CN101780605A - Wave-soldering brazing filler metal active agent - Google Patents
Wave-soldering brazing filler metal active agent Download PDFInfo
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- CN101780605A CN101780605A CN201010120675A CN201010120675A CN101780605A CN 101780605 A CN101780605 A CN 101780605A CN 201010120675 A CN201010120675 A CN 201010120675A CN 201010120675 A CN201010120675 A CN 201010120675A CN 101780605 A CN101780605 A CN 101780605A
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Abstract
The invention relates to a wave-soldering brazing filler metal active agent containing dimer acid, trimer acid or the mixture of the dimer acid and the trimer acid. The wave-soldering brazing filler metal active agent is oily liquid and forms a layer of protective film on the surface of fused brazing filler metal to protect the fused brazing filler metal from being oxidized and prevent the brazing filler metal from adsorbing with oxygen in air, thereby reducing the forming speed of tin slag, saving the consumption of soldering tin and power consumption and reducing production cost. The wave-soldering brazing filler metal active agent can also greatly improve the quality of products, enhance the soldering force of the products and simultaneously be convenient for the maintenance of equipment.
Description
Technical field
Patent application of the present invention relates to a kind of Wave-soldering brazing filler metal active agent, and described activating agent can prevent that fusion welding is oxidized and the scruff of oxidation is reduced into available metal, belongs to the wave-soldering technical field.
Background technology
In industrial production, for realizing the combination of two kinds of materials (or part), in the crack or gap is other betwixt adds filler, and this filler is exactly a solder, and the fusing point of solder must be lower than the material melting point of welding.And in the electronics assembly industry, topmost solder is exactly leypewter and ashbury metal, and numerous electronics producer often uses liquid leypewter (or ashbury metal) and welds various components and parts on the pcb board to rise with fixation.The most all be that the workman welds by hand, but manual welding production efficiency is low, can't adapt to large-scale production.So a kind of welding equipment---wave-soldering arises at the historic moment, the running that wave-soldering can not stop in 24 hours and can disposable a plurality of solder joints being welded so greatly improved production efficiency when adopting the wave-soldering welding, has improved the automatization level of producing.
But, the technological temperature of leypewter is 223 ℃-245 ℃ when adopting wave soldering, liquid solder in the tin stove at high temperature, thereby be in contact with one another by its aerial exposure and oxygen and oxidation to take place produce scruff, along with the reinforcement of people's environmental consciousness and coming into force of the ROHS of European Union rules, lead-free solder (ashbury metal) replaces Sn-Al alloy gradually, and the technological temperature of lead-free solder is 230 ℃-260 ℃, higher than tin-lead solder temperature, more be easy to generate scruff.
The generation of scruff not only causes the waste of scolding tin, the production cost that has added vast electronic enterprise, and have a strong impact on the quality of product, tin solder constantly oxidation under high temperature is flowed in liquefaction, make that tin solder constantly descends in the tin pot, depart from eutectic point, can occur quality problems such as gas hole, scolding tin is excessive, copper melts tin on the scolder of back, component wear, scolding tin pollution, even weldering, rosin joint, weld strength is not enough, the solder joint surface gloss is gloomy in succession.
Because the technological temperature of lead-free solder is higher, the scruff of its generation is just many more, As time goes on, scruff will get more and more and occupy the most surfaces of whole tin stove, and the heat absorptivity of scruff is stronger, can absorb the part heat of scolder, thus the user be the technological temperature that reaches lead-free solder must must improve again temperature with overcome in response to, and the raising of furnace temperature is also had higher requirement to the heat resisting temperature of spare part and material.
Therefore in order reducing production costs, to improve the quality of products, to need lead-free solder is carried out anti-oxidant treatment.Occurred multiple product at present on the market, it is divided into reduced powder substantially, anti-oxidant powder, scruff reduction machine, antioxidant and install nitrogen device etc. additional.
1, reduced powder, it is handled after producing for scruff again, fail from the generation of source control scruff, and in use need constantly to stir, produce very big dust and penetrating odor, the working environment in workshop is produced bigger influence, and the effect of reduced powder reduction scruff is not very desirable, percent reduction does not almost reach 60%.
2, anti-oxidant powder, anti-oxidant powder are the generations from source control scruff, but reality is in use more loaded down with trivial details and effect is also undesirable, and anti-oxidant powder will evenly be sprinkling upon the tin face when using, and wants to spread the very even certain degree of difficulty that has.Chlorion or fluorine ion are generally contained in anti-oxidant powder the inside, all belong to the Halogen product, not only do not meet the Halogen product requirement of European Union, and can produce certain corrosivity to equipment.
3, scruff reduction machine, scruff reduction machine is the method for unique employing physics reduction, it does not add any product toward tin stove the inside, but being drawn out the back, scruff reduces with an equipment specially, also belong to afterwards and to handle, also fail from the generation of source control scruff, and the present technology of reduction machine that is that all right is ripe, the tin impurity content that restores is higher, can't satisfy the requirement of producing high-end product.
4, antioxidant is a fluid product, and advantage is that antioxygenic property is better, and shortcoming is that cigarette is big, and smell is heavier, even the situation that antioxidant is stained with the pcb board surface can take place.
5, install the nitrogen device additional, can effectively reduce the scruff amount after installing the nitrogen device additional, but nitrogen gas generator cost height, later operating cost is higher, and practice is got up uneconomical.
Summary of the invention
In order better to solve the scruff problem, improve the quality of products, reduce production costs, the invention provides a kind of Wave-soldering brazing filler metal active agent, this activating agent not only can prevent the lead-free solder oxidation effectively, and the lead-free solder overwhelming majority of being wrapped up in the scruff can be restored, and has solved the problem of scruff effectively, and it is easy to maintenance to reach corrective maintenance again, and tin stove cleaning is clean.
At first activating agent contacts not oxidized at fusing solder surface formation monofilm protection brazing filler metal on surface with the fusing solder; next is active component and reactive metal oxide wherein and they is dissolved in this activating agent, is suspended between metal oxide particle and the residual activating agent as organo-metallic compound.Along with time lengthening up to activator consume be eliminated till.Activating agent does not react with metal, and only with the oxidizing slag reaction, few cigarette is tasteless.When the metal oxide in the oxidation scruff was dissolved, it was open that interconnective metal oxide is arranged, and anyly was clipped in metal useful in the slag and can dispersion train gets back to and melt in the tin, and can not be subjected to the influence of activating agent.This new technology can reduce scruff cost about 75%～85%.
Wave-soldering brazing filler metal active agent of the present invention is characterized in that: described activating agent comprises the mixture of dimeric dibasic acid, trimer acid or above-mentioned two kinds of acid.
Described a kind of Wave-soldering brazing filler metal active agent is characterized in that: described dimeric dibasic acid and trimer acid are organic acid.
Described a kind of Wave-soldering brazing filler metal active agent is characterized in that: described dimeric dibasic acid, its carbon atom number range of trimer acid are between 6-40.
Described a kind of Wave-soldering brazing filler metal active agent is characterized in that: contain NPE in the described activating agent.
Described a kind of Wave-soldering brazing filler metal active agent is characterized in that: described activating agent contain the alcohol that can dissolve each other with activating agent.
Described a kind of Wave-soldering brazing filler metal active agent is characterized in that: can add different pigments to be made into shades of colour in the described activating agent.
Find that in practice of the present invention dimeric dibasic acid or trimer acid all have good heat endurance, and can in very wide temperature range, keep flowing, be faint yellow transparent thick liquid under the normal temperature, avirulence, non-stimulated, flash-point, burning-point height, the characteristic that low temperature does not freeze, can be dissolved in most of solvent, the metal replacement in the part metals oxide can be come out.
Contain a spot of monomer acids and trimer acid in general in the dimeric dibasic acid, the quality of sour quality can be used as the foundation of assortment.As the U.S. is dimer content that 87%, 83%, 75% dimeric dibasic acid is decided to be high, medium and low third gear dimeric dibasic acid respectively.These products are commonly referred to as and just steam or single dimeric dibasic acid that steams, and distill once more and must distill dimeric dibasic acid (or claiming two dimeric dibasic acids that steam) as will just steaming dimeric dibasic acid, and its dimer content can reach more than 95%.If, can obtain the hydrogenated dimer acids that color is very light, antioxygenic property is fabulous again with the capable again hydrogenation of dimeric dibasic acid.Distillation dimeric dibasic acid and hydrogenated dimer acids are used for the occasion that some needs property mostly.The commercially available prod is based on single dimeric dibasic acid that steams.The dimeric dibasic acid that kind is different, its performance are also different, and same kind also has the difference of character because of raw materials used difference.About the quantitative analysis of monomer acids, dimeric dibasic acid and trimer acid in the dimeric dibasic acid, the direct method for measuring of a standard is not arranged as yet at present.The urea addition process of first vinegar is used to measure the monomer acids in the distillation dimeric dibasic acid at first, but this method is more time-consuming, and precision is not high, once proposed to improve this method with microlitre China process, to determine component of polymer, but during distillation, monomer vinegar is removed not exclusively or the loss of dimeric dibasic acid, all can cause error.
Its raw material of commercially available dimeric dibasic acid mainly contain peanut oil, corn oil, tall oil, cocounut oil, palm oil, the young oil of dish, olive wet goods, according to producing raw-material difference, can be divided into multiclass, can be used in different aspects, its dimerization by the saturated or unrighted acid of middle molecular weight produces, and its carbon number range is between 6 to 40, but the process experiment shows, they are used in the Wave-soldering brazing filler metal and distinguish not quite, so preferred commercially available dimeric dibasic acid.
NPE can be made emulsifying agent, dispersant, and washing agent can be used as wetting agent and emulsifying agent in general industry, have reactivity preferably.Our experiments show that, NPE also can simultaneously, add the concentration that NPE can reduce Wave-soldering brazing filler metal active agent effectively effectively with the scruff reduction in dimeric dibasic acid or trimer acid, reduce its adhesiveness, make equipment be easier to the cleaning maintenance equipment.
Alcohol such as isopropyl alcohol have good reactivity, promptly can effectively improve the reactivity of the Wave-soldering brazing filler metal active agent among the present invention, can reduce the concentration of Wave-soldering brazing filler metal active agent again.
The invention has the beneficial effects as follows:
A: scruff is restored, save the scolder production cost
In practice of the present invention, find, activating agent is slowly poured into can be found in the scolder of fusion that the scruff that has produced can be reduced rapidly, if activating agent and scruff are stirred a few minutes gently, more can improve the percent reduction of scruff, find during through market survey all not form piece or form very little bulk when most scruff is inside the tin stove, but also there is the scruff of part more serious at tin stove the inside caking phenomenon, the bulk of knot is bigger, this may be relevant with its used scolder and scaling powder kind, comparatively speaking, the bulk of knot is bigger, the tin that the scruff the inside contains is also many more, and the time during reduction is also long more, can not find out effect when pouring activating agent into this class scruff at once, after 1-2 hour, can find that the scolder that scruff wrapped up of forming the shape piece is reduced out too.Our experiments show that according to what of scruff stanniferous amount, percent reduction sometimes can be up to more than 95%.
B: scolder and air is isolated, prevent that scruff from producing
After activating agent being poured into tin stove the inside, it is not oxidized to form one deck oily diaphragm protection scolder on the fusion welding surface, prevents oxygen absorption in scolder and the air, reduces scruff and forms speed, guarantees smoke-free and tasteless simultaneously.
C: prevent that solder heat San Fa Damage from losing, improve solder wettability, can reach wetability faster
After activating agent is covered the fusion welding surface, can prevent effectively that fusion welding Re San Fa Damage from losing, 5 ℃ of-10 ℃ of soldering tin technique temperature can directly descend, save power consumption about 20%, liquid scolding tin heat is more evenly distributed, can effectively reduce the heat resisting temperature of spare part and material, improve welding procedure.Show by practice that simultaneously can effectively improve the wetability and the flowability of scolder, this is particularly important to pb-free solder.
D: absorb impurity, improve the quality of products
The tin sticky temperature descend the no slicker solder in back to printed circuit board (PCB) below the also decline thereupon of molten copper rate of naked copper of tin sticky face, tin oxide, not molten tin no longer take place, our experiments show that simultaneously, activating agent can effectively absorb impurity, purify the effect of scolding tin, it not only can effectively absorb various impurity such as carbon, and can remove molten copper fast lifting, and the also unnecessary periodic replacement of tin liquor.
E: the inhibition scolder reduces plant maintenance to the corrosion of equipment
The scolder particularly corrosivity of lead-free solder is bigger, even titanium alloy tin stove all easily pierces, anti-oxidant reduced powder is just easier to be pierced if added, and this activating agent has stronger rust inhibition, can effectively reduce the corrosion of lead-free solder, prolong service life of equipment equipment.
Description of drawings
Fig. 1 is the solder wettability table with activating agent;
Fig. 2 is for adding the wetability table of activating agent scolder.
Fig. 1 and Fig. 2 are the wetability table with wetability tester test scolder, and wherein Fig. 1 is the solder wettability table with activating agent, and Fig. 2 is for adding the wetability table of activating agent scolder.From the contrast of Fig. 1 and Fig. 2 as can be seen, when reaching same wetability, the wetting time (t1-t2 time period among Fig. 2) of having added the scolder of activating agent has been lacked 0.52 second than the wetting time (t1-t2 time period among Fig. 1) of the scolder that has not added activating agent, and time in several seconds just time of wave soldering itself, therefore can be less when reaching identical wetability 0.52 second be quite big.
The specific embodiment
Use Wave-soldering brazing filler metal active agent of the present invention, can be the mixture of dimeric dibasic acid, trimer acid or above-mentioned two kinds of acid.In one embodiment of the invention, take commercially available dimeric dibasic acid and trimer acid as activating agent, in fact, dimeric dibasic acid or trimer acid or the mixture of the two can be as activating agents, and as required, can also increase alcohols materials such as NPE or isopropyl alcohol therein to reduce the concentration of activating agent.Use the concrete operations step of Wave-soldering brazing filler metal active agent of the present invention as follows:
1, melt under the tin state normal unlatching of crest, the cleaning scruff, the tin face stays about 2-3 kilogram scruff;
2, control the tin flow path direction with the sheet metal that meets ROHS in the tin stove, tin liquor and scruff are flowed out to tin stove one end of handled easily, do a reducing zone at this end then, the length of reducing zone area is the width of tin stove, and width is about 20-30 centimetre;
3, activating agent is poured into reserve on the scruff of scolding tin liquid level and stirred, addition is first: the generally about 150-250 gram of kupper solder G is arranged, the generally about 200-300 gram of lead-free solder, added once in general afterwards every 2-3 hour, the addition of each activating agent has been generally about 100 grams of kupper solder, about 150 grams of lead-free solder, activating agent forms the anti-oxidation thing of pasty state and continues the new scruff that produces of reduction at the tin face;
4, add before the activating agent at every turn, activating agent and the formed residue of scruff must be stirred into pasty state gently, clean out the not material of stanniferous of upper strata then, again the scruff of other position of tin stove is cleared up the reducing zone, with activating agent set by step 3 method pour in the scruff and stir, repeat this process and action after about 2-3 hour, increase suddenly as scruff, then looking actual conditions suitably increases addition or shortens the interpolation time;
5, then need not to add activating agent this moment as do not continue to produce when not playing for a long time (be crest), when waiting to need to produce (when opening crest), again with activating agent set by step 3 method pour in the scruff and stir, repeat this process and action after 2-3 hour;
6, a small amount of scruff that mobile liquid level produces in the process is reduced rapidly, and reducing zone tin liquor face is isolated by anti-oxidation thing, can not produce scruff;
7, look what of product and tin stove size or scruff generation in the process, add activating agent quantity and also take the circumstances into consideration plus-minus.
Use the technical essential of the described Wave-soldering brazing filler metal active agent of the present patent application:
1, remakes cleaning after the residue that must will cover reducing zone tin face before each cleaning stirs into sposh shape material, and then add activating agent on request;
Must will be added on the scruff that just drags for activating agent and stir when 2, adding activating agent at every turn;
When 3, clearing up at every turn only with the upper strata not the sposh shape material of stanniferous clear, the instrument that does not allow to clear up scruff drags for below stretching into tin stove tin liquor face from the bottom up, so will take away a large amount of useful tin and causes unnecessary waste.
Use the points for attention of the method for Wave-soldering brazing filler metal active agent of the present invention:
1. please note that tin stove suction opeing is good before the use activating agent, suction opeing gas velocity each second＞1.5 meter;
2. owing to be high-temperature operation, mouth mask, safety goggles and super heated rubber gloves please have been worn.
Claims (9)
1. Wave-soldering brazing filler metal active agent, it is characterized in that: described activating agent comprises the mixture of dimeric dibasic acid, trimer acid or above-mentioned two kinds of acid.
2. a kind of Wave-soldering brazing filler metal active agent as claimed in claim 1 is characterized in that: described dimeric dibasic acid and trimer acid are organic acid.
3. a kind of Wave-soldering brazing filler metal active agent as claimed in claim 1 is characterized in that: described dimeric dibasic acid, its carbon atom number range of trimer acid are between 6-40.
4. a kind of Wave-soldering brazing filler metal active agent as claimed in claim 2 is characterized in that: described organic acid is from peanut oil, corn oil, tall oil, cocounut oil, palm oil, the young oil of dish, olive oil.
5. a kind of Wave-soldering brazing filler metal active agent as claimed in claim 1 is characterized in that: contain NPE in the described activating agent.
6. a kind of Wave-soldering brazing filler metal active agent as claimed in claim 1 is characterized in that: described activating agent contains the alcohol that can dissolve each other with activating agent.
7. a kind of Wave-soldering brazing filler metal active agent as claimed in claim 1 is characterized in that: add different pigments in the described activating agent to be made into shades of colour.
8. the application of the described Wave-soldering brazing filler metal active agent of claim 1 in the printed circuit board (PCB) wave-soldering.
9. the application of Wave-soldering brazing filler metal active agent as claimed in claim 8 in the printed circuit board (PCB) wave-soldering may further comprise the steps:
1) melt under the tin state normal unlatching of crest, the cleaning scruff, the tin face stays about 2-3 kilogram scruff;
2) control the tin flow path direction with sheet metal in the tin stove, tin liquor and scruff are flowed out to tin stove one end of handled easily, do a reducing zone at this end then, the length of reducing zone area is the width of tin stove, and width is about 20-30 centimetre;
3) activating agent is poured into reserve on the scruff of scolding tin liquid level and stirred, addition first, the generally about 150-250 gram of kupper solder is arranged, the generally about 200-300 gram of lead-free solder, added once in every afterwards 2-3 hour, the addition of each activating agent has been generally about 100 grams of kupper solder, about 150 grams of lead-free solder, activating agent forms the anti-oxidation thing of pasty state at the tin face, and continues the new scruff that produces of reduction;
4) add before the activating agent at every turn, activating agent and the formed residue of scruff must be stirred into pasty state gently, clean out the not material of stanniferous of upper strata then, again the scruff of other position of tin stove is cleared up the reducing zone, with activating agent set by step 3) method pour in the scruff and stir, repeat this process and action after about 2-3 hour, increase suddenly as scruff, then looking actual conditions suitably increases addition or shortens the interpolation time;
5) when promptly crest is not played for a long time, then need not to add activating agent this moment as do not continue to produce, when waiting to need to produce, when promptly opening crest, again with activating agent set by step 3) method pour in the scruff and stir, repeat this process and action after 2-3 hour.
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| Application Number | Priority Date | Filing Date | Title |
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| CN2010101206751A CN101780605B (en) | 2010-03-05 | 2010-03-05 | Wave-soldering brazing filler metal active agent |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010101206751A CN101780605B (en) | 2010-03-05 | 2010-03-05 | Wave-soldering brazing filler metal active agent |
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| CN101780605A true CN101780605A (en) | 2010-07-21 |
| CN101780605B CN101780605B (en) | 2013-11-13 |
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| CN2010101206751A Expired - Fee Related CN101780605B (en) | 2010-03-05 | 2010-03-05 | Wave-soldering brazing filler metal active agent |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104195351A (en) * | 2014-08-07 | 2014-12-10 | 安徽秋田电子有限公司 | Process for reducing solder splash in solder machine by peanut oil |
| CN105834546A (en) * | 2016-06-02 | 2016-08-10 | 陈浩 | Tin recovery device with hypersorber |
| TWI760588B (en) * | 2017-12-29 | 2022-04-11 | 日商千住金屬工業股份有限公司 | Flux and Solder Paste |
| CN115302131A (en) * | 2022-09-01 | 2022-11-08 | 广东省索艺柏科技有限公司 | Simple smelting method of gold-tin alloy solder |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1972779A (en) * | 2004-05-28 | 2007-05-30 | P·凯金属公司 | Solder paste and process |
| CN101157168A (en) * | 2007-11-16 | 2008-04-09 | 北京工业大学 | Lead-free solder thread-use colophony type non-halide cleaning-free scaling powder |
-
2010
- 2010-03-05 CN CN2010101206751A patent/CN101780605B/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1972779A (en) * | 2004-05-28 | 2007-05-30 | P·凯金属公司 | Solder paste and process |
| CN101157168A (en) * | 2007-11-16 | 2008-04-09 | 北京工业大学 | Lead-free solder thread-use colophony type non-halide cleaning-free scaling powder |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104195351A (en) * | 2014-08-07 | 2014-12-10 | 安徽秋田电子有限公司 | Process for reducing solder splash in solder machine by peanut oil |
| CN105834546A (en) * | 2016-06-02 | 2016-08-10 | 陈浩 | Tin recovery device with hypersorber |
| TWI760588B (en) * | 2017-12-29 | 2022-04-11 | 日商千住金屬工業股份有限公司 | Flux and Solder Paste |
| CN115302131A (en) * | 2022-09-01 | 2022-11-08 | 广东省索艺柏科技有限公司 | Simple smelting method of gold-tin alloy solder |
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| CN101780605B (en) | 2013-11-13 |
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