CN100591461C - Halogen-free soldering flux for soft welding wire without lead, and preparation method - Google Patents
Halogen-free soldering flux for soft welding wire without lead, and preparation method Download PDFInfo
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- CN100591461C CN100591461C CN200710022403A CN200710022403A CN100591461C CN 100591461 C CN100591461 C CN 100591461C CN 200710022403 A CN200710022403 A CN 200710022403A CN 200710022403 A CN200710022403 A CN 200710022403A CN 100591461 C CN100591461 C CN 100591461C
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Abstract
A non-halogen flux for Pb-free soft solder wire is prepared from activating agent (organic acid) (0.2-3 Wt%), non-ionic surfactant (0.2-3), and modifier rosin (rest) through heating the modified rosinto 120-150 deg.c while stirring, adding others, and stirring for 15-30 min.
Description
Technical field
The present invention relates to a kind of lead-free soldering flux and preparation method, especially a kind of soldering flux without halogen in use for soft welding wire without lead and preparation method.
Background technology
In recent years along with electronic product high speed development day by day, meanwhile, because Development of Human Civilization, environmental consciousness progressively strengthens, in order to realize the people and society harmony, must replace traditional kupper solder that has with lead-free solder, also just more strict to the requirement of scaling powder like this, conventional solder can not be complementary with lead-free solder with scaling powder, because its volatilization point is low, the fusing point of lead-free solder is higher relatively, does not also melt just volatilization in advance of solder flux at unleaded material, does not have the welding effect of demand.In addition, the lifting of the lightweight of electronic product, miniaturization, microminiaturization, the insulating properties residual to the scaling powder postwelding require also more strict.
Summary of the invention
In order to overcome above-mentioned defective, the invention provides a kind of soldering flux without halogen in use for soft welding wire without lead and preparation method, this soldering flux without halogen in use for soft welding wire without lead and preparation method's welding effect are good, the preparation method is simple.
The present invention for the technical scheme that solves its technical problem and adopt is: a kind of soldering flux without halogen in use for soft welding wire without lead, by weight percentage, mainly be made up of following material: organic acid for activating agent 0.9～1.3%, non-ionic surface activator 0.4～1.7% and surplus are modified rosin.
Further technical scheme of the present invention is:
Described modified rosin is at least a kind of in disproportionated rosin, newtrex and the Foral; It is solid-state that modified rosin is at normal temperatures, and unionization forms good, the transparent organic film of air-tightness after the soldering; bump can be wrapped up; completely cut off contacting of atmosphere and other Korrosionsmediums, had the excellent protection performance, solved activity and corrosive contradiction of scaling powder well.
Described organic acid for activating agent is at least a kind of (or the saying that the organic acid for activating agent is a kind of, two or more the combination of arbitrary proportion in adipic acid, decanedioic acid, succinic acid, glutaric acid, salicylic acid and the malic acid) in adipic acid, decanedioic acid, succinic acid, glutaric acid, salicylic acid and the malic acid; It is active that this type of activator has enough helping to weld, and the postwelding noresidue of can decomposing under welding temperature, distil or volatilize does not have corrosion.
Described non-ionic surface active agent is at least a kind of among dibromo butene glycol, dibromo ethyl benzene, bromohexadecane yl pyridines and the FSN-100; This type of activating agent can better reduce the surface tension of fusion lead-free solder and by weldering metallic surface energy, improve welding effect, and postwelding is residual few, and is non-conductive substantially.
With organic acid for activating agent, non-ionic surface activator and modified rosin gross weight is benchmark, also adds a kind of in the delustering agent of 0.1% or 0.2% corrosion inhibiter and 0.3% in the soldering flux in use for soft soldering wire at least.
Described corrosion inhibiter is at least a kind of in BTA and the ethylene glycol phenyl azoles, plays antopxidation, reduces scaling powder to by the corrosion of thing.
Described delustering agent is at least a kind of in acid of hard ester and the p t butylbenzoic acid; Be applicable to and require the brightless welding of welding back solder joint.
A kind of preparation method of soldering flux without halogen in use for soft welding wire without lead, undertaken by following step: by proportioning modified rosin is added to heat in the container and be stirred to fully and melt, under 120～150 ℃ temperature, add organic acid for activating agent 0.9～1.3% and non-ionic surface activator 0.4～1.7%, stirred 15～30 minutes, it is even all stand-by that it is mixed.Or undertaken: modified rosin is added in the container heating and is stirred to fusing fully by proportioning by following step, under 120～150 ℃ temperature, add organic acid for activating agent 0.9～1.3%, non-ionic surface activator 0.4～1.7%, also add a kind of in the delustering agent of 0.1% or 0.2% corrosion inhibiter and 0.3% at least, it is even all stand-by that it is mixed.
The invention has the beneficial effects as follows: with lead-free solder splendid matching effect is arranged on welding temperature, can effectively remove metal oxide film, postwelding is residual few, the insulating properties height, and effect and preparation method with film forming and protection base material are simple.
The specific embodiment
Embodiment 1
By weight:
Disproportionated rosin 7.6
Newtrex 41
Foral 50
Adipic acid 0.5
Decanedioic acid 0.5
Dibromo butene glycol 0.4
Compound method: modified rosin is added in the container heating and is stirred to fusing fully, under 120～150 ℃ temperature, add other raw material, stirred 15～30 minutes, make its mix spare all stand-by.
Embodiment 2
By weight:
Newtrex 57.6
Foral 40
Adipic acid 0.5
Succinic acid 0.4
Dibromo butene glycol 0.4
Dibromo ethyl benzene 1.0
BTA 0.1
Compound method: modified rosin is added in the container heating and is stirred to fusing fully, under 120～150 ℃ temperature, add other raw material, stirred 15～30 minutes, make its mix spare all stand-by.
Embodiment 3
By weight:
Newtrex 54
Foral 42.7
Adipic acid 0.7
Succinic acid 0.6
Dibromo butene glycol 1.7
P t butylbenzoic acid 0.3
Compound method: modified rosin is added in the container heating and is stirred to fusing fully, under 120～150 ℃ temperature, add other raw material, stirred 15～30 minutes, make its mix spare all stand-by.
Embodiment 4
By weight:
Foral 97
Adipic acid 0.7
Succinic acid 0.6
Bromohexadecane yl pyridines 1.2
P t butylbenzoic acid 0.3
BTA 0.2
Compound method: modified rosin is added in the container heating and is stirred to fusing fully, under 120～150 ℃ temperature, add other raw material, stirred 15～30 minutes, make its mix spare all stand-by.
FSN-100 of the present invention is a kind of surfactant that du pont company is produced, and is used to do scaling powder.
Claims (9)
1. soldering flux without halogen in use for soft welding wire without lead is characterized in that: by weight percentage, mainly be made up of material down: organic acid for activating agent 0.9～1.3%, non-ionic surface activator 0.4～1.7% and surplus are modified rosin.
2. soldering flux without halogen in use for soft welding wire without lead according to claim 1 is characterized in that: described modified rosin is at least a kind of in disproportionated rosin, newtrex and the Foral.
3. no-lead soft soldering silk according to claim 1 is characterized in that with the halogen-free scaling powder that helps: described organic acid for activating agent is at least a kind of in adipic acid, decanedioic acid, succinic acid, glutaric acid, salicylic acid and the malic acid.
4. soldering flux without halogen in use for soft welding wire without lead according to claim 1 is characterized in that: described non-ionic surface active agent is at least a kind of among dibromo butene glycol, dibromo ethyl benzene, bromohexadecane yl pyridines and the FSN-100.
5. no-lead soft soldering silk according to claim 1 is with the halogen-free scaling powder that helps, it is characterized in that: with organic acid for activating agent, non-ionic surface activator and modified rosin gross weight is benchmark, also adds a kind of in the delustering agent of 0.1% or 0.2% corrosion inhibiter and 0.3% in the soldering flux in use for soft soldering wire at least.
6. soldering flux without halogen in use for soft welding wire without lead according to claim 5 is characterized in that: described corrosion inhibiter is at least a kind of in BTA and the ethylene glycol phenyl azoles.
7. soldering flux without halogen in use for soft welding wire without lead according to claim 5 is characterized in that: described delustering agent is at least a kind of in acid of hard ester and the p t butylbenzoic acid.
8. the preparation method of the described soldering flux without halogen in use for soft welding wire without lead of claim 1, it is characterized in that: undertaken: by proportioning modified rosin is added to heat in the container and be stirred to fully and melt, under 120～150 ℃ temperature, add organic acid for activating agent 0.9～1.3% by following step
Non-ionic surface activator 0.4～1.7% stirred 15～30 minutes, and it is even all stand-by that it is mixed.
9. the preparation method of the described soldering flux without halogen in use for soft welding wire without lead of claim 5, it is characterized in that: undertaken: by proportioning modified rosin is added to heat in the container and be stirred to fully and melt by following step, under 120～150 ℃ temperature, add organic acid for activating agent 0.9～1.3%, non-ionic surface activator 0.4～1.7%, also add a kind of in the delustering agent of 0.1% or 0.2% corrosion inhibiter and 0.3% at least, it is even all stand-by that it is mixed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200710022403A CN100591461C (en) | 2007-05-09 | 2007-05-09 | Halogen-free soldering flux for soft welding wire without lead, and preparation method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200710022403A CN100591461C (en) | 2007-05-09 | 2007-05-09 | Halogen-free soldering flux for soft welding wire without lead, and preparation method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101049662A CN101049662A (en) | 2007-10-10 |
| CN100591461C true CN100591461C (en) | 2010-02-24 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200710022403A Expired - Fee Related CN100591461C (en) | 2007-05-09 | 2007-05-09 | Halogen-free soldering flux for soft welding wire without lead, and preparation method |
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Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101543943B (en) * | 2009-04-29 | 2012-07-11 | 云南锡业锡材有限公司 | Leadless rosin core low-halogen no-clean scaling powder and method for preparing same |
| CN102284809B (en) * | 2009-10-12 | 2015-04-15 | 宁波喜汉锡焊料有限公司 | No-halogen cleaning-free soldering flux for tin wire core |
| CN101764002B (en) * | 2009-12-25 | 2014-01-01 | 上海神沃电子有限公司 | Fluxing agent as well as preparation method and application thereof |
| CN101777467B (en) * | 2009-12-31 | 2013-01-09 | 上海长园维安电子线路保护有限公司 | Fluxing resin for temperature fuse and preparation method thereof and preparation method of temperature fuse |
| CN102069323B (en) * | 2010-12-14 | 2013-05-29 | 东莞市特尔佳电子有限公司 | Intermediate-temperate tin alloy soldering paste used for through hole coating and preparation method thereof |
| CN102554518A (en) * | 2012-01-19 | 2012-07-11 | 广东中实金属有限公司 | Halogen-free high-impedance soldering flux and preparation method |
| CN103394824B (en) * | 2013-08-02 | 2017-04-05 | 北京鹏瑞中联科技有限公司 | A kind of tin silk low spatter Halogen welding agent and preparation method thereof |
| CN105234591B (en) * | 2015-10-10 | 2017-12-05 | 广东省焊接技术研究所（广东省中乌研究院） | A kind of Halogen solder stick activating agent and preparation method thereof |
| CN106238968A (en) * | 2016-08-05 | 2016-12-21 | 雷春生 | A kind of preparation method of wear-resisting Halogen delustring solder |
| CN110091093A (en) * | 2019-05-17 | 2019-08-06 | 江苏三沃电子科技有限公司 | A kind of low-temperature and lead-free tin soldering cream and preparation method thereof |
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2007
- 2007-05-09 CN CN200710022403A patent/CN100591461C/en not_active Expired - Fee Related
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