CN110202295B - Low-temperature aluminum soft soldering paste and preparation method thereof - Google Patents
Low-temperature aluminum soft soldering paste and preparation method thereof Download PDFInfo
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- CN110202295B CN110202295B CN201910441633.9A CN201910441633A CN110202295B CN 110202295 B CN110202295 B CN 110202295B CN 201910441633 A CN201910441633 A CN 201910441633A CN 110202295 B CN110202295 B CN 110202295B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3613—Polymers, e.g. resins
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/362—Selection of compositions of fluxes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/40—Making wire or rods for soldering or welding
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a low-temperature aluminum soft soldering paste and a preparation method thereof. The low-temperature aluminum soldering tin paste comprises the following components in percentage by mass: 80-90% of solder alloy powder and 10-20% of soldering flux, wherein the soldering flux comprises the following components in percentage by mass: 25-35% of modified rosin, 5-10% of metal indium halide, 1-3% of hydroxy acid zinc salt, 2-5% of triethanolamine borate, 1-3% of polyaniline, 3-10% of thixotropic agent and 45-55% of solvent. The low-temperature aluminum soft soldering tin paste can effectively remove an oxide film on the surface of aluminum, realizes strong combination of the brazing filler metal and an aluminum base material, and has the advantages of firm formed aluminum soft soldering joint, better electrochemical corrosion resistance, good storage performance, no drying and no sand.
Description
Technical Field
The invention relates to the technical field of electronic packaging welding materials, in particular to low-temperature aluminum soft soldering tin paste and a preparation method thereof.
Background
Aluminum brazing technology is widely used in the electronics manufacturing industry. Aluminum has good electrical and thermal conductivity, proper strength, good corrosion resistance and low cost, and is widely applied to preparation of related devices of electronic appliances, LED lighting assemblies and intelligent hardware radiators, and the use of tin paste for aluminum for brazing to connect the devices and a substrate is a common technical means in the industry. The prior art of using solder paste for aluminum soldering mainly faces the following problems: the surface of the aluminum is provided with a layer of compact and firm oxide film, so that the brazing is difficult to smoothly carry out, the welding spot is easy to be infirm, and the phenomena of welding spot loosening and element separation are caused after a plurality of months after the aluminum element is welded. In view of the above problems, there are three major methods for improving aluminum brazing: the first is that the aluminum surface is plated with a layer of easily welded metal intermediate layer, such as nickel, copper or tin, and then welding is carried out between nickel, nickel copper and the like; secondly, the brazing temperature is increased, so that the activity of the brazing flux can be fully exerted; and thirdly, the high-activity soldering flux is used, and the welding requirement can be met at a lower temperature. However, the three methods described above still have certain drawbacks: the addition of a metal plating layer increases the process and cost; the soldering temperature is increased, so that electronic components can be damaged, and the soldering flux is particularly not suitable for soldering of heat-sensitive electronic components; the use of the high-activity soldering flux can easily cause the corrosion of the soldered dots after soldering, the service life of the soldered dots is obviously reduced, and the excessively high activity can easily corrode solder alloy powder to cause the drying or sand-making of solder paste to influence the printing performance.
Chinese patent application publication No. CN 102922162 a discloses that a soldering flux used in "an aluminum soldering tin paste and a preparation method thereof" is composed of hydroxylamine fluoride, metal active salt, an activating agent, and a corrosion inhibitor, the hydroxylamine fluoride in the soldering flux can release a large amount of highly active hydrofluoric acid, which has strong corrosivity to solder alloy powder and easily causes the tin paste to be sticky, and the content of the used metal active salt is high, which aggravates the corrosion of the soldering flux to the solder alloy powder and reduces the storage stability of the tin paste.
Chinese patent application publication No. CN103317260A discloses that a soldering flux used in "a soldering paste for soldering aluminum and aluminum alloy and a preparation method thereof" is composed of a heavy metal fluoride activator, a hydrofluoride of polyhydroxy amine, and ethylene glycol, the soldering paste generates a large amount of bubbles and irritant gases during soldering, and has a large amount of residues after soldering, which easily corrode the soldering point and affect the service life of the soldering point.
Disclosure of Invention
The invention aims to provide a low-temperature aluminum soft soldering paste and a preparation method thereof. The low-temperature aluminum soft soldering tin paste can effectively remove an oxide film on the surface of aluminum, realizes strong combination of a brazing filler metal and an aluminum base material, and has full, bright and firm welding spots, good electrochemical corrosion resistance and good storage stability.
The invention is realized by the following technical scheme:
the low-temperature aluminum soft soldering tin paste comprises the following components in percentage by mass: 80-90% of solder alloy powder and 10-20% of soldering flux, wherein the soldering flux comprises the following components in percentage by mass:
the halide of the metal indium is selected from one of indium chloride, indium fluoride and indium bromide.
Preferably, the halide of the metal indium is indium fluoride.
The zinc salt of the hydroxy acid is zinc salt of tartaric acid, salicylic acid, lactic acid, malic acid, glycolic acid or citric acid.
The modified rosin is selected from one or more of perhydrogenated rosin, disproportionated rosin and polymerized rosin.
The thixotropic agent is selected from one or more of hydrogenated castor oil, polyamide modified hydrogenated castor oil, polyethylene wax, ethylene bis stearamide and ethylene bis lauramide.
The solvent is one or more selected from ethylene glycol monobutyl ether, dipropylene glycol dimethyl ether, 2-methyl-2, 4-pentanediol, 2-ethyl-1, 3-hexanediol, diethylene glycol butyl ether and diethylene glycol hexyl ether.
The brazing alloy powder is selected from one of SnBiCu, SnBiAg, SnAgCu and SnBi alloy powder.
The low-temperature aluminum soft soldering paste is prepared by the following method, and the method comprises the following steps:
(1) adding modified rosin and a solvent into a reaction kettle, fully stirring at 100-120 ℃, cooling to 70-80 ℃ after the modified rosin is completely melted, adding triethanolamine borate, polyaniline and a rheological aid, continuously stirring until the materials are dissolved, cooling to 40-50 ℃, adding halides of metal indium and zinc salts of hydroxy acid, and uniformly stirring to obtain the soldering flux;
(2) and (3) refrigerating the soldering flux for 12-24 h at the temperature of 2-10 ℃, returning the temperature at normal temperature, grinding the soldering flux by using a three-roll grinder until the particle size of the soldering flux is 10-20 mu m, and then uniformly mixing the solder alloy powder and the soldering flux in a vacuum mixer according to the proportion to obtain the aluminum soft soldering tin paste.
The halide of the metal indium and the zinc salt of the hydroxy acid in the aluminum soldering tin paste have synergistic effect, play a remarkable role in removing the aluminum oxide film and promote the glass of the aluminum oxide film. In the high temperature condition, the aluminum oxide film cracks due to the difference of the thermal expansion coefficients of aluminum and aluminum oxide, and the halide of metallic indium3+And a halogen ion (F)-、Cl-、Br-) Has a small ion radius and can be squeezed into tetrahedral or octahedral voids of the alumina structure to destroy the alumina film, and In3+The aluminum oxide layer can be effectively stripped because the melting point of the metal In is lower (156.61 ℃) and is In a liquid state at the welding temperature, so that the spreading of liquid solder is promoted, and the wetting power is improved. The zinc salt of the hydroxy acid can decompose hydroxy acid and Zn2+Electron withdrawing effect of hydroxyl group in hydroxy acidThe acidity of the brazing filler metal is stronger than that of carboxylic acid, the metal oxide on the surfaces of aluminum oxide and brazing filler metal alloy powder can be effectively removed, the strong combination of the brazing filler metal and an aluminum base material is promoted, and Zn2+Will generate displacement reaction with simple substance aluminum to generate simple substance zinc, simple substance zinc and In3+And the simple substance metal In is generated by the same replacement reaction, so that the In metal layer can be quickly formed In the welding process, and the peeling of the aluminum oxide film is accelerated. The involved reaction formula is shown as follows: 2Al +3Zn2+→3Zn+2Al3+；Al+In3+→In+Al3+；3Zn+2In3 +→2In+3Zn2+。
The polyaniline has the function of reducing the electrode potential of a metal substrate and making metals not easy to lose electrons, thereby greatly improving the oxidation resistance of the metals of the brazing filler metal and a welding part and reducing the oxidation degree. The triethanolamine borate has the effects of corrosion inhibition and lubrication, can form a layer of protective film on the surface of an aluminum material and the surface of brazing filler metal alloy powder to prevent welding spots from being corroded, has excellent metal lubrication effect, can promote the brazing filler metal to be wetted, spread and filled in the surface or gaps of a solid aluminum base material after being melted, and can be mutually diffused and dissolved with the base material to form reliable welding spots.
The thixotropic agent can effectively prevent the phenomena of collapse, bridging and the like of the soldering paste. The modified rosin has good thermal stability and oxidation resistance, the carboxyl in the rosin can remove metal oxide at the welding temperature and protect the metal surface from being oxidized, the formed organic film has good insulation property, and has the effects of moisture prevention and oxygen isolation, and the service life of a welding spot is prolonged.
Compared with the prior art, the invention has the following beneficial effects:
(1) the low-temperature aluminum soft soldering paste can effectively remove an oxide film on the surface of aluminum, realizes strong combination of a brazing filler metal and an aluminum base material, has full, bright and firm welding spots, good electrochemical corrosion resistance, good printing performance and collapse resistance, can realize welding of the aluminum material at the temperature of 150-260 ℃, and obtains a good welding effect.
(2) The low-temperature aluminum soft soldering tin paste disclosed by the invention does not generate brazing flux to corrode alloy powder in the storage process, is stable in activity, has the advantages of being not easy to dry, not coarsening, not skinning and the like, and is suitable for the welding process of heat-sensitive electronic elements.
Detailed Description
The following examples are further illustrative of the present invention and are not intended to be limiting thereof.
Example 1
The low-temperature aluminum soft soldering tin paste comprises the following components in percentage by mass: 85% of Sn64Bi35Ag1 alloy powder and 15% of soldering flux, wherein the soldering flux comprises the following components in percentage by mass: 30% of fully hydrogenated rosin, 10% of indium fluoride, 2% of zinc tartrate, 4% of triethanolamine borate, 2% of polyaniline, 7% of hydrogenated castor oil and 45% of solvent.
The preparation method comprises the following steps:
(1) adding perhydrogenated rosin and ethylene glycol monobutyl ether into a reaction kettle, fully stirring at 100 ℃, cooling to 70 ℃ after the perhydrogenated rosin is completely melted, adding triethanolamine borate, polyaniline and hydrogenated castor oil, continuously stirring until the materials are dissolved, cooling to 40 ℃, adding indium fluoride and zinc tartrate, and uniformly stirring to obtain the soldering flux;
(2) and (3) refrigerating the soldering flux at the temperature of 2 ℃ for 12h, returning the temperature at normal temperature, grinding the soldering flux by using a three-roll grinder until the particle size of the soldering flux is 10-20 mu m, and then uniformly mixing the solder alloy powder and the soldering flux in a vacuum mixer according to the proportion to obtain the aluminum soft soldering tin paste.
Example 2
The low-temperature aluminum soft soldering tin paste comprises the following components in percentage by mass: 90% of Sn3Ag0.5Cu96.5 alloy powder and 10% of soldering flux, wherein the soldering flux comprises the following components in percentage by mass: 25% of polymerized rosin, 5% of indium chloride, 3% of zinc citrate, 5% of triethanolamine borate, 3% of polyaniline, 10% of ethylene-diethylene bis-stearamide and 49% of diethylene glycol butyl ether.
The preparation method comprises the following steps:
(1) adding polymerized rosin and diethylene glycol monobutyl ether into a reaction kettle, fully stirring at 120 ℃, cooling to 80 ℃ after the polymerized rosin is completely melted, adding triethanolamine borate, polyaniline and ethylene bis stearamide, continuously stirring until the materials are dissolved, cooling to 50 ℃, adding indium chloride and zinc citrate, and uniformly stirring to obtain the soldering flux;
(2) and (3) refrigerating the soldering flux at 10 ℃ for 24h, returning the temperature at normal temperature, grinding the soldering flux by using a three-roll grinder until the particle size of the soldering flux is 10-20 mu m, and then uniformly mixing the solder alloy powder and the soldering flux in a vacuum mixer according to the proportion to obtain the aluminum soft soldering tin paste.
Example 3
The low-temperature aluminum soft soldering tin paste comprises the following components in percentage by mass: 80% of Sn58Bi42 alloy powder and 20% of soldering flux, wherein the soldering flux comprises the following components in percentage by mass: 30% of disproportionated rosin, 8% of indium bromide, 1% of zinc salicylate, 2% of triethanolamine borate, 2% of polyaniline, 7% of polyamide modified hydrogenated castor oil and 50% of dipropylene glycol dimethyl ether.
The preparation procedure is as in example 1.
Example 4
The low-temperature aluminum soft soldering tin paste comprises the following components in percentage by mass: 82% of Sn64.5Bi35Cu0.5 alloy powder and 18% of soldering flux, wherein the soldering flux comprises the following components in percentage by mass: 28% of polymerized rosin, 7% of indium fluoride, 2% of zinc salicylate, 3% of triethanolamine borate, 1% of polyaniline, 4% of polyamide modified hydrogenated castor oil and 55% of 2-ethyl-1, 3-hexanediol.
The preparation procedure is as in example 1.
Example 5
The low-temperature aluminum soft soldering tin paste comprises the following components in percentage by mass: 88% of Sn58Bi42 alloy powder and 12% of soldering flux, wherein the soldering flux comprises the following components in percentage by mass: 35% of perhydrogenated rosin, 8% of indium fluoride, 3% of zinc lactate, 4% of triethanolamine borate, 2% of polyaniline, 3% of hydrogenated castor oil and 45% of dipropylene glycol dimethyl ether.
The preparation procedure is as in example 1.
Comparative example 1
Comparative example 1 differs from the low temperature aluminum solder paste of example 1 in that the formulation does not contain halides of metallic indium, i.e., does not contain indium fluoride, and the amount of zinc tartrate is increased accordingly.
The preparation procedure is as in example 1.
Comparative example 2
The difference between the low-temperature aluminum soldering paste of the comparative example 2 and the low-temperature aluminum soldering paste of the example 1 is that zinc fluoride is used for replacing indium fluoride in the formula, and the other components and the mixture ratio are not changed.
The preparation procedure is as in example 1.
Comparative example 3
Comparative example 3 differs from the low temperature aluminum solder paste of example 1 in that the formulation does not contain zinc salts of hydroxy acids, i.e., does not contain zinc tartrate, and the amount of indium fluoride is increased accordingly.
The preparation procedure is as in example 1.
Comparative example 4
Comparative example 4 differs from the low temperature aluminum solder paste of example 1 in that the formulation does not contain polyaniline and the amount of solvent is increased accordingly.
The preparation procedure is as in example 1.
Example 6
The low-temperature aluminum soldering tin pastes prepared in the examples 1 to 5 and the comparative examples 1 to 4 are respectively subjected to relevant performance detection according to the following test labeling method, wherein the detection method of the residual rate of the soldering flux is as follows: weighing a solder paste with mass m1, wherein the proportion of soldering flux in the solder paste is rho in the specific embodiment, respectively coating the solder paste on 1010 aluminum substrates with mass m2, thickness of 1mm, length and width of 40mm, placing a test soldering lug on an induction cooker with constant temperature of 120 ℃ for preheating for 15S, placing the test soldering lug on a lead-free solder furnace with constant temperature of 250 ℃, spreading solder and forming a soldering point, taking down the test soldering lug after keeping for 60S, directly weighing the test soldering lug to obtain mass m3, and calculating the residual rate f after soldering according to the following formula: f ═ m3-m2- (1- ρ) m1) ]/(ρ m 1). The results are shown in Table 1.
TABLE 1 test results of related Performance indicators
The results show that the low-temperature aluminum soldering pastes prepared in examples 1 to 5 have good soldering performance, the spreading rate reaches more than 80%, no thermal collapse occurs, the wetting effect is good, no tin bead is formed, the corrosivity is low, the residue is less, and the effect is better than that of the low-temperature aluminum soldering pastes prepared in comparative examples 1 to 4.
Example 7
The luminance of the solder joints of the low temperature aluminum soft soldering pastes prepared in examples 1 to 5 and comparative examples 1 to 4 were evaluated, and the tensile strength of the solder joints was measured to evaluate the removal of the solder joint oxides and the bonding strength of the solder joints, specifically, a tensile test was performed on a double interface stick solder joint using an Shimadzu precision electronic materials Universal testing machine (EZ-Graph500N) at a tensile rate of 1.0mm/min, and the tensile strength (MPa) of the solder joints was recorded. The tensile strength of 5 welds for each condition was arithmetically averaged. The results are shown in Table 2.
TABLE 2 detection results of the relevant Performance indicators
| Group of | Brightness of welding spot | Tensile strength (MPa) |
| Example 1 | Good taste | 86.0 |
| Example 2 | Good taste | 87.4 |
| Example 3 | Good taste | 84.2 |
| Example 4 | Good taste | 85.7 |
| Example 5 | Good taste | 86.4 |
| Comparative example 1 | A little bit worse | 66.8 |
| Comparative example 2 | A little bit worse | 70.2 |
| Comparative example 3 | A little bit worse | 77.5 |
| Comparative example 4 | In general | 80.6 |
The results show that the solder joint brightness of the low-temperature aluminum soft soldering tin paste prepared by the embodiments 1-5 of the invention is good, which shows that the solder paste can effectively remove the oxide of the solder joint, so that the solder joint is full and bright, and simultaneously, the tensile strength is higher, the mechanical property is excellent, and the solder joint is firm. As can be seen from comparative example 1, the formulation does not contain a halide of metallic indium, the luminance of the solder joint is slightly poor, and the tensile strength is weakened, which is presumed to be due to the fact that a metallic liquid layer of indium cannot be formed during the soldering process, resulting in a significant reduction in the removal effect of the aluminum oxide film, and simultaneously reducing the bonding force of the solder and the aluminum base material. Replacement with zinc fluoride is known from comparative example 2Indium fluoride, did not improve solder joint brightness and tensile strength, presumably due to Zn2+The simple substance Zn formed by the reaction and replacement with the simple substance aluminum has a higher melting point of 419 ℃, is in a solid state in the welding process, an aluminum oxide film is tightly attached to a Zn metal layer, and is difficult to strip, and meanwhile, the metal layer is not wetted with the brazing filler metal, so that the spreading of the liquid brazing filler metal cannot be promoted, and the bonding force between the brazing filler metal and an aluminum base material is reduced. As can be seen from comparative example 3, the formula does not contain zinc salt of hydroxy acid, and the brightness and tensile strength of the welding spot are reduced, because the high activity of hydroxy acid is lacked, the removal effect of the oxide film is reduced, and the brightness and welding firmness of the welding spot are affected. The formulation of comparative example 4, which did not contain benzidine, also reduced the luminance of the solder joints and the solder joint integrity due to the lack of benzidine, the reduced oxidation resistance of the metal, and the tendency to form an oxide film.
Example 8
The low-temperature aluminum solder pastes obtained in examples 1 to 5 were stored in a sealed state at room temperature, and the shelf lives of the low-temperature aluminum solder pastes obtained in examples 1 to 5 were measured with the spread wetting angle < 15 ℃ and the state of the solder paste being substantially unchanged as evaluation criteria, and the results are shown in Table 3.
TABLE 3 storage stability test results for low temperature aluminum soft solder paste
| Group of | Example 1 | Example 2 | Example 3 | Example 4 | Example 5 |
| Shelf life | More than 60 days | More than 60 days | More than 60 days | More than 60 days | More than 60 days |
The results show that the low-temperature aluminum soldering paste prepared in the embodiments 1-5 of the invention has good storage stability, the storage life is longer than 60 days at room temperature, and the stability is better.
The above is only a preferred embodiment of the present invention, and it should be noted that the above preferred embodiment should not be considered as limiting the present invention, and the protection scope of the present invention should be subject to the scope defined by the claims. It will be apparent to those skilled in the art that various modifications and adaptations can be made without departing from the spirit and scope of the invention, and these modifications and adaptations should be considered within the scope of the invention.
Claims (7)
1. The low-temperature aluminum soft soldering paste is characterized by comprising the following components in percentage by mass: 80-90% of solder alloy powder and 10-20% of soldering flux, wherein the soldering flux comprises the following components in percentage by mass:
25-35% of modified rosin
5 to 10 percent of halide of metallic indium
1-3% of zinc salt of hydroxy acid
2 to 5 percent of triethanolamine borate
1 to 3 percent of polyaniline
3 to 10 percent of thixotropic agent
45-55% of a solvent;
the halide of the metal indium is selected from one of indium chloride, indium fluoride and indium bromide;
the zinc salt of the hydroxy acid is zinc salt of tartaric acid, salicylic acid, lactic acid, malic acid, glycolic acid or citric acid.
2. The low temperature aluminum solder paste as claimed in claim 1, wherein the halide of metallic indium is indium fluoride.
3. The low temperature aluminum solder paste as claimed in claim 1, wherein the modified rosin is selected from one or more of perhydrogenated rosin, disproportionated rosin, and polymerized rosin.
4. The low temperature aluminum solder paste as claimed in claim 1, wherein the thixotropic agent is selected from one or more of hydrogenated castor oil, polyamide modified hydrogenated castor oil, polyethylene wax, ethylene bis stearamide, and ethylene bis lauramide.
5. The low temperature aluminum solder paste as claimed in claim 1, wherein the solvent is one or more selected from the group consisting of ethylene glycol monobutyl ether, dipropylene glycol dimethyl ether, 2-methyl-2, 4-pentanediol, 2-ethyl-1, 3-hexanediol, diethylene glycol butyl ether, and diethylene glycol hexyl ether.
6. The low temperature aluminum solder paste of claim 1, wherein the solder alloy powder is selected from one of SnBiCu, SnBiAg, SnAgCu, SnBi alloy powder.
7. A method of preparing the low temperature aluminum solder paste of any one of claims 1-6, comprising the steps of:
(1) adding modified rosin and a solvent into a reaction kettle, fully stirring at 100-120 ℃, cooling to 70-80 ℃ after the modified rosin is completely melted, adding triethanolamine borate, polyaniline and a thixotropic agent, continuously stirring until the materials are dissolved, cooling to 40-50 ℃, adding halides of metal indium and zinc salts of hydroxy acid, and uniformly stirring to obtain the soldering flux;
(2) and (3) refrigerating the soldering flux for 12-24 h at the temperature of 2-10 ℃, returning the temperature at normal temperature, grinding the soldering flux by using a three-roll grinder until the particle size of the soldering flux is 10-20 mu m, and then uniformly mixing the solder alloy powder and the soldering flux in a vacuum mixer according to the proportion to obtain the aluminum soft soldering tin paste.
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| JP2020116611A (en) * | 2019-01-24 | 2020-08-06 | 株式会社弘輝 | Flux and solder paste |
| CN114434047B (en) * | 2021-11-25 | 2023-02-28 | 浙江亚通新材料股份有限公司 | Soldering flux for indium-based solder low-temperature welding and preparation method thereof |
| CN115302129B (en) * | 2022-08-01 | 2023-09-15 | 中车青岛四方机车车辆股份有限公司 | Solder paste for stainless steel brazing and preparation method of solder paste |
| CN115448746A (en) * | 2022-08-22 | 2022-12-09 | 浙江湖州新京昌电子有限公司 | Production process for ceramic substrate |
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| CN103317260A (en) * | 2013-06-20 | 2013-09-25 | 天津市恒固科技有限公司 | Solder paste for soft brazing of aluminum and aluminum alloy and preparation method thereof |
| JP5850199B1 (en) * | 2015-06-29 | 2016-02-03 | 千住金属工業株式会社 | Solder material, solder joint and solder material inspection method |
| CN107009043B (en) * | 2017-03-31 | 2019-12-10 | 华南理工大学 | Low-residue high-storage-stability low-temperature aluminum solder paste and preparation method thereof |
| CN107160052B (en) * | 2017-04-12 | 2019-05-14 | 华南理工大学 | A kind of high performance low temperature solder lead-free tin cream and preparation method thereof |
| CN107150186B (en) * | 2017-05-05 | 2019-07-12 | 深圳市汉尔信电子科技有限公司 | A kind of antioxygen infiltration solder(ing) paste and preparation method thereof |
| JP6477965B1 (en) * | 2018-03-08 | 2019-03-06 | 千住金属工業株式会社 | Solder alloy, solder paste, solder ball, flux cored solder and solder joint |
| CN108456802B (en) * | 2018-04-11 | 2020-07-14 | 深圳市汉尔信电子科技有限公司 | Tin-bismuth composite alloy and preparation method thereof |
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