CN1307024C - High adhesion leadless soldering tin grease - Google Patents

High adhesion leadless soldering tin grease Download PDF

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Publication number
CN1307024C
CN1307024C CNB2004100231816A CN200410023181A CN1307024C CN 1307024 C CN1307024 C CN 1307024C CN B2004100231816 A CNB2004100231816 A CN B2004100231816A CN 200410023181 A CN200410023181 A CN 200410023181A CN 1307024 C CN1307024 C CN 1307024C
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acid
quality
resin
leadless soldering
solder flux
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CNB2004100231816A
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Chinese (zh)
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CN1569383A (en
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邓和升
于耀强
邓和军
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邓和升
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Abstract

The present invention discloses a high adhesion leadless soldering paste which is used for pasting the surface of electronic products. The leadless soldering paste comprises Sn-Ag-Cu-Bi-Ni based leadless soldering tin powder which is mixed with welding flux. The welding flux is basically prepared from the following ingredients by the mass percentage: 35 to 50% of resin (such as modified rosin resin and toxilic acid resin), 1 to 10 % of thixotropic agent (modified hydrogenated castor oil and fatty glyceride), 35 to 55% of solvent (undecanol, 2-methyl-hexanediol), and 1.5 to 5% of active agent (succinic acid, tetrabutyl hydrobromic acid amine). The welding flux can also comprise 0.01 to 0.9 mass% of corrosion inhibitors for copper, and the corrosion inhibitors comprise one or more than one of benzothiazole, benzotriazole, benzimidazole, etc. The leadless soldering paste of the present invention has obvious effects on increasing adhesion, and the welding performance and the properties of printing and demoulding are not changed.

Description

High adhesive force leadless soldering tin paste

Affiliated technical field

The present invention relates to a kind of electronic product surface mount leadless soldering tin paste that is used for, be particularly useful for pasting the high adhesive force leadless soldering tin paste of inserting the electronic product that loads in mixture and use a solder reflow process.

Background technology

Traditional solder(ing) paste product is made up of tin-lead solder powder and solder flux, and tin-lead solder powder wherein is generally 63%Sn, the 37%Pb of 25 μ m ∽, 75 μ m or 62%Sn, 36%Pb, the 2%Ag spherical powder constitutes; Solder flux generally is made of resin, activator, thixotropic agent, solvent, additive.On the one hand, heavy metal lead in the solder(ing) paste is after welding PCB, can intersperse among in the environment with discarded later on electronic product, long-term etch through acid rain, lead can permeate the ground, dissolve in ground water regime, long-term accumulation in human body can cause the harm to nervous system, fertility system etc. after drinking.For ensureing human body health, guarantee economic, social sustainable development, regulation in " electronics and IT products production prevention and cure of pollution management method " that China's Ministry of Information Industry puts into effect " the electronics and IT products producer should guarantee: carry out the minimizing production measure of harmful and noxious substance from July 1st, 2003; Electronics and IT products in the state key supervision catalogue of putting on market on July 1st, 2006 can not contain lead, mercury, cadmium, Cr VI, polymerization bromination biphenyl (PBB), polymerization bromination biphenyl ether (PBDE) etc. ".The NEDO of the IDEALS in NCMS, the NEMI of each the electronics industry developed country of west such as the U.S., Europe, the ITRI of Britain and Japan etc., research and development and large-scale production can substitute the lead-free solder of traditional tin-kupper solder.

Usually the alloy as lead-free solder has Sn-Ag system, Sn-Sb system, Sn-Zn system, Sn-Bi system.Sn-Bi is that mechanical performance can not be satisfactory, and Sn-Zn is easy oxidation, and Sn-Sb is that welding temperature is had relatively high expectations.For above-mentioned reasons, everybody concentrates on Sn-Ag system to sight, and its higher anti-aging, creep-resistant property and favorable mechanical performance, weldability can determine it to possess commercial basic fundamental condition.Consider the cost-performance factor,, need carry out the quality % of Ag preferably, also need to add the fusion temperature that other suitable metals improve solder powder as countermeasure.

On the other hand, some electronic product considers that thermal shock may cause damage to it, wish that weld interval is short, welding temperature is low as far as possible, again because the needs of the microminiaturized multifunction of electronic product, these electronic products require slotting the loading in mixture once of two-sided subsides to finish, this has just produced a kind of new welding manner: slice component, ventilating hole element all with behind the metal matrix printing lead-free tin cream, are implemented to mount and plug-in mounting, implement a reflow soldering of lead-free tin cream afterwards.This just needs lead-free tin cream that adhesive force is preferably arranged, and is unlikely to moving, causing device to come off in the welding process or weld preceding soldering paste coming off on the via pad.As countermeasure, need improve the component of the solder flux of solder(ing) paste, to increase the adhesive force of solder(ing) paste.

Summary of the invention

The purpose of this invention is to provide a kind of favorable mechanical performance that has, anti-aging, creep resistant, antioxygenic property improve, electronic product surface mount leadless soldering tin paste with good adhesive force is particularly useful for pasting the high adhesive force leadless soldering tin paste of inserting the electronic product that loads in mixture and use a solder reflow process.

Unleaded glass putty alloy composition among the present invention is main composition with Sn, Ag, Cu, Bi, Ni mainly, to wherein adding Ce, In, P, Ga, Sm, Pr, Eu, La, Pm rare earth and adding element and improve its machinery and antioxygenic property.

Lead-free solder based on Sn-Ag has gratifying mechanical performance, ageing resistace, solderability, but its eutectic alloy Sn-3.5Ag cost is higher, commercialization acquires a certain degree of difficulty, therefore, we suitably reduce the content of silver, the actual 0.1-3.0% scope of finding, effect is comparatively desirable, for keeping its favorable mechanical performance, we add Ni, Cu compensates, Sn, the eutectic point Sn-0.7Cu of Cu, 227 ℃ of eutectic temperatures, show high melt point again, such soldering paste welding temperature requires about 260 ℃, and is too big to the thermal shock of components and parts, also kept original mechanical performance, through the experiment contrast, the nickel of 0.01-1.0%, the copper of 0.01-1.5%, the Ag of 0.1-3.0%, the bismuth of 0.1-2.0% is comparatively desirable as the alloy effect of main composition, and its liquidus temperature is less than 220 ℃, percentage elongation>20%, shear strength>30mPa, tensile strength>40N/mm 2, it is anti-aging in order further to improve, creep resistant, antioxygenic property, and we are selective to add one or more additions among P, Ga, Se, Ce, Pr, Pm, Nd, Sm, Eu, Tm, the Tb between 0.01=0.05%, satisfactory for result.

The traditional material of resin in the solder flux is generally newtrex, Foral, disproportionation rosin etc., find that in practice its postwelding residue is more, residual color is darker, adhesion is also good inadequately, for increasing the adhesion of soldering paste, we have screened other several resins: the Foral glyceride, rosin pentaerythritol ester, modified rosin resin, terpene resin, the maleficent acid resin, alkyd resins etc., add wherein one or more, content is the 35-50% of flux quality, exceed this scope or adhesion is not enough, the solder(ing) paste life-span is bad, or adhesion influences printing too by force.The present invention has improved the adhesive force of solder(ing) paste by the adjustment to resin, because the decomposability of part resin, postwelding is residual very low.

Components contents has no particular limits in the resin, but in quality %, the modified rosin resin of preferred 55.0-75.0% respectively with the combination of the rosin pentaerythritol ester of 25.0-45.0%, maleficent acid resin, rosin pentaerythritol ester, account for the preferred 40.0-45.0% of amount of solder flux as resin.

Thixotropic agent is selected: rilanit special, castor oil, butter, modified hydrogenated castor oil, palmitic amide, glycerine monofatty ester, fatty acid glyceryl ester, select wherein one or more, and content is the 1.0-10.0% of flux quality.

Components contents has no particular limits in the thixotropic agent, but in quality %, the combination of preferred rilanit special, the modified hydrogenated castor oil of 45.0-55.0% and 45.0-55.0% palmitic amide; The combination of 45.0-55.0% glycerine monofatty ester and fat 45.0-55.0% fat acid glyceryl ester; Account for the preferred 5.0-7.0% of amount of solder flux as thixotropic agent.

Solvent is selected: diethylene glycol monoethyl ether acetic acid esters, diethylene glycol monobutyl ether, diethylene glycol monobutyl ether acetic acid esters, diglycol monotertiary hexyl ether, diglycol monotertiary hexyl ether acetic acid esters, ethylene glycol monobutyl ether, ethyleneglycol monophenylether, propylene glycol monobutyl ether, propane diols monophenyl ether, undecyl alcohol, 2-ethyl-pentanediol, 2-methyl-hexylene glycol, alkyl replace one or more in pentanediol, alkyl replacement hexylene glycol, the modification terpinol etc., and content is the 35.0-55.0% of flux quality.

Components contents has no particular limits in the solvent, but in quality %, preferred undecyl alcohol; 2-ethyl-pentanediol; 2-methyl-hexylene glycol; The diethylene glycol monoethyl ether acetic acid esters of 30.0-40.0% respectively with the combination of the undecyl alcohol of 60.0-70.0%, 2-ethyl-pentanediol, 2-methyl-hexylene glycol; Account for the preferred 40.0-50.0% of amount of solder flux as solvent.

Activator is selected: succinic acid, glutaric acid, adipic acid, azelaic acid, decanedioic acid, salicylic acid, phthalic acid, terephthalic acid (TPA), dimethylamine hydrochloride, diethylamine hydrochloride, tetrabutylammonium hydrogen bromic acid amine, diphenylguanidine hydrobromate, 1,3 one two bromo-2-propyl alcohol, 1,2 one two bromo-1-propyl alcohol, 1,4 one two bromo-2-butylene, 2,3 one two bromo-2-butene-1s, the mixture of one or more of 4-glycol, dibromosuccinic acid, α one bromo-butyric acid, guanidine hydrochloride, content is the 1.5-5.0%. of flux quality

Components contents has no particular limits in the activator, but in quality %, 2, the 3 one two bromo-2-butene-1s of 1, the 3 one two bromo-2-propyl alcohol of the succinic acid of 20.0-30.0% and the adipic acid of 20.0-30.0%, 20-30%, 20-30%, the combination of 4-glycol; The combination of the guanidine hydrochloride of the adipic acid of 20.0-30.0% and the dibromosuccinic acid of 20.0-30.0%, 40.0-50.0%; The combination of the tetrabutylammonium hydrogen bromic acid amine of the decanedioic acid of 20.0-30.0% and the α of 20.0-30.0% one bromo-butyric acid, 40.0-50.0%; Account for the preferred 4.0-5.0% of amount of solder flux as activator.

For preventing that corrosion from can add copper inhibitor: as benzothiazole, BTA, benzimidazole one or more, content is the 0.01-0.9% of flux quality.

The preparation method of the high adhesive force leadless soldering tin paste of the present invention:

Shape to invention Pb-free solder powder has no particular limits, but globular powder normally.This powder can prepare by methods such as centrifugal efflorescence method or gas efflorescence methods.The particle size of this Pb-free solder powder can be identical with the solder(ing) paste of routine, and its order of magnitude is generally the 200-400 order, but also can use 500 orders or thinner powder.

Resin among the present invention, activator, thixotropic agent are joined in the stainless steel cauldron in proportion, add the solvent of remaining proportion, add thermal agitation at 100-150 ℃, up to dissolving fully, cooling rapidly, the solvent part of additional volatilization, airtight placement is standby.Get the Pb-free solder powder of 88-92% ratio and put in the planetary stirrer, the solder flux that adds remaining proportion stirs, and little plastic bottle packing gets final product.

The specific embodiment

Embodiment 1; Calculate by percentage to the quality, the globular powder of the Pb-free solder powder that consists of 2.0%Ag-1.0%Cu-0.5%Bi-0.5%Ni-Sn (surplus) with 90.0%, with 10% solder flux, with the high adhesive force leadless soldering tin paste of preparation the present invention with 1 composition of embodiment shown in the table 1.

Embodiment 2; Calculate by percentage to the quality, the globular powder of the Pb-free solder powder that consists of 2.5%Ag-1.2%Cu-1.5%Bi-0.8%Ni-Sn (surplus) with 88.0%, with 12.0% solder flux, with the high adhesive force leadless soldering tin paste of preparation the present invention with 2 compositions of embodiment shown in the table 1.

Embodiment 3; Calculate by percentage to the quality, the globular powder of the Pb-free solder powder that consists of 1.5%Ag-0.7%Cu-0.9%Bi-0.1%Ni-Sn (surplus) with 92.0%, with 8.0% solder flux, with the high adhesive force leadless soldering tin paste of preparation the present invention with 3 compositions of embodiment shown in the table 1.

Embodiment 4; Calculate by percentage to the quality, the globular powder of the Pb-free solder powder that consists of 96.1%Sn-1.3%Ag-0.8%Cu-0.7%Bi-0.1%Ni-1.0%Ga with 92.0%, with 8.0% solder flux, with the high adhesive force leadless soldering tin paste of preparation the present invention with 1 composition of embodiment shown in the table 1.

Embodiment 5; Calculate by percentage to the quality, the globular powder of the Pb-free solder powder that consists of 95.7%Sn-1.3%Ag-0.8%Cu-0.7%Bi-0.1%Ni-1.0%Ga-0.4%In with 90.0%, with 10.0% solder flux, with the high adhesive force leadless soldering tin paste of preparation the present invention with composition shown in the table 1.

Embodiment 6; Calculate by percentage to the quality, the globular powder of the Pb-free solder powder that consists of 96.0%Sn-1.5%Ag-0.7%Cu-0.9%Bi-0.1%Ni-0.03%Ce-0.15%In-0.02 %P-0.5%Ga-0.02%Sm-0.02%Pr-0.02%Eu-0.02%La-0.02%Pm with 88.0%, with 12.0% solder flux, with the high adhesive force leadless soldering tin paste of preparation the present invention with composition shown in the table 1.

Embodiment 7; Calculate by percentage to the quality, the globular powder of the Pb-free solder powder that consists of 95.5%Sn-1.5%Ag-0.8%Cu-0.7%Bi-0.1%Ni-1.0%Ga-0.4%In with 89.0%, 11.0% solder flux of forming with 30.0% modified rosin resin, 16.0% maleficent acid resin, 1.0% decanedioic acid, α-bromo-butyric acid of 1.0%, 1.5% four butyl bromation amine, 4.0% modified hydrogenated castor oil, 3.0% palmitic amide, 2-ethyl-pentanediol of 43.5%, 0.5% copper inhibitor is with the high adhesive force leadless soldering tin paste of preparation the present invention.Copper inhibitor is made up of 30.0-40.0% benzothiazole, 30.0-40.0% BTA, 30.0-40.0% benzimidazole.

Table 1 is embodiment and comparative example component and the table of comparisons of content by mass percentage.

Table 1

Title Comparative example 1 Comparative example 2 Comparative example 3 Embodiment 1 Embodiment 2 Embodiment 3 Modified rosin resin 25.0 25.0 25.0 25.0 30.0 30.0 Foral 20.0 20.0 20.0 Alkyd resins 20.0 The maleficent acid resin 16.0 Rosin pentaerythritol ester 14.0 Succinic acid 1.0 1.0 Adipic acid 1.0 1.0 1.0 1.0 Decanedioic acid 1.0 1.0 α-bromo-butyric acid 1.0 1.0 Dibromosuccinic acid 1.0 1.0 Guanidine hydrochloride 2.0 2.0 Four butyl bromation amine 1.5 1.5 1,3-two bromo-2-propyl alcohol 1.0 1.0 2,3-two bromo-2-butene-1s, 4-glycol 1.0 1.0

Modified hydrogenated castor oil ????4.0 ????4.0 Glyceryl monostearate ????3.0 ????3.0 Glycerol stearate ????3.0 ????3.0 Rilanit special ????6.0 ????6.0 Palmitic amide ????3.0 ????3.0 2-ethyl-pentanediol ????43.5 ????43.5 2-methyl-hexylene glycol ????46.0 ????46.0 Undecyl alcohol ????45.0 ????45.0

Through to the test of the rate of spread of above-mentioned comparative example and embodiment, printing test, adhesive force test, the results are shown in Table 2, table 2 is the table of comparisons of embodiment and the comparative example rate of spread, printing, adhesive force.

Table 2

Project Comparative example 1 Comparative example 2 Comparative example 3 Embodiment 1 Embodiment 2 Embodiment 3 Rate of spread % ??90 ??88 ??89 ??89 ??89 ??90 Adhesive force, initial stage gf ??109 ??106 ??107 ??116 ??118 ??121 The limit 0.2mm thick template 0.3 * 2.0mm figure, spacing 〉=0.25mm do not collapse Qualified Qualified Qualified Qualified Qualified Qualified

By table 2 as seen, add to add the effect that the leadless soldering tin paste of resin has tangible adhesive force to increase, and its weldability, printing release property do not change.

Claims (7)

1, a kind ofly be used for the high adhesive force leadless soldering tin paste that the electronic product surface mount is used, it is characterized in that:
(1), described leadless soldering tin paste is made up of the Pb-free solder powder of 88.0-92.0 quality % and the solder flux of 8.0-12.0 quality %;
(2), described Pb-free solder powder is made up of Bi, the Ni of 0.01-1.0 quality % of Cu, the 0.1-2.0 quality % of Ag, the 0.01-1.5 quality % of Sn, the 0.1-3.0 quality % of 93.5-99.7 quality % basically;
(3) described solder flux is made up of the resin of 35.0-50.0 quality %, the thixotropic agent of 1.0-10.0 quality %, the solvent of 35.0-55.0 quality %, the activating agent of 1.5-5.0 quality % basically;
(4) the described resin of solder flux is made up of one or more of Foral glyceride, rosin pentaerythritol ester, modified rosin resin, terpene resin, maleficent acid resin, alkyd resins;
(5) the described thixotropic agent of solder flux is made up of one or more of rilanit special, castor oil, butter, modified hydrogenated castor oil, palmitic amide, glycerine monofatty ester, fatty acid glyceryl ester;
(6) the described solvent of solder flux is made up of one or more of diethylene glycol monoethyl ether acetic acid esters, diethylene glycol monobutyl ether, diethylene glycol monobutyl ether acetic acid esters, diglycol monotertiary hexyl ether, diglycol monotertiary hexyl ether acetic acid esters, ethylene glycol monobutyl ether, ethyleneglycol monophenylether, propylene glycol monobutyl ether, propane diols monophenyl ether, undecyl alcohol, 2-methyl-hexylene glycol, 2-ethyl-pentanediol, modification terpinol;
(7) the described activating agent of solder flux is by succinic acid, glutaric acid, adipic acid, azelaic acid, decanedioic acid, salicylic acid, phthalic acid, terephthalic acid (TPA), dimethylamine hydrochloride, diethylamine hydrochloride, tetrabutylammonium hydrogen bromic acid amine, diphenylguanidine hydrobromate, 1,3 one two bromo-2-propyl alcohol, 1,2 one two bromo-1-propyl alcohol, 1,4 one two bromo-2-butylene, 2,3 one two bromo-2-butene-1s, one or more compositions of 4-glycol, dibromosuccinic acid, α one bromo-butyric acid, guanidine hydrochloride.
2, according to the described high adhesive force leadless soldering tin paste of claim 1, it is characterized in that: the Pb-free solder powder at least also contains one or more of Ce, In, P, Ga, Sm, Pr, Eu, La, Pm, and its content is 0.8-1.4 quality %.
3, according to the described high adhesive force leadless soldering tin paste of claim 1, it is characterized in that: also include the copper inhibitor that one or more one-tenth by benzothiazole, BTA, benzimidazole are grouped in the solder flux, its content is 0.01-0.9 quality %.
4, according to the described high adhesive force leadless soldering tin paste of claim 1, it is characterized in that: resin be 55.0-75%.0 modified rosin resin respectively with more than one the combination of the rosin pentaerythritol ester of 25.0-45.0%, maleficent acid resin, rosin pentaerythritol ester, the amount that resin accounts for solder flux is 40.0-45.0%.
5, according to the described high adhesive force leadless soldering tin paste of claim 1, it is characterized in that: thixotropic agent is the combination of rilanit special or modified hydrogenated castor oil of 45.0-55.0% and 45.0-55.0% palmitic amide, and the amount that thixotropic agent accounts for solder flux is 5.0-7.0%.
6, according to the described high adhesive force leadless soldering tin paste of claim 1, it is characterized in that: solvent is undecyl alcohol or 2-ethyl-pentanediol or 2-methyl-hexylene glycol, and the amount that solvent accounts for solder flux is 40.0-50.0%.
7, according to the described high adhesive force leadless soldering tin paste of claim 1, it is characterized in that: activator be the succinic acid of 20.0-30.0% and 20.0-30.0% adipic acid, 20.0-30.0% 1,2 of 3 one two bromo-2-propyl alcohol, 20.0-30.0%, 3 one two bromo-2-butene-1s, the amount that the combination of 4-glycol, activator account for solder flux is 4.0-5.0%.
CNB2004100231816A 2004-05-09 2004-05-09 High adhesion leadless soldering tin grease CN1307024C (en)

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