ）（融点１５７℃）、Ｓｎ−５２Ｉｎ合金はんだ（融点１１８℃）等が挙げられる（特許文献１及び２参照）。しかし、これらのはんだ材料はいずれも融点が低く、はんだ接合後に、再度融点以上の温度になれば再溶融してしまうという課題を抱えている。 The lead-free solder composed of Sn-3.0Ag-0.5Cu has a higher melting point of the alloy than Sn-37Pb eutectic solder, and therefore the reflow heat treatment conditions also become higher. Recently, problems such as fossil fuel depletion and global warming are feared. Therefore, it is desired to establish an energy saving process and a low carbon dioxide emission process by lowering the reflow heat treatment temperature. In addition, such a decrease in reflow heat treatment temperature is expected because it makes it possible to suppress thermal damage to electric / electronic devices and substrate materials, and to expand the range of selection of usable substrate materials. Currently, typical examples of Pb-free solder materials that can be melt-bonded at low temperatures include Sn-58 bismuth (Bi) eutectic solder (melting point 138 ° C.), indium (In) (melting point 157 ° C.), Sn-52In alloy solder. (Melting point: 118 ° C.) and the like (see Patent Documents 1 and 2). However, all of these solder materials have a low melting point, and have a problem that they are remelted when the temperature again becomes higher than the melting point after soldering.
ところで、携帯電話に代表されるように、電子機器の小型化、軽量化及び高機能化の流れは目覚しく、これに追従して、高密度実装技術も急速な進歩を続けている。例えば、部品を基板中に内蔵するか、又は複数のＬＳＩを単一パッケージ化する手法のように、限られた容積を有効に利用するための多様な実装技術が開発されている。一方で、このような高密度化が進むほど、基板内部又はパッケージ内部に組み込まれた部品のはんだ接続部が、後工程で熱処理を受ける回数が増加する。これにより、後工程ではんだが再溶融して、そして部品と封止樹脂との隙間からはんだが流れ出すために、部品電極間等でショートが発生するという問題が顕在化している。したがって、基板内部又はパッケージ内部に組み込まれた部品の接続において、後工程で複数回の熱処理を受けても溶融流動しない鉛フリーはんだ材料の開発が望まれている。 By the way, as typified by mobile phones, the trend of downsizing, weight reduction and higher functionality of electronic devices is remarkable, and following this, high-density mounting technology continues to make rapid progress. For example, various mounting techniques for effectively utilizing a limited volume have been developed, such as a method of incorporating components in a substrate or packaging a plurality of LSIs into a single package. On the other hand, as the density increases, the number of times that the solder connection portion of the component incorporated in the substrate or the package is subjected to heat treatment in the subsequent process increases. As a result, since the solder is remelted in a later process and the solder flows out from the gap between the component and the sealing resin, there is a problem that a short circuit occurs between the component electrodes. Accordingly, there is a demand for the development of a lead-free solder material that does not melt and flow even when subjected to a plurality of heat treatments in a subsequent process in connection of components incorporated in a substrate or a package.
また、上述のように部品を基板に内蔵する場合、一般的には部品を基板に実装した後に、プリプレグ及び内層配線基板等を介して約１５０℃〜２００℃の熱処理を加えながら積層プレスが行われる。その際、一般的なＳｎ−５８Ｂｉはんだ（融点１３８℃）等の低温はんだで部品を実装した場合には、積層熱プレス等の温度のためにはんだが再溶融し、そしてプリプレグの樹脂流動圧力により、はんだ部及び部品自体が流動する。すなわち、低温はんだを用いる場合、現状では積層熱プレスをして部品を内蔵することが極めて困難である。このような背景から、低温での実装が可能であり、かつ耐熱性に優れた金属フィラー、及び該金属フィラーを含む鉛フリーはんだが望まれている。 In addition, when the component is built in the substrate as described above, generally, after the component is mounted on the substrate, the laminating press is performed while applying a heat treatment of about 150 ° C. to 200 ° C. through the prepreg and the inner layer wiring substrate. Is called. At that time, when the component is mounted with a low-temperature solder such as a general Sn-58Bi solder (melting point 138 ° C.), the solder is remelted due to the temperature of the laminated hot press or the like, and the resin flow pressure of the prepreg The solder part and the part itself flow. In other words, when using low-temperature solder, it is extremely difficult to build a component by multilayer hot pressing at present. From such a background, a metal filler that can be mounted at a low temperature and has excellent heat resistance, and a lead-free solder containing the metal filler are desired.
本発明者等は、これまで上記問題を考慮して、Ｓｎ−３７Ｐｂ共晶はんだのリフロー熱処理の温度よりも低い温度（例えばピーク温度１６０℃）で溶融接合でき、接合後は耐熱性に優れ、かつ接合後に室温での良好な接合強度を与えることができる金属フィラーを提案してきた（特許文献３参照）。 In view of the above problems, the present inventors have been able to perform melt bonding at a temperature lower than the temperature of reflow heat treatment of Sn-37Pb eutectic solder (for example, peak temperature 160 ° C.), and have excellent heat resistance after bonding. And the metal filler which can give the favorable joint strength in room temperature after joining has been proposed (refer patent document 3).
しかしながら、特許文献３に記載される技術においては、Ｂｉを大量に含むＳｎ−Ｂｉ系合金粒子を使用していた。通常、このようなＳｎ−Ｂｉ系合金粒子を含むＳｎ−Ｂｉ系はんだは、ＰｂフリーはんだであるＳｎ−３．５Ａｇ−０．５Ｃｕ等に比べて融点が低く、加熱時の流動性の観点で改善の余地がある。また、Ｂｉを大量に含むＳｎ−Ｂｉ系はんだは、その接続抵抗が高いので、部品接合後の接続特性において改善の余地がある。 However, in the technique described in Patent Document 3, Sn—Bi alloy particles containing a large amount of Bi are used. Usually, Sn-Bi solder containing such Sn-Bi alloy particles has a lower melting point than Sn-3.5Ag-0.5Cu, etc., which is Pb-free solder, and from the viewpoint of fluidity during heating. There is room for improvement. In addition, Sn—Bi solder containing a large amount of Bi has high connection resistance, so there is room for improvement in connection characteristics after component bonding.
したがって、本発明は、Ｃｕ系合金粒子、並びにＢｉ系合金粒子及びＳｎ粒子又はＢｉ不含有Ｓｎ系合金粒子を含む混合粉体を使用することにより、Ｓｎ−３７Ｐｂ共晶はんだのリフロー熱処理の温度条件よりも低い温度条件（例えば、ピーク温度１６０℃〜２００℃）で溶融接合でき、接合後は耐熱性に優れ、かつ室温で良好な接合強度を与えることができる金属フィラーを提供することを目的とする。また、本発明は、特許文献３の技術に比べてＢｉ使用量を大幅に低減して、接続抵抗等の接続特性を改良することも目的とする。さらに、本発明は、該金属フィラーを含む鉛フリーはんだ又は導電性接着剤、該鉛フリーはんだ又は導電性接着剤を用いて得られる接続構造体、並びに基板及び該接続構造体を含む部品搭載基板を提供することも目的とする。 Therefore, the present invention uses Cu-based alloy particles, and mixed powder containing Bi-based alloy particles and Sn particles or Bi-free Sn-based alloy particles, so that the temperature condition for reflow heat treatment of Sn-37Pb eutectic solder is achieved. An object of the present invention is to provide a metal filler that can be melt-bonded at lower temperature conditions (for example, peak temperature 160 ° C. to 200 ° C.), has excellent heat resistance after bonding, and can provide good bonding strength at room temperature. To do. Another object of the present invention is to significantly reduce the amount of Bi used as compared with the technique of Patent Document 3 and improve connection characteristics such as connection resistance. Furthermore, the present invention provides a lead-free solder or conductive adhesive containing the metal filler, a connection structure obtained using the lead-free solder or conductive adhesive, a substrate, and a component mounting board including the connection structure It is also intended to provide.
本発明は下記の通りである：
［１］ 以下の：
（１）銅（Ｃｕ）系合金粒子
ここで、該Ｃｕ系合金粒子は、Ｃｕ、インジウム（Ｉｎ）及びスズ（Ｓｎ）を含み、かつＣｕ、Ｉｎ及びＳｎの中でＣｕを最高の質量割合で含み、そして該Ｃｕ系合金粒子の含有量は、該金属フィラーの全質量を基準として３０〜４５質量％である；並びに
（２）複合合金粒子
ここで、該複合合金粒子は、ビスマス（Ｂｉ）系合金粒子とＳｎ粒子又はＢｉ不含有Ｓｎ系合金粒子との混合物であり、該Ｓｎ粒子又はＢｉ不含有Ｓｎ系合金粒子の含有量は、該Ｂｉ系合金粒子１００質量部に対して２５〜２５０質量部であり、該Ｂｉ系合金粒子は、該Ｂｉ系合金粒子の全質量を基準として、４０〜７０質量％のＢｉ並びに３０〜６０質量％の銀（Ａｇ）、Ｃｕ、Ｉｎ及びＳｎから選ばれる少なくとも１種の金属を含み、そして該Ｂｉ不含有Ｓｎ系合金粒子は、該Ｂｉ系合金粒子の固相線温度以上の固相線温度を有する；
を含む金属フィラー。
The present invention is as follows:
[1] The following:
(1) Copper (Cu) -based alloy particles Here, the Cu-based alloy particles include Cu, indium (In), and tin (Sn), and Cu is the highest mass ratio among Cu, In, and Sn. And the content of the Cu-based alloy particles is 30 to 45% by mass based on the total mass of the metal filler; and (2) Composite alloy particles, wherein the composite alloy particles are bismuth (Bi) It is a mixture of Sn-based alloy particles and Sn particles or Bi-free Sn-based alloy particles, and the content of the Sn particles or Bi-free Sn-based alloy particles is 25 to 250 with respect to 100 parts by mass of the Bi-based alloy particles. The Bi-based alloy particles are selected from 40 to 70% by mass of Bi and 30 to 60% by mass of silver (Ag), Cu, In and Sn based on the total mass of the Bi-based alloy particles. Containing at least one metal And the Bi-free Sn-based alloy particles have a solidus temperature equal to or higher than the solidus temperature of the Bi-based alloy particles;
Containing metal filler.
［２］ 前記Ｃｕ系合金粒子はＡｇ又はＢｉをさらに含む、［１］に記載の金属フィラー。 [2] The metal filler according to [1], wherein the Cu-based alloy particles further contain Ag or Bi.
［３］ 前記Ｂｉ系合金粒子はＳｎを含む、［１］又は［２］に記載の金属フィラー。 [3] The metal filler according to [1] or [2], wherein the Bi-based alloy particles include Sn.
［４］ 前記Ｂｉ不含有Ｓｎ系合金粒子は、Ｓｎ１００質量部に対して、４．０質量部以下のＡｇ及び／又はＣｕを含む、［１］〜［３］のいずれか１項に記載の金属フィラー。 [4] The Bi-free Sn-based alloy particles according to any one of [1] to [3], including 4.0 parts by mass or less of Ag and / or Cu with respect to 100 parts by mass of Sn. Metal filler.
［５］ ［１］〜［４］のいずれか１項に記載の金属フィラーを含む鉛フリーはんだ。 [5] A lead-free solder containing the metal filler according to any one of [1] to [4].
［６］ ［１］〜［４］のいずれか１項に記載の金属フィラーを含む導電性接着剤。 [6] A conductive adhesive containing the metal filler according to any one of [1] to [4].
［７］ 第１の電子部品、第２の電子部品、並びに該第１の電子部品及び該第２の電子部品を接合しているはんだ接合部を含む接続構造体であって、該はんだ接合部は、［５］に記載の鉛フリーはんだを、前記Ｂｉ系合金粒子の固相線温度以上であり、かつ前記Ｓｎ粒子又はＢｉ不含有Ｓｎ系合金粒子の固相線温度以下である温度でリフロー熱処理することにより形成されている接続構造体。 [7] A connection structure including a first electronic component, a second electronic component, and a solder joint that joins the first electronic component and the second electronic component, the solder joint Reflows the lead-free solder according to [5] at a temperature that is not lower than the solidus temperature of the Bi-based alloy particles and not higher than the solidus temperature of the Sn particles or Bi-free Sn-based alloy particles. A connection structure formed by heat treatment.
［８］ 第１の電子部品、第２の電子部品、並びに該第１の電子部品及び該第２の電子部品を接着している接着部を含む接続構造体であって、該接着部は、［６］に記載の導電性接着剤を、前記Ｂｉ系合金粒子の固相線温度以上であり、かつ前記Ｓｎ粒子又はＢｉ不含有Ｓｎ系合金粒子の固相線温度以下である温度でリフロー熱処理することにより形成されている接続構造体。 [8] A connection structure including a first electronic component, a second electronic component, and an adhesive portion bonding the first electronic component and the second electronic component, wherein the adhesive portion includes: The conductive adhesive according to [6] is subjected to a reflow heat treatment at a temperature that is not lower than a solidus temperature of the Bi-based alloy particles and not higher than a solidus temperature of the Sn particles or Bi-free Sn-based alloy particles. The connection structure formed by doing.
［９］ 基板及び該基板上に搭載された［７］又は［８］に記載の接続構造体を含む部品搭載基板。 [9] A component mounting substrate including the substrate and the connection structure according to [7] or [8] mounted on the substrate.
本発明の金属フィラーは、Ｓｎ−３７Ｐｂ共晶はんだよりも低いリフロー熱処理温度（例えば、ピーク温度１６０℃〜２００℃）で溶融接合を可能にし、接合後は耐熱性に優れ、かつ室温で良好な接合強度を与える。また、本発明は、特許文献３の技術に比べてＢｉ使用量を大幅に低減できるから、接続抵抗等の接続特性を改良できる。 The metal filler of the present invention enables fusion bonding at a reflow heat treatment temperature (for example, peak temperature 160 ° C. to 200 ° C.) lower than that of Sn-37Pb eutectic solder, has excellent heat resistance after bonding, and is good at room temperature. Gives bond strength. Moreover, since this invention can reduce Bi usage-amount compared with the technique of patent document 3, it can improve connection characteristics, such as connection resistance.
＜金属フィラー＞
一般に、金属フィラーとは、金属を含む充填剤をいう。本発明の金属フィラーは、銅（Ｃｕ）系合金粒子（１）及び複合合金粒子（２）を含む。また、本発明の金属フィラーは、Ｃｕ系合金粒子（１）と複合合金粒子（２）との混合物でもよい。本発明の金属フィラーは、特定のＣｕ系合金粒子（１）及び複合合金粒子（２）を含むことを特徴とする。
<Metal filler>
In general, a metal filler refers to a filler containing a metal. The metal filler of the present invention includes copper (Cu) -based alloy particles (1) and composite alloy particles (2). The metal filler of the present invention may be a mixture of Cu-based alloy particles (1) and composite alloy particles (2). The metal filler of the present invention is characterized by containing specific Cu-based alloy particles (1) and composite alloy particles (2).
本発明の金属フィラーでは、Ｃｕ系合金粒子（１）は、Ｃｕ、インジウム（Ｉｎ）及びスズ（Ｓｎ）を含み、かつＣｕ、Ｉｎ及びＳｎの中でＣｕを最高の質量割合で含む。したがって、Ｃｕ系合金粒子（１）は、主成分としてＣｕ元素を含む。また、本発明の金属フィラーでは、金属フィラー中のＣｕ系合金粒子（１）の含有量は、金属フィラーの全質量を基準として３０〜４５質量％である。 In the metal filler of the present invention, the Cu-based alloy particle (1) contains Cu, indium (In), and tin (Sn), and contains Cu at the highest mass ratio among Cu, In, and Sn. Therefore, Cu system alloy particle (1) contains Cu element as a main ingredient. Moreover, in the metal filler of this invention, content of Cu type alloy particle (1) in a metal filler is 30-45 mass% on the basis of the total mass of a metal filler.
本発明の金属フィラーでは、複合合金粒子（２）は、ビスマス（Ｂｉ）合金粒子とＳｎ粒子又はＢｉ不含有Ｓｎ系合金粒子との混合物であり、そして複合合金粒子（２）中のＳｎ粒子又はＢｉ不含有Ｓｎ系合金粒子の含有量は、Ｂｉ系合金粒子１００質量部に対して２５〜２５０質量部である。また、本発明の金属フィラーでは、Ｂｉ系合金粒子は、Ｂｉ系合金粒子の全質量を基準として、４０〜７０質量％のＢｉ並びに３０〜６０質量％の銀（Ａｇ）、Ｃｕ、Ｉｎ及びＳｎから選ばれる少なくとも１種の金属も含む。また、本発明の金属フィラーでは、Ｓｎ系合金粒子は、Ｂｉ系合金粒子の固相線温度以上の固相線温度を有し、かつＢｉを含まない。なお、本明細書において「特定の元素を含まない」とは、意図的にその元素を添加していないという意味であり、特定の元素が不可避的不純物の濃度で金属フィラーに混入することはあり得る。 In the metal filler of the present invention, the composite alloy particles (2) are a mixture of bismuth (Bi) alloy particles and Sn particles or Bi-free Sn-based alloy particles, and Sn particles in the composite alloy particles (2) or The content of the Bi-free Sn-based alloy particles is 25 to 250 parts by mass with respect to 100 parts by mass of the Bi-based alloy particles. In the metal filler of the present invention, Bi-based alloy particles are 40 to 70% by mass of Bi and 30 to 60% by mass of silver (Ag), Cu, In and Sn based on the total mass of Bi-based alloy particles. It also contains at least one metal selected from In the metal filler of the present invention, the Sn-based alloy particles have a solidus temperature higher than the solidus temperature of Bi-based alloy particles and do not contain Bi. In this specification, “not including a specific element” means that the element is not intentionally added, and the specific element may be mixed into the metal filler at an unavoidable impurity concentration. obtain.
本発明の金属フィラーの形態は、限定されるものではないが、固体、粉末などでよい。また、金属フィラーに含まれる成分の幾つかを予備混合するか、又は金属フィラーに含まれる全ての成分を同時に混合することも好ましい。
Form of the metal filler of the present invention, but are not limited to, solid bodies, the powder may like. It is also preferable to premix some of the components contained in the metal filler or to mix all the components contained in the metal filler at the same time.
本発明において、Ｃｕ系合金粒子（１）、並びにＳｎ粒子又はＢｉ不含有Ｓｎ系合金粒子とＢｉ系合金粒子との混合粉（複合合金粒子（２））に対して、Ｂｉ系合金粒子（例えばＳｎ５８Ｂｉ粒子）の固相線温度以上、かつＳｎ粒子又はＢｉ不含有Ｓｎ系合金粒子の固相線温度以下の熱処理温度でリフローした場合、Ｂｉ系合金粒子が溶融し、Ｃｕ系合金粒子（１）と溶融したＢｉ合金成分との間で熱拡散による合金化反応が進み、そしてＢｉ系合金粒子の融点よりも高い融点を有する安定合金相が形成される。安定合金相の形成と同時に、溶融したＢｉ合金成分は、Ｓｎ粒子又はＢｉを含まないＳｎ系合金粒子に溶融拡散することによって、Ｂｉ含有量の少ないＳｎ系合金相が形成される。 In the present invention, Cu-based alloy particles (1) and Bi-based alloy particles (for example, mixed particles (composite alloy particles (2)) of Sn particles or Bi-free Sn-based alloy particles and Bi-based alloy particles (for example, When reflowing at a heat treatment temperature not lower than the solidus temperature of Sn58Bi particles) and not higher than the solidus temperature of Sn particles or Bi-free Sn-based alloy particles, the Bi-based alloy particles melt and Cu-based alloy particles (1) An alloying reaction by thermal diffusion proceeds between the molten Bi alloy component and the molten Bi alloy component, and a stable alloy phase having a melting point higher than that of the Bi-based alloy particles is formed. Simultaneously with the formation of the stable alloy phase, the molten Bi alloy component melts and diffuses into Sn-based alloy particles or Sn-based alloy particles not containing Bi, thereby forming a Sn-based alloy phase with a low Bi content.
本発明の典型的な実施態様では、本発明に係るＣｕ系合金粒子（１）、Ｓｎ粒子又はＢｉ不含有Ｓｎ系合金粒子は、リフロー熱処理温度において完全溶融しない。これにより、本発明の金属フィラーを含む鉛（Ｐｂ）フリーはんだは、低温条件（典型的には、Ｓｎ−３７Ｐｂ共晶はんだのリフロー熱処理条件の温度よりも低い温度の条件）で溶融接合されることができて、溶融接合後には、熱処理で再溶融しないという効果を有する。さらに、本発明の金属フィラーを含む鉛（Ｐｂ）フリーはんだにより溶融接合された溶融接合部は、Ｓｎ−５８Ｂｉの共晶組成等に比べてＢｉ含有量の少ないＳｎ系合金相を形成するから、本発明の金属フィラーを含む鉛（Ｐｂ）フリーはんだは、接続信頼性に優れる。また、本発明の金属フィラーを含む鉛（Ｐｂ）フリーはんだは、低温で溶融接合されることができるから、省エネルギープロセス及び低二酸化炭素排出プロセスで使用されることができるとともに、適用される電気・電子機器及び基板材料等の熱損傷を抑制できる点で有利である。 In a typical embodiment of the present invention, the Cu-based alloy particles (1), Sn particles or Bi-free Sn-based alloy particles according to the present invention are not completely melted at the reflow heat treatment temperature. Thereby, the lead (Pb) -free solder containing the metal filler of the present invention is melt-bonded under a low temperature condition (typically, a temperature lower than the reflow heat treatment temperature of the Sn-37Pb eutectic solder). And after melting and joining, it has the effect of not being re-melted by heat treatment. Furthermore, since the melt-bonded portion melt-bonded by the lead (Pb) -free solder containing the metal filler of the present invention forms a Sn-based alloy phase with a low Bi content compared to the eutectic composition of Sn-58Bi, etc. Lead (Pb) -free solder containing the metal filler of the present invention is excellent in connection reliability. Moreover, since the lead (Pb) -free solder containing the metal filler of the present invention can be melt-bonded at a low temperature, it can be used in an energy saving process and a low carbon dioxide emission process, This is advantageous in that thermal damage to electronic devices and substrate materials can be suppressed.
＜Ｃｕ系合金粒子（１）、Ｂｉ系合金粒子、及びＳｎ粒子又はＳｎ系合金粒子の混合物＞
前述の通り、本発明の金属フィラーは、Ｃｕ系合金粒子（１）と複合合金粒子（２）との混合物でよい。該混合物である金属フィラー中のＣｕ系合金粒子（１）の含有量は、金属フィラーの全質量を基準として、３０〜４５質量％の範囲である。Ｃｕ系合金粒子（１）の含有量が４５質量％以下である場合、金属フィラー中の、リフロー熱処理時に溶融拡散する金属成分の存在割合が多いため、低温での溶融接合が良好に実施されることができるとともに、例えば、はんだとして接合された後に、溶融接合部に良好な物理的強度が付与される。Ｃｕ系合金粒子（１）の含有量が４０質量％以下である場合、さらに良好な物理的強度が得られるため好ましく、３７質量％以下が最も好ましい。Ｃｕ系合金粒子（１）の含有量が３０質量％以上である場合、溶融したＢｉ合金成分がＣｕ系合金粒子（１）と反応することで形成される、高融点を有する安定合金相の存在割合が多くなるため、耐熱性が得られるようになる。Ｃｕ系合金粒子（１）の含有量は、３１質量％以上が好ましく、３３質量％以上が最も好ましい。また、はんだ接合部の物理的強度及び耐熱性の観点から、該混合物である金属フィラー中のＣｕ系合金粒子（１）の含有量は、３０〜４５質量％の範囲である。
<Cu-based alloy particles (1), Bi-based alloy particles, and Sn particles or a mixture of Sn-based alloy particles>
As described above, the metal filler of the present invention may be a mixture of Cu-based alloy particles (1) and composite alloy particles (2). Content of Cu type alloy particle (1) in the metal filler which is this mixture is the range of 30-45 mass% on the basis of the total mass of a metal filler. When the content of the Cu-based alloy particles (1) is 45% by mass or less, the metal filler has a high proportion of the metal component that melts and diffuses during reflow heat treatment. In addition, for example, after being joined as solder, good physical strength is imparted to the melt joint. When the content of the Cu-based alloy particles (1) is 40% by mass or less, a better physical strength can be obtained, and 37% by mass or less is most preferable. When the content of the Cu-based alloy particles (1) is 30% by mass or more, the presence of a stable alloy phase having a high melting point formed by the reaction of the molten Bi alloy component with the Cu-based alloy particles (1) Since the ratio increases, heat resistance can be obtained. The content of the Cu-based alloy particles (1) is preferably 31% by mass or more, and most preferably 33% by mass or more. In addition, from the viewpoint of physical strength and heat resistance of the solder joint, the content of the Cu-based alloy particles (1) in the metal filler that is the mixture is in the range of 30 to 45 mass%.
Ｃｕ系合金粒子（１）及び複合合金粒子（２）の粒度分布は、はんだペースト用途に応じて定めることができる。例えば、スクリーン印刷用途では、版抜け性を重視して、粒度分布をブロードにするのが好ましく、ディスペンス用途、及びビア充填用途では、吐出流動性及び穴埋め性を重視して、粒度分布をシャープにするのが好ましい。 The particle size distribution of the Cu-based alloy particles (1) and the composite alloy particles (2) can be determined according to the solder paste application. For example, in screen printing applications, it is preferable to make the particle size distribution broader with emphasis on plate slippage, and in dispensing applications and via filling applications, emphasis is placed on discharge fluidity and hole filling properties, and the particle size distribution is sharpened. It is preferable to do this.
Ｃｕ系合金粒子（１）及び複合合金粒子（２）の平均粒径は、後述するように、フラックスとの反応性及びペースト特性の観点から、好ましくは、それぞれ２〜３０μｍ、及び５〜４０μｍの範囲であり、より好ましくは、Ｃｕ系合金粒子（１）及び複合合金粒子（２）の平均粒径は、いずれも５〜２５μｍの範囲である。 The average particle diameters of the Cu-based alloy particles (1) and the composite alloy particles (2) are preferably 2 to 30 μm and 5 to 40 μm, respectively, from the viewpoint of reactivity with the flux and paste properties, as will be described later. More preferably, the average particle diameters of the Cu-based alloy particles (1) and the composite alloy particles (2) are both in the range of 5 to 25 μm.
本発明の金属フィラーは、後述するように、例えばフラックスと組合わされることによって、ペースト状の鉛フリーはんだを形成できる。このはんだペーストを用いて部品実装を行なう場合、リフロー熱処理によって形成されるはんだ接合部（特にフィレット部分）の表面に、薄いフラックス層が形成される場合がある。金属フィラーの平均粒径が小さいと、該フラックス層中に金属フィラーの微粒子が浮遊した状態（すなわち金属粒子が互いに離れている状態）で同伴されやすく、はんだ接合された部品を後続のフラックス洗浄工程に供する際に、洗浄液中に金属フィラーの粒子が流れ出して部品に付着するという不都合が生じる場合がある。Ｃｕ系合金粒子（１）及び複合合金粒子の平均粒径がいずれも５μｍ以上である場合、部品実装時にフラックス層中に金属フィラーの微粒子が同伴されにくく、フラックス層中の浮遊粒子の発生を抑制できるため、洗浄液中に流れ出す粒子の数を低減できる。一方、Ｃｕ系合金粒子（１）及び複合合金粒子の平均粒径がいずれも２５μｍ以下である場合、はんだペーストの粘着力が損なわれ難くなるので好ましい。 As described later, the metal filler of the present invention can form a paste-like lead-free solder, for example, by being combined with a flux. When component mounting is performed using this solder paste, a thin flux layer may be formed on the surface of a solder joint portion (particularly a fillet portion) formed by reflow heat treatment. If the average particle size of the metal filler is small, the metal particles are likely to be entrained in a state where the fine particles of the metal filler are suspended in the flux layer (that is, the metal particles are separated from each other), and the solder-joined parts are subsequently subjected to a flux cleaning process. In the case of being used, there may be a disadvantage that the metal filler particles flow out into the cleaning liquid and adhere to the parts. When the average particle size of the Cu-based alloy particles (1) and the composite alloy particles is 5 μm or more, metal filler fine particles are less likely to be entrained in the flux layer during component mounting, and the generation of suspended particles in the flux layer is suppressed. Therefore, the number of particles flowing out into the cleaning liquid can be reduced. On the other hand, when the average particle diameters of the Cu-based alloy particles (1) and the composite alloy particles are both 25 μm or less, the adhesive strength of the solder paste is hardly impaired, which is preferable.
なお、本明細書で規定するＣｕ系合金粒子（１）及び複合合金粒子（２）の元素組成は、例えば、誘導結合プラズマ（ＩＣＰ）発光分析等で確認されることができる。また、粒子断面の元素組成は、ＳＥＭ−ＥＤＸ（特性Ｘ線分析装置）を用いることによって解析されることができる。 Note that the elemental composition of the Cu-based alloy particles (1) and the composite alloy particles (2) defined in the present specification can be confirmed by, for example, inductively coupled plasma (ICP) emission analysis. Further, the elemental composition of the particle cross section can be analyzed by using SEM-EDX (characteristic X-ray analyzer).
なお、本明細書における「平均粒径」とは、レーザー回折式粒子径分布測定装置で測定される値をいう。 In the present specification, “average particle diameter” refers to a value measured by a laser diffraction particle diameter distribution measuring apparatus.
＜Ｃｕ系合金粒子（１）＞
Ｃｕ系合金粒子（１）とは、Ｃｕ、Ｉｎ及びＳｎを含み、かつＣｕ、Ｉｎ及びＳｎの中でＣｕを最高の質量割合で含む粒子をいう。さらに、Ｃｕ系合金粒子（１）は、Ａｇ又はＢｉの金属を含むことが好ましい。これにより、Ｃｕ系合金粒子（１）は準安定合金相を形成できる。該準安定合金相の形成は、主に熱処理時のＣｕ系合金粒子（１）とＢｉ系合金粒子との合金化の促進に寄与し、従って、低温での溶融接合時の良好な接合強度の付与に寄与する。
<Cu-based alloy particles (1)>
The Cu-based alloy particles (1) refer to particles that contain Cu, In, and Sn and that contain Cu at the highest mass ratio among Cu, In, and Sn. Furthermore, it is preferable that Cu type alloy particle (1) contains the metal of Ag or Bi. Thereby, Cu system alloy particles (1) can form a metastable alloy phase. The formation of the metastable alloy phase mainly contributes to the promotion of alloying between the Cu-based alloy particles (1) and the Bi-based alloy particles during the heat treatment, and therefore has good bonding strength at the time of fusion bonding at a low temperature. Contributes to grant.
Ｃｕ系合金粒子（１）は、Ａｇ５〜１５質量％、Ｂｉ２〜８質量％、Ｃｕ４９〜８１質量％、Ｓｎ１０〜２０質量％及びＩｎ２〜８質量％から成る。なお、この場合、不可避的不純物がＣｕ系合金粒子（１）に含まれてもよい。さらに好ましくは、Ｃｕ系合金粒子（１）は、Ａｇ８〜１２質量％、Ｂｉ３〜７質量％、Ｃｕ６０〜７０質量％、Ｓｎ１３〜１７質量％及びＩｎ３〜７質量％から成る。
The Cu-based alloy particles (1) are composed of Ag 5 to 15% by mass, Bi 2 to 8% by mass, Cu 49 to 81% by mass, Sn 10 to 20% by mass, and In 2 to 8% by mass. In this case, inevitable impurities may be included in the Cu-based alloy particles (1). More preferably, Cu system alloy particle (1) consists of Ag8-12 mass%, Bi3-7 mass%, Cu60-70 mass%, Sn13-17 mass%, and In3-7 mass%.
Ｃｕ系合金粒子（１）の平均粒径は、２〜３０μｍの範囲であることが好ましい。Ｃｕ系合金粒子（１）の平均粒径が２μｍ以上である場合、粒子の比表面積が小さくなる。そのため、例えば、後述するフラックスを用いて、本発明の金属フィラーからはんだペーストを形成するときに、Ｃｕ系合金粒子（１）とフラックスとの接触面積が少なくなり、そしてはんだペーストの寿命が長くなるという利点が得られる。さらに、Ｃｕ系合金粒子（１）の平均粒径が２μｍ以上である場合には、リフロー熱処理において、フラックスによる金属フィラーの還元反応（すなわち、金属フィラー粒子の酸化膜除去）で発生するアウトガスを少なくすることができるので、はんだ接続内部に発生するボイドを低減させることができる。また、Ｃｕ系合金粒子（１）の平均粒径は、はんだペーストの粘着力の観点から３０μｍ以下が好ましい。粒子サイズが大きくなりすぎると、粒子間の隙間が大きくなるので、はんだペーストの粘着力が損なわれ易くなり、そしてはんだ接合される部品の搭載からリフロー熱処理が終わるまでの工程間で該部品が外れ易くなる。より好ましくは、Ｃｕ系合金粒子（１）の平均粒径は、５〜２５μｍの範囲である。 The average particle diameter of the Cu-based alloy particles (1) is preferably in the range of 2 to 30 μm. When the average particle diameter of the Cu-based alloy particles (1) is 2 μm or more, the specific surface area of the particles becomes small. Therefore, for example, when a solder paste is formed from the metal filler of the present invention using a flux described later, the contact area between the Cu-based alloy particles (1) and the flux is reduced, and the life of the solder paste is increased. The advantage is obtained. Further, when the average particle diameter of the Cu-based alloy particles (1) is 2 μm or more, the outflow generated by the reduction reaction of the metal filler by the flux (that is, the removal of the oxide film of the metal filler particles) is reduced in the reflow heat treatment. Therefore, voids generated inside the solder connection can be reduced. The average particle size of the Cu-based alloy particles (1) is preferably 30 μm or less from the viewpoint of the adhesive strength of the solder paste. If the particle size becomes too large, the gaps between the particles become large, so that the adhesive strength of the solder paste tends to be lost, and the parts come off during the process from the mounting of the parts to be soldered to the end of the reflow heat treatment. It becomes easy. More preferably, the average particle diameter of the Cu-based alloy particles (1) is in the range of 5 to 25 μm.
前述の通り、金属フィラー中のＣｕ系合金粒子（１）の含有量は、金属フィラーの全質量を基準として、３０〜４５質量％の範囲、好ましくは、３１〜４０質量％の範囲、より好ましくは、３３〜３７質量％の範囲である。 As described above, the content of the Cu-based alloy particles (1) in the metal filler is in the range of 30 to 45% by mass, preferably in the range of 31 to 40% by mass, more preferably based on the total mass of the metal filler. Is in the range of 33-37% by weight.
＜複合合金粒子（２）＞
複合合金粒子（２）とは、Ｂｉ系合金粒子とＳｎ粒子又はＢｉ不含有Ｓｎ系合金粒子との混合物をいう。Ｓｎ粒子又はＢｉ不含有Ｓｎ系合金粒子の固相線温度は、Ｂｉ系合金粒子の固相線温度以上である。低温溶融接合性を考慮すると、複合合金粒子（２）中のＳｎ粒子又はＢｉ不含有Ｓｎ系合金粒子の含有量は、Ｂｉ系合金粒子１００質量部に対して２５〜２５０質量部の範囲である。Ｂｉ系合金粒子１００質量部に対して、前記Ｓｎ粒子又はＢｉ不含有Ｓｎ系合金粒子の含有量が２５質量部以上である場合には、複合合金粒子（２）中のＢｉ含有量が相対的に少なくなるため接続信頼性の観点で有利である。Ｓｎ粒子又はＢｉ不含有Ｓｎ系合金粒子の含有量は、Ｂｉ系合金粒子１００質量部に対して、３０質量部以上であることが好ましく、５０質量部以上であることがより好ましい。また、Ｂｉ系合金粒子１００質量部に対して、前記Ｓｎ粒子又はＢｉ不含有Ｓｎ系合金粒子の含有量が２５０質量部以下である場合には、Ｂｉ系合金粒子による低温接合性が確保できる。Ｓｎ粒子又はＢｉ不含有Ｓｎ系合金粒子の含有量は、Ｂｉ系合金粒子１００質量部に対して、２３０質量％以下であることが好ましく、２１０質量％以下であることがより好ましい。
<Composite alloy particles (2)>
The composite alloy particle (2) refers to a mixture of Bi-based alloy particles and Sn particles or Bi-free Sn-based alloy particles. The solidus temperature of the Sn particles or Bi-free Sn-based alloy particles is equal to or higher than the solidus temperature of the Bi-based alloy particles. Considering the low-temperature melt bondability, the content of Sn particles or Bi-free Sn-based alloy particles in the composite alloy particles (2) is in the range of 25 to 250 parts by mass with respect to 100 parts by mass of Bi-based alloy particles. . When the content of the Sn particles or Bi-free Sn-based alloy particles is 25 parts by mass or more with respect to 100 parts by mass of the Bi-based alloy particles, the Bi content in the composite alloy particles (2) is relatively This is advantageous from the viewpoint of connection reliability. The content of Sn particles or Bi-free Sn-based alloy particles is preferably 30 parts by mass or more and more preferably 50 parts by mass or more with respect to 100 parts by mass of Bi-based alloy particles. Further, when the content of the Sn particles or Bi-free Sn-based alloy particles is 250 parts by mass or less with respect to 100 parts by mass of the Bi-based alloy particles, low-temperature bondability due to the Bi-based alloy particles can be ensured. The content of Sn particles or Bi-free Sn-based alloy particles is preferably 230% by mass or less, and more preferably 210% by mass or less with respect to 100 parts by mass of Bi-based alloy particles.
Ｂｉ系合金粒子の固相線温度は、好ましくは８０〜１６０℃の範囲であり、より好ましくは１００〜１５０℃の範囲である。また、Ｓｎ粒子及びＢｉを含まないＳｎ系合金粒子の固相線温度は、耐熱性の観点からＢｉ系合金粒子の固相線温度よりも、２０℃以上高いことが好ましく、５０℃以上高いことがより好ましい。本発明の典型的な実施態様では、本発明の鉛フリーはんだを用いるときのリフロー熱処理温度でＢｉ系合金粒子は溶融し、Ｓｎ粒子又はＢｉを含まないＳｎ系合金粒子は完全溶融しない。 The solidus temperature of the Bi-based alloy particles is preferably in the range of 80 to 160 ° C, more preferably in the range of 100 to 150 ° C. In addition, the solidus temperature of Sn-based alloy particles not containing Sn particles and Bi is preferably 20 ° C. or higher, and higher by 50 ° C. or higher than the solidus temperature of Bi-based alloy particles from the viewpoint of heat resistance. Is more preferable. In a typical embodiment of the present invention, the Bi-based alloy particles melt at the reflow heat treatment temperature when using the lead-free solder of the present invention, and the Sn-based alloy particles not containing Sn particles or Bi are not completely melted.
＜Ｂｉ系合金粒子＞
一般に、Ｂｉ系合金粒子とは、Ｂｉを含む合金粒子をいう。本発明で使用されるＢｉ系合金粒子は、Ｂｉ系合金粒子の全質量を基準として、４０〜７０質量％のＢｉ並びに３０〜６０質量％のＡｇ、Ｃｕ、Ｉｎ及びＳｎから選ばれる１種以上の金属から選択される少なくとも１種の金属を含む。なお、不可避的不純物がＢｉ系合金粒子に含まれていてもよい。Ｂｉ系合金粒子は、上記組成を有することにより、リフロー熱処理において溶融し、そして溶融したＢｉ系合金粒子成分とＣｕ系合金粒子（１）、又は溶融したＢｉ系合金粒子成分とＳｎ粒子若しくはＢｉ不含有Ｓｎ系合金粒子の間で、熱拡散による合金化が良好に実現される。
<Bi alloy particles>
In general, Bi-based alloy particles refer to alloy particles containing Bi. The Bi-based alloy particles used in the present invention are one or more selected from 40 to 70% by mass of Bi and 30 to 60% by mass of Ag, Cu, In and Sn based on the total mass of the Bi-based alloy particles. At least one metal selected from these metals. Inevitable impurities may be contained in the Bi-based alloy particles. The Bi-based alloy particles are melted in the reflow heat treatment by having the above composition, and the molten Bi-based alloy particle component and the Cu-based alloy particle (1), or the molten Bi-based alloy particle component and the Sn particle or Bi non-refined. Alloying by thermal diffusion is satisfactorily realized between the contained Sn-based alloy particles.
Ｂｉ系合金粒子中のＢｉの含有量は、Ｂｉ系合金粒子の全質量を基準として、低温での溶融接合を可能にするとともに接合後に室温での良好な接合強度を得る観点から、４０質量％以上７０質量％以下であり、好ましくは５０〜６０質量％である。 The Bi content in the Bi-based alloy particles is 40% by mass from the viewpoint of enabling fusion bonding at a low temperature and obtaining good bonding strength at room temperature after bonding based on the total mass of the Bi-based alloy particles. It is 70 mass% or less, Preferably it is 50-60 mass%.
Ｂｉ系合金粒子中の、Ａｇ、Ｃｕ、Ｉｎ及びＳｎから選ばれる１種以上の金属の含有量は、Ｃｕ系合金粒子（１）とＢｉ系合金粒子との合金化を良好に実現する観点から３０質量％以上であり、ＢｉをＢｉ系合金粒子中に十分な量で含有させて低温での溶融接合を可能にする観点から６０質量％以下である。上記Ａｇ、Ｃｕ、Ｉｎ及びＳｎから選ばれる１種以上の金属の含有量は、好ましくは４０〜５０質量％である。 The content of one or more metals selected from Ag, Cu, In and Sn in the Bi-based alloy particles is from the viewpoint of satisfactorily alloying the Cu-based alloy particles (1) with the Bi-based alloy particles. It is 30% by mass or more, and is 60% by mass or less from the viewpoint of allowing Bi to be contained in Bi-based alloy particles in a sufficient amount and enabling fusion bonding at a low temperature. The content of one or more metals selected from the above Ag, Cu, In and Sn is preferably 40 to 50% by mass.
特に、金属フィラーの良好な低温溶融性及び接合性、並びに低温での溶融接合における良好な接合強度を提供するために、Ｂｉ系合金粒子はＳｎを含むことが好ましい。Ｂｉ系合金粒子中のＳｎの含有量は、Ｂｉ系合金粒子の全質量を基準として、４０〜５０質量％であることが好ましく、４０〜４４質量％がより好ましい。また、Ｂｉ系合金粒子にＩｎを加えることによって、より低温での溶融接合も可能である。 In particular, the Bi-based alloy particles preferably contain Sn in order to provide good low-temperature meltability and bondability of the metal filler and good bonding strength in low-temperature melt bonding. The content of Sn in the Bi-based alloy particles is preferably 40 to 50% by mass and more preferably 40 to 44% by mass based on the total mass of the Bi-based alloy particles. Further, by adding In to Bi-based alloy particles, fusion bonding at a lower temperature is possible.
Ｂｉ系合金粒子が、Ａｇ、Ｃｕ及びＩｎから選ばれる１種以上の金属を含む場合には、延性の改善、低融点化、機械的強度等の改良が可能である。 When the Bi-based alloy particles contain one or more metals selected from Ag, Cu and In, it is possible to improve ductility, lower melting point, mechanical strength and the like.
また、金属フィラーの低温溶融性及び接合性の観点から、Ｂｉ系合金粒子は、好ましくは、Ｓｎ−Ｂｉ系合金粒子であり、より好ましくは、凝固欠陥及び偏析が生じ難い共晶組成（典型的には、固相線温度１３９℃のＳｎ−５８Ｂｉ）を有するＳｎ−Ｂｉ系合金粒子である。Ｓｎ−Ｂｉ系合金粒子は、典型的には、Ｓｎ及びＢｉのみを構成元素とする（但し、不可避的不純物を含有してもよい。）が、延性の改善、低融点化、機械的強度等の改良の目的で、Ａｇ、Ｃｕ及びＩｎから選ばれる１種以上の金属を微量添加されることができる。具体例として、固相線温度１３８℃のＳｎ−５７Ｂｉ−１Ａｇが挙げられる。 Further, from the viewpoint of the low-temperature melting property and bonding property of the metal filler, the Bi-based alloy particles are preferably Sn-Bi-based alloy particles, and more preferably a eutectic composition that hardly causes solidification defects and segregation (typical). Are Sn-Bi alloy particles having Sn-58Bi) with a solidus temperature of 139 ° C. Sn-Bi alloy particles typically contain only Sn and Bi as constituent elements (however, they may contain unavoidable impurities), but they have improved ductility, lower melting point, mechanical strength, etc. For the purpose of improving, a trace amount of one or more metals selected from Ag, Cu and In can be added. A specific example is Sn-57Bi-1Ag having a solidus temperature of 138 ° C.
Ｂｉ系合金粒子の平均粒径は、Ｃｕ系合金粒子（１）の平均粒径と同じ理由、すなわち、フラックスとの反応性及びペーストの粘着力の観点から、好ましくは、５〜４０μｍの範囲であり、より好ましくは、５〜２５μｍの範囲である。 The average particle diameter of the Bi-based alloy particles is preferably in the range of 5 to 40 μm from the same reason as the average particle diameter of the Cu-based alloy particles (1), that is, from the viewpoint of the reactivity with the flux and the adhesive strength of the paste. More preferably, it is the range of 5-25 micrometers.
＜Ｓｎ粒子又はＢｉ不含有Ｓｎ系合金粒子＞
一般に、Ｓｎ粒子とは、Ｓｎから成る粒子をいう。一般に、Ｓｎ粒子の固相線温度は、約２３２℃である。また、一般に、Ｂｉ不含有Ｓｎ系合金粒子とは、Ｂｉを含まず、かつＳｎを含む合金粒子をいうが、不可避的不純物としてのＢｉの混入を除外するものではない。Ｂｉ不含有Ｓｎ系合金粒子は、前記Ｂｉ系合金粒子の固相線温度以上の固相線温度を有する。前述の通り、Ｂｉ系合金粒子の固相線温度は、８０〜１６０℃の範囲であり、Ｓｎ粒子及びＢｉを含まないＳｎ系合金粒子の固相線温度は、耐熱性の観点からＢｉ系合金粒子の固相線温度よりも、２０℃以上高いことが好ましく、５０℃以上高いことがより好ましい。
<Sn particles or Bi-free Sn-based alloy particles>
In general, Sn particles refer to particles made of Sn. In general, the solidus temperature of Sn particles is about 232 ° C. In general, Bi-free Sn-based alloy particles refer to alloy particles that do not contain Bi and contain Sn, but do not exclude the inclusion of Bi as an inevitable impurity. The Bi-free Sn-based alloy particles have a solidus temperature higher than the solidus temperature of the Bi-based alloy particles. As described above, the solidus temperature of Bi-based alloy particles is in the range of 80 to 160 ° C., and the solidus temperature of Sn-based alloy particles not containing Sn particles and Bi is Bi-based alloy from the viewpoint of heat resistance. It is preferably 20 ° C. or higher, more preferably 50 ° C. or higher than the solidus temperature of the particles.
また、Ｓｎ系合金粒子は、Ｓｎ１００質量部に対して、４．０質量部以下のＡｇ及び／又はＣｕを含む。本発明に使用されるＳｎ系合金粒子の具体例としては、Ｓｎ−３．０Ａｇ−０．５Ｃｕ粒子（固相線温度：約２１７℃）、Ｓｎ−３．５Ａｇ粒子（固相線温度：約２２１℃）、Ｓｎ−０．７５Ｃｕ粒子（固相線温度：約２２７℃）、Ｓｎ−０．３Ａｇ−０．７Ｃｕ粒子（固相線温度：約２１７℃）等が挙げられる。Ｓｎ粒子又はＢｉ不含有Ｓｎ系合金粒子の平均粒子径は、Ｃｕ系合金粒子（１）の平均粒径と同じ理由、すなわちフラックスとの反応性及びペーストの粘着力の観点から、好ましくは、５〜４０μｍの範囲であり、より好ましくは、５〜２５μｍの範囲である。 In addition, the Sn-based alloy particles contain 4.0 parts by mass or less of Ag and / or Cu with respect to 100 parts by mass of Sn. Specific examples of Sn-based alloy particles used in the present invention include Sn-3.0Ag-0.5Cu particles (solidus temperature: about 217 ° C.), Sn-3.5Ag particles (solidus temperature: about 221 ° C.), Sn-0.75Cu particles (solidus temperature: about 227 ° C.), Sn-0.3Ag-0.7Cu particles (solidus temperature: about 217 ° C.), and the like. The average particle diameter of the Sn particles or Bi-free Sn-based alloy particles is preferably the same as the average particle diameter of the Cu-based alloy particles (1), that is, from the viewpoint of the reactivity with the flux and the adhesive strength of the paste. It is in the range of ˜40 μm, and more preferably in the range of 5 to 25 μm.
＜粒子の製造方法＞
Ｃｕ系合金粒子（１）、Ｂｉ系合金粒子、Ｓｎ粒子又はＢｉ不含有Ｓｎ系合金粒子を製造する方法としては、微粉末の製造方法として既知の方法を採用できるが、急冷凝固法が好ましい。急冷凝固法による微粉末の製造方法としては、水噴霧法、ガス噴霧法、遠心噴霧法等が挙げられる。これらの中でも、粒子の酸素含有量を抑えることができる点から、ガス噴霧法及び遠心噴霧法がより好ましい。
<Method for producing particles>
As a method for producing the Cu-based alloy particles (1), Bi-based alloy particles, Sn particles, or Bi-free Sn-based alloy particles, a known method can be adopted as a method for producing fine powder, but a rapid solidification method is preferred. Examples of the method for producing fine powder by the rapid solidification method include a water spray method, a gas spray method, and a centrifugal spray method. Among these, the gas spraying method and the centrifugal spraying method are more preferable because the oxygen content of the particles can be suppressed.
ガス噴霧法では、通常、窒素ガス、アルゴンガス、ヘリウムガス等の不活性ガスを使用することができる。これらの不活性ガスの中でも、ガス噴霧時の線速を高くして、冷却速度を速くできる点で、比重の軽いヘリウムガスを用いることが好ましい。冷却速度は、５００〜５０００℃／秒の範囲であることが好ましい。 In the gas spraying method, an inert gas such as nitrogen gas, argon gas, or helium gas can be usually used. Among these inert gases, helium gas having a low specific gravity is preferably used in that the linear velocity during gas spraying can be increased to increase the cooling rate. The cooling rate is preferably in the range of 500 to 5000 ° C./second.
遠心噴霧法では、回転ディスク上面に均一な溶融膜を形成する観点から、ディスクの材料は、サイアロンであることが好ましく、そしてディスク回転速度は、６万〜１２万ｒｐｍの範囲であることが好ましい。 In the centrifugal spraying method, from the viewpoint of forming a uniform molten film on the upper surface of the rotating disk, the disk material is preferably sialon, and the disk rotation speed is preferably in the range of 60,000 to 120,000 rpm. .
＜鉛フリーはんだ＞
本発明は、上述した本発明の金属フィラーを含む鉛フリーはんだをも提供する。本明細書において、「鉛フリー」とは、ＥＵの環境規制に準じ、鉛の含有量が０．１質量％以下であることを意味する。本発明の鉛フリーはんだは、金属フィラー成分及びフラックス成分を含むはんだペーストであることが好ましい。典型的には、本発明の鉛フリーはんだは、金属フィラー成分及びフラックス成分から成る。金属フィラー成分は、上述した本発明の金属フィラーであるが、本発明の効果を損なわない範囲で、他の金属フィラーを少量含んでもよい。
<Lead-free solder>
The present invention also provides a lead-free solder containing the metal filler of the present invention described above. In this specification, “lead-free” means that the lead content is 0.1% by mass or less in accordance with EU environmental regulations. The lead-free solder of the present invention is preferably a solder paste containing a metal filler component and a flux component. Typically, the lead-free solder of the present invention consists of a metal filler component and a flux component. The metal filler component is the metal filler of the present invention described above, but may contain a small amount of other metal fillers as long as the effects of the present invention are not impaired.
上記はんだペースト中の金属フィラー成分の含有量は、ペースト特性の観点から、はんだペーストの全質量（すなわち、１００質量％）を基準として、８４〜９４質量％の範囲であることが好ましい。はんだペースト中の金属フィラー成分の含有量のより好ましい範囲は、ペーストの用途に応じて定めることができる。例えば、スクリーン印刷用途では、版抜け性が重視されるので、はんだペースト中の金属フィラー成分の含有量は、はんだペーストの全質量を基準として、好ましくは、８７〜９２質量％の範囲であり、より好ましくは、８８〜９１質量％の範囲である。例えば、ディスペンス用途では、吐出流動性が重視されるので、はんだペースト中の金属フィラー成分の含有量は、はんだペーストの全質量を基準として、好ましくは、８０〜８９質量％の範囲であり、より好ましくは、８６〜８８質量％の範囲である。 The content of the metal filler component in the solder paste is preferably in the range of 84 to 94% by mass based on the total mass of the solder paste (that is, 100% by mass) from the viewpoint of paste characteristics. A more preferable range of the content of the metal filler component in the solder paste can be determined according to the use of the paste. For example, in screen printing applications, the ability to remove the plate is important, so the content of the metal filler component in the solder paste is preferably in the range of 87 to 92% by mass, based on the total mass of the solder paste, More preferably, it is the range of 88-91 mass%. For example, in dispensing applications, discharge fluidity is important, so the content of the metal filler component in the solder paste is preferably in the range of 80 to 89% by mass based on the total mass of the solder paste, and more Preferably, it is the range of 86-88 mass%.
一般に、フラックスとは、はんだより速く溶融して、金属表面を洗浄する材料をいう。本発明で使用されるフラックス成分は、ロジン、溶剤、活性剤及びチクソ剤を含むことが好ましい。そのようなフラックス成分は、金属フィラーの表面処理に好適である。すなわち、フラックス成分は、リフロー熱処理時にはんだペースト中の金属フィラー成分の酸化膜を除去し、再酸化を抑制することで、金属の溶融及び熱拡散による合金化を促進する。フラックス成分としては、既知の材料を使用することができる。 In general, flux refers to a material that melts faster than solder and cleans the metal surface. The flux component used in the present invention preferably contains rosin, a solvent, an activator and a thixotropic agent. Such a flux component is suitable for the surface treatment of the metal filler. That is, the flux component promotes alloying due to metal melting and thermal diffusion by removing the oxide film of the metal filler component in the solder paste during reflow heat treatment and suppressing reoxidation. As the flux component, a known material can be used.
＜導電性接着剤＞
本発明は、上述した本発明の金属フィラーを含む導電性接着剤も提供する。一般に、導電性接着剤とは、銀、銅、カーボンファイバー等の導電性の良い材料を含む接着剤をいう。一般に、導電性接着剤は、鉛フリー、揮発性有機化合物（ＶＯＣ）フリー、フラックスレス、容易な低温実装等の特徴を有するので、本発明の導電性接着剤は、電気接続したいがはんだ付けできない部品（例えば、半導体チップ、液晶、有機ＥＬ、ＬＥＤ等に関連するデバイス）に適する。また、本発明の導電性接着剤は、上記鉛フリーはんだと同じ組成を有することができる。ただし、本発明の導電性接着剤は、フラックス成分を含んでもよいし、含まなくてもよい。
<Conductive adhesive>
The present invention also provides a conductive adhesive containing the metal filler of the present invention described above. In general, the conductive adhesive refers to an adhesive containing a material having good conductivity such as silver, copper, or carbon fiber. In general, conductive adhesives have characteristics such as lead-free, volatile organic compound (VOC) -free, fluxless, easy low-temperature packaging, etc., so the conductive adhesive of the present invention can be electrically connected but cannot be soldered. Suitable for components (for example, devices related to semiconductor chips, liquid crystals, organic EL, LEDs, etc.). Moreover, the conductive adhesive of the present invention can have the same composition as the lead-free solder. However, the conductive adhesive of the present invention may or may not contain a flux component.
＜接続構造体＞
本発明は、第１の電子部品、第２の電子部品、並びに該第１の電子部品及び該第２の電子部品を接合しているはんだ接合部又は該第１の電子部品及び該第２の電子部品を接着している接着部を含む接続構造体も提供する。また、本発明の接続構造体では、前記はんだ接合部は、本発明の鉛フリーはんだを、前記Ｂｉ系合金粒子の固相線温度以上であり、かつ前記Ｓｎ粒子又はＳｎ系合金粒子の固相線温度以下である温度でリフロー熱処理することにより形成されている。また、本発明の接続構造体では、前記接着部は、本発明の導電性接着剤を、前記Ｂｉ系合金粒子の固相線温度以上であり、かつ前記Ｓｎ粒子又はＳｎ系合金粒子の固相線温度以下である温度でリフロー熱処理することにより形成されている。
<Connection structure>
The present invention provides a first electronic component, a second electronic component, and a solder joint that joins the first electronic component and the second electronic component, or the first electronic component and the second electronic component. There is also provided a connection structure including an adhesive part for adhering the electronic component. Moreover, in the connection structure of the present invention, the solder joint portion is made of the lead-free solder of the present invention at a temperature equal to or higher than the solidus temperature of the Bi-based alloy particles, and the solid phase of the Sn particles or Sn-based alloy particles. It is formed by performing a reflow heat treatment at a temperature that is lower than the line temperature. Moreover, in the connection structure of the present invention, the bonding portion is formed by using the conductive adhesive of the present invention at or above the solidus temperature of the Bi-based alloy particles, and the solid phase of the Sn particles or Sn-based alloy particles. It is formed by performing a reflow heat treatment at a temperature that is lower than the line temperature.
第１の電子部品及び第２の電子部品の組合せとしては、基板電極と搭載部品電極との組み合わせ等が挙げられる。本発明の接続構造体を形成するための第１の電子部品と第２の電子部品との接合方法としては、基板電極にはんだペーストを塗布した後に搭載部品電極を載せてリフロー熱処理により接合する方法、搭載部品電極又は基板電極にはんだペーストを塗布し、リフロー熱処理によるバンプ形成後、搭載部品電極と基板電極とを重ね合せて再度リフロー熱処理で接合する方法等が挙げられる。上記の場合、電極間のはんだ接合により該電極間を接続できる。 Examples of the combination of the first electronic component and the second electronic component include a combination of a substrate electrode and a mounted component electrode. As a method of joining the first electronic component and the second electronic component for forming the connection structure according to the present invention, a method of joining the mounting component electrode after applying the solder paste to the substrate electrode and joining by reflow heat treatment For example, a solder paste is applied to the mounting component electrode or the substrate electrode, bumps are formed by reflow heat treatment, and then the mounting component electrode and the substrate electrode are overlapped and joined again by reflow heat treatment. In the above case, the electrodes can be connected by solder bonding between the electrodes.
リフロー時の熱処理ピーク温度は、好ましくは、１００〜２１０℃の範囲であり、より好ましくは１６０〜２００℃の範囲である。この熱処理時のピーク温度は、典型的には、Ｃｕ系合金粒子（１）の融点未満かつＢｉ系合金粒子の融点以上に設定される。本発明に係る鉛フリーはんだを用いて、電子デバイス等の搭載部品電極と基板電極とを接続する場合、Ｂｉ系合金粒子の融点以上の熱履歴が与えられるとＢｉ系合金粒子は溶融し、Ｃｕ系合金粒子（１）と溶融したＢｉ合金成分との間で熱拡散による合金化反応が進み、Ｂｉ系合金粒子の融点よりも高い融点を有する安定合金相が形成される。この新たな安定合金相の融点は、Ｓｎ−３．０Ａｇ−０．５Ｃｕから成る鉛フリーはんだのリフロー熱処理温度（例えば２６０℃程度）より高く、後工程で複数回の熱処理を受けてもはんだが溶融しない。したがって、本発明によれば、はんだの再溶融によって部品電極間で発生するショートを防止できる。 The heat treatment peak temperature at the time of reflow is preferably in the range of 100 to 210 ° C, more preferably in the range of 160 to 200 ° C. The peak temperature during this heat treatment is typically set below the melting point of the Cu-based alloy particles (1) and above the melting point of the Bi-based alloy particles. In the case where a mounting component electrode such as an electronic device and a substrate electrode are connected using the lead-free solder according to the present invention, the Bi-based alloy particle is melted when a thermal history equal to or higher than the melting point of the Bi-based alloy particle is given. An alloying reaction by thermal diffusion proceeds between the system alloy particles (1) and the molten Bi alloy component, and a stable alloy phase having a melting point higher than that of the Bi system alloy particles is formed. The melting point of this new stable alloy phase is higher than the reflow heat treatment temperature (for example, about 260 ° C.) of the lead-free solder made of Sn-3.0Ag-0.5Cu, Does not melt. Therefore, according to this invention, the short circuit which generate | occur | produces between component electrodes by remelting of a solder can be prevented.
また、溶融したＢｉ合金成分はＳｎ粒子又はＢｉを含まないＳｎ系合金粒子に対して溶融拡散することで、Ｂｉ組成の少ないＳｎ系合金相を形成する。典型的な実施態様では、本発明の鉛フリーはんだ又は導電性接着剤を用いるときのリフロー熱処理温度においてＣｕ系合金粒子（１）は完全溶融しない。これにより、本発明の金属フィラーを含む鉛フリーはんだは、低温条件（典型的には、Ｓｎ−３７Ｐｂ共晶はんだのリフロー熱処理条件よりも低い温度の条件）で溶融接合されることができるとともに、溶融接合後には、熱処理で再溶融しないという効果を有し、そして溶融接合部は、Ｓｎ−５８Ｂｉの共晶組成等に比べてＢｉ含有量の少ないＳｎ系合金相を形成するので、接続抵抗が下がる等の特性に優れる。 Further, the melted Bi alloy component melts and diffuses with respect to Sn particles or Sn-based alloy particles not containing Bi, thereby forming a Sn-based alloy phase with a small Bi composition. In a typical embodiment, the Cu-based alloy particles (1) do not melt completely at the reflow heat treatment temperature when using the lead-free solder or conductive adhesive of the present invention. Thereby, the lead-free solder containing the metal filler of the present invention can be melt-bonded at a low temperature condition (typically, a temperature condition lower than the reflow heat treatment condition of the Sn-37Pb eutectic solder), After melt bonding, it has the effect of not being re-melted by heat treatment, and the melt-bonded portion forms an Sn-based alloy phase with a small Bi content compared to the eutectic composition of Sn-58Bi, etc. Excellent characteristics such as lowering.
＜部品搭載基板＞
本発明は、基板及び該基板上に搭載された本発明の接続構造体を含む部品搭載基板をも提供する。また、本発明の部品搭載基板は、好ましくは、電子部品が搭載されている基板であり、そして各種の電子機器の製造に使用されることができる。
<Component mounting board>
The present invention also provides a component mounting substrate including the substrate and the connection structure of the present invention mounted on the substrate. The component mounting board of the present invention is preferably a board on which electronic components are mounted, and can be used for manufacturing various electronic devices.
以下、本発明を実施例によって具体的に説明するが、本発明はこれらに限定されるものではない。 EXAMPLES Hereinafter, the present invention will be specifically described with reference to examples, but the present invention is not limited to these examples.
＜実施例１＞
（１）Ｃｕ系合金粒子（１）の製造
Ｃｕ６．５ｋｇ（純度９９質量％以上）、Ｓｎ１．５ｋｇ（純度９９質量％以上）、Ａｇ１．０ｋｇ（純度９９質量％以上）、Ｂｉ０．５ｋｇ（純度９９質量％以上）、及びＩｎ０．５ｋｇ（純度９９質量％以上）（すなわち、目標元素組成が、Ｃｕ：６５質量％、Ｓｎ：１５質量％、Ａｇ：１０質量％、Ｂｉ：５質量％、及びＩｎ：５質量％である。）を黒鉛坩堝に入れ、９９体積％以上のヘリウム雰囲気で、高周波誘導加熱装置により１４００℃まで加熱、融解した。次に、この溶融金属を、坩堝の先端より、ヘリウムガス雰囲気の噴霧槽内に導入した後、坩堝先端付近に設けられたガスノズルから、ヘリウムガス（純度９９体積％以上、酸素濃度０．１体積％未満、圧力２．５ＭＰａ）を噴出してアトマイズを行い、そして２６００℃／秒の冷却速度で溶融金属を冷却することにより、Ｃｕ系合金粒子（１）を作製した。
<Example 1>
(1) Production of Cu-based alloy particles (1) Cu 6.5 kg (purity 99 mass% or more), Sn 1.5 kg (purity 99 mass% or more), Ag 1.0 kg (purity 99 mass% or more), Bi 0.5 kg (purity) 99 mass% or more) and In 0.5 kg (purity 99 mass% or more) (that is, the target element composition is Cu: 65 mass%, Sn: 15 mass%, Ag: 10 mass%, Bi: 5 mass%, and In: 5 mass%) was placed in a graphite crucible, and heated and melted to 1400 ° C. with a high-frequency induction heating apparatus in a helium atmosphere of 99 vol% or more. Next, this molten metal is introduced into the spray tank in the helium gas atmosphere from the tip of the crucible, and then helium gas (purity 99 volume% or more, oxygen concentration 0.1 volume) from a gas nozzle provided in the vicinity of the crucible tip. The Cu-based alloy particles (1) were prepared by atomizing by spraying (less than%, pressure 2.5 MPa) and cooling the molten metal at a cooling rate of 2600 ° C./second.
このＣｕ系合金粒子（１）を気流式分級機（日清エンジニアリング：ＴＣ−１５Ｎ）を用いて、２０μｍ設定で分級し、大粒子側を回収後、もう一度３０μｍ設定で分級し、小粒子側を回収した。回収した合金粒子をレーザー回折式粒子径分布測定装置（ＨＥＬＯＳ＆ＲＯＤＯＳ）で測定したところ、平均粒径は、１５．１μｍであった。このＣｕ系合金粒子（１）を示差走査熱量計（島津製作所：ＤＳＣ−５０）を用いて、窒素雰囲気下、昇温速度１０℃／分の条件で、４０〜５８０℃の範囲において測定したところ、５０２℃及び５２１℃に吸熱ピークが検出され、これらによって示される複数の融点から、複数の合金相の存在を確認することができた。また、２５８℃及び２８２℃には発熱ピークが検出され、準安定合金相の存在を確認することができた。 This Cu-based alloy particle (1) is classified using an airflow classifier (Nisshin Engineering: TC-15N) at a setting of 20 μm, and after collecting the large particles, it is classified again at a setting of 30 μm. It was collected. When the collected alloy particles were measured with a laser diffraction particle size distribution analyzer (HELOS & RODOS), the average particle size was 15.1 μm. When this Cu-based alloy particle (1) was measured in the range of 40 to 580 ° C. using a differential scanning calorimeter (Shimadzu Corporation: DSC-50) under a nitrogen atmosphere under a temperature rising rate of 10 ° C./min. Endothermic peaks were detected at 502 ° C. and 521 ° C., and the presence of a plurality of alloy phases could be confirmed from the plurality of melting points indicated by these. Further, exothermic peaks were detected at 258 ° C. and 282 ° C., and the presence of a metastable alloy phase could be confirmed.
（２）Ｂｉ系合金粒子
Ｂｉ系合金粒子には、山石金属（株）社製の粒度１０μｍ〜２５μｍのはんだ粉末Ｓｎ−５８Ｂｉ（元素組成は、Ｂｉ：５８質量％、Ｓｎ：４２質量％であり、固相線温度は１３９℃である）を用いた。示差走査熱量計（島津製作所：ＤＳＣ−５０）によって、前記Ｃｕ系合金粒子（１）の測定と同じ測定条件で測定される融点は、１３８℃であった。また、Ｂｉ系合金粒子をレーザー回折式粒子径分布測定装置（ＨＥＬＯＳ＆ＲＯＤＯＳ）で測定したところ平均粒径は２０．４μｍであった。
(2) Bi-based alloy particles The Bi-based alloy particles include a solder powder Sn-58Bi with a particle size of 10 μm to 25 μm manufactured by Yamaishi Metal Co., Ltd. (element composition is Bi: 58 mass%, Sn: 42 mass%) The solidus temperature is 139 ° C.). The melting point measured by a differential scanning calorimeter (Shimadzu Corporation: DSC-50) under the same measurement conditions as the measurement of the Cu-based alloy particles (1) was 138 ° C. Further, when the Bi-based alloy particles were measured with a laser diffraction type particle size distribution measuring device (HELOS & RODOS), the average particle size was 20.4 μm.
（３）Ｓｎ粒子
Ｓｎ粒子としては、山石金属（株）社製の粒度１０μｍ〜２５μｍのＳｎ粒子を用いた。該Ｓｎ粒子をレーザー回折式粒子径分布測定装置（ＨＥＬＯＳ＆ＲＯＤＯＳ）で測定したところ平均粒径は２１．８μｍであった。なお、Ｓｎ粒子の固相線温度は、２３２℃である。
(3) Sn particles As the Sn particles, Sn particles having a particle size of 10 μm to 25 μm manufactured by Yamaishi Metal Co., Ltd. were used. When the Sn particles were measured with a laser diffraction particle size distribution analyzer (HELOS & RODOS), the average particle size was 21.8 μm. The solidus temperature of the Sn particles is 232 ° C.
（４）鉛フリーはんだペーストの作製
上記のＣｕ系合金粒子（１）、並びにＢｉ系合金粒子及びＳｎ粒子の混合粉（複合合金粒子（２））を、質量比３５：６５で混合し、金属フィラー成分を調製した。このとき、Ｂｉ系合金粒子１００質量部に対して、Ｓｎ粒子が２００質量部となるように複合合金粒子（２）を調製した。次に、９０質量％の金属フィラー成分及び１０質量％のロジン系フラックスを混合し、ソルダーソフナー（マルコム：ＳＰＳ−１）、及び脱泡混練機（松尾産業：ＳＮＢ−３５０）に順次に供して、はんだペーストを作製した。
(4) Preparation of lead-free solder paste The Cu-based alloy particles (1) and the mixed powder of Bi-based alloy particles and Sn particles (composite alloy particles (2)) are mixed at a mass ratio of 35:65 to obtain a metal. A filler component was prepared. At this time, composite alloy particles (2) were prepared so that Sn particles were 200 parts by mass with respect to 100 parts by mass of Bi-based alloy particles. Next, 90% by mass of the metal filler component and 10% by mass of the rosin-based flux are mixed and sequentially supplied to a solder softener (Malcom: SPS-1) and a defoaming kneader (Matsuo Sangyo: SNB-350). A solder paste was prepared.
（５）部品接合強度の測定
上記はんだペーストを用いて１００５サイズの０Ω抵抗部品（１００５Ｒ）を実装し、その後、Ｎ２雰囲気で、ピーク温度１７０℃のリフロー条件で熱処理に供して、１００５Ｒ、４５個のデイジーチェーンを作製した。熱処理装置は、リフローシミュレータ（マルコム：ＳＲＳ−１Ｃ）を使用した。温度プロファイルは、熱処理開始（常温）から１００℃までを１．５℃／秒で昇温し、１００℃から１３０℃までを９０秒かけて徐々に昇温した後、２．０℃／秒で昇温し、ピーク温度１７０℃で４５秒間保持する条件を採用した。印刷パターン形成には、スクリーン印刷機（マイクロテック：ＭＴ−３２０ＴＶ）を用いた。印刷マスクはメタル製であり、そしてスキージはウレタン製である。マスクは、開口サイズ２ｍｍ×３．５ｍｍ、厚み０．１ｍｍである。印刷条件は、速度５０ｍｍ／秒、印圧０．１ＭＰａ、スキージ圧０．２ＭＰａ、背圧０．１ＭＰａ、アタック角度２０°、クリアランス０ｍｍ、及び印刷回数１回とした。その後、部品の長手方向より荷重を掛けて接合強度を測定したところ、部品接合強度の平均値は、４．２Ｎであった。なお、実施例１の（５）以降の評価結果を表１に示す。
(5) Measurement of component bonding strength A 1005 size 0Ω resistance component (1005R) is mounted using the above solder paste, and then subjected to heat treatment under a reflow condition at a peak temperature of 170 ° C. in an N 2 atmosphere. Individual daisy chains were made. A reflow simulator (Malcom: SRS-1C) was used as the heat treatment apparatus. The temperature profile is as follows: from heat treatment start (room temperature) to 100 ° C. at a rate of 1.5 ° C./second, gradually increasing from 100 ° C. to 130 ° C. over 90 seconds, and then at 2.0 ° C./second. The temperature was raised and the condition of maintaining the peak temperature at 170 ° C. for 45 seconds was adopted. A screen printer (Microtech: MT-320TV) was used for forming the print pattern. The printing mask is made of metal and the squeegee is made of urethane. The mask has an opening size of 2 mm × 3.5 mm and a thickness of 0.1 mm. The printing conditions were a speed of 50 mm / second, a printing pressure of 0.1 MPa, a squeegee pressure of 0.2 MPa, a back pressure of 0.1 MPa, an attack angle of 20 °, a clearance of 0 mm, and a printing frequency of once. Thereafter, when the bonding strength was measured by applying a load from the longitudinal direction of the component, the average value of the component bonding strength was 4.2 N. The evaluation results after (5) of Example 1 are shown in Table 1.
（６）部品接続抵抗
上記１００５Ｒ、４５個のデイジーチェーンの抵抗値を測定したところ、９８８ｍΩであった。
(6) Component connection resistance The resistance value of the above 1005R, 45 daisy chains was measured and found to be 988 mΩ.
（７）加熱時溶融流動特性
上記はんだペーストを、アルミナ基板上にスクリーン印刷機（マイクロテック：ＭＴ−３２０ＴＶ）を用いて印刷し（印刷厚み：２００μｍ、印刷開口：６ｍｍΦ）、ピーク温度１７０℃のリフロー条件（（５）同様）で熱処理を行った。リフロー前後での、はんだの面積変化を測定したところ、リフロー後は、リフロー前に対して９２．１％の面積に変化した。該面積変化を、表１の加熱時溶融流動特性に示した。
(7) Melt flow characteristics during heating The solder paste was printed on an alumina substrate using a screen printer (Microtech: MT-320TV) (printing thickness: 200 μm, printing opening: 6 mmΦ), and a peak temperature of 170 ° C. Heat treatment was performed under reflow conditions (similar to (5)). When the area change of the solder before and after the reflow was measured, it changed to an area of 92.1% after the reflow compared to before the reflow. The area change is shown in the melt flow characteristics during heating in Table 1.
＜実施例２及び３並びに比較例１及び２＞
Ｂｉ系合金粒子とＳｎ粒子の混合質量比を表１に示した混合比に変えて、その他条件は実施例１と同様の条件で各評価を実施した。
<Examples 2 and 3 and Comparative Examples 1 and 2>
The evaluation was performed under the same conditions as in Example 1 except that the mixing mass ratio of Bi-based alloy particles and Sn particles was changed to the mixing ratio shown in Table 1.
＜部品接合強度＞
表１の実施例１〜３及び比較例１より、Ｂｉ系合金粒子１００質量部に対して、Ｓｎ粒子が０〜２００質量部の複合合金粒子（２）を用いた場合には、１００５Ｒで４Ｎ以上の部品接合強度が得られている。一方、Ｂｉ系合金粒子１００質量部に対して、Ｓｎ粒子が６００質量部である場合には、１００５Ｒの部品接合強度が０ Ｎであった（比較例２）。これは複合合金粒子（２）中のＢｉ系合金粒子の混合比が少なくなりすぎると、１７０℃のリフローにて溶融する粒子が少なくなるため（Ｓｎ粒子の融点：２３２℃）良好な金属接合が得られないことを意味する。逆に、実施例１ではＢｉ系合金粒子１００質量部に対して、Ｓｎ粒子が２００質量部であるにもかかわらず、ピーク温度１７０℃のリフローによって、Ｓｎ粒子を含有しない比較例１と同等の部品接合強度がえられた。
<Part bonding strength>
From Examples 1 to 3 and Comparative Example 1 in Table 1, when using composite alloy particles (2) with Sn particles of 0 to 200 parts by mass with respect to 100 parts by mass of Bi-based alloy particles, 4N at 1005R The above component bonding strength is obtained. On the other hand, when the Sn particles were 600 parts by mass with respect to 100 parts by mass of the Bi-based alloy particles, the component bonding strength of 1005R was 0 N (Comparative Example 2). This is because, when the mixing ratio of Bi-based alloy particles in the composite alloy particles (2) is too small, the number of particles that melt by reflow at 170 ° C. is reduced (the melting point of Sn particles: 232 ° C.). It means that it cannot be obtained. On the contrary, in Example 1, with respect to 100 parts by mass of Bi-based alloy particles, although Sn particles are 200 parts by mass, the reflow at a peak temperature of 170 ° C. is equivalent to Comparative Example 1 that does not contain Sn particles. The component bonding strength was obtained.
＜部品接続抵抗＞
表１の実施例１〜３及び比較例１より、複合合金粒子（２）中のＢｉ系合金粒子の混合比を減らすことによって、部品接続抵抗値を下げることが可能であり、部品接続特性を改善できることがわかる。
<Part connection resistance>
From Examples 1 to 3 and Comparative Example 1 in Table 1, it is possible to lower the component connection resistance value by reducing the mixing ratio of Bi-based alloy particles in the composite alloy particles (2), and the component connection characteristics are You can see that it can be improved.
＜加熱時溶融流動特性＞
比較例１では、印刷したはんだを１７０℃で熱処理を行うことで、該はんだの面積が６３％に変化する。これは、リフロー時に、溶融した金属成分に表面張力が働いて、溶融流動していることを意味する。一方、実施例１〜３では、所定量のＳｎ粒子が複合合金粒子（２）中に加わったことによって、上記熱処理後のはんだ面積は、いずれも７０％以上であった。すなわち、実施例１〜３の金属フィラー組成では、加熱時の溶融流動が少ないため、比較例１の金属フィラー組成に比べてより耐熱性に優れているといえる。
<Melt flow characteristics during heating>
In Comparative Example 1, the printed solder is heat-treated at 170 ° C., whereby the area of the solder changes to 63%. This means that at the time of reflowing, surface tension acts on the molten metal component to cause melt flow. On the other hand, in Examples 1 to 3, the solder area after the heat treatment was 70% or more because a predetermined amount of Sn particles was added to the composite alloy particles (2). That is, it can be said that the metal filler compositions of Examples 1 to 3 are more excellent in heat resistance than the metal filler composition of Comparative Example 1 because the melt flow during heating is small.
＜実施例４〜６＞
実施例１のＳｎ粒子の代わりに、Ｓｎ系合金粒子である、粒度１０〜２５μｍのＳｎ−３．０Ａｇ−０．５Ｃｕ粒子（実施例４）、粒度１０〜２５μｍのＳｎ−３．５Ａｇ粒子（実施例５）、及び粒度２５〜３８μｍのＳｎ−０．３Ａｇ−０．７Ｃｕ粒子（実施例６）を用いて、実施例１と同様の評価を行った結果を表２に示す。部品接合強度、部品接続抵抗値、加熱時溶融流動特性はいずれも、実施例１に近い値が得られた。
<Examples 4 to 6>
Instead of the Sn particles of Example 1, Sn-3.0Ag-0.5Cu particles (Example 4) having a particle size of 10 to 25 μm and Sn-3.5Ag particles having a particle size of 10 to 25 μm (Sn alloy particles) Table 2 shows the results of evaluation similar to Example 1 using Example 5) and Sn-0.3Ag-0.7Cu particles (Example 6) having a particle size of 25 to 38 μm. Values close to those of Example 1 were obtained for the part bonding strength, the part connection resistance value, and the melt flow characteristics during heating.
本発明の金属フィラー及びこれを含む鉛フリーはんだ又は導電性接着剤は、後工程で複数回の熱処理を受ける接続構造体の用途（例えば、部品内蔵基板、パッケージ等の電子デバイスの用途）に適用されることができ、かつ低温実装を実現できる。 The metal filler of the present invention and the lead-free solder or conductive adhesive containing the metal filler are applied to the use of a connection structure (for example, use of an electronic device such as a component-embedded substrate or a package) that undergoes multiple heat treatments in a subsequent process. And low temperature mounting can be realized.
Claims (6)
（１）銅（Ｃｕ）系合金粒子
ここで、該Ｃｕ系合金粒子は、銀（Ａｇ）５〜１５質量％、ビスマス（Ｂｉ）２〜８質量％、Ｃｕ４９〜８１質量％、スズ（Ｓｎ）１０〜２０質量％及びインジウム（Ｉｎ）２〜８質量％からなり、そして該Ｃｕ系合金粒子の含有量は、該金属フィラーの全質量を基準として３０〜４５質量％である；並びに
（２）複合合金粒子
ここで、該複合合金粒子は、Ｂｉ系合金粒子とＳｎ粒子又はＢｉ不含有Ｓｎ系合金粒子との混合物であり、
該Ｓｎ粒子又はＢｉ不含有Ｓｎ系合金粒子の含有量は、該Ｂｉ系合金粒子１００質量部に対して２５〜２５０質量部であり、
該Ｂｉ系合金粒子は、該Ｂｉ系合金粒子の全質量を基準として４０〜７０質量％のＢｉ並びに３０〜６０質量％のＳｎからなり、
該Ｂｉ不含有Ｓｎ系合金粒子は、ＳｎとＡｇ及び／又はＣｕとからなり、該Ａｇ及び／又はＣｕの含有量は、Ｓｎ１００質量部に対して４．０質量部以下であり、
そして、該Ｂｉ不含有Ｓｎ系合金粒子は、該Ｂｉ系合金粒子の固相線温度以上の固相線温度を有する；
からなる金属フィラー。 below:
(1) Copper (Cu) -based alloy particles Here, the Cu-based alloy particles are 5 to 15% by mass of silver (Ag), 2 to 8% by mass of bismuth (Bi), 49 to 81% by mass of Cu, and tin (Sn). 10 to 20% by weight and indium (In) 2 to 8% by weight, and the content of the Cu-based alloy particles is 30 to 45% by weight based on the total weight of the metal filler; and (2) Here, the composite alloy particles are a mixture of Bi-based alloy particles and Sn particles or Bi-free Sn-based alloy particles,
The content of the Sn particles or Bi-free Sn-based alloy particles is 25 to 250 parts by mass with respect to 100 parts by mass of the Bi-based alloy particles.
The Bi-based alloy particles are composed of 40 to 70% by mass Bi and 30 to 60% by mass Sn based on the total mass of the Bi-based alloy particles ,
The Bi-free Sn-based alloy particles are composed of Sn and Ag and / or Cu, and the content of Ag and / or Cu is 4.0 parts by mass or less with respect to 100 parts by mass of Sn.
And the Bi-free Sn-based alloy particles have a solidus temperature equal to or higher than the solidus temperature of the Bi-based alloy particles;
Metal filler consisting of
A component mounting board including the board and the connection structure according to claim 4 mounted on the board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010279115A JP5724088B2 (en) | 2010-12-15 | 2010-12-15 | Metal filler and lead-free solder containing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010279115A JP5724088B2 (en) | 2010-12-15 | 2010-12-15 | Metal filler and lead-free solder containing the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2012125791A JP2012125791A (en) | 2012-07-05 |
| JP5724088B2 true JP5724088B2 (en) | 2015-05-27 |
Family
ID=46643450
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010279115A Active JP5724088B2 (en) | 2010-12-15 | 2010-12-15 | Metal filler and lead-free solder containing the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5724088B2 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0845721A (en) * | 1994-08-03 | 1996-02-16 | Sumitomo Metal Mining Co Ltd | Composition for resin bonded magnetic and manufacture of resin bonded magnet using said composition. |
| JP6184731B2 (en) * | 2013-04-25 | 2017-08-23 | Ｄｏｗａエレクトロニクス株式会社 | Silver-bismuth powder, conductive paste and conductive film |
| US20150060742A1 (en) * | 2013-09-03 | 2015-03-05 | E I Du Pont De Nemours And Company | Conductive paste used for a solar cell electrode |
| JP7500943B2 (en) * | 2019-10-11 | 2024-06-18 | 株式会社レゾナック | Metal paste for bonding, method for manufacturing bonded body, and bonded body |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11347784A (en) * | 1998-06-01 | 1999-12-21 | Victor Co Of Japan Ltd | Soldering paste and electronic circuit using the same |
| EP1864750B1 (en) * | 2005-04-01 | 2016-11-09 | Koki Company Limited | Conductive filler and solder material |
| JP4667103B2 (en) * | 2005-04-01 | 2011-04-06 | 旭化成イーマテリアルズ株式会社 | Conductive filler and low-temperature solder material |
| JP5584909B2 (en) * | 2008-11-28 | 2014-09-10 | 株式会社弘輝 | Connection structure |
| WO2010098357A1 (en) * | 2009-02-25 | 2010-09-02 | 旭化成イーマテリアルズ株式会社 | Metal filler, low-temperature-bonding lead-free solder and bonded structure |
-
2010
- 2010-12-15 JP JP2010279115A patent/JP5724088B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| JP2012125791A (en) | 2012-07-05 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5166261B2 (en) | Conductive filler | |
| JP2021178364A (en) | Solder composition | |
| TWI292355B (en) | ||
| JP5754794B2 (en) | Lead-free solder paste | |
| JP5643972B2 (en) | Metal filler, low-temperature connection lead-free solder, and connection structure | |
| JP5951339B2 (en) | Solder paste using thermosetting resin composition | |
| JP2012250240A (en) | Metal filler, solder paste, and connected structure | |
| JP6002947B2 (en) | Metal filler, solder paste, and connection structure | |
| JP5724088B2 (en) | Metal filler and lead-free solder containing the same | |
| JP2011147982A (en) | Solder, electronic component, and method for manufacturing the electronic component | |
| JP5188999B2 (en) | Metal filler and solder paste | |
| JP5975377B2 (en) | Metal filler, solder paste, and connection structure | |
| JP5147349B2 (en) | Bump forming paste and bump structure | |
| JP5609774B2 (en) | Ternary alloy particles | |
| JP4662483B2 (en) | Conductive filler and medium temperature solder material | |
| JP5652689B2 (en) | Manufacturing method of electronic component bonded structure and electronic component bonded structure obtained by the manufacturing method | |
| JP2018144076A (en) | Metal powder for producing solder bump, paste for producing solder bump and production method of solder bump | |
| JP2012250239A (en) | Metal filler, solder paste, and connected structure | |
| KR102069276B1 (en) | Electronic parts soldering cream and method thereof | |
| CN105234579B (en) | Low-melting-point welding paste added with antioxidant particles | |
| JP2009200285A (en) | Bump and bump connection structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A711 | Notification of change in applicant |
Free format text: JAPANESE INTERMEDIATE CODE: A711 Effective date: 20130711 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20131212 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20140922 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20141031 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20150105 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20150206 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20150223 |
|
| R150 | Certificate of patent or registration of utility model |
Ref document number: 5724088 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |