CN100450700C - Lead-free halogen-free tinol and preparation process - Google Patents
Lead-free halogen-free tinol and preparation process Download PDFInfo
- Publication number
- CN100450700C CN100450700C CNB2006100780348A CN200610078034A CN100450700C CN 100450700 C CN100450700 C CN 100450700C CN B2006100780348 A CNB2006100780348 A CN B2006100780348A CN 200610078034 A CN200610078034 A CN 200610078034A CN 100450700 C CN100450700 C CN 100450700C
- Authority
- CN
- China
- Prior art keywords
- free
- acid
- tinol
- lead
- preparation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Abstract
The present invention discloses lead-free and halogen-free tinol which comprises the following ingredients with the shares by weight: 80 to 98 shares of alloy powder and 2 to 20 shares of welding flux, wherein the alloy powder is any one of SnAgCu, SnAgNi, SnAgBiCu, SnAgBiSb, SnCu and SnAg; the welding flux is prepared from the following ingredients: 30 to 60 wt% of modified resin oxidation inhibitor, 5 to 15 wt% of activating agent of an organic acid class, 4 to 14 wt% of thixotropic agent, 2 to 6 wt% of plasticizing agent, 0.4 to 2 wt% of shaping agent, 0.1 to 0.5 wt% of corrosion inhibitor and 20 to 40 wt% of organic solvent; the modified resin oxidation inhibitors are prepared from the following ingredients: 80 to 90 wt% of modified rosin resin, 2 to 8 wt% of antioxidant and 2 to8 wt% of reducing agent. The lead-free tinol prepared by the present invention has the advantages of favorable printing and thixotropic properties, high speed of spreading at the welding temperature, no oxidation, no false welding and no short circuit.
Description
Technical field
The present invention relates to a kind of tinol, be particularly useful for lead-free halogen-free tinol of circuit board assembling surface mounting technology (SMT, Surface Mount Technology) usefulness and preparation method thereof.
Background technology
In the assembling of electronic industrial products welding, all using tin-lead (Sn-Pb) solder, still in the melting of scolder, use, generation is arranged because of phenomenons such as the lead poisoning in the scolder cause death, disables more always.When discarded electric equipment products landfill disposal, the lead in the scolder of welding position runs into acid rain or acid underground water.Promptly can form the lead salts that contains of solubility, be dissolved in the underground water again, and polluted source after people's long-term drinking, also can cause lead poisoning, seriously endanger human beings'health, destroy ball ecological environment.
European Parliament and EU Council on January 23rd, 2003 2002/95/EC number is used some harmful substance instruction about restriction in electrical equipment, i.e. " ROHS " instruction, clearly stipulate, from in July, 2006, manufacturer will prove that product facility does not comprise greater than the maximum standard substance that is allowed, and one of them is exactly plumbous.In view of electronic product to unleaded strong request, the present invention has released the SMT lead-free halogen-free tinol, has used solders such as SnAgCu, SnAgNi, SnAgBiCu, SnAgBiSb, SnCu, SnAg to substitute the SnPb scolder.
Summary of the invention
The purpose of this invention is to provide a kind of tinol, lead-free halogen-free tinol that is applicable to circuit board assembling surface mounting technology (SMT, Surface Mount Technology) usefulness and preparation method thereof especially is provided, overcome the shortcoming of above-mentioned scolder.
The objective of the invention is to be achieved through the following technical solutions:
A kind of lead-free halogen-free tinol comprises following parts by weight of component: alloyed powder 80-98, scaling powder 2-20; Described alloyed powder is any among SnAgCu, SnAgNi, SnAgBiCu, SnAgBiSb, SnCu, the SnAg; Described scaling powder is made up of following weight proportion ratio component: modified resin antioxidant 30-60, and organic acid activator 5-15, thixotropic agent 4-14, plasticizer 2-6, forming agent 0.4-2, corrosion inhibiter 0.1-0.5, organic solvent 20-40 forms; Described modified resin antioxidant is made up of following weight proportion ratio component: modified rosin resin 80-90, antioxidant 2-8, reducing agent 2-8;
Described component is preferably following parts by weight of component: alloyed powder 88～92, scaling powder 8～12.
Described modified rosin resin is preferably one or more of newtrex, Foral, water-white rosin, acryl rosin; Described antioxidant is preferably by four [β-(3,5-di-t-butyl 4-hydroxyl-phenyl) propionic acid] pentaerythritol ester, 1,3,5-trimethyl-2,4,6-three (3, the 5-tert-butyl group-4 hydroxyl Bian Ji) benzene, 1,1, three kinds of components of 3-three (2-methyl-4-hydroxyl-5-tert-butyl-phenyl) butane are formed, and its proportioning is 1: 1: 1; Described reducing agent is cis-9-octadecenoic acid;
Described organic acid activator is preferably one of organic dibasic acid, aromatic acid or its combination;
Described thixotropic agent is preferably one or both in ten dihydroxystearic acids, cotmar, single stearic acid glycerine lipoprotein, the oleamide;
Described plasticizer is preferably one or both of hercolyn D, di-n-octyl sebacate;
Described forming agent is preferably ceresin;
Described corrosion inhibiter is preferably a kind of in BTA, the alpha-mercapto benzothiazole;
Described organic solvent is preferably one or both of diethylene glycol ether, triethylene glycol methyl ether, N-methyl pyrrolidone, propane diols.
Described organic dibasic acid is one or more of suberic acid, azelaic acid, decanedioic acid, malic acid, tartaric acid, phthalic acid; Aromatic acid is a phthalic acid
The trans-substitution of the above-mentioned preferred homogeneous raw material phase of the present invention can obtain identical technique effect.
The present invention also provides the preparation method of described lead-free halogen-free tinol, may further comprise the steps:
(1) preparation modified resin antioxidant: after the modified rosin resin fusing, add antioxidant and reducing agent under stirring to fusing, mixing is prepared into liquid, and cooling is standby;
(2) preparation scaling powder: in above-mentioned modified resin antioxidant, add part organic solvent, stirring and dissolving; Add residual solvent in another container, when being heated to 90-100 ℃, add thixotropic agent, plasticizer, forming agent, corrosion inhibiter successively under stirring, be stirred to dissolving, add the organic acid for activating agent when being cooled to 70-80 ℃, and be stirred to dissolving evenly, cooling, standby; The modified resin antioxidant liquid of above-mentioned preparation is poured in the solution of this preparation and stirred, be the scaling powder of transferring cream to use;
(3) preparation tinol: the scaling powder and the alloyed powder raw material of above-mentioned preparation are put into blending kettle, vacuumize, stirring is described lead-free halogen-free tinol.
The preparation method of described lead-free halogen-free tinol also further is: mixing speed is 40～60 rev/mins; Scaling powder, alloyed powder raw material are put into blending kettle, vacuumize, vacuum-0.06--0.04MPa stirs 20-60min, promptly gets described lead-free halogen-free tinol.
Raw material among the present invention can be buied from market.
Lead-free halogen-free tinol of the present invention has the following advantages:
1, lead-free halogen-free tinol of the present invention can be used for the unleaded electronics of electronic product assembling processing procedure, and with the coating on components and parts surface, PCB surface protective layer compatibility is good.
2, lead-free halogen-free tinol of the present invention has tinol non-oxidizability height, good, the easy demoulding of printing, can carry out reflow soldering under 260-275 ℃ of high temperature, soldering paste sprawls soon, helps that the weldering performance is good, tin sweat(ing) is few, no rosin joint, no circuit defect, postwelding residue are few, the advantage of environmental protection.
The specific embodiment
Embodiment 1
Preparation modified resin antioxidant (1)
Raw material (g): modified rosin resin 80g is (by the feedstock production of following weight proportion ratio: newtrex, water-white rosin, Foral or acryl rosin, ratio 47: 40: 2), antioxidant 2g is (by the feedstock production of following weight proportion ratio: four [β-3,5-di-t-butyl 4-hydroxyl---phenyl] propionic acid pentaerythritol ester, 1,3,5-trimethyl-2,4,6-three (3, the 5-tert-butyl group-4 hydroxybenzyl) benzene, 1,1,3-three (2-methyl-4-hydroxyl-5-tert-butyl-phenyl) butane, ratio 1: 1: 1), reducing agent 5g is cis-9-octadecenoic acid.
Preparation method: press every kind of raw material of proportion speed weighing, after newtrex, water-white rosin, acryl rosin put into enamel or enamel still and treat all fusings, start agitator and carry out stirring at low speed, mixing speed is 40 ~ 60 rev/mins, under agitation add antioxidant and reducing agent successively to whole melt-blended uniform liquid that become, pour in the enamel tray, it is standby to be cooled to room temperature.
Preparation modified resin antioxidant (2)
Raw material (g): modified rosin resin 90g (by the feedstock production of following weight proportion ratio: newtrex 47, water-white rosin 40, Foral or acryl rosin 2), antioxidant 6g are (by the feedstock production of following weight proportion ratio: four [β-3,5-di-t-butyl 4-hydroxyl---phenyl] propionic acid pentaerythritol ester, 1,3,5-trimethyl-2,4,6-three (3, the 5-tert-butyl group-4 hydroxybenzyl) benzene, 1,1,3-three (2-methyl-4-hydroxyl-5-tert-butyl-phenyl) butane, ratio 1: 1: 1), reducing agent 2g is cis-9-octadecenoic acid.
Preparation method: the same preparation modified resin antioxidant (1).
Preparation modified resin antioxidant (3)
Raw material (g): modified rosin resin 85g (by the feedstock production of following weight proportion ratio: newtrex 47, water-white rosin 40, Foral or acryl rosin 2), antioxidant 4g are (by the feedstock production of following weight proportion ratio: four [β-3,5-di-t-butyl 4-hydroxyl-phenyl] propionic acid pentaerythritol ester, 1,3,5-trimethyl-2,4,6-three (3, the 5-tert-butyl group-4 hydroxybenzyl) benzene, 1,1,3-three (2-methyl-4-hydroxyl-5-tert-butyl-phenyl) butane, ratio 1: 1: 1), reducing agent 8g is cis-9-octadecenoic acid.
Preparation method: the same preparation modified resin antioxidant (1).
Embodiment 2
Preparation scaling powder (1)
The modified resin antioxidant 40 of raw material (g): one of embodiment 1, suberic acid 1, malic acid 2, tartaric acid 3, ten dihydroxystearic acids 6, monoglyceride 4, hercolyn D 3.5, ceresin 0.5, BTA 0.2, tri ethylene glycol ethyl ether 16, propane diols 23.8.
The preparation method: accurately take by weighing various raw materials by formula rate, modified resin antioxidant is placed in enamel or the enamel still, add the part organic solvent and at room temperature be stirred to whole dissolvings, mixing speed is 40-60 rev/min.In another enamel or enamel still, add residual solvent, under agitation add thixotropic agent, plasticizer, forming agent, corrosion inhibiter when being heated to 90-100 ℃ successively, be stirred to whole dissolvings.Add the organic acid for activating agent when being cooled to 70-80 ℃, and it is even to be stirred to whole dissolvings, reduces to room temperature naturally.With the above-mentioned modified resin antioxidant liquid that makes, slowly pour in this solution of lowering the temperature naturally and stir, be the scaling powder of transferring cream to use.
Preparation scaling powder (2)
The modified resin antioxidant 48 of raw material (g): one of embodiment 1, suberic acid 2, decanedioic acid 1, malic acid 5% tartaric acid 1, oleamide 6, monoglyceride 4, hercolyn D 5.3, ceresin 0.5, BTA 0.2, tri ethylene glycol ethyl ether 27.
The preparation method: accurately take by weighing various raw materials by formula rate, modified resin antioxidant is placed in enamel or the enamel still, add the part organic solvent and at room temperature be stirred to whole dissolvings, mixing speed is 40 rev/mins.In another enamel or enamel still, add residual solvent, under agitation add thixotropic agent, plasticizer, forming agent, corrosion inhibiter when being heated to 90 ℃ successively, be stirred to whole dissolvings.Add the organic acid for activating agent when being cooled to 70 ℃, and it is even to be stirred to whole dissolvings, reduces to room temperature naturally.With the above-mentioned modified resin antioxidant liquid that makes, slowly pour in this solution of lowering the temperature naturally and stir, be the scaling powder of transferring cream to use.
Preparation scaling powder (3)
The modified resin antioxidant 50 of raw material (g): one of embodiment 1, decanedioic acid 5, malic acid 4, ten dihydroxystearic acids 4, monoglyceride 4, di-n-octyl sebacate 4, ceresin 1, alpha-mercapto benzothiazole 0.1, diethylene glycol ether 10, triethylene glycol formic acid 20.
Preparation method: the same preparation scaling powder (1).
Preparation scaling powder (4)
The modified resin antioxidant 45 of raw material (g): one of embodiment 1, azelaic acid 2, phthalic acid 5, tartaric acid 1, cotmar 6, oleamide 4, di-n-octyl sebacate 2, ceresin 2, BTA 0.3, N-methyl pyrrolidone 14.7, propane diols 18.
Preparation method: the same preparation scaling powder (1).
Preparation scaling powder (5)
The modified resin antioxidant 44 of raw material (g): one of embodiment 1, malic acid 5.4, phthalic acid 1, tartaric acid 1.5, ten dihydroxystearic acids 2.4, oleamide 8, monoglyceride 2, hercolyn D 6, ceresin 0.5, alpha-mercapto benzothiazole 0.2, triethylene glycol methyl ether 11, propane diols 18.
Preparation method: the same preparation scaling powder (1).
Preparation scaling powder (6)
The modified resin antioxidant 30 of raw material (g): one of embodiment 1, malic acid 3, phthalic acid 1, tartaric acid 1, ten dihydroxystearic acid 2, monoglyceride 2, hercolyn D 2, ceresin 0.4, alpha-mercapto benzothiazole 0.1, triethylene glycol methyl ether 8, propane diols 12.
Preparation method: the same preparation scaling powder (1).
Preparation scaling powder (7)
The modified resin antioxidant 60 of raw material (g): one of embodiment 1, azelaic acid 5, phthalic acid 9, tartaric acid 1, cotmar 9, oleamide 4, di-n-octyl sebacate 6, ceresin 2, BTA 0.5, N-methyl pyrrolidone 22, propane diols 18.
Preparation method: the same preparation scaling powder (1).
Embodiment 3
Preparation lead-free halogen-free tinol (1)
Raw material (g): Sn3.0Ag0.5Cu alloyed powder 90g, the scaling powder 10g of one of embodiment 2.
The preparation method: with scaling powder, alloyed powder, put into the stainless steel blending kettle, vacuumize, vacuum-0.06--0.04MPa starts and is the tinol finished product after agitator stirs 30-40min.
Preparation lead-free halogen-free tinol (2)
Raw material (g): Sn3Ag1.2Ni alloyed powder 91g, the scaling powder 9g of one of embodiment 2.
The preparation method: with scaling powder, alloyed powder, put into the stainless steel blending kettle, vacuumize, vacuum-0.06MPa starts and is the tinol finished product after agitator stirs 20min.
Preparation SMT lead-free halogen-free tinol (3)
Raw material (g): Sn4Ag6Bi0.18Cu alloyed powder 88g, the scaling powder 12g of one of embodiment 2.
The preparation method: with scaling powder, alloyed powder, put into the stainless steel blending kettle, vacuumize, vacuum-0.04MPa starts and is the tinol finished product after agitator stirs 60min.
Preparation SMT lead-free halogen-free tinol (4)
Raw material (g): Sn3Ag5Bi0.5Sb alloyed powder 80g, the scaling powder 20g of one of embodiment 2.
Preparation method: with preparation lead-free halogen-free tinol (1).
Preparation SMT lead-free halogen-free tinol (5)
Raw material (g): Sn0.7Cu alloyed powder 98g, the scaling powder of embodiment 1 (4) 2g.
Preparation method: with preparation lead-free halogen-free tinol (1).
Embodiment 6
Preparation SMT lead-free halogen-free tinol (6)
Raw material (g): Sn3.5Ag alloyed powder 89g, the scaling powder of embodiment 1 (5) 11g.
Preparation method: with preparation lead-free halogen-free tinol (1).
Exempt to clean welding according to national electron trade standard SJ/T11168 and embodiment 1 to embodiment 6 has been carried out the overall target test, result such as following table with solder stick and SJ/T11186 tin lead plaster shape scolder general specification.
Place after one month viscosity as can be known under the tinol room temperature shown in the embodiment 1 to embodiment 6 by above result of the test and change lessly, lotion is stable, and cold cave in and heat is caved in do not taken place in the slump test, the viscosity rheological characteristic is good, little in the variation of shearing force effect viscosity, thixotropy is good, is beneficial to the printing and the demoulding.Welding back tin ball is less relatively, wetting good.Bronze mirror does not have the penetrability corrosion, and ionic pollution degree is at 0.35 μ g/cm
2～0.51 μ g/cm
2, be higher than ionic pollution degree I level (＜1.5 μ g/cm
2) standard, reproducibility and good in oxidation resistance under the tinol high temperature of the present invention being described, need not clean after the welding.
Claims (6)
1, a kind of lead-free halogen-free tinol comprises following parts by weight of component: alloyed powder 80-98, scaling powder 2-20; Described alloyed powder is any among SnAgCu, SnAgNi, SnAgBiCu, SnAgBiSb, SnCu, the SnAg; Described scaling powder is made up of following weight proportion ratio component: modified resin antioxidant 30-60, and organic acid activator 5-15, thixotropic agent 4-14, plasticizer 2-6, forming agent 0.4-2, corrosion inhibiter 0.1-0.5, organic solvent 20-40 forms; Described modified resin antioxidant is made up of following weight proportion ratio component: modified rosin resin 80-90, antioxidant 2-8, reducing agent 2-8.
2, according to the lead-free halogen-free tinol of claim 1, described component is following parts by weight of component: alloyed powder 88～92, scaling powder 8～12.
3, according to the lead-free halogen-free tinol of claim 1 or 2, described modified rosin resin is one or more of newtrex, Foral, water-white rosin, acryl rosin; Described antioxidant is by four [β-(3,5-two uncles base 4-hydroxyl-phenyl) propionic acid] pentaerythritol ester, 1,3,5-trimethyl-2,4,6-three (3, the 5-tert-butyl group-4 hydroxyl Bian Ji) benzene, 1,1, three kinds of components of 3-three (2-methyl-4-hydroxyl-5-tert-butyl-phenyl) butane are formed, and its weight proportion is 1: 1: 1; Described reducing agent is cis-9-octadecenoic acid;
Described organic acid activator is one of organic dibasic acid, aromatic acid or its combination;
Described thixotropic agent is one or both in ten dihydroxystearic acids, cotmar, single stearic acid glycerine lipoprotein, the oleamide;
Described plasticizer is one or both of hercolyn D, di-n-octyl sebacate;
Described forming agent is a ceresin;
Described corrosion inhibiter is a kind of in BTA, the alpha-mercapto benzothiazole;
Described organic solvent is one or both of diethylene glycol ether, triethylene glycol methyl ether, N-methyl pyrrolidone, propane diols.
4, according to the lead-free halogen-free tinol of claim 3, described organic dibasic acid is one or more of suberic acid, azelaic acid, decanedioic acid, malic acid, tartaric acid, phthalic acid; Aromatic acid is a phthalic acid.
5, the preparation method of the lead-free halogen-free tinol of one of a kind of claim 1-3 may further comprise the steps: (1) preparation modified resin antioxidant: after the modified rosin resin fusing, add antioxidant and reducing agent under stirring to fusing, mixing, be prepared into liquid, cooling, standby;
(2) preparation scaling powder: add the part organic solvent in above-mentioned modified resin antioxidant, stirring and dissolving gets liquid A; Add residual solvent in another container, when being heated to 90-100 ℃, add thixotropic agent, plasticizer, forming agent, corrosion inhibiter successively under stirring, be stirred to dissolving, add the organic acid for activating agent when being cooled to 70-80 ℃, and be stirred to dissolving evenly, cooling gets liquid B, and is standby; The modified resin antioxidant liquid A of above-mentioned preparation is poured in the solution B of this preparation and stirred, be the scaling powder of transferring cream to use;
(3) preparation tinol: the scaling powder and the alloyed powder raw material of above-mentioned preparation are put into blending kettle, vacuumize, stirring is described lead-free halogen-free tinol.
6, according to the preparation method of the lead-free halogen-free tinol of claim 5, also further be: mixing speed is 40～60 rev/mins; Scaling powder, alloyed powder raw material are put into blending kettle, vacuumize, vacuum-0.06--0.04MPa stirs 20-60min, promptly gets described lead-free halogen-free tinol.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006100780348A CN100450700C (en) | 2006-04-30 | 2006-04-30 | Lead-free halogen-free tinol and preparation process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006100780348A CN100450700C (en) | 2006-04-30 | 2006-04-30 | Lead-free halogen-free tinol and preparation process |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1876311A CN1876311A (en) | 2006-12-13 |
| CN100450700C true CN100450700C (en) | 2009-01-14 |
Family
ID=37508963
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2006100780348A Active CN100450700C (en) | 2006-04-30 | 2006-04-30 | Lead-free halogen-free tinol and preparation process |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100450700C (en) |
Families Citing this family (30)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101508061B (en) * | 2009-03-30 | 2012-10-03 | 汕头市骏码凯撒有限公司 | Welding flux for SnAgCu alloy solder powder and preparation method thereof |
| TWI428198B (en) * | 2009-04-08 | 2014-03-01 | Ishikawa Metal Co Ltd | Solder paste and method for manufacturing the same |
| CN101670499B (en) * | 2009-09-11 | 2012-04-04 | 厦门大学 | Rosin-free, lead-free and cleaning-free soldering paste containing activity control agent |
| CN101670504A (en) * | 2009-10-12 | 2010-03-17 | 东莞市焊宏爱法电子科技有限公司 | Halogen-free and rosin-free welding fluid |
| CN101733573B (en) * | 2009-11-04 | 2012-09-19 | 昆山成利焊锡制造有限公司 | Lead-free and halogen-free environmental soldering paste for electronic industry |
| US9770786B2 (en) * | 2010-06-01 | 2017-09-26 | Senju Metal Industry Co., Ltd. | Lead-free solder paste |
| CN104308388A (en) * | 2010-11-26 | 2015-01-28 | 深圳市晨日科技有限公司 | Die-bond soldering paste for high-power LED and preparation method of die-bond soldering paste |
| CN102179644B (en) * | 2011-04-29 | 2012-12-26 | 东莞永安科技有限公司 | Soldering flux |
| US20140130940A1 (en) | 2011-06-08 | 2014-05-15 | Senju Metal Industry Co., Ltd. | Solder Paste |
| CN102513732B (en) * | 2011-12-15 | 2014-06-25 | 中南大学 | Halogen-free cleaning-free rosin flux, and preparation and application thereof |
| CN102513738A (en) * | 2011-12-28 | 2012-06-27 | 东莞优诺电子焊接材料有限公司 | Continuous spot coating halogen-free solder paste and preparation method |
| CN102601537A (en) * | 2012-03-22 | 2012-07-25 | 浙江亚通焊材有限公司 | Aqueous aluminum base solder paste |
| CN103706961B (en) * | 2012-09-28 | 2016-08-03 | 钟广飞 | Halogen-free tin paste |
| CN103909358B (en) * | 2014-03-13 | 2016-01-13 | 江苏科技大学 | A kind of washing tin cream and preparation method thereof |
| CN104174315B (en) * | 2014-05-05 | 2016-06-08 | 江苏博迁新材料有限公司 | Improve production technology and the mixing and emulsifying device thereof of solder(ing) paste scaling powder stability |
| CN104117786B (en) * | 2014-07-25 | 2016-12-28 | 青岛申达众创技术服务有限公司 | A kind of scaling powder |
| CN104741821B (en) * | 2015-04-17 | 2016-10-05 | 哈尔滨工业大学 | A kind of preparation method for the micro-nano copper of electronic module High-temperature Packaging particles filled Sn base soldering paste |
| CN104858563A (en) * | 2015-04-30 | 2015-08-26 | 东莞市晨锦电子新材料有限公司 | Dedicated tin paste for LED and preparation method thereof |
| CN105728982B (en) * | 2015-11-05 | 2017-11-24 | 广东轻工职业技术学院 | A kind of efficient scaling powder |
| CN105290642B (en) * | 2015-11-28 | 2018-02-23 | 上海一远电子科技有限公司 | A kind of anti-oxidant tin copper series alloy solder |
| CN107695566A (en) * | 2017-11-29 | 2018-02-16 | 苏州市宽道模具机械有限公司 | A kind of leadless rosin scaling powder and preparation method thereof |
| CN109093290A (en) * | 2018-08-31 | 2018-12-28 | 安徽红桥金属制造有限公司 | A kind of scaling powder that can be reduced weldment residue and improve welding efficiency |
| CN113441868B (en) * | 2019-03-20 | 2022-06-14 | 中山翰华锡业有限公司 | Lead-free antioxidant tin paste with good wetting effect and preparation method thereof |
| CN110248494B (en) * | 2019-05-31 | 2020-07-31 | 深圳市英创立电子有限公司 | PCB (printed Circuit Board) mounting process |
| CN113130727B (en) * | 2019-12-31 | 2022-10-11 | Tcl科技集团股份有限公司 | LED chip mounting and pasting method |
| JP7194141B2 (en) * | 2020-03-25 | 2022-12-21 | 株式会社タムラ製作所 | SOLDER COMPOSITION FOR LASER SOLDERING AND METHOD FOR PRODUCING ELECTRONIC SUBSTRATE |
| CN111390429B (en) * | 2020-04-21 | 2021-09-14 | 深圳市唯特偶新材料股份有限公司 | Soldering paste with three-proofing effect for film forming after welding and preparation method thereof |
| CN111940947B (en) * | 2020-08-17 | 2022-05-13 | 惠州市源德智科技有限公司 | Halogen-free tin paste and preparation method thereof |
| CN113118662B (en) * | 2021-04-23 | 2022-04-08 | 宏桥金属制品(昆山)有限公司 | High-collapse-resistance solder wire and preparation method thereof |
| CN116900553B (en) * | 2023-07-13 | 2024-02-13 | 广东中实金属有限公司 | Preparation method of lead-free composite soldering paste with high spreading rate |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002001581A (en) * | 2000-06-21 | 2002-01-08 | Fujikura Ltd | Flux for non-lead soft solder |
| US6630036B2 (en) * | 2000-09-21 | 2003-10-07 | Advatest Corporation | Flux for Pb-free Sn-based alloy solders |
| CN1569383A (en) * | 2004-05-09 | 2005-01-26 | 邓和升 | High adhesion leadless soldering tin grease |
| CN1709638A (en) * | 2005-08-12 | 2005-12-21 | 北京工业大学 | Rosin halogen-free scaling powder for lead-free soldering paste |
-
2006
- 2006-04-30 CN CNB2006100780348A patent/CN100450700C/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002001581A (en) * | 2000-06-21 | 2002-01-08 | Fujikura Ltd | Flux for non-lead soft solder |
| US6630036B2 (en) * | 2000-09-21 | 2003-10-07 | Advatest Corporation | Flux for Pb-free Sn-based alloy solders |
| CN1569383A (en) * | 2004-05-09 | 2005-01-26 | 邓和升 | High adhesion leadless soldering tin grease |
| CN1709638A (en) * | 2005-08-12 | 2005-12-21 | 北京工业大学 | Rosin halogen-free scaling powder for lead-free soldering paste |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1876311A (en) | 2006-12-13 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN100450700C (en) | Lead-free halogen-free tinol and preparation process | |
| CN100560272C (en) | A kind of solder(ing) paste and preparation method thereof | |
| CN103286477B (en) | A kind of lead-free solder scaling powder and preparation method thereof | |
| CN100528461C (en) | Non-rosin cleaning-free scaling powder for tin-lead soldering paste and preparation method thereof | |
| KR20130034030A (en) | No-clean lead-free solder paste | |
| CN101116931A (en) | Scaling powder for sn96.5ag3cu0.5 alloy soldering tin paste | |
| CN101462209A (en) | Common resin type soldering flux without halogen suitable for low-silver leadless solder paste | |
| CN107442970A (en) | Low temperature No-clean Flux Used for Making Solder Paste and preparation method thereof | |
| CN101780606A (en) | Washing-free lead-free halogen-free tin soldering paste | |
| JP2019042805A (en) | Solder composition and electronic substrate | |
| CN101850483A (en) | Environmental-friendly water-soluble flux and preparation method thereof | |
| JP2015047616A (en) | Solder composition for jet dispenser | |
| CN109332943A (en) | A kind of tin silk and preparation method thereof using halogen-free high impedance solid state rosin scaling powder | |
| CN111136402A (en) | Enhanced composite soldering paste and preparation method thereof | |
| CN104220210A (en) | Soldering flux and solder composition | |
| CN104942480A (en) | Solid state scaling powder for stainless steel soldering and preparing method | |
| CN111318832B (en) | Low-temperature lead-free soldering paste and preparation method thereof | |
| CN108555475A (en) | A kind of lead-free and halogen-free solder(ing) paste | |
| JP2015080814A (en) | Flux for solder and solder paste | |
| CN108555474B (en) | Halogen-free environment-friendly lead-free tin paste and preparation method thereof | |
| CN106425153A (en) | Bismuth-containing low-silver lead-free solder paste | |
| CN104476018A (en) | Special soldering paste for welding chip diode | |
| CN102489899B (en) | Lead-free soldering paste and preparation method thereof | |
| CN104384747A (en) | Cold-storage-free soldering tin paste and preparing method of cold-storage-free soldering tin paste | |
| CN101176957A (en) | Soft solder for SnAgCuNiGe alloy solder paste |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20090306 Address after: Box 103, box 132, Beijing Patentee after: Beijing Xinli Machinery Works (State-owned 699 Works) Address before: Box 168, box 132, Beijing Patentee before: Beijing Aerospace Welding Materials Factory |
|
| C57 | Notification of unclear or unknown address | ||
| DD01 | Delivery of document by public notice |
Addressee: Zhu Lina Document name: Special business review memo Addressee: Zhu Lina Document name: Notice of conformity |
|
| ASS | Succession or assignment of patent right |
Owner name: BEIJING XINLI MACHINE FACTORY (STATE-RUN 699 FACTO Free format text: FORMER OWNER: BEIJING CITY SPACE WELDING MATERIALS FACTORY Effective date: 20090306 |
|
| C56 | Change in the name or address of the patentee |
Owner name: BEIJING XINLI MACHINERY CO., LTD. Free format text: FORMER NAME: XINLI MACHINERY FACTORY (STATE-OWNED FACTORY 699), BEIJING |
|
| CP01 | Change in the name or title of a patent holder |
Address after: 100039 box 103, box 132, Beijing Patentee after: Beijing Xinli Machinery Co.,Ltd. Address before: 100039 box 103, box 132, Beijing Patentee before: Beijing Xinli Machinery Works (State-owned 699 Works) |